KR20050087093A - A parallelepiped type directional condenser microphone - Google Patents

Abstract

The present invention relates to a directional condenser microphone of parallel hexahedron type.

Such a bidirectional microphone of the present invention, one side is opened and the rectangular cylindrical case formed with sound holes for introducing sound to the bottom surface; A ring diaphragm that can be inserted into a rectangular cylindrical case; Ring-shaped thin spacers; A cylindrical insulating ring having an upper and lower opening; A disk-shaped back plate in which sound holes are formed; An annular conductive ring for electrically connecting the back plate to the circuit board; The sound hole for the rear sound is formed in the center, and components (IC, MLCC) are mounted on one side and a rectangular plate type PCB is formed on the other side, and the diaphragm, spacer, insulation ring, back plate, conductive ring, After the PCB is placed in sequence, it is assembled into a structure where the end of the case is cured. Therefore, the microphone of the present invention has directing characteristics and can easily align two or more connection terminals by checking the direction of the components in the surface mount (SMD) process, so that the connection terminals of the main PCB connection terminal and the condenser microphone are connected. There is an effect to reduce the connection failure that the surface is distorted or the connection or direction (polarity) of the connection terminal is changed.

Description

A parallelepiped type directional condenser microphone}

The present invention relates to a condenser microphone, and more particularly, to a parallel hexahedron type, parallel hexahedral directional condenser microphone which is easy to check the direction of the component in the surface mount (SMD) process even if two or more electrical connection terminals are provided. It is about.

A typical condenser microphone is a voltage bias element (usually an electret), a diaphragm / backplate pair forming a capacitor (C) that changes in response to sound pressure, and a field effect transistor to buffer the output signal. (JFET).

1 is a schematic diagram illustrating a conventional directional condenser microphone.

A conventional directional condenser microphone 10 has a first base in the form of a polar ring, a diaphragm, a spacer, a back plate, a ring insulator, a second base of conductors, as shown in FIG. And a PCB having a sound hole for introducing rear sound, and the like, and the appearance of the assembly is cylindrical, and two connection terminals are formed on the PCB.

However, when mounting the surface, it is necessary to connect the connection terminal of the main PCB terminal and the condenser microphone correctly. The connection terminal of the conventional cylindrical condenser microphone as described above is not suitable for the surface mounting (SMD), and the terminal surface is lower than the curing surface of the case. Due to this problem, solder adhesion defects occur during surface mounting.In particular, when a large number of connection terminals are provided, it is difficult to check the direction of the connection terminals. There is a problem in that the connection is broken and only a part of the connection is made, resulting in an increase in connection failure.

The present invention has been proposed to solve the above problems while providing directivity, and has a parallelepiped shape, so that it is easy to check the direction of components in a surface mount (SMD) process, and even surface mount is made of a plurality of connection terminals. The object is to provide this possible parallelepiped directional condenser microphone.

In order to achieve the above object, a microphone of a temporary embodiment of the present invention includes a rectangular cylindrical case in which one surface is opened and a sound hole for introducing sound into the bottom surface is formed; A ring diaphragm that can be inserted into the rectangular cylindrical case; Ring-shaped thin spacers; Cylindrical insulating ring with upper and lower openings; A disk-shaped back plate in which sound holes are formed; An annular conductive ring for electrically connecting the back plate to the circuit board; The sound hole for the rear sound is formed in the center, and components (IC, MLCC) are mounted on one side and the rectangular plate type PCB is formed on the other side. The diaphragm, spacer, insulation ring, back plate, and conductive ring are formed in the case. After the PCB is arranged in sequence, the end of the case is characterized in that the assembled structure.

In order to achieve the above object, the microphone of another exemplary embodiment of the present invention includes a rectangular cylindrical case in which one surface is opened and a sound hole for injecting front sound into the bottom surface is formed; A ring diaphragm that can be inserted into the rectangular cylindrical case; Ring-shaped thin spacers; An annular shield ring for insulating the backplate; A disk-shaped back plate in which sound holes are formed; An integrated base having a conductive layer formed on the inner circumferential surface of the cylindrical insulating body having upper and lower openings for providing electrical connection between the back plate and the PCB; And a rectangular plate PCB having a sound hole for rear sound in the center, a component (IC, MLCC) mounted on one surface, and a protruding terminal formed on the other surface of the diaphragm, spacers, shield rings, back plates, and the like. After the base, the PCB is arranged in sequence, characterized in that assembled to the structure of the end of the case cured.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is a perspective view of a parallelepiped condenser microphone according to the present invention.

In the directional condenser microphones 100 to 600 according to the present invention, as shown in FIG. 2, components are inserted in a parallelepiped casing, and an acoustic hole 114a is formed on the PCB surface and a main PCB is provided through the protruding terminal. It is intended to be connected to. Since the condenser microphones 100 to 600 of the present invention have a parallelepiped shape, they can easily align the direction of the components when the surface is mounted, so that the connection surface of the connection terminal of the connection terminal of the main PCB and the connection terminal of the condenser microphone is changed or changed. The problem can be solved. Such a parallelepiped condenser microphone of the present invention can be implemented with a wide variety of components, which will be described below in detail through the first to sixth embodiments of the present invention.

[First embodiment (bidirectional)]

3 is an exploded perspective view showing a first embodiment of a parallelepiped bidirectional condenser microphone according to the present invention.

