KR20050078587A - 유기 반도체 소자, 그 제조 방법 및 이를 제조하기 위한조성물 - Google Patents
유기 반도체 소자, 그 제조 방법 및 이를 제조하기 위한조성물 Download PDFInfo
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- KR20050078587A KR20050078587A KR1020040006765A KR20040006765A KR20050078587A KR 20050078587 A KR20050078587 A KR 20050078587A KR 1020040006765 A KR1020040006765 A KR 1020040006765A KR 20040006765 A KR20040006765 A KR 20040006765A KR 20050078587 A KR20050078587 A KR 20050078587A
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- Prior art keywords
- organic
- polymer
- semiconductor device
- organic semiconductor
- semiconductor layer
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 132
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- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- YYMBJDOZVAITBP-UHFFFAOYSA-N rubrene Chemical compound C1=CC=CC=C1C(C1=C(C=2C=CC=CC=2)C2=CC=CC=C2C(C=2C=CC=CC=2)=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 YYMBJDOZVAITBP-UHFFFAOYSA-N 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229940042055 systemic antimycotics triazole derivative Drugs 0.000 description 1
- 125000005207 tetraalkylammonium group Chemical group 0.000 description 1
- 238000003852 thin film production method Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- 150000001651 triphenylamine derivatives Chemical class 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/441—Thermal treatment, e.g. annealing in the presence of a solvent vapour in the presence of solvent vapors, e.g. solvent vapour annealing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
박막 형태 | Vonset (V) | 발광 휘도(cd/㎡) | 전류(mA) | |
실시예 1 | 그레이디드 졍션형 | 3.5 | 3200 | 8.5 |
비교예 1 | 그레이디드 졍션형 | - | 38 | 1.3 |
비교예 2 | 그레이디드 졍션형 | 3.5 | 1000 | 4.4 |
실시예 2 | 그레이디드 졍션형 | 5.0 | 114 | 7.4 |
실시예 3 | 단순 분산형 | 5.0 | 260 | 2.5 |
실시예 4 | 단순 분산형 | 5.0 | 45 | 12 |
실시예 5 | 그레이디드 졍션형 | 4.0 | 500 | 1.6 |
실시예 6 | 그레이디드 졍션형 | 4.0 | 307 | 2.7 |
실시예 7 | 그레이디드 졍션형 | 4.0 | 760 | 2.0 |
실시예 8 | 그레이디드 졍션형 | 4.0 | 693 | 2.4 |
실시예 9 | 그레이디드 졍션형 | 4.0 | 213 | 3.6 |
실시예 10 | 그레이디드 졍션형 | 4.0 | 66 | 3.5 |
실시예 11 | 그레이디드 졍션형 | 5.0 | 892 | 2.3 |
실시예 12 | 그레이디드 졍션형 | 4.0 | 886 | 2.8 |
Claims (38)
- 유기 용매, 이온성 염 및 유기 반도체 화합물을 포함하는 유기 화합물 용액을 기판에 코팅한 후 유기 용매를 제거하여 유기 반도체층을 형성하는 단계; 및형성된 유기 반도체층에 대하여 열-어닐닝과 전기-어닐닝을 병행하여 수행하는 단계를 포함하는 유기 반도체 소자의 제조 방법.
- 제1항에 있어서, 상기 유기 용매는 단일 용매로 구성된 것인 유기 반도체 소자의 제조 방법.
- 제1항에 있어서, 상기 유기 화합물 용액은 2종 이상의 유기 반도체 화합물 및 휘발성이 상이한 2종 이상의 유기 용매를 포함하는 것인 유기 반도체 소자의 제조 방법.
- 제3항에 있어서, 상기 유기 용매가 제거됨에 따라, 상기 2종 이상의 유기 반도체 화합물이 그 적층 방향을 따라 농도 그래디언트를 가지도록 순차적으로 적층되는 것인 유기 반도체 소자의 제조 방법.
- 제1항에 있어서, 상기 유기 반도체층은 제1 전극이 형성된 기판의 상부에 형성되며, 상기 유기 반도체층을 형성한 후, 유기 반도체층의 상부에 제2 전극을 형성하는 단계를 더욱 포함하는 유기 반도체 소자의 제조 방법.
- 제5항에 있어서, 상기 제2 전극을 형성한 후, 불활성 가스 분위기에서 밀봉 부재를 사용하여 상기 유기 반도체층 및 전극을 봉지하는 과정을 더욱 포함하는 유기 반도체 소자의 제조 방법.
- 제1항에 있어서, 상기 열-어닐닝 온도는 섭씨 35도 내지 섭씨 200도인 것인 유기 반도체 소자의 제조 방법.
- 제1항에 있어서, 상기 전기-어닐닝 과정의 바이어스 전압은 3 내지 20볼트인 것인 유기 반도체 소자의 제조 방법.
- 제1항에 있어서, 상기 이온성 염은 무기염, 유기염, 고분자염 및 이들의 혼합물로 이루어진 군으로부터 선택되는 것인 유기 반도체 소자의 제조 방법.
