KR20050073223A - Molding apparatus for semiconductor package - Google Patents

Abstract

The present invention relates to a semiconductor package molding apparatus, further comprising a clamp pin for supporting the lead frame when the molding compound is injected into the cavity of the molding die, and an operation means for operating the clamp pin, the molding compound injected into the cavity Tilting of the semiconductor chip or twisting of the lead frame due to the filling pressure can be prevented.

Description

Semiconductor Package Molding Equipment {MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package molding apparatus, and more particularly, to molding a lead frame in which die bonding and wire bonding have been completed. The present invention relates to a semiconductor package molding apparatus capable of preventing distortion of a frame.

In general, a semiconductor package includes a die bonding process for attaching a semiconductor chip separated on a wafer to a lead frame, and an external lead of the semiconductor chip and an inner lead of the lead frame. A wire bonding process for electrically connecting, a molding process for sealing the semiconductor chip and the network with a molding compound, and a trimming process for cutting the dam bars supporting the leads of the lead frame. ), A forming process for bending an outer lead protruding outward from the package body into a predetermined shape, and a singulation process for cutting individual semiconductor packages. Lose.

Such a molding process is usually performed by a semiconductor package molding apparatus which loads a lead frame having a semiconductor chip attached to a cavity formed in upper and lower molds and injects and fills a molding compound from the outside.

1 is a vertical sectional view showing a conventional semiconductor package molding apparatus.

As shown in the drawing, the conventional semiconductor package molding apparatus includes an upper mold 10a and a lower mold 10b which mesh with each other to form a cavity. The upper mold 10a and the lower mold 10b are each composed of a chase and a cavity bar supported by the chase. Ejector pin plates 21 are provided on the outer sides of the upper mold 10a and the lower mold 10b, respectively, and the ejector pins 20 are fixed to the ejector pin plates 21. The ejector pin 20 is inserted into the ejector hole formed in the upper mold 10a and the lower mold 10b as a protruding material. In addition, an ejector pin return pin 22 is installed on the ejector pin plate 21 to prevent a collision between upper and lower ejector pins 20, and an ejector bar 23 fixed to a base B is mounted on the ejector pin. The plate 21 is supported. In addition, an ejector spring 24 is provided on the upper plate 11a, and the ejector spring 24 elastically supports the ejector pin plate 21.

Referring to the operation of the conventional semiconductor package molding device configured as described above is as follows.

A semiconductor chip is molded by loading a lead frame (not shown) in which semiconductor chips are arranged into the lower mold 10b and lowering the upper mold 10a to inject molding compounds through a gate (not shown) while being engaged with each other. . As such, when the molding process is completed, the upper mold 10a and the lower mold 10b are separated, and the ejector pin 20 protrudes into the cavity, thereby molding the semiconductor package from the upper and lower molds 10a and 10b. Are separated.

However, in the conventional semiconductor package molding apparatus, since the wire-bonded semiconductor chip is loaded into the cavity of the upper and lower molds in a state in which the lead chip is weakly supported by an adhesive or the like, the high pressure filling pressure generated when the molding compound is injected. As a result, a chip tilt phenomenon occurs in which the position of the semiconductor chip attached to the lead frame is changed.

In addition, in general, the lead frame is made of a thin plate, the problem that the lead frame is bent or twisted when the high-pressure molding compound is injected.

In addition, when one end of the lead frame is molded in the cavity in a free end state, a more serious problem such as occurrence of a short may be caused by the chip tilt or the twist of the lead frame.

The present invention has been made to solve the above problems, an object of the present invention is to provide a semiconductor package molding apparatus that can prevent the semiconductor chip from twisting by supporting the lead frame during the injection of the molding compound into the upper and lower mold cavity To provide.

Another object of the present invention is to provide a semiconductor package molding apparatus having clamping means for supporting a lead frame during injection of a molding compound into an upper and lower mold cavity.

An object of the present invention is a semiconductor package molding apparatus for molding a lead frame to which a semiconductor chip is attached, comprising: a plate; An operation bar installed horizontally on the plate and having an inclined surface; An operation block installed to be in contact with an inclined surface of the operation bar and vertically moving by horizontal movement of the operation bar; And clamp pins interlocked with the operation block and mounted in the upper and lower mold cavities to support the lead frame when the molding compound is injected into the cavity. Is achieved.