Referring to FIG. 3, the bidirectional condenser microphone 100 of the present invention includes a rectangular cylindrical case 102 having one side opening and a sound hole 102a for introducing sound into the bottom surface, and a rectangular cylindrical case 102. Ring-shaped diaphragm 104 that can be inserted into the ring, a ring-shaped thin spacer (106), a cylindrical insulating ring 108 of the upper and lower openings, a disk-shaped back plate 110 formed with a sound hole (110a), An annular conductive ring 112 for electrically connecting the back plate 110 to the circuit board (PCB) 114, a sound hole 114a for the rear sound is formed in the center portion, and parts (IC, MLCC) are mounted on one surface. And a rectangular plate-shaped PCB 114 having a protruding terminal 116 formed on the other surface thereof. Here, the diaphragm 104 is composed of a polar ring 104a for electrical connection with the case 102 and a vibrating membrane 104b vibrated by sound pressure, and the back plate 110 is fused with an organic film on a metal plate. And electrets are formed on the organic film.

Second Embodiment (Bidirectional)

Figure 4 is an exploded perspective view showing a second embodiment of a parallelepiped bidirectional condenser microphone according to the present invention.

Referring to FIG. 4, the bidirectional condenser microphone 200 according to the present invention includes a rectangular cylindrical case 202 and a rectangular cylindrical case 202 in which one surface is opened and a sound hole 202a for introducing sound into the bottom surface is formed. The diaphragm 204 having a rectangular outer circumferential surface and a circular diaphragm portion of the inner circumference, a spacer having a rectangular outer circumferential surface and a circular inner circumferential surface, and a circular cylindrical insulating ring having an upper and lower openings 208. ), A square plate-shaped back plate 210 having a sound hole 210a, a conductive ring 212 having a rectangular outer circumferential surface and a circular inner circumferential surface for electrically connecting the back plate 210 to the circuit board 214, the center The sound hole 214a for the rear sound is formed in the part, and the components (IC, MLCC) are mounted on one surface and the rectangular plate-shaped PCB 214 formed with the protruding terminal 216 on the other surface. Here, the diaphragm 204 is composed of a polar ring 204a for electrical connection with the case 202 and a vibrating membrane 204b vibrated by sound pressure, and the back plate 210 is fused with a metal plate on an organic film. And electrets are formed on the organic film.

[Example 3 (Bidirectional)]

5 is an exploded perspective view showing a third embodiment of a parallelepiped bidirectional condenser microphone according to the present invention.

Referring to FIG. 5, the bidirectional condenser microphone 300 according to the present invention includes a rectangular cylindrical case 302 having one surface opened and a sound hole 302a for introducing sound into the bottom surface, and a rectangular cylindrical case 302. A diaphragm 304 having a rectangular outer circumferential surface and a rectangular diaphragm portion of the inner circumference, a rectangular outer circumferential surface and a rectangular inner circumferential surface, and a rectangular cylindrical insulating ring having a top and bottom openings. ), A rectangular plate-shaped back plate 310 having a sound hole 310a, a conductive ring 312 having a rectangular outer circumferential surface and a rectangular inner circumferential surface for electrically connecting the back plate 310 to the circuit board 314, the center The sound hole 314a for the rear sound is formed in the part, and the components (IC, MLCC) are mounted on one surface and the rectangular plate-shaped PCB 314 formed with the protruding terminal 316 on the other surface. Here, the diaphragm 304 is composed of a polar ring 304a for electrical connection with the case 302 and a vibrating membrane 304b vibrated by sound pressure, and the back plate 310 is fused with a metal plate on an organic film. And electrets are formed on the organic film.

[Operation of the first to third embodiments (bidirectional)]

6 is a side cross-sectional view of the assembly of the first to third embodiments of the present invention, wherein the reference numerals of the parts use the reference numbers of the first embodiment as representative numbers.

Referring to FIG. 6, the bidirectional condenser microphones 100 to 300 of the first to third embodiments include diaphragms 104a and 104b, spacers 106, insulating rings 108, and the like in a rectangular cylindrical case 102. The back plate 110, the conductive ring 112, and the square plate-shaped PCB 114 are sequentially arranged and then assembled into a structure in which the end of the case 102 is cured.

In addition, the exposed surface of the PCB 114 has a protruding terminal 116 formed to protrude from the curing surface of the case 102 so that the microphones 100 to 300 can be attached to the main PCB, for example, a PCB of a mobile phone by SMD method. . The protruding terminal 116 may be a terminal for connecting Vdd and a ground terminal, and terminals required according to additional functions.

In addition, in the second to third embodiments, the rectangular components may have a rounded shape in which corners of the sides of the square contact each other according to the convenience of manufacturing or assembling each component, and the IC mounted on the PCB may have a field effect. It consists of a transistor (JFET), an amplifier (Amplifier), an analog-to-digital (A / D) converter, or an IC that customizes an amplifier and an analog-to-digital (A / D) converter (ASIC).

Looking at the operation of the condenser microphone of the first to third embodiments (bidirectional) as follows.

The protruding terminal 116 of the condenser microphone according to the present invention is connected to the connection terminal of the main PCB so that Vdd and GND power are applied. Accordingly, in the condenser microphone 100 to 300 according to the present invention, the vibrating membrane 104b is electrically connected to the PCB 114 via the case 102 and the polar ring 104a, and the back plate 110 is electrically conductive. Electrically connected to the PCB 114 through 112.

