KR20050065030A - A reusing method of waste water comprising copper and hydrochloric acid as etching solution and cucl powder - Google Patents

A reusing method of waste water comprising copper and hydrochloric acid as etching solution and cucl powder Download PDF

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KR20050065030A
KR20050065030A KR1020030096776A KR20030096776A KR20050065030A KR 20050065030 A KR20050065030 A KR 20050065030A KR 1020030096776 A KR1020030096776 A KR 1020030096776A KR 20030096776 A KR20030096776 A KR 20030096776A KR 20050065030 A KR20050065030 A KR 20050065030A
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copper
hydrochloric acid
solution
waste liquid
etching
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Korean (ko)
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박성국
전희동
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재단법인 포항산업과학연구원
장석훈
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Publication of KR20050065030A publication Critical patent/KR20050065030A/en

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    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/46Treatment of water, waste water, or sewage by electrochemical methods
    • C02F1/461Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
    • C02F1/463Treatment of water, waste water, or sewage by electrochemical methods by electrolysis by electrocoagulation
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/44Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

구리 및 염산 함유 폐액을 확산투석하여 엣칭액과 염화제일구리 분말로 재활용하는 방법에 관한 것이다. 구리 및 염산을 함유하는 폐액을 여과하여 고형슬러지를 제거하는 단계; 염산을 회수하고, 잔류하는 구리 용액중의 유리산 농도가 20 g/l 이하 그리고 구리이온농도가 50g/l 이상이 되도록 확산투석하는 단계; 및 염산이 회수된 구리용액을 150∼450A/m2 전류밀도로 전해채취하여 염화제일구리 분말을 얻는 단계;를 포함하는 염산엣칭액과 염화제일구리 분말로 구리 및 염산을 함유하는 폐액을 재활용하는 방법이 제공된다.The present invention relates to a method for diffusing dialysis of copper and hydrochloric acid containing waste liquids and recycling them into an etching solution and cuprous chloride powder. Filtering the waste liquid containing copper and hydrochloric acid to remove solid sludge; Recovering hydrochloric acid and diffusing dialysis such that the free acid concentration in the remaining copper solution is 20 g / l or less and the copper ion concentration is 50 g / l or more; Recycling the waste solution containing copper and hydrochloric acid into the hydrochloric acid etching solution and cuprous chloride powder, comprising: electrolytically collecting the copper solution from which hydrochloric acid is recovered at a current density of 150 to 450 A / m 2 . A method is provided.

Description

엣칭액 및 염화제일구리 분말로 염산 및 구리 함유 폐액을 재활용하는 방법 {A Reusing Method of Waste Water Comprising Copper and Hydrochloric Acid as Etching Solution and CuCl Powder} A Reusing Method of Waste Water Comprising Copper and Hydrochloric Acid as Etching Solution and CuCl Powder}

본 발명은 구리 및 염산 함유 폐액을 확산투석하여 엣칭액과 염화제일구리 분말로 재활용하는 방법에 관한 것이다. The present invention relates to a method of recycling dialysis copper and hydrochloric acid-containing waste liquid into an etching solution and cuprous chloride powder.

보다 상세하게 본 발명은 구리 회로기판의 엣칭공정에서 발생하는 구리 및 염산을 함유하는 염산 및 구리 함유 엣칭폐액중의 고형 슬러지를 여과하고, 확산투석으로 염산을 회수하고 잔류하는 구리용액으로부터 전해채취법으로 염화제일구리 분말을 제조함으로써 염산 및 구리 함유 폐액을 재활용하는 방법에 관한 것이다.More specifically, the present invention is to filter the solid sludge in the hydrochloric acid and copper-containing etching waste solution containing copper and hydrochloric acid generated in the etching process of the copper circuit board, recover the hydrochloric acid by diffusion dialysis and from the remaining copper solution by electrolytic extraction method It relates to a method for recycling hydrochloric acid and copper-containing waste liquor by preparing cuprous chloride powder.

구리회로기판의 엣칭공정에서 발생하는 염산 및 구리 함유 폐액은 일반적으로 중화침전법으로 수처리하거나 알카리 투입으로 pH를 상승시켜 수산화구리를 침전시키고 여과한 다음 분말을 가열하여 산화구리를 제조하여 재활용한다. Hydrochloric acid and copper-containing waste liquids generated during etching of copper circuit boards are generally treated by neutralization precipitation or by raising the pH by alkali addition to precipitate copper hydroxide, filtered and heated to produce copper oxide.

