KR20050056015A - Wafer lifter for use in wet station bath - Google Patents
Wafer lifter for use in wet station bath Download PDFInfo
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- KR20050056015A KR20050056015A KR1020030089095A KR20030089095A KR20050056015A KR 20050056015 A KR20050056015 A KR 20050056015A KR 1020030089095 A KR1020030089095 A KR 1020030089095A KR 20030089095 A KR20030089095 A KR 20030089095A KR 20050056015 A KR20050056015 A KR 20050056015A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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Abstract
본 발명은 반도체소자 제조를 위한 습식세정장치(wet station)에서 다수매의 웨이퍼를 일정간격으로 안착시켜 내부베스(bath)에 침지시키는 리프터(lifter)에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lifter for immersing a plurality of wafers at predetermined intervals in a wet station for manufacturing a semiconductor device to immerse them in an internal bath.
본 발명은, 다수매의 웨이퍼를 동일방향을 향하도록 몸체부상에 일정간격으로 구비된 슬롯에 안착시켜 내부베스내로 침지시키는 습식세정장치의 리프터에 있어서, 상기 몸체부상의 상기 슬롯 사이에 수직방향으로 소정높이의 차단판재가 일체로 형성되어, 습식세정과정에서 상기 웨이퍼의 후면쪽 이물이 대향하는 다른 웨이퍼의 전면으로 전이되는 것을 방지하는 것을 특징으로 한다.The present invention is a lifter of a wet cleaning apparatus for seating a plurality of wafers in a slot provided at a predetermined interval on the body portion so as to face in the same direction, and immersed in the inner bath, in the vertical direction between the slots on the body portion The barrier plate material having a predetermined height is integrally formed to prevent foreign substances on the rear surface of the wafer from being transferred to the front surface of the other wafer in the wet cleaning process.
따라서, 웨이퍼상의 파티클의 발생 방지와 세정액의 빠른 유속에 의한 세정효과의 극대화로 웨이퍼의 신뢰성과 생산성을 향상시키는 효과가 있다.Therefore, there is an effect of improving the reliability and productivity of the wafer by preventing the generation of particles on the wafer and maximizing the cleaning effect by the rapid flow rate of the cleaning liquid.
Description
본 발명은 반도체소자 제조를 위한 습식세정장치(wet station)에서 다수매의 웨이퍼를 일정간격으로 안착시켜 내부베스에 침지시키는 리프터(lifter)에 관한 것으로써, 더욱 상세하게는 웨이퍼가 안착되는 슬롯간에 차단판재를 일체 형성하여 웨이퍼의 후면쪽에 부착된 이물이 대향하는 다른 웨이퍼의 전면으로 전이되어 파티클 발생 등 공정이상을 야기시키는 것을 방지하는 습식세정장치의 리프터에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lifter for immersing a plurality of wafers at predetermined intervals in a wet station for manufacturing a semiconductor device to be immersed in an internal bath, and more particularly, between slots in which wafers are seated. The present invention relates to a lifter of a wet cleaning apparatus which integrally forms a blocking plate material and prevents foreign substances attached to the rear side of the wafer from being transferred to the front surface of the opposite wafer and causing process abnormalities such as particle generation.
일반적으로, 반도체소자는 확산공정, 식각공정, 화학기상증착공정, 세정공정 등 다양한 단위공정을 진행함으로써 제조된다.In general, semiconductor devices are manufactured by performing various unit processes, such as a diffusion process, an etching process, a chemical vapor deposition process, and a cleaning process.
이러한 단위공정중에서 가장 기본적인 공정중의 하나인 세정공정은 반도체소자를 제조하기 위해서 수행되어지는 여러 단계의 공정에서 웨이퍼에 부착된 각종 오염물을 제거하기 위한 공정으로, 이 세정공정을 수행하는 습식세정장치(wet station)는 파티클, 유기오염, 자연산화막, 이온성 불순물 등 다양한 세정 대상을 제거하기 위해 여러 세정액이 사용되며, 이때 사용되는 처리조(process bath)도 하나의 처리조에서 실시되기도 하지만 각 세정액에 따라 분리하여 실시되기도 한다.The cleaning process, which is one of the most basic processes among such unit processes, is a process for removing various contaminants adhering to the wafer in various steps performed to manufacture a semiconductor device. (Wt station) is used to remove various cleaning objects such as particles, organic pollution, natural oxide film, ionic impurities, etc. In this process, the process bath (process bath) is also used in one treatment tank, but each cleaning liquid It may be carried out separately depending on.