In this state, the front sound from the external sound source is introduced into the microphone through the sound hole 102a of the case and transmitted to the vibrating membrane 104b, and the sound from the rear faces the sound hole 114a of the PCB to form a back plate ( Passed through the sound hole (110a) of the 110 is transmitted to the vibrating membrane (104b).

Accordingly, the diaphragm 104b vibrates with a positive orientation that reacts only to the front and rear sounds due to the canceling effect of the side sounds caused by the synthesized sound pressures of the front and rear sounds, thereby vibrating the membrane 104b. The distance between the back plate 110 and the back plate 110 is changed. As a result, the capacitance formed by the vibrating membrane 104b and the back plate 110 is changed to obtain a change in the electrical signal (voltage) according to sound waves. The signal is transferred to the IC mounted on the PCB 114 along the electrical connection line described above, amplified, and then output to the external circuit through the protruding terminal 116.

[Example 4 (Bidirectional)]

7 is an exploded perspective view of a fourth embodiment of a bidirectional condenser microphone according to the present invention.

Referring to FIG. 7, the bidirectional condenser microphone 400 of the present invention includes a rectangular cylindrical case 402 and a rectangular cylindrical case in which one surface is opened and a sound hole 402a is formed to introduce a front sound into the bottom surface. A circular diaphragm 404 that can be inserted into the 402, a ring-shaped spacer 406, an annular shield ring 408 for insulating the back plate 410, and a disk-shaped disc formed with a sound hole 410a. An integrated base 412 having a backing plate 410 and a conductive layer 412b formed on the inner circumferential surface of the cylindrical insulating body 412a having a top and bottom openings for providing an electrical connection between the backplate 410 and the PCB 414. ), The sound hole 414a for the rear sound is formed in the center portion, and the components (IC, MLCC) are mounted on one surface and the rectangular plate-shaped PCB 414 having the protruding terminal 416 formed on the other surface. Here, the diaphragm 404 is composed of a polar ring 404a for electrical connection with the case 402 and a vibrating membrane 404b vibrated by sound pressure, and the back plate 410 is fused with an organic film on a metal plate. And electrets are formed on the organic film. The integrated base 412 forms a hollow cylindrical insulating body 412a as a PCB substrate by using a PCB technology, and then conducts a metal plating layer to have an outer diameter smaller than the outer diameter on both sides and the inner circumferential surface of the insulating body 412a. The layer 412b is formed. As described above, the integrated base 412 according to the present invention includes a first base having a conventional insulation function and a second base having a conductive function as one integrated base. At this time, the outer diameter of the metal plating layer should be smaller than the outer diameter of the insulating body so as not to be in electrical contact with the case. Here, the insulating body 412a may be implemented with an insulator printed substrate of glass epoxy, resin, or PVC.

In addition, although not shown in detail in the drawing, the insulating body 412a functions as an insulating function, and a metal plating layer is formed on one surface of the insulating body 412a in contact with the back plate 410 and the other surface in contact with the PCB 414. After that, the upper and lower metal plating layers may be connected through through holes or via holes to provide conductive functions by allowing the metal plating layers on both sides to be conductive.

Fifth Embodiment (bidirectional)

8 is an exploded perspective view of a fifth embodiment of a bidirectional condenser microphone according to the present invention.

Referring to FIG. 8, the condenser microphone 500 of the present invention includes a rectangular cylindrical case 502 having one surface opened and a sound hole 502a for introducing sound into the bottom surface, and a rectangular cylindrical case 502. The diaphragm 504 having a rectangular outer circumferential surface that can be inserted into the diaphragm and a diaphragm portion of the inner circumferential surface also has a rectangular shape, a rectangular ring type for insulating the spacer 506 having a rectangular outer circumferential surface and a rectangular inner circumferential surface, and a back plate 510. Electrical shielding between the back plate 510 and the PCB 514 on the inner circumferential surface of the shield plate 508, the square plate-shaped back plate 510 having the sound hole 510a, and the upper and lower square cylindrical insulation bodies 512a. An integrated base 512 having a conductive layer 512b for providing a connection, a sound hole 514a for a rear sound is formed in the center portion, and components (IC, MLCC) are mounted on one surface thereof, and a protruding terminal 516 on the other surface thereof. Is composed of a rectangular plate-shaped PCB 514 is formed.

Sixth Example (Bidirectional)

9 is an exploded perspective view of a sixth embodiment of a bidirectional condenser microphone according to the present invention;

Referring to FIG. 9, the bidirectional condenser microphone 600 of the present invention includes a rectangular cylindrical case 602 having one surface open and a sound hole 602a for introducing sound into the bottom surface, and a rectangular cylindrical case 602. The outer circumferential surface that can be inserted into the square and the inner diaphragm diaphragm portion is a circular diaphragm 604, the outer circumferential surface is a rectangular spacer (circr: 606), the outer peripheral surface for insulating the back plate 610 is A back plate (610) having a rectangular and inner circumferential surface, a circular back plate 610 having a sound hole 610a, and an inner circumferential surface of the insulating body 612a having an upper and lower openings and a rectangular outer circumferential surface and a cylindrical inner circumferential surface. An integrated base 612 having a conductive layer 612b for providing electrical connection between the 610 and the PCB 614, a sound hole 614a for the rear sound is formed in the center and a part (IC, MLCC) on one side. ) Is mounted and the protruding terminal 616 is provided on the other side. Generated consists of the PCB (614) of rectangular shape.