그러나, 상기 방법은 중화과정에서 고가의 중화제인 가성소다를 다량으로 사용하여야 하고 이후 여러 단계의 수처리공정 혹은 산화구리 제조공정을 거쳐야 한다. 이러한 처리공정은 처리비용이 매우 높으며 2차 폐수 및 다량의 슬러지가 발생하는 문제가 있다. However, in the neutralization process, caustic soda, an expensive neutralizing agent, must be used in a large amount and then subjected to several steps of water treatment or copper oxide production. This treatment process is very expensive and there is a problem that the secondary wastewater and a large amount of sludge occurs.

한편, 염산 및 구리 함유 에칭폐액중에는 보통 200 g/l가 넘는 고농도의 염산이 함유되어 있고 구리이온도 100 g/l 이상이 함유되어 있다. 따라서 중화침전법으로 처리할 경우 염산함유량에 비례하는 많은 양의 가성소다가 필요하며 고가인 다량의 구리가 폐기물로 버려지게 된다. On the other hand, hydrochloric acid and copper-containing etching waste liquids usually contain high concentrations of hydrochloric acid in excess of 200 g / l, and copper or higher temperatures of 100 g / l or more. Therefore, when treated by neutralization precipitation method, a large amount of caustic soda in proportion to the amount of hydrochloric acid is required, and a large amount of expensive copper is discarded as waste.

따라서 구리회로기판의 엣칭공정에서 발생하는 염산 및 구리 함유 엣칭폐액에서 유가성분을 회수하여 재활용하는 경제적이고 친환경적인 기술의 개발이 요구된다.Therefore, it is required to develop an economical and environmentally friendly technology for recovering and recycling valuable components from hydrochloric acid and copper-containing etching waste liquid generated in the etching process of copper circuit boards.

이에, 본 발명의 목적은 구리 및 염산을 함유하는 폐액을 염산엣칭액 및 염화제일구리(CuCl) 분말로 재활용하는 방법을 제공하는 것이다. Accordingly, an object of the present invention is to provide a method for recycling waste liquid containing copper and hydrochloric acid into hydrochloric acid etching solution and cuprous chloride (CuCl) powder.

본 발명의 다른 목적은 구리회로기판의 엣칭공정에서 발생하는 구리 및 염산을 함유하는 엣칭폐액중의 고형 슬러지를 여과한 다음 확산투석으로 염산을 회수하고 잔류하는 구리용액으로부터 전해채취법으로 염화제일구리 분말을 제조함으로써 구리 및 염산 함유 엣칭폐액을 재활용하는 방법에 관한 것이다. Another object of the present invention is to filter solid sludge in an etching waste liquid containing copper and hydrochloric acid generated in the etching process of a copper circuit board, recover hydrochloric acid by diffusion dialysis, and cuprous chloride powder by electrolytic extraction from the remaining copper solution. The present invention relates to a method for recycling copper and hydrochloric acid-containing etching waste liquid.

본 발명에 의하면, According to the invention,

구리 및 염산을 함유하는 폐액을 여과하여 고형슬러지를 제거하는 단계;Filtering the waste liquid containing copper and hydrochloric acid to remove solid sludge;

염산을 회수하고, 잔류하는 구리 용액중의 유리산 농도가 20 g/l 이하 그리고 구리이온농도가 50 g/l 이상이 되도록 확산투석하는 단계; 및Recovering hydrochloric acid and diffusing dialysis such that the free acid concentration in the remaining copper solution is 20 g / l or less and the copper ion concentration is 50 g / l or more; And

염산이 회수된 구리용액을 150∼450A/m2 전류밀도로 전해채취하여 염화제일구리 분말을 얻는 단계;Electrolytically collecting the copper solution from which hydrochloric acid is recovered at a current density of 150 to 450 A / m 2 to obtain cuprous chloride powder;

를 포함하는 염산엣칭액과 염화제일구리 분말로 구리 및 염산 함유 폐액을 재활용하는 방법이 제공된다.There is provided a method of recycling copper and hydrochloric acid-containing waste liquid with an etchant hydrochloric acid and cuprous chloride powder.

이하, 본 발명에 대하여 상세히 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail.

본 발명은 염산 및 구리를 함유하는 폐액(이하, '염산/구리폐액'이라 한다.)에는 다량의 염산과 구리이온이 함유되어 있으며, 이러한 염산과 구리이온을 분리하여 각각 유가자원으로 재활용할 수 있다는 점에서 착안한 것이다.In the present invention, a waste solution containing hydrochloric acid and copper (hereinafter referred to as hydrochloric acid / copper waste liquid) contains a large amount of hydrochloric acid and copper ions, and the hydrochloric acid and copper ions can be separated and recycled as valuable resources. It was conceived in that it exists.

