KR20050104800A - Liquid crystal display panel and method for fabricating the same - Google Patents

Abstract

The liquid crystal display panel of the present invention and a method of manufacturing the same by forming a light blocking film on the array substrate of the pad portion to prevent photo leakage current (chip leakage) generated in the chip on glass (chip on glass) chip by a high brightness backlight light source A first substrate divided into a pixel portion, a gate pad portion, and a data pad portion; A plurality of thin film transistors formed in the pixel portion of the first substrate; A driving circuit unit including a chip-on-glass chip connected to each of the gate pad unit and the data pad unit; A gate pad light blocking film and a data pad light blocking film formed on each of the gate pad part and the data pad part to block a lower backlight light source from being irradiated onto the chip-on-glass chip; And a second substrate bonded to the first substrate.

Description

Liquid crystal display panel and its manufacturing method {LIQUID CRYSTAL DISPLAY PANEL AND METHOD FOR FABRICATING THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display panel and a method of manufacturing the same, and more particularly, to form a light blocking film on an array substrate of a pad part to block a light source of a backlight, thereby providing a chip on glass (COG) by a light leakage current. The present invention relates to a liquid crystal display panel capable of preventing malfunction of a chip circuit and a method of manufacturing the same.

Recently, the importance of the display (display) in the information society as a visual information transmission medium is further emphasized, and in order to occupy a major position in the future, it is necessary to meet the requirements of low power consumption, thinning, light weight, high quality.

In general, among image display apparatuses displaying image information on a screen, a thin film flat panel display (FPD) has been developed intensively in recent years because of its advantages of being light and easily used in any place. In particular, the liquid crystal display (LCD) of the flat panel display device is an image representing the image using the optical anisotropy of the liquid crystal, is excellent in resolution, color display and image quality, and is actively applied to notebooks or desktop monitors have.

Hereinafter, a general liquid crystal display device will be described in detail.

The liquid crystal display device drives the liquid crystal display panel and the liquid crystal display panel where the array substrate and the color filter substrate facing each other are bonded to each other to have a constant cell gap, and a liquid crystal layer is formed in the cell gap. And a backlight unit for supplying light to the panel.

In this case, red, green, and blue color filters repeatedly implementing colors are disposed on the color filter substrates (that is, the pixel areas), and the light passing through the liquid crystal layer is blocked between the color filters. The black matrix is formed in a mesh shape. In addition, a transparent common electrode for applying a voltage to the liquid crystal layer is formed on the color filter.

In addition, a plurality of gate lines and data lines are vertically and horizontally arranged on the array substrate to define a plurality of pixel regions, and pixel electrodes are formed in each pixel region. In addition, a thin film transistor (TFT) for driving the pixel electrode is formed in a portion of the pixels.

A gate pad portion and a data pad portion are formed at one end of the gate lines and the data lines.

The driving circuit unit is combined with the liquid crystal display panel to drive the liquid crystal display panel configured as described above. The driving circuit unit is divided into a gate driving circuit unit and a data driving circuit unit.

The gate driving circuit part is composed of a plurality of integrated circuit (IC) chips to apply a scan signal to the gate pad part, and the data driving circuit part is also composed of a plurality of integrated circuit chips. Image information is applied to the unit.

Hereinafter, a chip-on-glass type liquid crystal display panel in which the driving integrated circuit chips are directly mounted on a pad unit will be described in detail with reference to the accompanying drawings.

1 is a plan view schematically illustrating a part of a general chip-on-glass type liquid crystal display panel.

As shown in the drawing, the array substrate 10 and the color filter substrate 20 facing each other are bonded to have a constant cell gap, and a liquid crystal layer (not shown) is formed in the cell gap to form a liquid crystal display panel. In this case, a plurality of gate lines 16 and data lines 17 are formed on the array substrate 10 to be arranged laterally and horizontally to define a plurality of image regions, and a plurality of gate lines 16 and an outer region of the array substrate 10 are formed. Driving integrated circuit chips 40 and 41 are mounted. In addition, printed circuit boards (PCBs) 50 which supply various control signals, driving voltages, or image information to the driving integrated circuit chips 40 and 41 are driven integrated circuits of the array substrate 10. It is connected to the chips 40 and 41.