[Operation of Example 4-6 Example (Bidirectional)]

10 is a side cross-sectional view of the assembly of the fourth to sixth embodiments of the present invention, in which reference numerals are used for the reference numerals of the fourth embodiment.

Referring to FIG. 10, the bidirectional condenser microphones 400 to 600 of the fourth to sixth embodiments include diaphragms 404a and 404b, spacers 406, shield rings 408, in a rectangular cylindrical case 402. The back plate 410, the integrated base 412, and the rectangular plate-shaped PCB 414 are sequentially arranged and assembled into a structure in which the end of the case 402 is cured.

In addition, the exposed surface of the PCB 414 has a protruding terminal 416 formed to protrude from the curing surface of the case 402 so that the microphones 400 to 600 can be attached to the main PCB, for example, a PCB of a mobile phone by SMD method. . The protruding terminal 416 may be a terminal for the Vdd connection, a ground terminal, and terminals required according to additional functions.

In addition, in the fourth to sixth embodiments, the rectangular components may have a round shape in which corners of the sides of the square contact each other according to the convenience of manufacturing or assembling each component, and the IC mounted on the PCB may include an amplifier ( It consists of an IC or an analog-to-digital (A / D) converter or an IC that customizes an amplifier and an analog-to-digital (A / D) converter.

Looking at the operation of the condenser microphone of the fourth to sixth embodiments as follows.

The protruding terminal 416 of the condenser microphone according to the present invention is connected to the connection terminal of the main PCB so that Vdd and GND power are applied. Accordingly, in the condenser microphones 400 to 600 according to the present invention, the vibrating membrane 404b is electrically connected to the PCB 414 via the case 402 and the polar ring 404a, and the back plate 410 is integrated base. It is electrically connected to the PCB 414 through the conductive layer 412b of 412.

In such a state, the front sound from the external sound source is introduced into the microphone through the sound hole 402a of the case and transmitted to the vibrating membrane 404b, and the sound from the rear is passed through the sound hole of the PCB 414a. Passed through the sound hole 410a of the 410 is transmitted to the vibrating membrane 404b.

Therefore, the diaphragm 404b vibrates with a positive orientation that reacts only to the front and rear sounds due to the canceling effect of the side sounds by the synthesized sound pressure of the front and rear sounds, and thus vibrating membrane 404b. The distance between the back plate 410 and the back plate 410 is changed. As a result, the capacitance formed by the vibrating membrane 404b and the back plate 410 is changed to obtain a change in the electrical signal (voltage) according to sound waves. The signal is transmitted to the IC mounted on the PCB 414 along the electrical connection line, amplified, and then output to the external circuit through the protruding terminal 416.

The unidirectional condenser microphones 100 to 600 according to the present invention have the same configuration except that an acoustic resistor made of a metal sintered body having micropores is inserted into the back plate in the configuration of the bidirectional condenser microphone described above. . Such a parallelepiped unidirectional condenser microphone of the present invention can be implemented with a wide variety of components, which will be described in detail through the following first to sixth embodiments.

[First embodiment (unidirectional)]

Fig. 11 is an exploded perspective view showing a first embodiment of a parallelepiped condenser microphone according to the present invention.

Referring to FIG. 11, the bidirectional condenser microphone 100 of the present invention includes a rectangular cylindrical case 102 having one side opening and a sound hole 102a for introducing sound into the bottom surface, and a rectangular cylindrical case 102. Ring-shaped diaphragm 104 that can be inserted into the ring, a ring-shaped thin spacer (106), a cylindrical insulating ring 108 of the upper and lower openings, a disk-shaped back plate 110 formed with a sound hole (110a), An annular conductive ring 112 for electrically connecting the acoustic resistor 111 and the back plate 110 to the circuit board (PCB) 114 via the acoustic resistor 111, and the sound hole 114a for the rear sound at the center portion. Is formed, and components (IC, MLCC) are mounted on one surface thereof, and a rectangular plate-shaped PCB 114 having protruding terminals 116 formed on the other surface thereof.

Second Embodiment (unidirectional)

12 is an exploded perspective view showing a second embodiment of a parallelepiped unidirectional condenser microphone according to the present invention.

Referring to FIG. 12, the bidirectional condenser microphone 200 of the present invention includes a rectangular cylindrical case 202 having one surface opened and a sound hole 202a for introducing sound into the bottom surface, and a rectangular cylindrical case 202. The diaphragm 204 having a rectangular outer circumferential surface and a circular diaphragm portion of the inner circumference, a spacer having a rectangular outer circumferential surface and a circular inner circumferential surface, and a circular cylindrical insulating ring having an upper and lower openings 208. ), The outer circumferential surface for electrically connecting the square plate-shaped back plate 210, the acoustic resistor 211, and the back plate 210 to the circuit board 214 via the acoustic resistor 211 is formed in a rectangular shape. And a conductive ring 212 having a circular inner circumferential surface, a sound hole 214a for a rear sound is formed in the center portion, and a component (IC, MLCC) is mounted on one surface and a protruding terminal 216 is formed on the other surface. And 214. Here, the diaphragm 204 is composed of a polar ring 204a for electrical connection with the case 202 and a vibrating membrane 204b vibrated by sound pressure, and the back plate 210 is fused with a metal plate on an organic film. And electrets are formed on the organic film.

Third Embodiment (unidirectional)

Figure 13 is an exploded perspective view showing a third embodiment of a parallelepiped unidirectional condenser microphone according to the present invention.