즉, 본 발명에서는 염산/구리 폐액을 확산투석처리하여 확산투석 후에 회수된 산은 염산엣칭액으로 재활용하고, 염산이 제거되고 구리를 다량 함유하는 구리용액(이하, '구리용액'이라 한다.)에서 전해채취법으로 염화제일구리 분말을 제조함으로써 염산/구리 폐액을 염산엣칭액 및 염화제일구리 분말로 재활용하게 된다. That is, in the present invention, the acid recovered from the hydrochloric acid / copper waste solution by diffusion dialysis is recycled to hydrochloric acid etching solution, and the hydrochloric acid is removed and the copper solution containing a large amount of copper (hereinafter referred to as 'copper solution'). By producing cuprous chloride powder by electrolytic extraction, the hydrochloric acid / copper waste liquid is recycled into hydrochloric acid etching solution and cuprous chloride powder.

상기 염산 및 구리 함유 폐액의 예로는 구리회로기판의 에칭공정에서 발생하는 염산 및 구리 함유 엣칭폐액등을 들 수 있다. 구리회로기판의 엣칭공정에서 발생하는 염산 및 구리 함유 엣칭폐액의 성분조성 범위는 하기 표 1에 나타낸 바와 같다.Examples of the hydrochloric acid and copper-containing waste liquid include hydrochloric acid and copper-containing etching waste liquid generated in the etching process of the copper circuit board. The composition ranges of the hydrochloric acid and the copper-containing etching waste liquid generated in the etching process of the copper circuit board are shown in Table 1 below.

[표 1]TABLE 1

상기 표 1에서 알 수 있듯이 구리회로기판의 엣칭공정에서 발생하는 염산 및 구리 함유 엣칭폐액의 성분조성은 염산농도가 200 g/l 이상, 구리이온농도가 90 g/l 이상으로 매우 높다. 그 외의 성분은 미소량으로 함유되어 있다. As can be seen from Table 1, the composition of hydrochloric acid and copper-containing etching waste liquid generated in the etching process of the copper circuit board has a very high hydrochloric acid concentration of 200 g / l or more and a copper ion concentration of 90 g / l or more. The other components are contained in a small amount.

그러나, 이러한 고농도의 염산폐액을 기존의 방법인 중화침전으로 처리하는 경우에는 다량의 중화제가 투입되고 중금속 슬러지가 다량 발생한다. However, in the case of treating such a high concentration of hydrochloric acid waste solution by neutralization precipitation, which is a conventional method, a large amount of neutralizing agent is added and heavy metal sludge is generated.

따라서 본 발명에서는 구리회로기판의 엣칭공정에서 발생하는 구리 및 염산 함유 엣칭폐액중의 고형 슬러지를 여과한 다음 확산투석으로 염산을 회수하여 엣칭액으로 재활용하고 잔류하는 구리용액으로부터 전해채취법으로 염화제일구리 분말을 제조할 수 있다.Therefore, in the present invention, the solid sludge in the copper and hydrochloric acid-containing etching waste liquid generated in the etching process of the copper circuit board is filtered, hydrochloric acid is recovered by diffusion dialysis, recycled as an etching solution, and cuprous chloride by electrolytic extraction from the remaining copper solution. Powders can be prepared.

염산/구리 폐액은 먼저 여과하여 폐액중의 고형 슬러지 성분을 제거한다. 상기 고형 슬러지 성분은 예를들어 마이크로 카트리지 필터를 이용하여 여과할 수 있다. 상기 고형 슬러지 성분을 여과하여 제거함으로서 다음 단계인 확산투석공정에서 투석막이 오염되지 않도록 한다. The hydrochloric acid / copper waste liquor is first filtered to remove solid sludge components in the waste liquor. The solid sludge component can be filtered using, for example, a micro cartridge filter. The solid sludge component is filtered to remove the dialysis membrane from contamination in the next step of diffusion dialysis.

여과된 염산/구리폐액은 확산투석하여 염산을 회수함과 동시에 전해채취법으로 염화제일구리를 수득하기에 적합한 조건이 되도록 염산/구리 폐액중의 유리산농도와 구리이온농도를 조절한다. The filtered hydrochloric acid / copper waste liquid is diffusely dialyzed to recover hydrochloric acid, and the free acid concentration and copper ion concentration in the hydrochloric acid / copper waste liquid are controlled so as to be suitable for obtaining cuprous chloride by electrolytic extraction.

확산투석에서 회수된 염산은 엣칭액으로 재활용된다. 한편, 확산투석은 염산회수후 잔류하는 구리용액중에서 유리산이 20 g/l 이하로 그리고 구리이온농도가 50 g/l 이상이 되도록 확산투석한다. 또한, 전해채취 전공정에서 구리용액중의 유리산 농도를 20 g/l 이하로 그리고 구리이온농도를 50 g/l 이상으로 유지하면서 전해채취하여야 한다. The hydrochloric acid recovered from the diffusion dialysis is recycled to the etching solution. On the other hand, diffusion dialysis is performed by diffusion dialysis in a copper solution remaining after hydrochloric acid recovery so that the free acid is 20 g / l or less and the copper ion concentration is 50 g / l or more. In addition, the electrolytic extraction should be carried out while maintaining the concentration of free acid in the copper solution at 20 g / l or less and the copper ion concentration at 50 g / l or more.