An object of the present invention is a semiconductor package molding apparatus for molding a lead frame to which a semiconductor chip is attached, comprising: a plate; An operation bar installed horizontally on the plate and having an inclined surface; An operation block installed to be in contact with an inclined surface of the operation bar and vertically moving by horizontal movement of the operation bar; And clamping the lead frame when the molding compound is injected into the cavity, interlocking with the operation block, and clamping the lead frame when the molding compound is injected into the cavity. It is achieved by a semiconductor package molding apparatus comprising a.

The plate is characterized in that the guide block for guiding while supporting the operation bar is further installed.

A coupling hole is formed in the guide block, and a vertical hole corresponding to the coupling hole is formed in the operation block, and a coupling pin is inserted into the coupling hole and the vertical hole so that the operation block is vertically movable with respect to the guide block. It is characterized by being combined.

The upper and lower surfaces of the operation bar is characterized in that the flat roller bearing is further provided with a plurality of rollers in order to reduce the friction loss between the guide block and the operation block.

The upper and lower surfaces of the operation bar is characterized in that the stopper is further provided for limiting the moving range of the flat roller bearing.

In addition, the roller and the surface of the operating block and the guide block in contact with the upper and lower surfaces of the operating bar is characterized in that the roller is rotatably installed to reduce the friction loss with the operating bar.

The operation block is characterized in that the surface in contact with the inclined surface of the operation bar is formed to be inclined at the same angle as the inclination angle of the inclined surface.

The plate is provided with an operation bar driving means for horizontally moving the operation bar, the operation bar driving means, the fixed frame is fixed to the plate, the guide rail is provided; A ball screw rotatably installed on the fixing frame; A moving frame installed to be movable along the guide rail and having a nut part screwed to the ball screw, the moving frame being coupled to one end of the operation bar; And a motor installed in the fixed frame to impart rotational force to the ball screw.

The clamp pin is fixedly installed on a clamp pin plate supported and interlocked by the operation block, and the clamp pin plate further includes a clamp pin return pin for preventing a collision between upper and lower clamp pins.

The ejector pin is fixed to the ejector pin plate that is supported and linked to the operation block, the ejector pin plate is characterized in that the ejector pin return pin is further installed to prevent the upper and lower ejector pin collision.

Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the accompanying drawings.

In describing the embodiments, the same names and the same reference numbers will be given for the elements that perform the same function for convenience, even though the embodiments are different. In addition, for the components having a structure symmetrical to each other with one description instead of the description for the rest, and the configuration and operation already described in other embodiments will be omitted to avoid duplication.

2 is a vertical cross-sectional view illustrating a semiconductor package molding apparatus according to an embodiment of the present invention, FIG. 3 is an enlarged view of a main portion of the semiconductor package molding apparatus illustrated in FIG. 2, and FIG. 4A is a semiconductor package molding illustrated in FIG. 2. Is a plan view of the bottom mold of the apparatus, and FIG. 4B is an enlarged plan view of the "A" portion of the bottom mold shown in FIG. 4A.

As shown in the figure, the semiconductor package molding apparatus includes upper molds 100a and 101a and lower molds 100b and 101b for molding a lead frame to which semiconductor chips are attached while being engaged with each other. The upper mold (100a, 101a) and the lower mold (100b, 101b) is a cavity bar (101a, 101b) forming the cavity 102 and the chase (100a, 100b) for supporting the cavity bar (101a, 101b). Consists of. Ejector pin plates 210 are provided on the outer sides of the upper molds 100a and 101a and the lower molds 100b and 101b, respectively, and a plurality of ejector pins 200 are fixed to the ejector pin plates 210. have. The ejector pin 200 is inserted into the ejector hole 202 formed in the upper molds 100a and 101a and the lower molds 100b and 101b. In addition, the ejector pin plate 210 is provided with an ejector pin return pin 220 to prevent a collision of the upper and lower ejector pins 200. The ejector bar 230 fixed to the base B passes through the lower plate 110b and supports the ejector pin plate 210. In addition, an ejector spring 240 is installed on the upper plate 110a, and the ejector spring 240 elastically supports the ejector pin plate 210.