In this case, when the array substrate 10 and the color filter substrate 20 are bonded together, an outer region of the array substrate 10 is exposed to the outside, and the exposed region is referred to as a pad portion 45.

On the other hand, the data lines 17 are electrically connected to the data driving integrated circuit chip 41 mounted on the pad part 45, and the gate lines 16 are similarly integrated with the gate driving integrated on the pad part 45. It is electrically connected to the circuit chip 40.

In addition, the printed circuit boards 50 provided on the outer side of the liquid crystal display panel are connected to the data driving integrated circuit chip 41 and the gate driving integrated circuit chip 40 through a flexible printed circuit (FPC) 55. ) Is electrically connected. The printed circuit boards 50 receive external data through the connector 51 and process the signals into signals for driving the liquid crystal display panel to supply image information to the data driver integrated circuit chip 41 and drive the gate. The integrated circuit chip 40 supplies control signals and driving voltages.

Although not shown in the drawing, an input pad and an output pad are formed in the pad part 45 on which the gate driving integrated circuit chip 40 and the data driving integrated circuit chip 41 are mounted to form the gate driving integrated circuit chip ( 40 and the input terminal and the output terminal of the data driving integrated circuit chip 41 are respectively connected correspondingly.

In this case, a transparent protective film (not shown) is generally formed on the surfaces of the lower portion of the gate driving integrated circuit chip 40 and the data driving integrated circuit chip 41 of the pad part 45 where various circuits (not shown) exist. The light source emitted from the backlight unit provided on the rear surface of the liquid crystal display panel is incident on the lower end of the circuit portion of the gate driving integrated circuit chip 40 and the data driving integrated circuit chip 41, thereby affecting the circuit portion. . In particular, when a high brightness backlight is used, there is a problem that a malfunction of the circuit portion of the driving integrated circuit chips 40 and 41 due to photo leakage current may occur.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and the liquid crystal display panel which can prevent the malfunction of the integrated circuit chip itself due to the light leakage current which may occur due to the increase in the light intensity of the backlight in the development of the high brightness liquid crystal display panel and its It is an object to provide a manufacturing method.

Other objects and features of the present invention will be described in the configuration and claims of the invention described below.

In order to achieve the above object, a liquid crystal display panel according to the present invention includes a first substrate divided into a pixel portion, a gate pad portion, and a data pad portion, a plurality of thin film transistors formed on the pixel portion of the first substrate, and the respective gate pads. A driving circuit unit including a chip-on-glass chip connected to the unit and the data pad unit, and formed in each of the gate pad unit and the data pad unit to block a lower backlight light source from being irradiated to the chip-on-glass chip. And a gate pad part light blocking film, a data pad part light blocking film, and a second substrate bonded to the first substrate.

In addition, the manufacturing method of the liquid crystal display panel of the present invention comprises the steps of providing a first substrate divided into a pixel portion, a gate pad portion and a data pad portion, forming a gate electrode and a gate line in the pixel portion of the first substrate, Forming a gate pad wiring on a gate pad of the first substrate and forming a light blocking film of the data pad on the data pad, forming a first insulating film on the first substrate, and forming silicon on the pixel of the first substrate. Forming an active pattern with a layer and an n + silicon layer, forming a data line and a source / drain electrode in a pixel portion of the first substrate, and forming a gate pad portion light blocking film in a gate pad portion of the first substrate and Forming a data pad line in a pad portion, a pixel portion contact hole exposing a portion of the drain electrode on the first substrate, and the gate pad Forming a second insulating film having a pad portion contact hole exposing a line and a portion of the data pad wiring, forming a pixel electrode connected to the drain electrode through the pixel portion contact hole, and forming each of the pad portion contact holes Forming a gate pad electrode to be connected to the gate pad wiring through the data and forming a data pad electrode to be connected to the data pad wiring; and forming a chip-on-glass integrated circuit chip in each of the gate pad portion and the data pad portion. And mounting the gate driving circuit part and the data driving circuit part, and bonding the first substrate and the second substrate which is a color filter substrate.