후속공정인 전해채취공정에서 전해액중 유리산의 농도가 20 g/l을 초과하는 경우에는 수소발생이 극심하여 별도의 가스처리장치를 필요로 하는 등 작업하기 어려우며, 특히 높은 수소과전압이 발생하여 염화제일구리 분말을 전해채취하기 어렵다. 한펀, 확산투석후, 구리용액중에 잔류하는 유리산의 농도가 적을수록 후속 공정인 전해채취에서 염화제일구리를 수득하기 용이하다. 또한, 구리용액중에 잔류하는 유리산의 농도가 적을수록 많은 산이 회수되는 것으로 바람직하다. When the concentration of free acid in the electrolyte exceeds 20 g / l in the electrolytic extraction process, which is a subsequent process, it is difficult to work such as requiring a separate gas treatment device due to the high hydrogen generation. It is difficult to collect electrolytic copper powder. The smaller the concentration of free acid remaining in the copper solution after Hanfen and diffusion dialysis, the easier it is to obtain cuprous chloride in the subsequent electrolytic extraction. In addition, as the concentration of free acid remaining in the copper solution decreases, more acid is preferably recovered.

또한, 50 g/l 이상의 구리이온농도가 확보되어야 전해채취에 의한 염화제일구리 분말의 제조가 가능하게 된다. 확산투석에 의해 염산이 회수되고 남은 구리용액중의 구리이온의 농도는 농도가 클수록 염화제일구리를 얻기위한 전해채취에 이롭다. 따라서, 구리용액중 구리이온의 농도는 50g/l이상으로 높을수록 바람직하다. In addition, the copper ion concentration of 50 g / l or more should be secured to enable the production of cuprous chloride powder by electrowinning. Hydrochloric acid is recovered by diffusion dialysis, and the higher the concentration of copper ions in the remaining copper solution is, the better the electrolytic extraction for obtaining cuprous chloride. Therefore, the higher the concentration of copper ions in the copper solution, the higher is 50g / l or more is preferable.

확산투석과정에서 염산이 회수되고 잔류하는 구리용액을 150∼450A/m2 의 전류밀도로 전해채취함으로 염화제일구리 분말이 제조된다. 전해채취시 전류밀도를 제외한 기타 전해채취 조건 및 이와 관련된 여러가지 전기화학적 인자들은 일반적인 조건에서 적절하게 조절가능하다.Hydrochloric acid is recovered during diffusion dialysis, and the cuprous chloride powder is prepared by electrolytically collecting the remaining copper solution at a current density of 150 to 450 A / m 2 . Other electrochemical harvesting conditions and related electrochemical factors except current density can be properly adjusted under general conditions.

전류밀도는 전해채취법으로 염화제일구리 분말 수득시 가장 큰 경향을 미치는 인자로서, 450 A/m2 을 초과하는 전류밀도를 가하여 전해채취하는 경우에는 CuCl 및 Cu가 혼재하여 석출되며, Cu가 혼재하는 CuCl은 재활용이 불가능하다. 150 A/m2 미만의 전류밀도로 전해채취하는 경우에는 CuCl, Cu 및 Cu2(OH)3Cl의 복합물이 석출됨으로 재활용이 불가능하다. 상기 150∼450A/m2의 전류밀도로 전해채취하는 경우에는 진흙 형태의 CuCl 분말이 석출된다.The current density is the most influential factor in obtaining cuprous chloride powder by the electrolytic extraction method. When electrolytic extraction is carried out by applying a current density exceeding 450 A / m 2 , CuCl and Cu are mixed and precipitated, and Cu is mixed. CuCl is not recyclable. In the case of electrowinning at a current density of less than 150 A / m 2 , a complex of CuCl, Cu, and Cu 2 (OH) 3 Cl is precipitated, and thus recycling is impossible. In the case of electrowinning at a current density of 150 to 450 A / m 2 , mud-type CuCl powder is precipitated.

CuCl 분말은 안료(플탈로시아닌 블루의 원료), 화약품(유기화합물 반응의 촉매제), 석유화학(촉매제, 표백제, 탈황제), 셀룰로오스(탈질제), 농약원료, 염소화 촉매, 온도변화 측정, 살충제, 아세틸렌정제, CO흡수제, 아크릴로니트릴용, 광택제, 탈색제, 납땜용제, 전기밧데리등에 사용된다.CuCl powders are pigments (raw material of phthalocyanine blue), chemicals (catalyst of organic compound reaction), petrochemical (catalyst, bleach, desulfurization agent), cellulose (denitrification agent), pesticide raw material, chlorination catalyst, temperature change measurement, It is used in insecticides, acetylene tablets, CO absorbers, acrylonitrile, brighteners, bleaching agents, soldering solvents, and electric batteries.