도 1은 습식세정장치를 도시한 단면도로서, 이를 참조하면, 습식세정장치는 웨이퍼(W)가 투입되며 세정액을 공급받아 웨이퍼(W)의 세정이 진행되는 내부베스(bath)(1)와, 내부베스(1)의 외측에 설치되어 내부베스(1)로부터 오버플로우(overflow)되는 세정액이 유입되는 외부베스(2)와, 외부베스(2)의 외측으로 웨이퍼(W)에 묻어 있는 파티클(particle)을 제거하기 위한 샤워노즐(3)과, 샤워노즐(3)의 외측으로 유독한 화학물의 대기 노출을 방지하기 위하여 실린더로 작동되는 자동커버(4)와, 내부베스(1)의 하측에 설치되어 내부베스(1)에 투입된 웨이퍼(W)에 초음파를 전달하여 웨이퍼(W)의 세정을 촉진시키는 메가소닉 발진기(5)를 포함한다.FIG. 1 is a cross-sectional view of a wet cleaning device. Referring to this, the wet cleaning device includes an internal bath 1 in which a wafer W is input and a cleaning liquid is supplied to perform cleaning of the wafer W; Particles buried in the wafer W on the outside of the inner bath (1) and the outer bath (2) into which the cleaning liquid overflowed from the inner bath (1) flows, and the outer bath (2) ( a shower nozzle 3 for removing particles, an automatic cover 4 actuated by a cylinder to prevent atmospheric exposure of toxic chemicals to the outside of the shower nozzle 3, and a lower portion of the inner bath 1 It includes a megasonic oscillator (5) installed to transfer the ultrasonic wave to the wafer (W) injected into the internal bath (1) to promote the cleaning of the wafer (W).
내부베스(1)에는 수직방향으로 상하이동하며 다수매(예컨대, 50매)의 웨이퍼(W)를 안착한 쿼츠(quartz)재질의 리프터(lifter)(10)에 의해 상측으로부터 웨이퍼(W)가 투입되어 침지되며, 침지된 웨이퍼(W)의 세정을 위해 약액세정, 린스세정, 최종린스세정 등 세정의 단계마다 약액(chemical) 또는 초순수(DIW ; De-Ionized Water) 등의 세정액이 내부로 공급된다.The wafer W is introduced from the upper side into the inner bath 1 by a lifter 10 made of quartz material, which is moved in a vertical direction and seats a plurality of wafers W (for example, 50 sheets). To clean the immersed wafer W, a cleaning liquid such as chemical or de-ionized water (DIW) is supplied to the inside of each cleaning step such as chemical cleaning, rinse cleaning, and final rinse cleaning. .
도 2는 종래의 리프터를 개략적으로 도시한 횡단면도이다.2 is a cross-sectional view schematically showing a conventional lifter.
리프터(10)는 일측에 상하방향으로 구비되는 리프터헤드부(12)와, 이 리프터헤드부(12)의 하단측에 일측이 연결되도록 수평방향으로 구비되며 그 상면에 일정매수의 웨이퍼(W)를 안착하도록 일정간격으로 슬롯(16)이 다수개 형성된 몸체부(14)로 구성된다.The lifter 10 is provided with a lifter head portion 12 provided on one side in an up and down direction, and is provided in a horizontal direction so that one side is connected to a lower end side of the lifter head portion 12, and a predetermined number of wafers W are provided on the upper surface thereof. It consists of a body portion 14 formed with a plurality of slots 16 at regular intervals to seat the.
여기서, 슬롯(16)을 통해 웨이퍼(W)의 에지부가 지지되어 다수매의 웨이퍼(W)가 일률적으로 수직으로 세워져 안착되는데, 슬롯(16)간에는 돌출분리부(18)가 몸체부(14)에 일체 형성되어 있어 슬롯(16) 사이를 구분시킨다.Here, the edge portion of the wafer W is supported by the slot 16 so that a plurality of wafers W are vertically placed vertically, and the protrusion separation portion 18 is disposed between the slots 16. It is formed integrally with each other to distinguish between the slots (16).