Referring to FIG. 13, the condenser microphone 300 of the present invention includes a rectangular cylindrical case 302 having one side opening and a sound hole 302a for introducing sound into the bottom surface, and a rectangular cylindrical case 302. A diaphragm 304 having a rectangular outer circumferential surface that can be inserted into the diaphragm and a diaphragm portion of the inner circumference also having a rectangular shape, a spacer having a rectangular outer circumferential surface and a rectangular inner circumferential surface, and a rectangular cylindrical insulating ring having an upper and lower openings opened The outer circumferential surface for electrically connecting the square plate-shaped back plate 310, the acoustic resistor 311, and the back plate 310 to the circuit board 314 via the acoustic resistor 311 is formed in a rectangular shape. Rectangular conductive ring 312 in the inner circumferential surface, the sound hole 314a for the rear sound is formed in the center portion, the component (IC, MLCC) is mounted on one surface and the rectangular plate-shaped PCB (316) formed with the protruding terminal 316 on the other surface ( 314). Here, the diaphragm 304 is composed of a polar ring 304a for electrical connection with the case 302 and a vibrating membrane 304b vibrated by sound pressure, and the back plate 310 is fused with a metal plate on an organic film. And electrets are formed on the organic film.

[Operation of the first to third embodiments (unidirectional)]

Fig. 14 is a side cross-sectional view of the assembly of the first to third embodiments of the present invention, wherein the reference numerals of the parts use the reference numbers of the first embodiment as representative numbers.

Referring to FIG. 14, the unidirectional condenser microphones 100 to 300 of the first to third embodiments include diaphragms 104a and 104b, spacers 106, insulating rings 108, and the like in a rectangular cylindrical case 102. The back plate 110, the acoustic resistor 111, the conductive ring 112, and the square plate-shaped PCB 114 are sequentially arranged and then assembled into a structure in which the end of the case 102 is cured.

In addition, the exposed surface of the PCB 114 has a protruding terminal 116 formed to protrude from the curing surface of the case 102 so that the microphones 100 to 300 can be attached to the main PCB, for example, a PCB of a mobile phone by SMD method. . The protruding terminal 116 may be a terminal for connecting Vdd and a ground terminal, and terminals required according to additional functions.

In addition, in the first to third embodiments, the rectangular components may have a rounded shape in which corners of the sides of the square contact each other according to the convenience of manufacturing or assembling each component, and the IC mounted on the PCB may have a field effect. It consists of a transistor (JFET), an amplifier (Amplifier), an analog-to-digital (A / D) converter, or an IC that customizes an amplifier and an analog-to-digital (A / D) converter (ASIC).

Looking at the operation of the unidirectional condenser microphone of the first to third embodiments as follows.

The protruding terminal 116 of the condenser microphone according to the present invention is connected to the connection terminal of the main PCB so that Vdd and GND power are applied. Accordingly, in the condenser microphone 100 to 300 according to the present invention, the vibrating membrane 104b is electrically connected to the PCB 114 via the case 102 and the polar ring 104a, and the back plate 110 is an acoustic resistor. Electrically connected to the PCB 114 through the 111 and the conductive ring 112.

In such a state, the front sound from the external sound source is introduced into the microphone through the sound hole 102a of the case and transmitted to the vibrating membrane 104b, and the sound from the rear is directed to the sound hole 114a of the PCB to form an acoustic resistor ( After the attenuation or phase is converted at 111, the sound is transmitted to the vibrating membrane 104b through the sound hole 110a of the back plate 110. At this time, the rear sound is attenuated by the acoustic resistor 111 so that the vibration membrane 104b reacts only with the front sound.

Therefore, the vibrating membrane 104b vibrates by the sound pressure of the front sound, and thus, the distance between the vibrating membrane 104b and the back plate 110 is changed. As a result, the vibrating membrane 104b and the back plate 110 are changed. The capacitance formed by this is changed to obtain a change in the electrical signal (voltage) according to the sound wave, which is transmitted to the IC mounted on the PCB 114 along the electrical connection line, amplified, and then protruded. It is output to an external circuit through 116.

[Example 4 (unidirectional)]

15 is an exploded perspective view of a fourth embodiment of a unidirectional condenser microphone according to the present invention.

Referring to FIG. 15, the unidirectional condenser microphone 400 of the present invention includes a rectangular cylindrical case 402 having one surface opened and a sound hole 402a for introducing front sound into the bottom surface, and a rectangular cylindrical case ( A circular diaphragm 404 that can be inserted into the 402, a ring-shaped spacer 406, an annular shield ring 408 for insulating the back plate 410, and a disk-shaped disc formed with a sound hole 410a. A conductive layer 412b for providing an electrical connection between the back plate 410 and the PCB 414 on the inner circumferential surface of the back plate 410, the acoustic resistor 411, and the cylindrical insulating body 412 a having an upper and lower openings. The formed integrated base 412, the sound hole 414a for the rear sound is formed in the center portion, the component (IC, MLCC) is mounted on one surface and the rectangular plate-shaped PCB 414 formed with the protruding terminal 416 on the other surface Consists of. Here, the diaphragm 404 is composed of a polar ring 404a for electrical connection with the case 402 and a vibrating membrane 404b vibrated by sound pressure, and the back plate 410 is fused with an organic film on a metal plate. And electrets are formed on the organic film. The integrated base 412 forms a hollow cylindrical insulating body 412a as a PCB substrate by using a PCB technology, and then conducts a metal plating layer to have an outer diameter smaller than the outer diameter on both sides and the inner circumferential surface of the insulating body 412a. The layer 412b is formed.