본 발명의 방법으로 염산 및 구리 함유폐액으로부터 염산과 염화제일구리 분말을 회수하여 재활용함으로써 폐자원을 효율적으로 재활용할 수 있다. By recovering and recycling hydrochloric acid and cuprous chloride powder from hydrochloric acid and copper-containing waste liquid by the method of the present invention, waste resources can be efficiently recycled.

이하, 실시예를 통하여 본 발명을 설명한다.Hereinafter, the present invention will be described through examples.

[실시예]EXAMPLE

처리용량이 2000ml/min이며, 내산용 카트리지 필터 및 내산용 마그네트 펌프 등으로 구성된 전처리 여과장치를 이용하여 구리회로기판의 엣칭공정에서 발생하는 구리 및 염산 함유 엣칭폐액을 여과하여 고형분 슬러리를 제거하였다. The treatment capacity was 2000 ml / min, and the copper and hydrochloric acid-containing etching waste liquid generated in the etching process of the copper circuit board was filtered by using a pretreatment filtration device composed of an acid resistant cartridge filter and an acid resistant magnet pump.

후공정인 확산투석공정에서의 막오염(Membrane Fouling)을 방지하기 위해 SDI 4 이하로 조정하였다. SDI(Silt Density Index) 측정은 Millipore社의 SDI Kit를 사용하였다.In order to prevent membrane fouling in the post-diffusion diffusion dialysis process, it was adjusted to SDI 4 or less. SDI (Silt Density Index) was measured using Millipore's SDI Kit.

확산투석장치로는 처리용량이 500 ml/hr인 Tokuyama Soda Co.의 AFX 투석막을 장착한 확산투석장치를 사용하였다. 처리성능은 염산 및 구리 함유 엣칭폐액인 경우 산회수율이 유리산 기준 85% 이상, 금속이온 Leakage Rate가 20% 이하이였다.As a diffusion dialysis apparatus, a diffusion dialysis apparatus equipped with an AFX dialysis membrane of Tokuyama Soda Co. having a treatment capacity of 500 ml / hr was used. In the case of hydrochloric acid and copper-containing etching waste, the acid recovery yield was 85% or more based on the free acid and the metal ion leakage rate was 20% or less.

전해채취장치에서 음극으로는 스테인레스강인STS 316 혹은 Cu를 사용가능하며, 양극으로는 IrO2 코팅된Ti을 사용하였으며, 내산펌프, 항온조, 정류기(Rectifier)(정전류, 정전압), 부스바(Cu), 전해액 순환식 전해장치를 사용하였다.In the electrode, STS 316 or Cu, which is stainless steel, can be used as the cathode. IrO 2 coated Ti is used as the anode. Acid pumps, thermostats, rectifiers (constant current, constant voltage) and busbars (Cu) are used. , Electrolyte circulation electrolytic apparatus was used.

전착물은 SEM(Scanning electron microscope), XRD(X-ray diffraction) 및 EDS(Energy-dispersive X-ray spectroscopy)로 분석하였다. Electrodeposits were analyzed by scanning electron microscope (SEM), X-ray diffraction (XRD) and Energy-dispersive X-ray spectroscopy (EDS).

확산투석시험 결과는 표 2에서 나타내었다. 구리회로기판의 엣칭공정에서 발생한 염화구리 엣칭폐액의 유리산 농도가 116.g/l로 분석되었으며 이를 확산투석시, 염화구리 용액에서 유리산의 농도는 1.1 g/l, 그리고 회수된 염산에서 유리산의 농도는 102.2 g/l이었다. Diffusion dialysis test results are shown in Table 2. The concentration of free acid in the copper chloride etching waste liquid from the etching process of the copper circuit board was 116.g / l. The concentration of free acid in copper chloride solution was 1.1 g / l and the recovered hydrochloric acid was released. The concentration of acid was 102.2 g / l.

확산투석은 실온에서 0.8-1.0 l/㎡의 유속으로 행하였다. Diffusion dialysis was performed at room temperature at a flow rate of 0.8-1.0 l / m 2.