그러나, 웨이퍼(W)가 안착된 상태를 보면, 웨이퍼(W)가 모두 동일방향을 향하도록 안착되므로, 다음 슬롯(16)에 안착된 웨이퍼(W)의 후면은 전 슬롯(16)에 안착된 웨이퍼(W)의 전면과 대향되게 되어, 약액 처리나 초순수 업플로우 등의 세정공정이 진행됨에 따라 이전공정에서 부착된 웨이퍼 후면쪽의 이물이 다른 웨이퍼(W)의 전면으로 전이될 수 있어, 파티클(particle) 발생 등 공정이상을 야기시키고 있다.However, when the wafer W is seated, the wafers W are all seated in the same direction, so that the rear surface of the wafer W seated in the next slot 16 is seated in the previous slot 16. As it faces the front surface of the wafer W, as the cleaning process such as chemical liquid treatment or ultrapure water upflow proceeds, foreign matter on the back side of the wafer attached in the previous process may be transferred to the front surface of the other wafer W, so that the particles It causes process abnormality such as particle generation.
본 발명은 상기와 같은 제반 문제점을 해결하기 위하여 창안된 것으로써, 슬롯간에 차단판재를 일체 형성하여 웨이퍼 후면쪽 이물이 대향하는 다른 웨이퍼의 전면으로 전이되는 것을 방지하여 웨이퍼상의 파티클 부착을 최소화하는 습식세정장치의 리프터를 제공하는데 그 목적이 있다.The present invention was devised to solve the above problems, and a wet type that minimizes particle adhesion on the wafer by preventing the transfer of foreign matter to the front surface of the opposite wafer by integrally forming a blocking plate between slots. The object is to provide a lifter of the cleaning device.
상술한 목적을 달성하기 위한 본 발명은, 다수매의 웨이퍼를 동일방향을 향하도록 몸체부상에 일정간격으로 구비된 슬롯에 안착시켜 내부베스내로 침지시키는 습식세정장치의 리프터에 있어서, 상기 몸체부상의 상기 슬롯 사이에 수직방향으로 소정높이의 차단판재가 일체로 형성되어, 습식세정과정에서 상기 웨이퍼의 후면쪽 이물이 대향하는 다른 웨이퍼의 전면으로 전이되는 것을 방지하는 것을 특징으로 하는 습식세정장치의 리프터를 제공한다.The present invention for achieving the above object is, in the lifter of the wet cleaning device for immersing in the internal bath by seating a plurality of wafers in a slot provided at a predetermined interval on the body portion to face in the same direction, A barrier plate material having a predetermined height is integrally formed in the vertical direction between the slots, so that a foreign material on the rear surface of the wafer is prevented from transferring to the front surface of another wafer facing each other during the wet cleaning process. To provide.
본 발명의 상기 목적과 여러가지 장점은 이 기술분야에 숙련된 사람들에 의해 첨부된 도면을 참조하여 아래에 기술되는 발명의 바람직한 실시예로부터 더욱 명확하게 될 것이다.The above objects and various advantages of the present invention will become more apparent from the preferred embodiments of the invention described below with reference to the accompanying drawings by those skilled in the art.
이하, 첨부된 도면을 참조로 본 발명의 바람직한 실시예를 상세히 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 3은 본 발명의 바람직한 실시예에 따른 리프터를 개략적으로 도시한 횡단면도이다.3 is a cross-sectional view schematically showing a lifter according to a preferred embodiment of the present invention.
습식세정장치의 리프터(100)는 내부베스(1)에 설치되어 다수매의 웨이퍼(W)를 안착하여 내부베스(1)내로 투입하여 침지시키는데, 일측에 상하방향으로 구비되는 리프터헤드부(120)와, 이 리프터헤드부(120)의 하단측에 일측이 연결되도록 수평방향으로 구비되며 그 상면에 일정매수의 웨이퍼(W)를 안착하도록 일정간격으로 슬롯(160)이 다수개 형성된 몸체부(140)로 구성되며, 슬롯(160)간에는 돌출분리부(180)가 몸체부(140)에 일체 형성되어 슬롯(160)간을 구분시킨다The lifter 100 of the wet cleaning device is installed in the inner bath 1, seats a plurality of wafers W, and inputs and immerses them into the inner bath 1. The lifter head part 120 provided on one side in the vertical direction is provided. And a body portion having a plurality of slots 160 formed at predetermined intervals so as to be connected to the lower end side of the lifter head part 120 so as to be connected to one side thereof to seat a predetermined number of wafers W on the upper surface thereof. 140 is formed between the slots 160, the protrusion separation unit 180 is integrally formed in the body portion 140 to distinguish between the slots 160
따라서, 각 슬롯(160)을 통해 각 웨이퍼(W)의 에지부가 지지되어 다수매의 웨이퍼(W)는 일률적으로 수직으로 세워져 모두 동일방향을 향하도록 안착되게 된다.Therefore, the edge portion of each wafer W is supported through each slot 160 so that a plurality of wafers W are vertically vertically placed and are all seated in the same direction.