- 제9항에 있어서, 상기 무기염은 LiClO4, LiPF6, LiBF4, LiN(CF3 SO2)2, 리튬트리플로로메탄 트리설포네이트 및 이들의 혼합물로 이루어진 군으로부터 선택되는 것인 유기 반도체 소자의 제조 방법.
- 제9항에 있어서, 상기 유기염은 테트라 알킬, 아릴 또는 헤테로아릴 쿼터너리 암모늄염인 것인 유기 반도체 소자의 제조 방법.
- 제9항에 있어서, 상기 고분자염은 폴리스티렌설포네이트인 것인 유기 반도체 소자의 제조 방법.
- 제1항에 있어서, 상기 유기 용매는 메틸 알콜, 에틸 알콜, n-프로필 알콜, 이소프로필 알콜, n-부틸 알콜, 섹-부틸 알콜, 터트-부틸 알콜, 디메틸포름아미드, 디메틸아세트아미드, 케톤, 아세톤, 디아세톤 알콜, 케토-알콜, 디옥산, 에테르, 폴리에틸렌글리콜, 폴리프로필렌글리콜, 폴리알킬렌글리콜, 에틸렌글리콜, 프로필렌글리콜, 부틸렌글리콜, 트리에틸렌글리콜, 헥실렌글리콜, 디에틸렌글리콜, 글리세롤, 에틸렌글리콜 모노메틸에테르, 디에틸렌글리콜 메틸에테르, 트리에틸렌글리콜 모노메틸에테르, 2-피롤리돈, 톨루엔, 크실렌, 클로로벤젠, 디클로로벤젠, 클로로포름, 디클로로메탄, 디클로로에탄, 감마부틸락톤, 부틸셀로졸브, 시클로헥산, NMP(N-메틸-2-피롤리돈), 시클로헥사논, THF(테트라히드로푸란), 사염화탄소, 테트라클로로에탄, 옥틸벤젠, 도데실벤젠, 퀴놀린, 트리클로로벤젠, 니트로벤즈알데하이드, 니트로벤젠, 2황화탄소, 2-헵타논, 벤젠, 테르피네올, 부틸카르비톨아세테이트, 이온 교환수, 및 이들의 혼합물로 이루어진 군으로부터 선택되는 것인 유기 반도체 소자의 제조 방법.
- 제1항에 있어서, 상기 유기 반도체 화합물은 정공 주입, 정공 수송, 발광, 형광, 전자 수송, 및 전자 주입으로 이루어지는 군으로부터 선택되는 하나 이상의 전기 및/또는 광학적 특성을 가지는 것인 유기 반도체 소자의 제조 방법.
- 제1항에 있어서, 상기 유기 화합물 용액은 바인더 고분자 및/또는 도판트를 더욱 포함하는 것인 유기 반도체 소자의 제조 방법.
- 제15항에 있어서, 상기 바인더 고분자는 절연성 또는 전도성 고분자인 것인 유기 반도체 소자의 제조 방법.
- 제15항에 있어서, 상기 바인더 고분자는 폴리페닐렌-비닐렌, 폴리-N-비닐카르바졸, 폴리메틸메타클리레이트, 폴리플루오렌, 폴리카보네이트, 폴리에스테르 , 폴리알릴레이트, 부틸알 고분자, 폴리비닐아세탈, 디알릴프탈레이트 고분자, 아크릴 고분자, 메타크릴릭 고분자, 페놀 고분자, 에폭시 고분자, 실리콘 고분자, 폴리술폰 고분자, 요소 고분자 및 이들의 유도체로 이루어진 군으로부터 선택되는 것인 유기 반도체 소자의 제조 방법.
- 제1항에 있어서, 상기 유기 화합물 용액의 농도는 0.005 내지 30중량%인 것인 유기 반도체 소자의 제조 방법.
- 제1항에 있어서, 상기 유기 화합물 용액의 점도는 5000cp 이하인 유기 반도체 소자의 제조 방법.
- 제1항에 있어서, 상기 유기 반도체 화합물은 적색, 녹색 및 청색 발광 화합물을 포함하며, 상기 유기 용매를 제거하여 유기 반도체층을 형성하는 단계는 적색, 녹색 및 청색 발광 화합물에 대하여 각각 별개로 수행되는 것인 유기 반도체 소자의 제조 방법.
- 제1항에 있어서, 상기 유기 화합물 용액은 스핀-코팅 법, 캐스트 방법, 잉크제트 방법, 침적 방법, 및 인쇄 방법으로 이루어진 군으로부터 선택되는 습식 방법에 의하여 기판상에 도포되는 것인 유기 반도체 소자의 제조 방법.
- 유기 용매, 이온성 염 및 유기 반도체 화합물을 포함하는 유기 반도체 박막 제조용 조성물.
- 제22항에 있어서, 상기 조성물은 2종 이상의 유기 반도체 화합물 및 휘발성이 상이한 2종 이상의 유기 용매를 포함하는 것인 유기 반도체 박막 제조용 조성물.