In addition, a gate 104 is formed in a side surface of the cavity 102, and the gate 104 communicates with the runner 106 and the port 108. When the lead frame R to which the semiconductor chip C with the wire bonding is completed is loaded in the cavity 102 by this configuration, the molding compound sequentially moves through the port 108, the runner 106, and the gate 104. The semiconductor package molding process is performed while being injected into and filled into the cavity 102 via the furnace.

Since this configuration and operation are similar to those of the conventional semiconductor package molding apparatus, detailed description thereof will be omitted.

In the present embodiment, in addition to the above-described configuration, a clamping means for supporting the lead frame R is further provided when a molding compound is injected into the cavity 102.

The clamp means is composed of a clamp pin 300, a clamp pin plate 310, a clamp pin return pin 320 and the clamp pin operating means, as shown in Figures 3, 4a and 4b.

As shown in FIGS. 3, 4A and 4B, the clamp pin 300 is installed to be movable in the clamp hole 302 formed in the upper molds 100a and 101a and the lower molds 100b and 101b. When a molding compound is injected into the cavity 102, it supports the lead frame R while coming out into the cavity 102.

The clamp pin 300 is fixed to the clamp pin plate 310 provided between the upper, lower chase (100a, 100b) and the ejector pin plate 210. The clamp pin plate 310 is elastically supported in the upper and lower chases (100a, 100b) by the clamp spring 312. In addition, the clamp hole 302 may be provided with a bush for guiding the shangdong of the clamp pin (300).

The clamp pin return pin 320 is for preventing the upper and lower clamp pin 300 from colliding, and is fixed to the clamp pin plate 310. Since the clamp pin return pin 320 is fixed to the clamp pin plate 310 similarly to the clamp pin 300, the clamp pin return pin 320 reciprocates up and down with the clamp pin 300, and has a larger diameter than the clamp pin 300. And have a great strength. In addition, the clamp pin return pin 320 is designed to be slightly longer than the clamp pin 300, because the upper and lower clamp pin 300 should be in contact or at the same time before contacting.

On the other hand, the ejector pin plate 210 and the clamp pin plate 310 is composed of a double plate of the drive plate and the cover plate.

In the present embodiment, it is assumed that four ejector pins 200 and two clamp pins 300 are provided for each cavity 102, but may be designed in various numbers and in various arrangements according to design conditions. .

5 is an exploded perspective view showing a clamp pin operating means of the semiconductor package molding apparatus shown in FIG. 2, FIG. 6 is an exploded perspective view of an operation bar, an operation block, and a guide block of the semiconductor package molding apparatus shown in FIG. 7A and 7B are combined perspective and exploded perspective views respectively illustrating operation bars of the semiconductor package molding apparatus shown in FIG. 2.

The clamp pin actuating means is a part for moving the clamp pin plate 320 up and down and includes a guide block, an actuating block 340, an actuating bar 350, and an actuating bar driving means 360.

The guide block is installed extending in the longitudinal direction on both sides of the upper, lower plates (110a, 110b), the guide body 330, the guide receiving portion 331 is formed in the lower portion, and inserted into the guide receiving portion 331 The first guide block 332 is installed and the operation block receiving portion 333 is formed, and the second guide block 334 is assembled with the first guide block 332 while supporting the operation bar 350. Consists of. Coupling holes 336 are formed through the first guide block 332 and the second guide block 334.

The operation block 340 is moved vertically by the horizontal movement of the operation bar 350, the vertical movement of the clamp pin plate 310. The surface 342 in contact with the inclined surface 352 of the operation bar 350 is formed at the same angle as the inclination angle Δ of the inclined surface 352 of the operation bar 350. However, the inclined surface 342 is not necessarily formed in the operation block 340. In addition, a vertical long hole 344 corresponding to the coupling hole 336 is formed in the operation block 340. In the present embodiment, the vertical long hole 344 is formed in an oval shape, but may be designed in various forms as long as it is formed larger than the diameter of the coupling hole 336.