본 발명에 따르면, 슬롯(160)간에 소정높이의 차단판재(190)가 수직방향으로 몸체부(140)의 돌출분리부(180)를 통해 일체로 형성되며, 이로써 세정공정의 진행에 따라 이전공정에서 부착된 웨이퍼(W) 후면쪽의 이물이 대향하는 다른 웨이퍼(W)의 전면으로 전이되는 것을 방지하게 된다.According to the present invention, the blocking plate material 190 having a predetermined height between the slots 160 is integrally formed through the protrusion separation unit 180 of the body portion 140 in the vertical direction, whereby the previous process as the cleaning process proceeds. The foreign matter on the back side of the wafer W attached at the front side is prevented from being transferred to the front side of the other wafer W facing each other.
여기서, 차단판재(190)의 높이는 안착되는 웨이퍼(W)의 높이에 대응하는 정도가 적당할 것이다.Here, the height of the blocking plate material 190 may be appropriate to correspond to the height of the wafer (W) to be seated.
이상과 같은 구성을 갖는 본 발명에 따른 습식세정장치의 리프터의 작용에 대해 이하 설명한다.The operation of the lifter of the wet cleaning apparatus according to the present invention having the above configuration will be described below.
1회 처리를 위한 다수매의 웨이퍼(W)는 로봇(미도시)에 의해 이전공정으로부터 내부베스(1)측으로 이송되어 리프터(100)에 일정간격으로 안착된 후, 리프터(100)가 내부베스(1)내로 하향 이동하여 안착된 웨이퍼(W)들을 내부베스(1)내에 침지시키게 된다. A plurality of wafers W for one-time processing are transferred to the internal bath 1 from a previous process by a robot (not shown) and seated on the lifter 100 at a predetermined interval, and then the lifter 100 is an internal bath. It moves downward into (1) to immerse the seated wafers (W) in the inner bath (1).
다음으로, 내부베스(1)에 웨이퍼(W)가 침지되면, 하측에 연결된 세정액 공급파이프(미도시)로부터 세정액이 내부베스(1)에 공급되어 웨이퍼(W)의 세정공정이 진행되게 된다.Next, when the wafer W is immersed in the internal bath 1, the cleaning liquid is supplied to the internal bath 1 from the cleaning liquid supply pipe (not shown) connected to the lower side, and the cleaning process of the wafer W is performed.
따라서, 약액 처리나 초순수 업플로우 등의 세정공정이 진행됨에 따라 이전공정에서 웨이퍼(W)의 후면쪽에 부착된 이물이 대향하는 다른 웨이퍼(W)의 전면으로 전이될 수 있는데, 본 발명에 의하면 슬롯(160)간에 차단판재(190)가 구비되어 있어 직접적으로 이물이 전이되는 것을 막게 된다.Therefore, as the cleaning process such as chemical liquid treatment or ultrapure water upflow proceeds, foreign matter attached to the rear side of the wafer W in the previous process may be transferred to the front surface of the other wafer W facing the slot. Blocking member 190 is provided between the 160 to prevent the transfer of foreign matter directly.
덧붙여, 본 발명에서와 같이 슬롯(160)간에 차단판재(190)를 구비시키면, 사이간격이 좁아짐에 따라 세정액의 이동속도가 빨라져 세정효과를 향상시키는 효과도 거둘 수 있다.In addition, when the blocking plate material 190 is provided between the slots 160, as in the present invention, as the interval between the narrower, the moving speed of the cleaning solution can be increased, thereby improving the cleaning effect.