In this case, each of the gate pad part light blocking film and the data pad part light blocking film may be formed by patterning a width wider than an upper gate driving integrated circuit chip and a data driving integrated circuit chip.

The gate pad light blocking film and the data pad light blocking film may be formed of an opaque conductive metal material.

In addition, another method of manufacturing a liquid crystal display panel according to the present invention includes providing a first substrate divided into a pixel portion, a gate pad portion, and a data pad portion, forming a thin film transistor on the pixel portion of the first substrate, and the gate. A gate pad portion light blocking layer is formed by patterning the data metal layer of the pixel portion thin film transistor on the pad portion, and a data pad portion light blocking layer is formed by patterning the gate metal layer of the pixel portion thin film transistor on the data pad portion. And mounting a driving circuit unit including a chip-on-glass chip to each of the gate pad unit and the data pad unit, and bonding the first substrate to a second substrate, which is a color filter substrate.

Hereinafter, exemplary embodiments of a liquid crystal display panel and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.

As described above, the liquid crystal display panel is largely composed of an array substrate and a color filter substrate including a driving circuit unit, and a liquid crystal layer formed between the array substrate and the color filter substrate.

In this case, one side of the long side and one side of the array substrate protrude relative to the color filter substrate so that a driving circuit unit for driving the liquid crystal display panel is located. Particularly, one side of the array substrate protrudes from one side of the array substrate. The gate pad part is formed and a data pad part is formed at one side of the protruding side.

The gate pad unit supplies a scan signal supplied from the gate driver circuit unit to the gate line of each pixel region, and the data pad unit supplies image information supplied from the data driver circuit unit to the data line of the pixel region.

The gate driver circuit part is composed of a plurality of integrated circuit chips to apply a scan signal to the gate pad part, and the data driver circuit part is also composed of a plurality of integrated circuit chips to apply image information to the data pad part.

In general, there are two methods for connecting the data driver integrated circuit chips and the gate driver integrated circuit chips to the pad unit. The tape carrier package may be mounted on the tape carrier package by mounting the driver integrated circuit chip on the pad unit. There is a tab automated bonding (TAB) method and a chip-on-glass method in which the driving integrated circuit chips are directly mounted on a pad part.

Among the tap method and the chip-on-glass method, the chip-on-glass method does not require a tape carrier package as in the tap method, and directly mounts an integrated circuit chip to a pad part, thereby reducing manufacturing costs. By reducing the number of parts, the liquid crystal display panel can be made lighter.

Meanwhile, in the chip-on-glass type liquid crystal display panel as described above, a gate metal layer is formed on the data pad portion and data is formed on the gate pad portion without a separate process when forming a thin film transistor on the pixel portion of the array substrate. By forming a light blocking film by patterning the metal layer, a backlight light source is not irradiated to the lower end of the chip-on-glass chip, thereby preventing malfunction of the circuit unit due to the light leakage current.

2A and 2B are cross-sectional views schematically illustrating a portion of a gate pad portion and a data pad portion of a liquid crystal display panel according to an exemplary embodiment of the present invention, together with a portion of an integrated circuit chip connected to the pad portion.

First, FIG. 2A is a cross-sectional view schematically illustrating a portion of a gate pad portion and a gate driving circuit chip connected thereto. As illustrated in the drawing, each gate pad electrode 121P of the gate pad portion is a gate driving circuit chip 141. And are electrically connected through a bump 142.