확산투석에 의해 폐액중의 유리산이 99%이상이 회수되었다. 또한, 확산투석은 잔류용액중의 유리산 함량이 적을수록 전해채취하기 유리함으로 바람직한 것이다. 한편 구리이온은 염산 및 구리 함유 엣칭폐액에서 회수염산중으로 26.3 g/l가 누출되었다. By diffusion dialysis, more than 99% of the free acid in the waste liquid was recovered. In addition, diffusion dialysis is preferable because the less the free acid content in the residual solution, the more advantageous it is to electrolytic extraction. Meanwhile, copper ions leaked 26.3 g / l into the recovered hydrochloric acid from the hydrochloric acid and the copper-containing etching waste liquid.

[표 2]TABLE 2

염화구리엣칭폐액에 대한 확산투석시험 결과Diffusion Dialysis Test Results for Copper Chloride Etching Waste

확산투석 후, 산이 회수, 제거된 구리용액을 전해채취하였다. 전해채취는 구리용액중의 구리이온과 염소이온의 착체 결합상태를 이용하여 음극에 전착시 CuCl분말 형태로 석출되도록 전해조건을 가하였다. After diffusion dialysis, the copper solution from which the acid was recovered and removed was electrowinned. Electrolyzing was applied to the electrolytic conditions so as to precipitate in the form of CuCl powder when electrodeposited to the anode using a complex bonding state of copper ions and chlorine ions in the copper solution.

음극으로 Cu 판을 그리고 양극으로는 IrO2 코팅된Ti판을 사용하여, 20~25℃ 그리고 pH 0~1.0, 1.7V전압 그리고 200 mS/cm 전도도에서, 각각 100A/m2, 200A/m2, 500A/m2 및 1000A/m2의 전류밀도로 전해채취하였다. 전해채취시 구리용액중 구리이온의 농도를 50g/l 이상으로 유지하였다.Cu plate as cathode and IrO 2 coated Ti plate as anode, 100A / m 2 , 200A / m 2 at 20 ~ 25 ℃ and pH 0 ~ 1.0, 1.7V voltage and 200mS / cm conductivity, respectively Electrolytic harvesting was performed at current densities of, 500 A / m 2 and 1000 A / m 2 . The concentration of copper ions in the copper solution was maintained at 50 g / l or more during the electrowinning.

상기 조건으로 전해채취하여 환원전류밀도 변화에 따른 음극표면에 석출되는 CuCl, Cu 및 구리염 등의 전착물을 조사하였다. 도 1a 내지 4a는 전류밀도 변화에 따라 음극에서 석출된 전착물에 대한 XRD분석 그래프이며, 도 1b 내지 4b는 전류밀도 변화에 따라 음극에서 석출된 전착물에 대한 표면사진이다. The electrodeposited materials such as CuCl, Cu, and copper salts deposited on the surface of the cathode according to the change of the reduction current density by electrolytic extraction under the above conditions were investigated. 1A to 4A are XRD analysis graphs of electrodeposits deposited on the cathode according to current density changes, and FIGS. 1B to 4B are surface photographs of electrodeposits deposited on the cathode according to current density changes.

도 1a 및 2a에서와 같이 500A/m2 이상의 높은 전류밀도 영역의 음극석출물에는 구리가 다량 혼재하며, 전류밀도가 100A/m2인 도 4a에서의 석출물에는 CuCl, Cu, Cu2(OH)3Cl이 혼재하며, 전류밀도가 200A/m2인 도 3a의 경우 순수한 CuCl 분말이 석출되었다.As shown in FIGS. 1A and 2A, a large amount of copper is mixed in a cathode precipitate in a high current density region of 500 A / m 2 or more, and a precipitate in FIG. 4A having a current density of 100 A / m 2 includes CuCl, Cu, Cu 2 (OH) 3 Cl In the mixed case, pure CuCl powder was precipitated in the case of FIG. 3A having a current density of 200 A / m 2 .

이러한 석출물의 종류는 표면사진에서 또한 알 수 있다. 도 1b및 2b에 나타낸 바와 같이, 500A/m2 이상의 높은 전류밀도 영역에서 음극석출물은 구리 함유량이 높고 금속과 분말의 혼합체로서 전형적인 구리색을 나타냈다. 도 3b에서와 같이 전류밀도가 200A/m2로 낮아지면 짙은 회색의 염화제일구리가 분말 덩어리 형태로 석출되었다. 도 4b에서와 같이 전류밀도가 100A/m2로 더 낮아지면 분말은 없어지고 회색의 금속막으로 석출되었다.This kind of precipitate can also be seen in the surface photograph. As shown in FIGS. 1B and 2B, in the high current density region of 500 A / m 2 or more, the negative electrode precipitates had a high copper content and exhibited a typical copper color as a mixture of metal and powder. As shown in FIG. 3b, when the current density was lowered to 200 A / m 2 , dark gray cuprous chloride precipitated in the form of a powder mass. When the current density was lowered to 100 A / m 2 as in FIG. 4B, the powder disappeared and precipitated as a gray metal film.