Fifth Embodiment (unidirectional)

16 is an exploded perspective view of a fifth embodiment of a unidirectional condenser microphone according to the present invention.

Referring to FIG. 16, the unidirectional condenser microphone 500 of the present invention includes a rectangular cylindrical case 502 having one surface opened and a sound hole 502a for introducing sound into the bottom surface, and a rectangular cylindrical case 502. The diaphragm 504, which has a rectangular outer circumferential surface and a rectangular diaphragm portion of the inner circumference, may also be inserted into a square plate. The back plate 510 and the PCB on the inner circumferential surface of the rectangular plate-shaped back plate 510 having the shield ring 508, the sound hole 510 a, the acoustic resistor 511, and the rectangular cylindrical insulating body 512a having the upper and lower sides thereof open. An integrated base 512 having a conductive layer 512b for providing an electrical connection therebetween, a sound hole 514a for a rear sound is formed in the center portion, and parts (IC, MLCC) are mounted on one surface thereof. It consists of a square plate-shaped PCB 514 formed with a protruding terminal 516 on the other side There is.

Here, the diaphragm 504 is composed of a polar ring 504a for electrical connection with the case 502 and a vibrating membrane 504b vibrated by sound pressure, and the back plate 510 is fused with an organic film on a metal plate. And electrets are formed on the organic film. In addition, the integrated base 512 forms a hollow cylindrical insulating body 512a as a PCB substrate using PCB technology, and then challenges the metal plating layer to have an outer diameter smaller than the outer diameter on both sides and the inner circumferential surface of the insulating body 512a. The layer 512b is formed.

Sixth Embodiment (unidirectional)

17 is an exploded perspective view of a sixth embodiment of a unidirectional condenser microphone according to the present invention.

Referring to FIG. 17, the unidirectional condenser microphone 600 of the present invention includes a rectangular cylindrical case 602 having one surface open and a sound hole 602a for introducing sound into the bottom surface, and a rectangular cylindrical case 602. The outer circumferential surface that can be inserted into the square and the inner diaphragm diaphragm portion is a circular diaphragm 604, the outer circumferential surface is a rectangular spacer (circr: 606), the outer peripheral surface for insulating the back plate 610 is A back plate (610) having a rectangular and inner circumferential surface, a circular back plate 610 having a sound hole 610a, and an inner circumferential surface of the insulating body 612a having an upper and lower openings and a rectangular outer circumferential surface and a cylindrical inner circumferential surface. An integrated base 612 having a conductive layer 612b for providing electrical connection between the 610 and the PCB 614, a sound hole 614a for the rear sound is formed in the center and a part (IC, MLCC) on one side. ) Is mounted and the protruding terminal 616 is provided on the other side. It consists of a rectangular plate-shaped PCB 614 formed.

Here, the diaphragm 604 is composed of a polar ring 604a for electrical connection with the case 602 and a vibrating membrane 604b vibrated by sound pressure, and the back plate 610 is fused with an organic film on a metal plate. And electrets are formed on the organic film. In addition, the integrated base 612 forms a hollow cylindrical insulating body 612a as a PCB substrate using PCB technology, and then conducts the metal plating layer to have an outer diameter smaller than the outer diameter on both sides and the inner circumferential surface of the insulating body 612a. Layer 612b is formed. As described above, the integrated base 612 according to the present invention includes a first base having a conventional insulation function and a second base having a conductive function as one integrated base.

[Operation of Example 4-6 (Single Direction)]

18 is a side cross-sectional view of the assembly according to the fourth to sixth embodiments of the present invention, in which the reference numerals of the parts use the reference numbers of the fourth embodiment as representative numbers.

18, the unidirectional condenser microphones 400 to 600 of the fourth to sixth embodiments include diaphragms 404a and 404b, spacers 406, shield rings 408, in a rectangular cylindrical case 402. The back plate 410, the acoustic resistor 411, the integrated base 412, and the rectangular plate-shaped PCB 414 are sequentially arranged and assembled into a structure in which the end of the case 402 is cured.

In addition, the exposed surface of the PCB 414 has a protruding terminal 416 formed to protrude from the curing surface of the case 402 so that the microphones 400 to 600 can be attached to the main PCB, for example, a PCB of a mobile phone by SMD method. . The protruding terminal 416 may be a terminal for the Vdd connection, a ground terminal, and terminals required according to additional functions.

In addition, in the fourth to sixth embodiments, the rectangular components may have a round shape in which corners of the sides of the square contact each other according to the convenience of manufacturing or assembling each component, and the IC mounted on the PCB may include an amplifier ( It consists of an IC or an analog-to-digital (A / D) converter or an IC that customizes an amplifier and an analog-to-digital (A / D) converter.

Looking at the operation of the condenser microphone of the fourth to sixth embodiments as follows.

The protruding terminal 416 of the condenser microphone according to the present invention is connected to the connection terminal of the main PCB so that Vdd and GND power are applied. Accordingly, in the condenser microphones 400 to 600 according to the present invention, the vibrating membrane 404b is electrically connected to the PCB 414 via the case 402 and the polar ring 404a, and the back plate 410 is an acoustic resistor. Electrically connected to the PCB 414 through the conductive layer 412b of the integrated base 412 and 411.