In this case, the gate pad electrode 121P connected to the bump 142 of the gate driving circuit chip 141 is electrically connected to the gate pad wiring 116P formed on the array substrate 110 through a pad contact hole. A gate pad portion light blocking layer 171 is formed between the gate pad electrodes 121P to block a light source incident from a lower backlight (not shown).

The gate pad part light blocking layer 171 is formed by patterning an opaque gate metal layer in the process of forming a thin film transistor in the pixel portion of the array substrate 110, and thus does not require an additional mask process, and the gate driving circuit chip 141. By forming a pattern larger than), the backlight light source may not be irradiated to various circuits (not shown) formed at the lower end of the gate driving circuit chip 141.

2B is a cross-sectional view illustrating a data pad part and a portion of a data driving circuit chip connected thereto. As shown in the gate pad part, each data pad electrode 122P of the data pad part includes a data driving circuit chip 140. It is electrically connected through the bump 142.

In this case, the data pad electrode 122P connected to the bump 142 of the data driving circuit chip 140 is electrically connected to the data pad wiring 117P formed on the array substrate 110 through a pad contact hole. The data pad part light blocking layer 170 is formed below the data pad line 117P to block a light source incident from the lower backlight.

The data pad part light blocking film 170 is formed by patterning an opaque data metal layer in the process of forming a thin film transistor in the pixel portion of the array substrate 110, and thus does not require an additional mask process. 140 is formed by patterning larger than the data driving circuit chip 140 so that the backlight light source is not irradiated to the various circuits (not shown) of the lower end.

As described above, the light blocking film formed on the pad part prevents the lower backlight light source from directly radiating to the circuit part under the chip-on-glass chip, thereby preventing the chip-on-glass chip from the circuit due to the light leakage current generated when the high brightness backlight is used. The malfunction can be prevented.

Hereinafter, the light blocking film of the present invention configured as described above will be described in detail through the manufacturing process of the liquid crystal display panel.

3A through 3F are cross-sectional views sequentially illustrating a manufacturing process of an array substrate of a liquid crystal display panel according to an exemplary embodiment of the present invention, and a process of manufacturing an array substrate of a pixel unit on the left side and an array of a gate pad unit and a data pad unit on the right side. The process of manufacturing a board | substrate is shown together.

First, as shown in FIG. 3A, the gate electrode 121 is formed on the pixel portion of the substrate 110 made of a transparent insulating material such as glass, and the gate pad wiring 116P is formed on the gate pad portion. The data pad part light blocking film 170 is formed in the portion. The gate electrode 121, the gate pad wiring 116P, and the data pad part light blocking film 170 may include aluminum (Al), aluminum alloy, tungsten (W), copper (Cu), and chromium (chromium). It may be formed by depositing an opaque conductive metal material such as Cr), molybdenum (Mo) and the like, and then patterning the conductive metal material using a photolithography process.

On the other hand, the data pad part light blocking film 170 is composed of opaque gate lines 121 and 116P to prevent the backlight light source from being irradiated to the lower end of the data driving integrated circuit (not shown) chip.

Although not shown in the drawing, when the gate electrode 121 is formed on the array substrate 110 of the pixel portion, a gate line connected to the gate electrode 121 is also formed, and an end of the gate line is formed at the gate pad. It is connected to the wiring 116P and receives a scan signal from an external driving circuit.

Meanwhile, after forming a buffer layer including a silicon oxide film (SiO ₂ ) on the glass substrate 110, the above-described gate wirings 121 and 116P and the data pad part light blocking film 170 may be formed. It may be. In this case, the buffer layer serves to block impurities such as sodium (natrium) from the glass substrate 110 from penetrating into the upper layer during the process.

Next, as shown in FIG. 3B, a first insulating film 115A, which is a gate insulating film, is formed on the entire surface of the substrate 110 on which the gate lines 121 and 116P and the data pad part light blocking film 170 are formed.