The operation block 340 is coupled to the first guide block 332 and the second guide block 334 by a coupling pin 337. Since the coupling pin 337 is coupled through the coupling hole 336 and the vertical long hole 344, the operation block 340 is capable of vertical movement relative to the first guide block 332. On the other hand, the operating spring 346 is provided on the lower surface of the operation block 344. By the action of the operation spring 346, the operation block 340 is always elastically supported upwards. The actuating spring 346 provides an elastic force to the actuating block 344 while offsetting that the actuating block 340 is receiving a rotation moment by the clamp spring 312.

On the other hand, in the present embodiment is provided with a clamp spring 312 and its associated components and operating spring 346, this configuration may be omitted depending on the design conditions. In this case, the operation block 340 and the clamp pin plate 310 are manufactured in one piece or precisely processed and assembled. In addition, the clamp spring 312 is only an embodiment for supporting the clamp pin plate 310 in an elastic manner, and may be replaced with another technical configuration capable of supporting the clamp pin plate 310 in an elastic manner.

The operation bar 350 is inserted into and installed in the guide channel formed by the first guide block 332, the second guide block 334, and the operation block 340, and acts on the operation of the operation bar driving means 360. It is a member for vertically moving the operation block 340 while moving horizontally. The wedge-shaped inclined surface 352 is formed at the front and rear of the lower surface of the operation bar 350. Since the inclined surface 352 is formed as described above, the operation block 340 in contact with the inclined surface 350 is movable up and down by the horizontal movement of the operation bar 350. In the present embodiment, the inclined surface 352 is formed on the lower surface of the operation bar 350, but the inclined surface may be formed on both the upper surface or the upper and lower surfaces according to the design conditions. In addition, the inclination angle Δ may also be variously selected according to design conditions, but it is preferable to set it to about 1 °. Meanwhile, the number of the inclined surfaces 352 may also be variously selected depending on the number of the operation blocks 340.

Upper and lower surfaces of the operation bar 350 are provided with a flat roller bearing 354 provided with a plurality of rollers in order to reduce friction loss between the first guide block 332 and the operation block 340. Upper and lower surfaces of the operation bar 350 are provided with a stopper 356 for limiting the moving range of the flat roller bearing 354. An operating bar cover 358 is attached to both sides of the operating bar 350 to prevent the flat roller bearing 354 from being separated.

On the other hand, as a means for reducing the friction loss between the first guide block 332 and the operation block 340, in this embodiment a flat roller bearing 354 is adopted, as shown in Figure 7a the operating bar The rollers 359 rotatably installed on the surfaces of the operation block 340 and the first guide block 332 in contact with the upper and lower surfaces of the 350 may be installed. In addition, as shown in FIG. 8B, if contact friction does not become a problem, the operation bar 350 may be used alone.

The operation bar driving means 360 is a means for horizontally moving the operation bar 350. As shown in FIG. 5, the operation bar driving means 360 is fixedly installed on the upper and lower plates 110a and 110b, and includes a fixed frame 362 having a guide rail 363 and the fixed frame. A ball screw 364 rotatably installed at 362 and a nut portion 367 rotatably installed along the guide rail 363 and screwed to the ball screw 364 are provided. A moving frame 366 coupled to one end of the bar 350 and a motor (not shown) installed on the fixed frame 332 to impart rotational force to the ball screw 364.

In this embodiment, the operation bar driving means 360 is composed of a combination of the ball screw 364 and the nut portion 367, a general horizontal transfer mechanism such as a rack and pinion combination can be adopted according to the design conditions.

Meanwhile, in the present embodiment, the clamp pin 300 is designed to move in a state in which the operating block 340 clamps both ends of the clamp pin plate 310, but if the design condition permits the operation block 340. Clamp pin operating means including a may be designed to be installed directly on the lower surface of the clamp pin plate (310). Alternatively, the clamp pin 300 may be designed to be installed directly on the operation block 340 without the clamp pin plate 310.

Hereinafter, the operation of the clamp pin operating means will be described.