또한, 전류밀도 100A/m2 및200A/m2 에서 석출된 석출물의 SEM 사진과 EDS분석그래프를 각각 도 5a, 5b, 6a 및 6b에 나타내었다.In addition, SEM photographs and EDS analysis graphs of precipitates deposited at current densities of 100 A / m 2 and 200 A / m 2 are shown in FIGS. 5A, 5B, 6A, and 6B, respectively.

EDS분석에 따르면 100A/m2 전류밀도로 전해채취하는 경우, 석출물중 Cu 원자%는 55.1%, Cl원자%는 44.9%로 이들의 차이는 석출물중 불순물로 존재한다(도 5b 참조). 도 5a는 세척과정중 물속에 있는 100A/m2에서의 석출된 석출물의 SEM 사진(배율 x 1000)이다.According to the EDS analysis, when electrolytically collected at a current density of 100 A / m 2 , 55.1% Cu atoms and 44.9% Cl atoms in the precipitates were present as impurities in the precipitates (see FIG. 5B). FIG. 5A is a SEM photograph (magnification × 1000) of precipitated precipitate at 100 A / m 2 in water during the washing process.

200A/m2의 전류밀도로 전해채취한 경우 XRD 분석에서 Cu의 존재는 전혀 감지되지 않았고 EDS 분석에서도 원자%가 Cu 49%, Cl 51%로 거의 대부분의 석출물이 CuCl임을 나타내었다(도 6b 참조). 도 6a는 세척과정중 물속에 있는 200A/m2에서 석출한 CuCl 분말(흰색)의 SEM 사진(배율 x 1000)이다.In the current collection of 200A / m 2 , the presence of Cu was not detected at all by XRD analysis, and the EDS analysis showed that almost all precipitates were CuCl with 49% Cu and 51% Cl (see FIG. 6B). ). 6A is a SEM photograph (magnification × 1000) of CuCl powder (white) precipitated at 200 A / m 2 in water during the washing process.

염산 및 구리를 함유하는 폐액으로부터 엣칭액 및 CuCl 분말을 회수하여 재활용할 수 있다. 또한, 염산 및 구리 함유 엣칭폐액의 수처리 혹은 재활용에서 소요되는 처리비용이 절감될 뿐만 아니라, 폐자원을 유가자원으로 재활용할 수 있다. 종래 에칭폐액의 수처리 혹은 재활용 공정에서 발생하는 슬러지 매립문제가 해소될 뿐만 아니라, 중금속을 함유하는 악성폐액에 의한 2차 오염이 방지됨으로 환경적 측면에서도 이롭다. The etching liquid and CuCl powder can be recovered from the waste liquid containing hydrochloric acid and copper and recycled. In addition, not only the treatment cost required for water treatment or recycling of the hydrochloric acid and copper-containing etching waste liquid can be reduced, but the waste resources can be recycled as valuable resources. The sludge landfill problem generated in the conventional water treatment or recycling process of the etching waste solution is not only solved, but it is also advantageous in terms of environment because secondary contamination by the malignant waste liquid containing heavy metals is prevented.

도 1a 및 도 1b는 각각 1000A/㎡의 전류밀도로 전해채취시 음극에 석출된 전착물에 대한 XRD 분석 그래프 및 표면 사진이며, 1A and 1B are XRD analysis graphs and surface photographs of electrodeposits deposited on the negative electrode during the electrochemical extraction at a current density of 1000 A / m 2, respectively.

도 2a 및 도 2b는 각각 500A/㎡의 전류밀도로 전해채취시 음극에 석출된 전착물에 대한 XRD 분석 그래프 및 표면 사진이며, 2A and 2B are XRD analysis graphs and surface photographs of electrodeposits deposited on the negative electrode during electrolysis at a current density of 500 A / m 2, respectively.

도 3a 및 도 3b는 각각 200A/㎡의 전류밀도로 전해채취시 음극에 석출된 전착물에 대한 XRD 분석 그래프 및 표면 사진이며, 3A and 3B are XRD analysis graphs and surface photographs of electrodeposits deposited on the cathode during electrolysis at a current density of 200 A / m 2, respectively.

도 4a 및 도 4b는 각각 100A/㎡의 전류밀도로 전해채취시 음극에 석출된 전착물에 대한 XRD 분석 그래프 및 표면 사진이며, 4A and 4B are XRD analysis graphs and surface photographs of electrodeposits deposited on the negative electrode during electrolysis at a current density of 100 A / m 2, respectively.

도 5a 및 도 5b는 각각 100A/㎡의 전류밀도로 전해채취시 석출된 전착물의 SEM사진 및 EDS 분석그래프이며, 5A and 5B are SEM photographs and EDS analysis graphs of the electrodeposited precipitates during electrowinning at current densities of 100 A / m 2, respectively.

