KR20050087565A - Underfill equipment for manufacturing semiconductor devices - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an underfill facility for manufacturing a semiconductor device, comprising: a mounting plate on which a plurality of semiconductor devices are bonded, in which a substrate strip is bonded, driven in a vertical direction, and fixed to the substrate strip by vacuum blocks; And a dispenser having a plurality of heads for applying the resin composition, fixing pins fixing the substrate strip, and a calibration jig having marks formed on the upper surface at predetermined intervals. A belt conveyor having an alignment portion, a transfer belt for transferring the substrate strip, a pressing pin for pressing the semiconductor elements, and a stopper for stopping the substrate strip; The underfill operation is simultaneously performed by the dispenser having the above heads, thereby improving the throughput. It reduces the number of equipment to be added to the underfill process the volume, and thus the underfill facility is reduced the space (Space) occupied on the semiconductor process line.

Description

Underfill Equipment for Manufacturing Semiconductor Devices

The present invention relates to an underfill apparatus for manufacturing a semiconductor device, and more particularly, to a resin composition through a dispenser having a plurality of heads in a space between a semiconductor element and a substrate strip on a molded substrate strip to which a plurality of molded semiconductor elements are attached. The underfill installation for semiconductor device manufacture which apply | coats this is related.

With the development of mobile products, the field of application of memory devices also began to expand. In particular, the development of the memory card field, in which a large number of memory devices are mounted on a thin printed circuit board of 1 mm or less, is expected to be greatly developed in the future, which will be expanded to a new field of the semiconductor industry.

At present, a variety of memory cards that are small in size and light in weight for multimedia data storage are provided. For example, a multimedia card (MMC) is used as an auxiliary memory means for storing, playing back, and deleting various types of data, sounds, and images, which are used for MP3 players, digital cameras, digital camcorders, and various portable electronic devices. Used for

In the method of manufacturing a multimedia card, semiconductor devices such as memory devices and control devices are mounted on a printed circuit board or a substrate strip in one form of a chip or a package, and are electrically connected to each other by wire bonding, tape bonding, ball bonding, or the like. The internal elements are configured to be protected by molding and capping. Here, before the multimedia card is electrically connected and molded, an underfill process is performed in the space between the semiconductor device and the printed circuit board.

Underfill process is a liquid resin material is applied to the space between the semiconductor device and the printed circuit board after the liquid resin material is cured to form a support layer, which strengthens the bearing capacity of the semiconductor device on the substrate, damage to the semiconductor device And heat transfer ability.

In addition, such multimedia card fabrication is handled in units of substrate strips in which a plurality of substrates are arranged in series to increase production rates.

Hereinafter, an underfill apparatus for manufacturing a semiconductor device according to the related art, in which a plurality of molded semiconductor devices are bonded to a substrate strip by soldering and an underfill process is performed, will now be described.

1 is a partial perspective view showing an underfill facility for manufacturing a semiconductor device according to the prior art.

Referring to FIG. 1, the underfill facility 101 for manufacturing a semiconductor device according to the related art includes a belt conveyor 109 for transferring a substrate strip 108 to which a plurality of semiconductor elements 103 and 105 are bonded, and a substrate strip 108. ) Is fixed and vertically driven mounting plate 110, the dispenser 111 for applying the resin composition to the space between the semiconductor element 103, 105 and the substrate strip 108, and the semiconductor element subjected to the underfill process And a CCD camera (not shown) for aligning the 103 and 105 with the dispenser 111.

In the underfill method using the underfill facility 101 for manufacturing a semiconductor device, first, the position of the head 112 of the outermost semiconductor element 105 and the dispenser 111 among the semiconductor elements 103 and 105 may be a CCD camera (not shown). The position of the head 112 relative to the position of the semiconductor element 105 is properly aligned by moving the head 112 by the operation of the micrometer (not shown) mounted on the dispenser 111 while visually confirming the do.

Next, the substrate strip 108 is transported by the belt conveyor 109, and the substrate strip 108 to be transported is a stopper 113 formed at the bottom of the belt conveyor 109 in the space where the underfill process is performed again. After stopping by and seated on the seating plate 110, it is fixed by the vacuum block 114 formed on the seating plate 110. Thereafter, the mounting plate 110 is lifted up by a driving device (not shown), and the semiconductor elements 103 and 105 on the substrate strip 108 are attached to the support wall 115 of the belt conveyor 109 and When the contact plate 110 is in contact with the pressing pins 116 protruding on the rising path, the mounting plate 110 stops the driving of the lift. At this time, the semiconductor elements 103 and 105 are pressed pins 116. Pressurized by

As such, after the semiconductor element 105 and the head 112 of the dispenser 111 are aligned, a pump (not shown) built in the head 112 is operated to store the head from the reservoir 118 in which the underfill solution is stored. The underfill solution is supplied through the supply pipe 117 to the 112, and the underfill solution is discharged through the needle 112 ′ to apply the underfill solution around the outermost semiconductor element body 105 ′. Thereafter, an underfill solution is applied around the bodies 103 ', 105' of all the semiconductor elements 103, 105 as the head 112 is moved along the programmed travel path.