Figure 9a is a perspective view showing the operation bar driving means when the clamp pin is immersed in the clamp hole formed in the lower mold, Figure 9b is a reference showing the relative positional relationship of the operation bar, the operation block and the main guide block in the state of Figure 9a It is also. 10A is a perspective view showing the operation bar driving means when the clamp pin protrudes into the cavity to support the lead frame, and FIG. 10B is a relative positional relationship between the operation bar, the operation block and the main guide block in the state of FIG. 10A. Reference is also shown.

In order to immerse the clamp pin 300 into the clamp hole 302 formed in the lower molds 100b and 101b, as shown in FIGS. 9A and 9B, the screw ball 364 is driven clockwise to Move the operation bar 350 to the front. At this time, the relatively thick portion of the operation bar 350 is in contact with the operation block 340. Therefore, as the operation block 340 is moved directly downward, the clamp pin plate 310 clamped to the operation block 340 is moved directly downward so that the clamp pin 300 is also moved directly downward to the lower portion. It is immersed into the clamp holes 302 formed in the molds 100b and 101b.

On the contrary, in order to support the lead frame R by protruding the clamp pin 300 into the cavity 102, the screw ball 364 is driven counterclockwise as shown in FIGS. 10A and 10B. By moving the operation bar 350 to the rear. At this time, the relatively thin portion of the operation bar 350 is in contact with the operation block 340. Therefore, the clamp pin plate 310 clamped to the operation block 340 is moved upwards as the operation block 340 is moved upward by the elastic force of the operation spring 346 so that the clamp pin ( 300 is also moved upwards so that the clamp pin 300 is protruded into the cavity 102 to support the lead frame (R).

Hereinafter, the operating state of one embodiment of the present invention will be described in detail.

11A to 11H are process state diagrams illustrating a semiconductor package molding process performed by the semiconductor package molding apparatus shown in FIG. 2.

First, the lead frame R to which the semiconductor chip C is attached and the wire W bonded is loaded on the lower molds 100b and 101b, and the lower molds 100b and 101b are raised to be engaged with each other. In this case, as shown in FIGS. 9A and 9B, a relatively thick portion of the operation bar 350 comes into contact with the operation block 340, such that the clamp pin 300 is connected to the lower molds 100b and 101b. It is a state immersed in the formed clamp hole 302. At this time, the ejector pin 200 is also immersed in the ejector hole 202 (see FIG. 11A).

In this state, as shown in FIGS. 10A and 10B, when the screw ball 364 is driven counterclockwise to move the operation bar 350 to the rear, a relatively thin portion of the operation bar 350 is It comes into contact with the operation block 340. At this time, since the clamp pin plate 310 clamped to the operation block 340 is moved to the upper and lower molds 100a and 100b, the clamp pin 300 is protruded into the cavity 102 to lead the lead frame. (R) is supported (see FIG. 11B).

In this way, the clamping pin 300 firstly injects the molding compound through the gate 104 while supporting the lead frame R to fill the cavity 102 (see FIG. 11C). When the filling is completed to some extent, the clamp pin 300 is retracted to release the support of the lead frame R, and then the molding compound is secondly injected to completely fill the cavity 102 (see FIGS. 11D and 11E). . At this time, the secondary molding compound should be injected rapidly before the primary injected molding compound is cured.

When the molding compound is hardened and sufficiently firm, the lower molds 100b and 101b move downward. At this time, the upper ejector pin 200 elastically supported by the ejector spring 240 moves the lead frame R to the upper mold 100a. , 101a) (see FIGS. 11F and 11G). In this state, when the lower molds 100b and 101b move further downward, the lead frame R is lowered by the lower ejector pin 200 fixed to the ejector bar 230 fixed to the base B. The molding process is completed by separating from (100b, 101b) (see Fig. 11H).

Hereinafter, another embodiment of the present invention will be described.

12 is a vertical cross-sectional view illustrating a semiconductor package molding apparatus according to another embodiment of the present invention. FIG. 13A is a plan view of a lower mold of the semiconductor package molding apparatus illustrated in FIG. 12, and FIG. 13B is a lower mold illustrated in FIG. 13A. The planar magnification of "B" of.

As can be seen in this figure, the present embodiment is not provided with the ejector pin and the clamp pin separately, the clamp pin of the embodiment shown in Figure 2 is configured to perform the clamping and ejecting of the lead frame at the same time. That is, in the embodiment shown in FIG. 2, the configuration (ejector pin, ejector pin plate, ejector bar, ejector spring, etc.) related to the ejector pin is omitted.