이상, 상기 내용은 본 발명의 바람직한 일 실시예를 단지 예시한 것으로 본 발명의 당업자는 본 발명의 요지를 변경시킴이 없이 본 발명에 대한 수정과 변경을 가할 수 있음을 인지해야 한다.In the foregoing description, it should be understood that those skilled in the art can make modifications and changes to the present invention without changing the gist of the present invention as merely illustrative of a preferred embodiment of the present invention.
본 발명에 따르면, 웨이퍼상의 파티클의 발생 방지와 세정액의 빠른 유속에 의한 세정효과의 극대화로 웨이퍼의 신뢰성과 생산성을 향상시키는 효과가 달성될 수 있다.According to the present invention, the effect of improving the reliability and productivity of the wafer can be achieved by preventing generation of particles on the wafer and maximizing the cleaning effect due to the rapid flow rate of the cleaning liquid.
도 1은 종래의 습식세정장치를 도시한 단면도,1 is a cross-sectional view showing a conventional wet cleaning device;
도 2는 종래의 리프터를 개략적으로 도시한 횡단면도,Figure 2 is a cross-sectional view schematically showing a conventional lifter,
도 3은 본 발명의 바람직한 실시예에 따른 리프터를 개략적으로 도시한 횡단면도이다.3 is a cross-sectional view schematically showing a lifter according to a preferred embodiment of the present invention.
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
1 : 내부베스(bath) 2 : 외부베스1: inside bath 2: outside bath
3 : 샤워노즐 4 : 자동커버3: shower nozzle 4: automatic cover
5 : 메가소닉 발진기 10, 100 : 리프터5: megasonic oscillator 10, 100: lifter
12, 120 : 리프터헤드부 14, 140 : 몸체부12, 120: lifter head 14, 140: body
16, 160 : 슬롯 18, 180 : 돌출분리부16, 160: slot 18, 180: protrusion separation
190 : 차단판재 W : 웨이퍼190: blocking plate W: wafer
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030089095A KR20050056015A (en) | 2003-12-09 | 2003-12-09 | Wafer lifter for use in wet station bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030089095A KR20050056015A (en) | 2003-12-09 | 2003-12-09 | Wafer lifter for use in wet station bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20050056015A true KR20050056015A (en) | 2005-06-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020030089095A KR20050056015A (en) | 2003-12-09 | 2003-12-09 | Wafer lifter for use in wet station bath |
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| Country | Link |
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| KR (1) | KR20050056015A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100800871B1 (en) * | 2006-12-26 | 2008-02-04 | 동부일렉트로닉스 주식회사 | Wafer wet cleaning bath |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04151829A (en) * | 1990-10-16 | 1992-05-25 | Nippon Steel Corp | Wafer carrier for silicon wafer cleaning use |
| JPH0845887A (en) * | 1994-07-29 | 1996-02-16 | Nippon Steel Corp | Wafer cleaning method |
| JPH08107099A (en) * | 1994-10-05 | 1996-04-23 | Rohm Co Ltd | Etching method |
| JPH11162907A (en) * | 1997-11-27 | 1999-06-18 | Hitachi Ltd | Cleaning method |
| KR20050039060A (en) * | 2003-10-23 | 2005-04-29 | 삼성전자주식회사 | Semiconductor cleaning equipment having pollution prevention unit |
-
2003
- 2003-12-09 KR KR1020030089095A patent/KR20050056015A/en not_active Application Discontinuation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04151829A (en) * | 1990-10-16 | 1992-05-25 | Nippon Steel Corp | Wafer carrier for silicon wafer cleaning use |
| JPH0845887A (en) * | 1994-07-29 | 1996-02-16 | Nippon Steel Corp | Wafer cleaning method |
| JPH08107099A (en) * | 1994-10-05 | 1996-04-23 | Rohm Co Ltd | Etching method |
| JPH11162907A (en) * | 1997-11-27 | 1999-06-18 | Hitachi Ltd | Cleaning method |
| KR20050039060A (en) * | 2003-10-23 | 2005-04-29 | 삼성전자주식회사 | Semiconductor cleaning equipment having pollution prevention unit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100800871B1 (en) * | 2006-12-26 | 2008-02-04 | 동부일렉트로닉스 주식회사 | Wafer wet cleaning bath |
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