KR20050081717A - Light emitting diode package - Google Patents

Abstract

The present invention discloses a light emitting diode package capable of miniaturizing a light emitting diode package and expanding a soldering area, thereby preventing solder failure and damage to a light emitting portion of the package. The disclosed invention has an electrode lead formed on both sides and an upper surface on which a reflecting plate is formed; And a lower surface having electrode leads formed at both sides thereof to correspond to the electrode leads of the upper surface, and having a light emitting diode mounted at the center thereof.

Here, the upper surface and the lower surface are bonded in a vertical stack form to form a package, the Ag plate is coated on the reflecting plate formed on the upper surface to improve the light reflection efficiency, the electrode lead on the lower surface It is characterized in that the extension further includes.

Description

 Light Emitting Diode Package {LIGHT EMITTING DIODE PACKAGE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode (Light Emitting Diode) package, and more particularly, a light emitting diode capable of miniaturizing a package while allowing a soldering area to be expanded, thereby preventing poor soldering and damage to a light emitting part of the package. It's about packages.

In general, an LED is also called a light emitting diode, which is a device used to transmit and receive an electric signal by converting an electric signal into an infrared, visible or light form using the characteristics of a compound semiconductor.

Usually, the use range of LED is used in home appliances, remote controllers, electronic signs, indicators, and various automation devices, and the types are largely divided into Infrared Emitting Diode (IRD) and Visible Light Emitting Diode (VLED).

The structure of the LED is an N-type GaN layer is formed on the sapphire substrate, N-metal on one side of the surface of the N-type GaN layer, consisting of an active layer in addition to the region where the N-metal is formed, from the active layer Holes transmitted through P metal and electrons transmitted through N metal combine to generate light.

In particular, LEDs are becoming smaller and smaller, such as resistors, capacitors, and noise filters, due to the trend toward miniaturization and slimming of information and communication devices, and directly mounting them on a PCB (Printed Circuit Board) board. In order to make the surface mount device (Surface Mount Device) type.

Such LEDs are used in home appliances, electronic displays, and the like, depending on the intensity of light output.

Accordingly, LED lamps, which are used as display elements, are also being developed in SMD type. Such SMD can replace the existing simple lighting lamp, which is used for lighting indicators of various colors, character display and image display.

1 is a view showing the structure of a light emitting diode package according to the prior art.

As shown in FIG. 1, in the structure of the LED package 1 according to the related art, an LED chip 5 is disposed on a lead frame 10, and electrode leads 7 are disposed on both edges of the lead frame 10, respectively. ) Is arranged.

The electrode lead 7 is a terminal corresponding to the P electrode and the N electrode of the LED chip 5, and one of the two electrode leads 7 has an electrode lead 7 extended to the lead frame center region. have,

The LED chip 5 is mounted on the electrode lead 7 that is extended, and the light emitting diode 5 is electrically bonded to the electrode lead 7 by a wire 9.

Therefore, when the lead frame 10 on which the LED chip 5 is mounted is disposed on the PCB, power is applied to the LED chip 5 through the electrode leads 7 of the lead frame 10 and light is applied. Generates.

The light generated from the LED chip 5 is formed of a lens 3 is formed 10 ~ 50㎛ higher than the lead frame 10 plane, the lens 3 is molded by an epoxy resin.

The epoxy resin of the lens 3 is bonded to the light transmitting resin, it is possible to minimize the heat generated in the LED chip (5).

When the epoxy molding is finished as described above, the lead frame 10 is attached to an adhesive, and then manufactured by a process of cutting and individualizing the lead frame 10 with a diamond blade.

However, the light emitting diode package having the above structure is soldered and mounted on the PCB with the electrode lead formed on the lead frame, which has recently been miniaturized and thinned to the electrode lead that has a smaller soldering area. It will cause soldering failure.

In particular, since the size of the LED package is also reduced, a problem arises that damages the lens area of the LED package during soldering.

The present invention provides a light emitting diode package capable of miniaturizing and thinning the package as well as extending a soldering area by assembling the LED package on a top surface and a bottom surface on which the LED chip is mounted and the top surface for light reflection. The purpose is to provide.