The semiconductor package molding apparatus according to the present embodiment includes upper molds 100a and 101a and lower molds 100b and 101b for molding a lead frame to which a semiconductor chip is attached while being engaged with each other. The upper mold (100a, 101a) and the lower mold (100b, 101b) is a cavity bar (101a, 101b) forming the cavity 102 and the chase (100a, 100b) for supporting the cavity bar (101a, 101b). Consists of.

Clamp pin plates 310 are provided on the outer sides of the upper molds 100a and 101a and the lower molds 100b and 101b, respectively, and a plurality of clamp pins 300 are fixed to the clamp pin plates 310. have. The clamp pin 300 is inserted into the clamp hole 302 formed in the upper mold (100a, 101a) and the lower mold (100b, 101b) as a protruding material. In addition, the clamp pin plate 310 is provided with a clamp pin return pin 320 to prevent the collision of the upper and lower clamp pin 300. In addition, a gate 104 is formed in a side surface of the cavity 102, and the gate 104 communicates with the runner 106 and the port 108.

The clamp pin 300 clamps the lead frame R when the molding compound is injected into the cavity 102 while reciprocating up and down by clamp pin operating means installed on the upper and lower plates 110a and 110b. After the process is completed, the lead frame R is ejected at the same time.

The clamp pin actuating means is composed of a guide block, actuating block, actuating bar and actuating bar actuating means similarly to that of the embodiment shown in FIG. This clamp pin operating means has already been described in the embodiment shown in Figure 2, it will be omitted.

Meanwhile, as shown in FIG. 13B, in this embodiment, it is assumed that three clamp pins 300 are provided for each cavity 102, but may be designed in various numbers and in various arrangements according to design conditions. have.

Hereinafter, the operating state of another embodiment of the present invention will be described in detail.

14A to 14H are process state diagrams illustrating a semiconductor package molding process performed by the semiconductor package molding apparatus shown in FIG. 12.

First, the lead frame R to which the semiconductor chip C is attached and the wire W bonded is loaded on the lower molds 100b and 101b, and the lower molds 100b and 101b are raised to be engaged with each other. In this state, the clamp pin 300 is moved toward the lead frame R to support the lead frame R (see FIGS. 14A and 14B). Here, since the three clamp pins 300 are installed in the clamp pin plate 310 and move up and down together, only the clamp pins 300 installed at the free end of the lead frame R support the lead frame R. .

In this way, the clamping pin 300 firstly injects the molding compound through the gate 104 while supporting the free end of the lead frame R to fill the cavity 102 (see FIG. 14C).

When the filling is completed to some extent, the clamp pin 300 is retracted to release the support of the lead frame R, and then the molding compound is secondly injected to completely fill the cavity 102 (see FIGS. 14D and 14E). . At this time, the secondary molding compound should be injected rapidly before the primary injected molding compound is cured.

When the molding compound is hardened and sufficiently firm, the lower molds 100b and 100b are lowered downward, and the upper clamp pin 300 protrudes into the cavity 102 to protrude the lead frame R into the upper molds 100a and 100b. From 101a). Subsequently, while lowering the lower molds 100b and 101b further downward, the lower clamp pin 300 protrudes into the cavity 102 to lead the lead frame R to the lower molds 100b and 101b. Separating from to complete the semiconductor package molding process (see FIGS. 14F to 14H). In this case, since the clamp pins 300 are controlled by the servo motor, clamping and ejecting operations of the lead frame R may be independently performed.

In this embodiment, only the clamp pin 300 installed at the free end of the lead frame R by the servo motor is controlled to support the lead frame R, but each clamp pin 300 is designed to operate independently. Etc., the fixed end lead frame R may be designed to be supported.