도 6a 및 도 6b는 각각 200A/㎡의 전류밀도로 전해채취시 석출된 전착물의 SEM사진 및 EDS 분석그래프이다. 6A and 6B are SEM photographs and EDS analysis graphs of the electrodeposited precipitates during electrowinning at current densities of 200 A / m 2, respectively.

Claims (3)

구리 및 염산을 함유하는 폐액을 여과하여 고형슬러지를 제거하는 단계;Filtering the waste liquid containing copper and hydrochloric acid to remove solid sludge; 염산을 회수하고, 잔류하는 염화구리 용액중의 유리산 농도가 20 g/l 이하 그리고 구리이온농도가 50 g/l 이상으로 되도록 확산투석하는 단계; 및Recovering hydrochloric acid and diffusing dialysis such that the free acid concentration in the remaining copper chloride solution is 20 g / l or less and the copper ion concentration is 50 g / l or more; And 염산이 회수된 구리용액을 150∼450A/m2 전류밀도로 전해채취하여 염화제일구리 분말을 얻는 단계;Electrolytically collecting the copper solution from which hydrochloric acid is recovered at a current density of 150 to 450 A / m 2 to obtain cuprous chloride powder; 를 포함하는 염산엣칭액과 염화제일구리 분말로 구리 및 염산 함유 폐액을 재활용하는 방법. A method for recycling copper and hydrochloric acid-containing waste liquid by etching hydrochloric acid and cuprous chloride powder comprising a. 제 1항에 있어서, 상기 전해채취시 구리용액에서 유리산 농도는 20 g/l 이하 그리고 구리이온농도는 50 g/l 이상으로 유지함을 특징으로 하는 방법.The method of claim 1, wherein the concentration of the free acid in the copper solution is 20 g / l or less and the copper ion concentration is 50 g / l or more. 제 1항에 있어서, 상기 구리 및 염산 함유 폐액은 구리회로기판 제조공정시 발생하는 염산 및 구리 함유 엣칭폐액임을 특징으로 하는 방법.The method of claim 1, wherein the copper and hydrochloric acid-containing waste liquid is hydrochloric acid and copper-containing etching waste liquid generated during a copper circuit board manufacturing process.
KR1020030096776A 2003-12-24 2003-12-24 A reusing method of waste water comprising copper and hydrochloric acid as etching solution and cucl powder KR20050065030A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101030080B1 (en) * 2009-02-03 2011-04-19 (주)에이치에스켐텍 Method for preparing copper chloridei from waste copper liquid and system thereof
KR101249990B1 (en) * 2006-09-18 2013-04-02 대일개발 주식회사 Recovery of indium, tin and acid from spent ito etching solution
KR101439505B1 (en) * 2012-12-28 2014-09-15 재단법인 포항산업과학연구원 METHOD FOR RECOVERING In, Sn AND ACID FROM USED ITO ETCHING SOLUTION
CN106757028A (en) * 2016-12-29 2017-05-31 通富微电子股份有限公司 The preparation method of etching solution, semiconductor packing device and semiconductor packing device
CN113969404A (en) * 2021-10-25 2022-01-25 天水华洋电子科技股份有限公司 Integrated circuit lead frame etching solution recovery unit
CN115928078A (en) * 2022-12-12 2023-04-07 深圳晶恒宇环境科技有限公司 Etching waste liquid cyclic regeneration and cuprous chloride, copper recovery system

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101249990B1 (en) * 2006-09-18 2013-04-02 대일개발 주식회사 Recovery of indium, tin and acid from spent ito etching solution
KR101030080B1 (en) * 2009-02-03 2011-04-19 (주)에이치에스켐텍 Method for preparing copper chloridei from waste copper liquid and system thereof
KR101439505B1 (en) * 2012-12-28 2014-09-15 재단법인 포항산업과학연구원 METHOD FOR RECOVERING In, Sn AND ACID FROM USED ITO ETCHING SOLUTION
CN106757028A (en) * 2016-12-29 2017-05-31 通富微电子股份有限公司 The preparation method of etching solution, semiconductor packing device and semiconductor packing device
CN106757028B (en) * 2016-12-29 2019-09-20 通富微电子股份有限公司 The preparation method of etching solution, semiconductor packing device and semiconductor packing device
CN113969404A (en) * 2021-10-25 2022-01-25 天水华洋电子科技股份有限公司 Integrated circuit lead frame etching solution recovery unit
CN115928078A (en) * 2022-12-12 2023-04-07 深圳晶恒宇环境科技有限公司 Etching waste liquid cyclic regeneration and cuprous chloride, copper recovery system

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