Thereafter, as shown in FIG. 3C, the pixel layer is formed by patterning the amorphous silicon layer 124 and the n + amorphous silicon layer 125 which are active patterns. In this case, the amorphous silicon layer 124 is used as an active layer of a thin film transistor, and the n + amorphous silicon layer 125 is an ohmic between a source / drain electrode and a predetermined region (ie, source / drain region) of the active layer, which will be described later. -Formed for contact.

Meanwhile, in the present embodiment, an example of forming an amorphous silicon thin film transistor using amorphous silicon as an active layer is described as an example. However, the present invention is not limited thereto, and the gate pad may be formed regardless of the structure of the thin film transistor of the pixel portion. The light shielding film need only be formed in the portion and the data pad portion.

Next, as illustrated in FIG. 3D, a data line (not shown) defining a pixel region crossing the gate line in the pixel portion by depositing and patterning an opaque conductive metal material on the entire surface of the substrate 110, and A source electrode 122 and a drain electrode 123 are formed to be connected to the data line, and a data pad line 117P is formed at the end of the data line to connect an external driving circuit to the data pad part. The gate pad part light blocking film 171 is formed. After that, the n + amorphous silicon layer 125 is etched using the source / drain electrodes 122 and 123 as the mask to expose the amorphous silicon layer 124 on the gate electrode 121.

On the other hand, the gate pad light blocking film 171 is composed of opaque data lines 122, 123, and 117P to prevent the backlight light source from being irradiated to the lower end of the gate driving integrated circuit (not shown) chip.

Next, as illustrated in FIG. 3E, a pixel contact contact hole exposing a part of the drain electrode 123 by depositing and patterning the second insulating film 115B, which is an interlayer insulating film, on the entire surface of the substrate 110. A pad portion contact hole 160P exposing a portion of the gate pad wiring 116P and the data pad wiring 117P is formed in the gate pad portion and the data pad portion, respectively.

In this case, the second insulating film 115B may be formed of an inorganic insulating film such as a silicon oxide film or a silicon nitride film (SiN _x ), and has a low dielectric constant benzocyclobutene (BCB) to realize a high opening ratio on the inorganic insulating film. It is also possible to form an organic insulating film.

3F, Indium-Tin-Oxide (ITO), Indium-Zinc-Oxide (IZO), or Indium-Tin is formed on the entire surface of the substrate 110. Depositing and patterning a transparent conductive material such as indium-tin-zinc-oxide (ITZO) to form a pixel electrode 118 connected to the drain electrode 123 through the contact hole 160 of the pixel portion. And a gate pad electrode 121P connected to the gate pad wiring 116P and a data pad electrode connected to the data pad wiring 117P through the pad portion contact hole 160P of the gate pad portion and the data pad portion, respectively. To form 122P.

In this case, although not shown in the drawing, the gate pad electrode 121P is electrically connected to the gate driving integrated circuit chip through a bump to receive a scan signal from the gate driving circuit unit, and the data pad electrode 122P also bumps. Through the electrical connection with the data driving integrated circuit chip through the image information is received from the data driving circuit.

Meanwhile, as described above, the gate pad part light blocking film 171 formed in the gate pad part and the data pad part light blocking film 170 formed in the data pad part are irradiated with the backlight light source to the lower end of the chip-on-glass chip. By interrupting the circuit, the occurrence of photo leakage current is minimized in the circuit portion of the chip, thereby preventing malfunction of the circuit portion.

Many details are set forth in the foregoing description but should be construed as illustrative of preferred embodiments rather than to limit the scope of the invention. Therefore, the invention should not be defined by the described embodiments, but should be defined by the claims and their equivalents.

As described above, the liquid crystal display panel and the manufacturing method thereof of the present invention can prevent a circuit malfunction of the chip-on-glass chip when the backlight light source for high brightness is formed by forming a light blocking film on the pad portion without adding a separate process. It can be effective.

1 is a plan view schematically illustrating a part of a typical chip-on-glass type liquid crystal display panel.