In this state, the front sound from the external sound source is introduced into the microphone through the sound hole 402a of the case and transmitted to the vibrating membrane 404b, and the sound from the rear passes through the sound hole of the PCB 414a. Attenuation or phase delay at 411 is transmitted to the vibrating membrane 404b through the sound hole 410a of the back plate 410. At this time, the rear sound is attenuated by the acoustic resistor 411 so that the vibration membrane 404b reacts only with the front sound.

Therefore, the vibrating membrane 404b vibrates by the sound pressure of the front sound, and thus the distance between the vibrating membrane 404b and the back plate 410 is changed, and as a result, the vibrating membrane 404b and the back plate 410 are changed. The capacitance formed by this is changed to obtain a change in the electrical signal (voltage) according to the sound wave, which is transferred to the IC mounted on the PCB 414 along the electrical connection line and amplified, and then the protruding terminal It is output to an external circuit through 416.

On the other hand, in the above embodiments, the bottom center portion of the case 202 is used to accurately pick-up the parallelepiped microphone from the tape & reel to a vacuum chuck for surface mount (SMD). It is important to note that no sound holes are formed because of the location.

As described above, the parallelepiped condenser microphone according to the present invention has directivity and can easily align the connection terminal by checking the direction of the component in the surface mount (SMD) process. There is an effect that the connection failure of the connection surface of the connection terminal of the microphone or the direction (polarity) is changed can be reduced.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. I can understand that you can.

1 is a schematic diagram showing a conventional general directional condenser microphone;

2 is a perspective view of a parallelepiped condenser microphone according to the present invention;

3 is an exploded perspective view of a first embodiment of a bidirectional condenser microphone according to the present invention;

4 is an exploded perspective view of a second embodiment of a bidirectional condenser microphone according to the present invention;

5 is an exploded perspective view of a third embodiment of a bidirectional condenser microphone according to the present invention;

6 is a side cross-sectional view of the assembly of the first to third embodiments of the present invention;

7 is an exploded perspective view of a fourth embodiment of a bidirectional condenser microphone according to the present invention;

8 is an exploded perspective view of a fifth embodiment of a bidirectional condenser microphone according to the present invention;

9 is an exploded perspective view of a sixth embodiment of a bidirectional condenser microphone according to the present invention;

10 is a side cross-sectional view of the assembly of the fourth to sixth embodiments of the present invention;

11 is an exploded perspective view of a first embodiment of a unidirectional condenser microphone according to the present invention;

12 is an exploded perspective view of a second embodiment of a unidirectional condenser microphone according to the present invention;

13 is an exploded perspective view of a third embodiment of a unidirectional condenser microphone according to the present invention;

14 is a side cross-sectional view of the assembly of the first to third embodiments of the present invention;

15 is an exploded perspective view of a fourth embodiment of a unidirectional condenser microphone according to the present invention;

16 is an exploded perspective view of a fifth embodiment of a unidirectional condenser microphone according to the present invention;

17 is an exploded perspective view of a sixth embodiment of a unidirectional condenser microphone according to the present invention;

18 is a side cross-sectional view of the assembly of the fourth to sixth embodiments of the present invention.

* Explanation of symbols for main parts of the drawings

100,200,300,400,500,600: condenser microphone

102,202,302,402,502,602: case

412,512,612: integrated base

Claims (14)