- 제22항에 있어서, 상기 조성물은 바인더 고분자 및/또는 도판트를 더욱 포함하는 것인 유기 반도체 박막 제조용 조성물.
- 제22항에 있어서, 상기 조성물의 농도는 0.005 내지 30중량%인 것인 유기 반도체 박막 제조용 조성물.
- 제22항에 있어서, 상기 조성물의 점도는 5000cp 이하인 것인 유기 반도체 박막 제조용 조성물.
- 제1항에 따른 방법에 의하여 제조된 유기 반도체 소자.
- 양극; 음극; 및 상기 양극과 음극 사이에 개재되어 있으며, 이온성 염을 함유하는 반도체층을 포함하며,상기 양극과 상기 반도체층의 경계면에는 상기 이온성 염의 음이온 수가 상기 이온성 염의 양이온 수보다 많으며, 상기 음극과 상기 반도체층의 경계면에는 상기 이온성 염의 양이온 수가 상기 이온성 염의 음이온 수보다 많은 반도체 소자.
- 제28항에 있어서, 상기 반도체 소자는 상기 이온성 염을 함유하는 반도체층에 대하여 열-어닐닝과 전기-어닐닝을 동시에 수행하여 제조된 것인 반도체 소자.
- 제28항에 있어서, 상기 반도체층은 2종 이상의 유기 화합물이 균일하게 분산되어 있는 것인 반도체 소자.
- 제28항에 있어서, 상기 반도체층은 2종 이상의 유기 화합물이 그 적층 방향을 따라 농도 그래디언트를 가지도록 순차적으로 적층되어 있는 것인 반도체 소자.
- 제28항에 있어서, 상기 반도체층의 두께는 10 내지 1000 ㎚인 반도체 소자.
- 제28항에 있어서, 상기 양극 및 음극은 패시브 또는 액티브 매트릭스 전극 구조를 가지는 것인 반도체 소자.
- 제28항에 있어서, 상기 반도체 소자는 유기 전계발광 소자이며, 상기 유기 전계발광 소자는 텔레비전, 디지털 카메라, 컴퓨터, 노트북 컴퓨터, 이동 컴퓨터, 녹화 매체를 구비한 휴대용 재생 장치, 스크린, 게시판, 광고판, 고글형 표시장치, 자동차 표시장치, 비디오카메라, 프린터 표시장치, 원격 통신 장치, 전화기 표시장치, 및 이동 전화로 이루어지는 군으로부터 선택되는 기기에 사용되는 것인 반도체 소자.
- 양극; 음극; 및 상기 양극과 음극 사이에 개재되어 있는 반도체층을 포함하며,상기 양극과 상기 반도체층의 경계면 및 상기 음극과 상기 반도체층의 경계면 중 어느 하나 이상에는 이온성 염을 포함하는 유기 박막이 형성되어 있는 반도체 소자.
- 제35항에 있어서, 상기 유기 박막은 이온성 염이 도핑된 전도성 고분자, 또는 절연성 고분자로 이루어진 것인 반도체 소자.
- 제36항에 있어서, 상기 전도성 고분자는 폴리아닐린, 폴리(3-메틸티오펜), 폴리페닐렌술파이드, 폴리피롤 및 폴리(3,4-옥시에틸렌옥시티오펜)/폴리(스티렌술포네이트)로 이루어지는 군으로부터 선택되는 것인 반도체 소자.
- 제35항에 있어서, 상기 이온성 염의 함량은 전체 유기 박막에 대하여 0.02 내지 30 중량%이고, 상기 유기 박막의 두께는 10 내지 1000 nm 인 것인 반도체 소자.
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Cited By (4)
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KR100828870B1 (ko) * | 2005-12-20 | 2008-05-09 | 가시오게산키 가부시키가이샤 | 표시장치 및 그 제조방법 |
KR100897260B1 (ko) * | 2007-05-23 | 2009-05-14 | 제일모직주식회사 | 백색 발광 나노입자 분산액 및 이를 이용한 유기광전소자 |
KR20100040263A (ko) * | 2008-10-09 | 2010-04-19 | 제록스 코포레이션 | 반도전성 잉크 조성물 |
CN107579159A (zh) * | 2017-08-01 | 2018-01-12 | 上海天马有机发光显示技术有限公司 | 一种有机发光二极管、显示面板及显示装置 |
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JP4778660B2 (ja) | 2001-11-27 | 2011-09-21 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100828870B1 (ko) * | 2005-12-20 | 2008-05-09 | 가시오게산키 가부시키가이샤 | 표시장치 및 그 제조방법 |
KR100897260B1 (ko) * | 2007-05-23 | 2009-05-14 | 제일모직주식회사 | 백색 발광 나노입자 분산액 및 이를 이용한 유기광전소자 |
KR20100040263A (ko) * | 2008-10-09 | 2010-04-19 | 제록스 코포레이션 | 반도전성 잉크 조성물 |
CN107579159A (zh) * | 2017-08-01 | 2018-01-12 | 上海天马有机发光显示技术有限公司 | 一种有机发光二极管、显示面板及显示装置 |
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