The preferred embodiment of the present invention has been described above. The present invention may use various changes, modifications, and equivalents. It is clear that the present invention can be applied in the same manner by appropriately modifying the above embodiments. For example, the above embodiments assume that the lead frame is supported at one end by the free end and the other end by the fixed end in the cavity, but may still be applied to the lead frame supported by the both ends fixed end, and the like. It can be applied to a semiconductor package. In addition, the above embodiments are designed such that the clamp pin is moved by two pairs of clamp pin actuating means installed on both sides of the upper and lower sides, but the number of the clamp pin actuating means may be variously selected according to the design conditions. Can be. In addition, if the horizontal reciprocating motion of the operating bar is converted to the vertical reciprocating motion of the operation block, the shape or structure of the operation bar and the operation block can be changed to meet the design conditions. Accordingly, the above description does not limit the scope of the invention as defined by the limitations of the following claims.

As described above, in the semiconductor package molding apparatus according to the present invention, since the molding compound is injected into the cavity of the upper and lower molds while the clamp pin is firmly supporting the lead frame, the semiconductor chip is warped by the injection pressure of the molding compound. It is possible to prevent development or deformation of the lead frame.

In addition, when each clamp pin or clamp pin plate is operated independently by a plurality of hydraulic cylinders, etc., it is difficult to maintain the horizontal level due to eccentricity, etc., but it is not possible to accurately control the operation of the clamp pins. Since the clamp pin is designed to be moved by the horizontal reciprocating motion of the bar and the vertical reciprocating motion of the operation block which is in contact with the bar, it is possible to accurately control the operation of the clamp pin.

In addition, a clamping means for effectively supporting and ejecting the lead frame in the molding process is proposed.

1 is a vertical sectional view showing a conventional semiconductor package molding apparatus.

Figure 2 is a vertical cross-sectional view showing a semiconductor package molding apparatus according to an embodiment of the present invention.

3 is an enlarged view illustrating main parts of the semiconductor package molding apparatus of FIG. 2;

4A is a plan view of a lower mold of the semiconductor package molding apparatus shown in FIG. 2.

4B is an enlarged plan view of portion “A” of the lower mold shown in FIG. 4A;

5 is an exploded perspective view showing the clamp pin operating means of the semiconductor package molding device shown in FIG.

6 is an exploded perspective view of an operation bar, an operation block, and a guide block of the semiconductor package molding apparatus shown in FIG. 2;

7A and 7B are exploded perspective and exploded perspective views respectively illustrating operation bars of the semiconductor package molding apparatus shown in FIG. 2;

8a and 8b are exploded perspective views showing another embodiment of the operation bar, the operation block and the guide block of the semiconductor package molding apparatus according to the present invention.

Figure 9a is a perspective view showing the operation bar driving means when the clamp pin is immersed in the clamp hole formed in the lower mold.

9B is a reference diagram showing the relative positional relationship of the operation bar, the operation block and the main guide block in the state of FIG. 9A;

Figure 10a is a perspective view showing the operation bar drive means when the clamp pin protrudes into the cavity to support the lead frame.

10B is a reference diagram showing the relative positional relationship of the operation bar, the operation block and the main guide block in the state of FIG. 10A;

11A to 11H are process state diagrams illustrating a semiconductor package molding process performed by the semiconductor package molding apparatus shown in FIG. 2.

12 is a vertical sectional view showing a semiconductor package molding apparatus according to another embodiment of the present invention.

FIG. 13A is a plan view of a lower mold of the semiconductor package molding apparatus shown in FIG. 12; FIG.

FIG. 13B is an enlarged plan view of the portion “B” of the lower mold shown in FIG. 13A;

14A to 14H are process state diagrams illustrating a semiconductor package molding process performed by the semiconductor package molding apparatus shown in FIG. 12.

* Description of the symbols for the main parts of the drawings *

100a: upper chase 100b: lower chase

101a: upper cavity bar 101b: lower cavity bar

102: cavity 104: gate

106: runner 108: port

110a: upper plate 110b: lower plate

200: ejector pin 210: ejector pin plate

220: ejector pin return pin 230: ejector bar

240: ejector spring 300: clamp pin

310: clamp pin plate 320: clamp pin return pin

330: guide body 332: first guide block

334: second guide block 336: coupling hole

340: operation block 344: vertical slot

346: operating spring 350: operating bar

352: inclined surface 354: flat roller bearing

356: stopper 358: operation bar cover

For reference, reference numerals for only one component will be shown for components that are vertically and horizontally symmetrical.