A rectangular cylindrical case 102 having one surface opened and a sound hole 102a for introducing sound to the bottom surface; A ring-shaped diaphragm 104 that can be inserted into the case 102; Ring-shaped thin spacers 106; Cylindrical insulating ring 108, the upper and lower openings; A disk-shaped back plate 110 having a sound hole 110a formed therein; An annular conductive ring 112 for electrically connecting the back plate 110 to a circuit board (PCB) 114; And The sound hole 114a for the rear sound is formed in the center part, and components (IC, MLCC) are mounted on one surface, and the PCB 114 is formed of a square plate shape having a protruding terminal 116 formed on the other surface. The diaphragm 104, the spacer 106, the insulating ring 108, the back plate 110, the conductive ring 112, and the PCB 114 are sequentially arranged in the case, and the end of the case is cured. Parallel hexahedral directional condenser microphone, characterized in that assembled. A rectangular cylindrical case 202 having one surface opened and a sound hole 202a for introducing sound to the bottom surface; A diaphragm 204 having a rectangular outer circumferential surface that can be inserted into the case 202 and a circular diaphragm portion of the inner circumference; A spacer 206 having a rectangular outer circumferential surface and a circular inner circumferential surface; A rectangular cylindrical insulating ring having an upper and lower surface opened therein; Square plate-shaped back plate 210 formed with a sound hole (210a); A conductive ring 212 having a rectangular outer circumferential surface and a circular inner circumferential surface for electrically connecting the back plate 210 to the circuit board 214; And The sound hole 214a for the rear sound is formed in the center part, and components (IC, MLCC) are mounted on one surface, and the PCB 214 is formed in a square plate shape in which a protruding terminal 216 is formed on the other surface. And the diaphragm and the spacer, the insulating ring, the back plate, the conductive ring, and the PCB are sequentially arranged in the case, and then assembled into a structure in which the end of the case is cured. A rectangular cylindrical case 302 having one surface opened and a sound hole 302a for introducing sound to the bottom surface; A diaphragm 304 having an outer circumferential surface that can be inserted into the case 302 and a diaphragm of the inner circumference of the inner diaphragm; A spacer 306 having a rectangular outer circumferential surface and a rectangular inner circumferential surface; A square cylindrical insulating ring having an upper and lower surface opened therein; Square plate-shaped back plate 310 formed with a sound hole (310a); A conductive ring having a rectangular outer circumferential surface and a rectangular inner circumferential surface for connecting the back plate 310 to the circuit board 314 electrically; And The sound hole 314a for the rear sound is formed in the center part, and the components (IC, MLCC) are mounted on one surface and the rectangular plate-shaped PCB 314 formed with the protruding terminal 316 on the other surface. And the diaphragm and the spacer, the insulating ring, the back plate, the conductive ring, and the PCB are sequentially arranged in the case, and then assembled into a structure in which the end of the case is cured. The method of claim 1, wherein the microphone is A parallelepiped directional condenser microphone, further comprising an acoustic resistor for attenuating or delaying rear sounds on the rear surface of the back plate. The parallelepiped directional capacitor according to any one of claims 1 to 3, wherein each of the rectangular components has a rounded shape in which corners of the quadrilateral sides of the quadrangles have a round shape according to manufacturing convenience or assembly convenience of each component. microphone. The parallelepiped directional condenser microphone according to any one of claims 1 to 3, wherein each of the components can be replaced by changing the corresponding components according to the convenience of manufacturing the components or the convenience of assembly. A rectangular cylindrical case 402 having one surface opened and a sound hole 402a formed therein for introducing front sound to the bottom surface; A ring-shaped diaphragm 404 that can be inserted into the case 402; Ring-shaped thin spacers 406; An annular shield ring 408 for insulating the backplate 410; A disk-shaped back plate 410 having a sound hole 410a formed therein; An integrated base 412 having a conductive layer 412b for providing an electrical connection between the back plate 410 and the PCB 414 on the inner circumferential surface of the cylindrical insulating body 412a having an upper and lower openings; And The sound hole 414a for the rear sound is formed in the center part, and a component (IC, MLCC) is mounted on one surface and a rectangular plate-shaped PCB 414 having a protruding terminal 416 formed on the other surface. And the diaphragm, spacer, shield ring, back plate, integrated base, and PCB are sequentially arranged in the case, and assembled into a structure in which the end of the case is cured. A rectangular cylindrical case 502 having one surface opened and a sound hole 502a for introducing sound to the bottom surface; A diaphragm 504 having an outer circumferential surface that may be inserted into the case 502 and a vibrating membrane portion of the inner circumference also having a rectangular shape; A spacer 506 having a rectangular outer circumferential surface and a rectangular inner circumferential surface; A square ring-shaped shield ring 508 for insulating the back plate 510; A square plate-shaped back plate 510 having a sound hole 510a formed therein; An integrated base 512 having a conductive layer 512b for providing an electrical connection between the back plate 510 and the PCB 514 on the inner circumferential surface of the rectangular cylindrical body 512a having an upper and lower openings; And The sound hole 514a for the rear sound is formed in the center part, and a component (IC, MLCC) is mounted on one surface and the square plate-shaped PCB 514 is formed with the protruding terminal 516 on the other surface. And the diaphragm, spacer, shield ring, back plate, integrated base, and PCB are sequentially arranged in the case, and assembled into a structure in which the end of the case is cured. A rectangular cylindrical case 602 having one surface opened and a sound hole 602a for introducing sound into the bottom surface; A diaphragm 604 having a rectangular outer circumferential surface that can be inserted into the case 602 and a circular diaphragm portion of the inner circumference; A spacer 606 having a rectangular outer circumferential surface and a circular inner circumferential surface; A shield ring 608 having a rectangular outer circumferential surface and a circular inner circumferential surface for insulating the back plate 610; A disk-shaped back plate 610 in which sound holes 610a are formed; An integrated base 612 having a conductive layer 612b formed on the inner circumferential surface of the insulating body 612a having an upper and lower opening, a rectangular outer circumferential surface, and a cylindrical inner circumferential surface to provide an electrical connection between the back plate 610 and the PCB 614. ); And The sound hole 614a for the rear sound is formed in the center part, and components (IC, MLCC) are mounted on one surface and a rectangular plate-shaped PCB 614 is formed on the other surface. And the diaphragm, spacer, shield ring, back plate, integrated base, and PCB are sequentially arranged in the case, and assembled into a structure in which the end of the case is cured. The microphone of claim 7, wherein the microphone is A parallelepiped directional condenser microphone, further comprising an acoustic resistor for attenuating or delaying rear sounds on the rear surface of the back plate. The method according to any one of claims 7 to 9, wherein the integrated base, A parallelepiped directional condenser microphone, characterized in that the conductive pattern formed on the upper and lower surfaces of the insulating body is connected to a through hole or a via hole formed in the insulating body. 10. The parallelepiped directional capacitor according to any one of claims 7 to 9, wherein the rectangular components have rounded corners at which edges of the squares meet each other according to manufacturing convenience or assembly convenience of each component. microphone. 10. The parallelepiped directional condenser microphone according to any one of claims 7 to 9, wherein each of the components can be replaced by changing the corresponding components according to the convenience of manufacturing the components or the convenience of assembly. 10. The casing according to any one of claims 1 to 3 or 7 to 9, wherein the case has no sound hole as a position for the bottom surface center to pick up from the tape & reel for surface mounting. A parallelepiped directional condenser microphone.