2A and 2B are cross-sectional views schematically illustrating a portion of a gate pad portion and a data pad portion of a liquid crystal display panel according to an exemplary embodiment of the present invention.

3A to 3F are cross-sectional views sequentially illustrating a manufacturing process of an array substrate of a liquid crystal display panel according to an exemplary embodiment of the present invention.

** Explanation of symbols for main parts of drawings **

110: array substrate 116P: gate pad wiring

117P: Data pad wiring 118: Pixel electrode

121P: Gate pad electrode 122P: Data pad electrode

140,141: integrated circuit chip 142: bump

170,171: Light shielding film

Claims (8)

A first substrate divided into a pixel portion, a gate pad portion, and a data pad portion; A plurality of thin film transistors formed in the pixel portion of the first substrate; A driving circuit unit including a chip-on-glass chip connected to each of the gate pad unit and the data pad unit; A gate pad light blocking film and a data pad light blocking film formed on each of the gate pad part and the data pad part to block a lower backlight light source from being irradiated onto the chip-on-glass chip; And A liquid crystal display panel comprising a second substrate bonded to the first substrate. The thin film transistor of claim 1, wherein the thin film transistor A gate electrode formed on the first substrate; A first insulating film formed on the gate electrode; A silicon layer and an n + silicon layer formed by patterning an active pattern on the gate electrode; A source / drain electrode formed on the first substrate and connected to the source / drain regions of the n + silicon layer, respectively; A second insulating layer formed on the first substrate and having a pixel portion contact hole exposing a portion of the drain electrode; And And a pixel electrode connected to the drain electrode through the pixel portion contact hole. The liquid crystal display panel of claim 2, wherein the light blocking layer of the gate pad part is made of an opaque conductive metal material that is the same as the source / drain electrodes of the pixel part thin film transistor. The liquid crystal display panel of claim 2, wherein the data pad part light blocking layer is made of an opaque conductive metal material that is the same as the gate electrode of the pixel part thin film transistor. Providing a first substrate divided into a pixel portion, a gate pad portion, and a data pad portion; Forming a gate electrode and a gate line on the pixel portion of the first substrate, forming a gate pad line on the gate pad portion of the first substrate, and forming a data pad portion light blocking film on the data pad portion; Forming a first insulating film on the first substrate; Forming an active pattern of a silicon layer and an n + silicon layer on the pixel portion of the first substrate; Forming a data line and a source / drain electrode on a pixel portion of the first substrate, forming a gate pad portion light blocking layer on a gate pad portion of the first substrate, and forming a data pad line on a data pad portion; Forming a second insulating layer having a pixel portion contact hole exposing a portion of the drain electrode and a pad portion contact hole exposing a portion of each of the gate pad wiring and the data pad wiring on the first substrate; A pixel electrode is formed to be connected to the drain electrode through the pixel portion contact hole. Making; Mounting a gate driving circuit unit and a data driving circuit unit to each of the gate pad unit and the data pad unit including a chip-on-glass integrated circuit chip; And And bonding the first substrate and a second substrate, which is a color filter substrate, to each other. 6. The liquid crystal display panel of claim 5, wherein each of the gate pad part light blocking film and the data pad part light blocking film is formed by patterning a width wider than an upper gate driving integrated circuit chip and a data driving integrated circuit chip. Manufacturing method. The method of claim 5, wherein the gate pad light blocking film and the data pad light blocking film are formed of an opaque conductive metal material. Providing a first substrate divided into a pixel portion, a gate pad portion, and a data pad portion; Forming a thin film transistor in a pixel portion of the first substrate; The gate pad part is patterned using a data metal layer of the pixel part thin film transistor to form a gate pad part light blocking film, and the data pad part is patterned using a gate metal layer of the pixel part thin film transistor. Forming a; Mounting a driving circuit unit including a chip-on-glass chip in each of the gate pad unit and the data pad unit; And A method of manufacturing a liquid crystal display panel comprising bonding the first substrate and a second substrate which is a color filter substrate.