In the underfill facility 101 for manufacturing a semiconductor device according to the related art, expensive equipment such as a CCD camera (not shown) is used in the dispensing agent 111 with respect to the semiconductor element 105, and one head 112 is used. Application of the underfill solution takes a lot of time to process the underfill operation, which requires a lot of underfill equipment 101 to process the target volume, increasing the investment cost, the underfill equipment 101 is a lot of on the semiconductor process line It takes up space.

Accordingly, the present invention enables the alignment of dispensers with respect to semiconductor devices without vision aligner equipment such as CCD cameras, which are expensive alignment equipment, and improves the efficiency of underfill work by providing two or more dispensers. The number of underfill facilities required to process a target quantity is reduced, and therefore, the underfill facilities provide an underfill facility for manufacturing a semiconductor device which takes up less space on a semiconductor processing line.

The present invention provides an underfill facility for manufacturing a semiconductor device in which a resin composition is applied to a gap between a semiconductor device and a substrate strip after a plurality of semiconductor devices having external leads are mounted on a substrate strip, and a plurality of semiconductor devices are mounted. Dispenser having a seating plate on which the substrate strip is placed and driven in a vertical direction and fixed to the substrate strip by vacuum blocks, and a plurality of heads, each spaced apart at predetermined intervals, to apply a resin composition. And an instrument alignment unit having a calibration pin for fixing the substrate strip and a mark formed on the upper surface at predetermined intervals, and pressurizing the transfer belt and the semiconductor elements for transferring the substrate strip. It includes a belt conveyor with a stopper for stopping pins and substrate strips. And that is characterized.

In the underfill facility for manufacturing a semiconductor device according to the present invention, it is preferable that the heads simultaneously apply the resin composition.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

2 is a partial perspective view showing an underfill facility for manufacturing a semiconductor device according to the present invention.

The underfill facility 1 for manufacturing a semiconductor device according to the present invention will be described with reference to FIG. 2.

The underfill facility 1 for manufacturing a semiconductor device includes a belt conveyor 9 for transporting the substrate strip 8, a seating plate 10 on which the substrate strip 8 is placed for the underfill process, and an application of the underfill solution. A dispenser 11 to perform and an instrument alignment portion 20 for aligning the dispensers 11 with the semiconductor elements 3, 5 on the substrate strip 8. Here, the substrate strip 8 has a circuit pattern (not shown) formed on its surface, and memory elements 5 and control elements, which are semiconductor elements, on the substrate strip 8 having fixing holes 6 at each edge. (3) includes a plurality of memory cards 4 bonded to each other. In addition, separation holes 7 are formed between the memory cards 4 to be separated separately.

The belt conveyor 9 is a device for transporting the substrate strip 8, in which a transport belt 21 driven by a driving device (not shown) is formed along the inner wall of the support wall 15 located on both sides along the transport path. Substrate pins 16, which are respectively positioned and attached to the support wall 15 to apply pressure by the elastic force of the spring, are attached to the bottom of the space near which the underfill process is carried out, and the substrate strip is transferred onto the transfer belt 21 ( A stopper 13 is attached to stop the feeding of 8).

The seating plate 10 is a device to which the substrate strip 8 for performing the underfill process is fixed. The mounting plate 10 is installed at the bottom of the belt conveyor 9 before the substrate strip 8 reaches the stopper 13, and the substrate strip 8 A plurality of vacuum blocks 14 are formed at the portion where the) is placed, and are driven up and down in the vertical direction by a driving device (not shown).

The dispenser 11 is a device for applying the resin composition around the bodies 3 ', 5' of the semiconductor elements 3, 5 mounted on the substrate strip 8, and is installed higher than the belt conveyor 9, and A pump (not shown) for discharging the upper underfill solution therein and having heads 12 and 24 having needles 12 'which are underfill solution discharge ports, and supply pipes formed in the respective heads 12 and 24 ( And an underfill solution reservoir 18 for supplying the underfill solution through 17). In addition, a sensor (not shown) for detecting the presence or absence of an underfill solution in the heads 12 and 24 is attached to one side of the heads 12 and 24, and the heads 12 and 24 are connected to each other. Since they are fixed at regular intervals, they are moved in the same direction and in the same direction, respectively, and micrometers (not shown) are provided between the heads 12 and 24 to correct positions.