Claims (12)

In the semiconductor package molding apparatus for molding a lead frame to which a semiconductor chip is attached, plate; An operation bar installed horizontally on the plate and having an inclined surface; An operation block installed to be in contact with an inclined surface of the operation bar and vertically moving by horizontal movement of the operation bar; And And a clamp pin installed in the upper and lower mold cavities interlocked with the operation block, the clamp pin supporting the lead frame when the molding compound is injected into the cavity. In the semiconductor package molding apparatus for molding a lead frame to which a semiconductor chip is attached, plate; An operation bar installed horizontally on the plate and having an inclined surface; An operation block installed to be in contact with an inclined surface of the operation bar and vertically moving by horizontal movement of the operation bar; And The clamping pin is interlocked with the operation block and installed in the upper and lower mold cavities, clamping the lead frame when a molding compound is injected into the cavity, and ejecting the lead frame after the molding process is completed. Semiconductor package molding apparatus comprising a. The method according to claim 1 or 2, The plate is a semiconductor package molding apparatus, characterized in that the guide block is further installed to support the operating bar. The method of claim 3, A coupling hole is formed in the guide block, and a vertical hole corresponding to the coupling hole is formed in the operation block, and a coupling pin is inserted into the coupling hole and the vertical hole so that the operation block is vertically movable with respect to the guide block. Semiconductor package molding apparatus, characterized in that coupled. The method of claim 3, The upper and lower surfaces of the operation bar is a semiconductor package molding apparatus further comprises a flat roller bearing is provided with a plurality of rollers in order to reduce the friction loss between the guide block and the operation block. The method of claim 5, The upper and lower surfaces of the operation bar is a semiconductor package molding apparatus, characterized in that the stopper is further provided for limiting the moving range of the flat roller bearing. The method of claim 3, The surface of the operation block and the guide block in contact with the upper and lower surfaces of the operation bar, the semiconductor package molding apparatus, characterized in that the roller is rotatably installed to reduce the friction loss with the operation bar. The method of claim 3, The operation block is a semiconductor package molding apparatus, characterized in that the surface in contact with the inclined surface of the operation bar is formed to be inclined at the same angle as the inclination angle of the inclined surface. The method of claim 3, The plate is provided with an operation bar driving means for horizontally moving the operation bar, The operation bar driving means, A fixing frame fixed to the plate and provided with a guide rail; A ball screw rotatably installed on the fixing frame; A moving frame installed to be movable along the guide rail and having a nut part screwed to the ball screw, the moving frame being coupled to one end of the operation bar; And And a motor installed on the fixed frame to impart rotational force to the ball screw. The method of claim 1, The clamp pin is fixedly installed on a clamp pin plate supported and interlocked with the operation block, and the clamp pin plate further comprises a clamp pin return pin for preventing a collision between upper and lower clamp pins. . The method of claim 2, The ejector pin is fixed to the ejector pin plate that is supported and interlocked to the operation block, the ejector pin plate is a semiconductor package molding device, characterized in that the ejector pin return pin is further installed to prevent collision of the upper and lower ejector pins . In the semiconductor package molding apparatus for molding a lead frame to which a semiconductor chip is attached, plate; An operation bar installed horizontally on the plate and having an inclined surface formed on an upper surface or a lower surface thereof; A guide block installed on the plate to guide the support bar while supporting the operation bar; An actuation bar driving means installed on the plate to horizontally move the actuation bar; An operation block which is installed to contact the inclined surface of the operation bar, the surface in contact with the inclined surface of the operation bar is inclined at the same angle as the inclination angle of the inclined surface, and moves up and down by horizontal movement of the operation bar; A clamp pin plate installed horizontally with the plate and clamped to the operation block to move up and down; A clamp pin fixed to the clamp pin plate, the clamp pin supporting the semiconductor chip when a molding compound is injected into the cavity while being interlocked with the clamp pin plate to emerge in the cavity; An eject pin plate installed in parallel with the clamp pin plate; And The semiconductor package molding apparatus is fixed to the ejector pin plate, comprising a eject pin for ejecting the lead frame is completed molding process.