In order to achieve the above object, a light emitting diode package according to the present invention,

Electrode leads are formed on both sides, and a reflecting plate is formed inside.

Upper surface; And

Electrode leads are formed on both sides to correspond to the electrode leads of the upper surface, and includes a lower surface on which a light emitting diode is mounted.

Here, the upper surface and the lower surface are bonded in a vertical stack form to form a package, the Ag plate is coated on the reflecting plate formed on the upper surface to improve the light reflection efficiency, the electrode lead on the lower surface It is characterized in that the extension further includes.

The light emitting diode mounted on the lower surface is mounted by wire bonding or flip chip bonding, and the upper and lower surfaces extend the electrical bonding area of the LED package by vertical bonding, and the material of the upper and lower surfaces is acrylic, A material such as ceramic, metal, SiOB, etc. may be used.

According to the present invention, the LED package is assembled with the lower surface on which the LED chip is mounted and the upper surface for light reflection up and down, so that the package can be made smaller and lighter.

In addition, the soldering area of the LED package may be expanded to prevent soldering failure.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a view showing the structure of a light emitting diode package according to the present invention.

As shown in FIG. 2, the lower surface 102b on which the LED chip 110 is mounted and the upper surface 102a for reflecting light generated from the LED chip 110 are configured in a stacked form. The LED chip 110 is mounted at 102b.

The upper surface 102a is formed with a reflecting plate 105 around the center, and first and second electrode leads 112 and 122 are formed on both sides for soldering, and the lower surface 102b is also the LED. After the chip 110 is mounted, first and second electrode leads 112 and 122 connected to each other by wire 111 bonding are formed on both sides of the lower surface 102b.

Here, a bonding pad 123 electrically connected to the first and second electrodes may be further formed on the lower surface 102b for the wire bonding.

Therefore, in the present invention, the LED chip 110 is mounted on a thin PCB, but the upper and lower surfaces 102a and 102b are assembled up and down, and both side regions are used as solder regions, thereby miniaturizing the LED package 100. Even if it is thin, the area of the electrode leads 112 and 122 for soldering can be formed large.

3 is a view showing an upper surface of the LED package according to the present invention, Figure 4 is a view showing a lower surface of the LED package according to the present invention.

As shown in FIGS. 3 and 4, the upper surface 102a of the LED package 110 is formed with a reflector plate 105 that reflects light emitted from the LED chip 110 to be generated in the LED chip 110. The light to be reflected is not lost in the reflecting plate 105, and can be reflected to the outside.

In addition, first and second electrode leads 112 and 122 are formed at both edges of the upper surface 102a for electrical contact with the electrodes on the PCB. The LED chip is electrically connected to the first electrode lead and the wire 111a.

Therefore, the thickness of the first and second electrode leads 112 and 122 is the same as the thickness of the upper surface 102a of the LED package.

In the lower surface 102b of FIG. 4, the LED chip 110 is mounted at the center of the lower surface 102b, and first and second electrode leads 112 and 122 are formed at both sides. The LED chip 110 is electrically connected to the first and second electrode leads 112 and 122 by a wire 111b.

The thicknesses of the first and second electrode leads 112 and 122 are formed to have the same thickness as that of the lower surface 102b and are stacked together with the upper surface 102a to form a light emitting diode package.

 Therefore, the first electrode lead 112 of the upper surface 102a and the first electrode lead 112 of the lower surface 102b are stacked to act as electrode leads 102a and 120b which are one of the packages. .

The upper and lower surfaces 102a and 120b may be formed of acrylic, ceramic, metal, SiOB, or the like.

5 is a view illustrating a state in which a light emitting diode package according to the present invention is soldered on a PCB.

As shown in FIG. 5, the light emitting diode package 100 shown in FIG. 2 is mounted on the PCB 200. When the LED package 100 is mounted on the PCB 200, the first electrode lead 112 and the second electrode lead 122 of the LED package 100 are respectively soldered by the solder 150. It is electrically connected to the power supply terminal of the 200.

Here, the solder 150 may cover the entire side surfaces of the first and second electrode leads 112 and 122.