The instrument aligning portion 20 has fixing protrusions 19 'inserted into fixing holes 6 formed at respective edges of the substrate strip 8, respectively, and is fixed on two supporting walls 15 respectively. Calibration Zig located near the belt conveyor 9 with pins 19 and marks 23 indicating the spacing between the heads 12, 24 to apply the resin composition on the upper surface in the correct position. (22).

Looking at the underfill process using the underfill facility (1) for manufacturing a semiconductor device having such a configuration,

Here, in the underfill process, the underfill solution is accurately applied around the bodies 3 'and 5' of the semiconductor elements 3 and 5 by the two heads 12 and 24 of the dispenser 11, and the working time is the most. The movement paths in the X, Y, and Z axis directions are programmed to be the shortest, and are moved according to the control of the program.

First, the heads 12 and 24 are placed in an optimal position depending on the position of the semiconductor elements 3 and 5 in which the respective needles 12 'and 24' are mounted on the substrate strip 8. Is moved to a calibration jig 22 for correcting the positions of the two needles 12 'and 24' such that the positions of the marks 23 on the calibration jig 22 corresponding respectively to the two needles 12 'and 24'. The position of the two needles 12 'and 24' is corrected by adjusting the positions of the two heads 12 and 24 by the operation of the micrometer (not shown) so that the? Thereafter, the heads 12 and 24 are fixed such that the gap between the two position corrected needles 12 'and 24' is maintained and then sent back to the underfill process start position.

Subsequently, the substrate strip 8 having the plurality of semiconductor elements 3 and 5 attached thereto is placed on the conveying belt 21 formed on the belt conveyor 9 and conveyed, and stopped by the stopper 13 to underfill the process. It is placed on the seating plate 10 located on the space in which this is made. Next, the substrate strip 8 is fixed by vacuum suction of the vacuum blocks 10 formed on the seating plate 10, and the seating plate 10 is lifted by a driving device (not shown). The raised seating plate 10 stops the lift driving when the semiconductor devices 3 and 5 and the pressure pins 16 on the substrate strip 8 fixed to the upper surface are contacted, and the pressure pins 16 By pressing the upper surfaces of the semiconductor devices 3 and 5, the semiconductor devices 3 and 5 and the substrate strip 8 are brought into close contact with the seating plate 10. In addition, the substrate strip 8 has a fixing protrusion 19 'inserted into each of the grooves 6 formed at the edge of the substrate strip 8 to which the fixing pins 19 placed on top of the substrate strip 8 correspond. It is fixed. In this way, the heads 12 and 24, which maintain a predetermined distance according to the corrected position, and the substrate strip 8 fixed by the fixing pins 19 are aligned to the proper positions for performing the underfill process.

Next, the underfill solution is discharged from the needles 12 'and 24' of the two heads 12 and 24, so that the body of the memory elements 5 located under each of the two heads 12 and 24 ( Underfill solution is applied around the 5 '). Thereafter, the two heads 12 and 24 are moved along the programmed path at the same distance and at the same distance so that all the memory elements 5 and the body 5 ', of the control elements 3 on the substrate strip 8 are moved. The underfill solution is applied around 3 ').

As described above, the underfill facility for manufacturing a semiconductor device according to the present invention includes two or more heads of a dispenser for applying an underfill solution, thereby reducing the underfill process time for one substrate strip, and using an apparatus alignment unit, The heads of the dispenser and the substrate strip are aligned without using a vision alignment method such as a CCD camera. As a result, the throughput of the underfill process is increased, the number of underfill facilities used to process the same quantity is reduced, and the capital investment is reduced, and the space on the semiconductor process line occupied by the underfill facilities is reduced.

1 is a partial perspective view showing an underfill facility for manufacturing a semiconductor device according to the prior art.

2 is a partial perspective view showing an underfill facility for manufacturing a semiconductor device according to the present invention.

<Description of Symbols for Major Parts of Drawings>

1, 101: underfill facility

2, 102: semiconductor device

3, 5, 103, 105: semiconductor device

4: memory card

8, 108: substrate strip

9, 109: belt conveyor

10, 110: seating plate

11, 111: dispenser

12, 24, 112: head

13, 113: stopper

22: calibration jig

Claims (2)

A mounting plate on which a substrate strip on which a plurality of semiconductor elements are bonded is arranged, in which a substrate strip is continuously arranged, driven in a vertical direction, and the substrate strip is fixed by vacuum blocks; A dispenser having a plurality of heads, each spaced apart at predetermined intervals and applying a resin composition; An instrument alignment unit having a calibration pin for fixing the substrate strip and a calibration zig formed at predetermined intervals on an upper surface thereof; And And a belt conveyor having a transfer belt for transferring the substrate strip, a pressure pin for pressing the semiconductor elements, and a stopper for stopping the substrate strip. The underfill facility for manufacturing a semiconductor device according to claim 1, wherein the heads simultaneously apply a resin composition.