The first and second electrode leads 112 and 122 serve as electrode leads 102a and 102b of the LED package 100 to supply power to the LED chip 110 mounted on the lower surface 102b. Will be supplied.

In addition, the reflector plate 105 formed on the upper surface 102a is formed to have a predetermined inclination, thereby improving the light efficiency generated by the LED chip 110 mounted on the lower surface 102b.

The surface of the reflector 105 is Ag coated to increase the light efficiency.

Therefore, in the present invention, even if the light emitting diode package is downsized, the soldering area of the electrode lead is large, and there is an advantage in that soldering failure does not occur when mounting on the PCB.

6 is a view showing another embodiment of the present invention.

As illustrated in FIG. 6, the LED chip 210 mounted on the bottom surface 202b of the LED package 300 is mounted by flip chip bonding.

The first and second electrode leads 212 and 222, which are formed on both sides of the bottom surface 202b of the LED package 300, may have the bottom surface such that the LED chip 210 may be flip chip bonded. 202b extends near the center region.

An upper surface 202a on which the reflecting plate 205 is formed is attached to the lower surface 202b on which the LED chip 210 is flip chip bonded.

The first and second electrode leads 212 and 222 formed on the upper and lower surfaces 202a and 202b of the LED package 300 are mounted on the PCB 400 and the Au, The soldering 250 is processed by Cu or the like.

Therefore, as shown in FIG. 5, since the upper and lower surfaces 202a and 202b of the LED package 300 are stacked, the first and second electrode leads 212 of the upper surface 202a may be reduced even if the package 300 is reduced in size. The 222 and the first and second electrode leads 212 and 222 of the lower surface 202b are stacked to extend the solder 250 area, thereby preventing solder failure.

Although not shown, 211 is a solder ball for flip chip bonding.

Therefore, in the present invention, the bonding structure of the LED can be applied to both wire bonding and flip chip bonding, and by stacking two different lower and upper surfaces, the soldering area can be increased while maintaining miniaturization.

As described in detail above, the present invention has the effect of miniaturizing and thinning the package by assembling the LED package is mounted on the upper surface for the light reflection and the lower surface on which the LED chip is mounted.

In addition, there is an advantage in that the solder area of the light emitting diode package can be expanded to prevent defects due to soldering.

The present invention is not limited to the above-described embodiments, and various changes can be made by those skilled in the art without departing from the gist of the present invention as claimed in the following claims.

1 is a view showing the structure of a light emitting diode package according to the prior art.

2 is a view showing the structure of a light emitting diode package according to the present invention.

3 is a view showing an upper surface of the LED package according to the present invention.

4 is a view showing the lower surface of the LED package according to the present invention.

5 is a view illustrating a state in which a light emitting diode package according to the present invention is soldered onto a PCB.

6 illustrates another embodiment of the present invention.

* Description of the symbols for the main parts of the drawings

100: light emitting diode package 102a: upper surface

102b: bottom surface 111: wire

110: LED chip 112: first electrode lead

122: second electrode lead 123: bonding pad

Claims (7)

Electrode leads are formed on both sides, and a reflecting plate is formed inside. Upper surface; And The LED package of claim 1, wherein the electrode leads are formed on both sides thereof to correspond to the electrode leads of the upper surface, and the lower surface has a light emitting diode mounted thereon. The method of claim 1, The upper surface and the lower surface is bonded to the upper and lower stacks to form a light emitting diode package, characterized in that one package. The method of claim 1, On the reflecting plate formed on the upper surface is a light emitting diode package characterized in that the Ag coating to improve the light reflection efficiency. The method of claim 1, The LED package of claim 1, further comprising an extension of the electrode lead on the lower surface. The method according to claim 1, 4, The light emitting diode package mounted on the lower surface is a light emitting diode package, characterized in that mounted by wire bonding or flip chip bonding. The method of claim 1, The upper and lower surfaces of the LED package, characterized in that for extending the electrical junction area of the LED package by the vertical junction. The method of claim 1, The upper and lower surfaces of the light emitting diode package, characterized in that a material such as acrylic, ceramic, metal, SiOB is used.