KR20050045106A - A dc-dc converter module easy to sink the heat - Google Patents

Abstract

The present invention is a low-temperature simultaneous firing ceramic substrate in which a plurality of ceramic sheets are laminated; A converter integrated circuit chip electrically connected to an upper pattern layer formed on an uppermost ceramic sheet of the substrate to convert a DC voltage supplied from the battery into a predetermined DC voltage and output the predetermined DC voltage; A multilayer inductor having one end connected to an output terminal of the converter integrated circuit chip and rectifying the converted DC voltage formed in a conductive pattern on a portion of an upper surface of the ceramic sheet; A passive circuit unit mounted on the substrate to be electrically connected between the other end of the stacked inductor and the lower pattern layer; And a heat dissipation unit having inner layer ground connected through the upper pattern layer and the plurality of first conductive via holes to discharge heat generated from the converter integrated circuit chip to the outside.

According to the present invention, an effect of easily dissipating heat generated during the operation of the converter integrated circuit chip included in the power amplifier is obtained so as to lower the operating voltage of the power amplifier to prolong the service time of the battery.

Description

DC-DC converter module that can easily dissipate heat {A DC-DC CONVERTER MODULE EASY TO SINK THE HEAT}

The present invention relates to a DC-DC converter module, and more particularly, it is possible to easily dissipate heat generated during operation of the converter integrated circuit provided in the power amplifier to extend the operating time of the battery by lowering the operating voltage of the power amplifier. The present invention relates to a DC-DC converter that has improved heat dissipation.

In general, a power amplifier is an electrical component that amplifies a transmission signal of a mobile terminal, which is a wireless communication device, and has a major influence on the performance of a terminal by affecting the usage time of a battery that provides power for driving the terminal. One of the parts.

If the power amplifier is operated in the low power mode, the longest transmission time measured by the terminal is measured in the low power mode to increase the use time of the terminal for the limited battery capacity. It is necessary to increase the efficiency of the power amplifier. Accordingly, by using the DC-DC converter module to lower the operating voltage of the power amplifier at low output power to improve the performance and efficiency of the terminal.

1 is a circuit diagram in which a general DC-DC converter module is applied to a power amplifier, and the power amplifier 3 performs an operation of amplifying and outputting an input to a predetermined transmission power. To be supplied.

And, in order to supply the operating voltage to the input side of the power amplifier (3) in order to directly supply the voltage of the battery or to improve power consumption by modulating the direct current of the voltage of the battery to alternating current and then to a high voltage with a transformer Next, a predetermined operating voltage may be supplied by using the DC-DC converter module 4 which is converted to DC again.

As shown in FIG. 1, the DC-DC converter module 4 electrically connected to the input terminal of the power amplifier 3 converts the DC voltage VB of the battery into the DC voltage required by the power amplifier 3. A converter integrated circuit chip (1) and a rectifier (2) for rectifying and smoothing the output voltage of the converter integrated circuit chip (1) using a coil (L) and a capacitor (C). The driving voltage converted by the chip 1 and supplied to the power amplification module PAM is approximately 3.4V to 4.2V from the voltage of the battery.

 The DC-DC converter module 4 is a converter integrated circuit chip (1), coil (L), capacitor to convert the voltage of the battery into a suitable DC voltage in order to supply the necessary voltage inside the mobile communication terminal such as a mobile phone Passive devices such as (C) are usually manufactured as modules.

Figure 2 (a) (b) is a configuration diagram of a typical DC-DC converter module, the conventional DC-DC converter module 4 is a high temperature cofired ceramics (HTCC) substrate 12 or a printed circuit board An inductor corresponding to the passive circuit section 14 (24) and the coil (L) formed of a converter integrated circuit chip (11) (21) mounted on the (22), and other passive elements such as the capacitor (C). 13 and 23 are respectively mounted and modularized into one component.

In this case, the inductors 13 and 23 necessary for rectifying the voltage converted and output from the DC-DC converter module 4 to a DC voltage are generally 4.7 uH and have a high current / low resistance characteristic. A coil type (Ferrite Coil Type) or a ferrite lamination type is manufactured and used separately. Such an inductor 13 is mounted on the substrate 12 to be epoxy 15 as shown in FIG. It may be molded or placed on top of the substrate 12 via a material such as solder 26, as shown in FIG.

However, the conventional DC-DC converter module 4 uses the inductor 13, 23 mounted on the substrate 12 or mounted on the substrate 22, thereby completing the assembly of the converter module 1. Part height (H1) (H2) of the high, the material cost is increased, there was a limit to apply to the terminal designed to be compact.

In addition, the DC-DC converter module (4) modulates the direct current of the low voltage of the battery and converts it to alternating current, and converts it into a high voltage and then generates a lot of current flows during the operation of the electronic circuit to switch to direct current, The generated heat is transferred to the substrate 12, 22, passive circuit portion 14, 24, etc. as well as to other components mounted on the substrate 12, 22 to overheat it, and the service life of the terminal. And a problem of degrading performance.

Therefore, the present invention has been proposed to solve the above-mentioned conventional problems, and its object is to integrate the inductor and the substrate to reduce the material cost, to miniaturize the terminal design, and to occur during the conversion of the operating voltage supplied from the battery. The present invention aims to provide a DC-DC converter module that is easy to dissipate heat that can be released to the outside to prevent deterioration of the life and performance of the terminal.

As a technical configuration for achieving the above object, the present invention,

In the converter module for converting the voltage of the battery to a DC voltage of the low power mode and outputting,

A low temperature simultaneous firing ceramic substrate in which a plurality of ceramic sheets are laminated;

A converter integrated circuit chip electrically connected to an upper pattern layer formed on an uppermost ceramic sheet of the substrate to convert a DC voltage supplied from the battery into a predetermined DC voltage and output the predetermined DC voltage;

A multilayer inductor having one end connected to an output terminal of the converter integrated circuit chip and rectifying the converted DC voltage formed in a conductive pattern on a portion of an upper surface of the ceramic sheet;

A passive circuit unit mounted on the substrate to be electrically connected between the other end of the stacked inductor and the lower pattern layer;

A heat dissipation unit having an inner ground connected through the upper pattern layer and a plurality of first conductive via holes to dissipate heat generated from the converter integrated circuit chip to the outside; -By providing a DC converter module.

Preferably, the multilayer inductor includes a plurality of conductive patterns formed on at least two ceramic sheets of the plurality of ceramic sheets constituting the low temperature simultaneous firing ceramic substrate, and a pattern for electrically connecting the conductive patterns formed on the different layers. Conductive via holes for connection.

Preferably, the inner layer ground is formed between an uppermost ceramic sheet on which the upper pattern layer is formed and the multilayer inductor.

Preferably, a second conductive via hole is formed between the upper pattern layer and the lower pattern layer provided with the passive circuit unit.

Preferably, an extension part is formed on the outer edge of the inner ground, and a third conductive via hole is formed between the extension part and the lower pattern layer.

Hereinafter, the present invention will be described in more detail.

Figure 3 is a block diagram of the easy heat dissipation DC-DC converter module according to the present invention, Figure 4 (a) (b) is a ceramic sheet is excluded from the easy heat dissipation DC-DC converter module according to the present invention Figure 5 is a perspective view of the inductor and the radiator, Figure 5 is a cross-sectional view of the inductor and the heat dissipation portion except for the ceramic sheet in the easy heat emission DC-DC converter module according to the present invention.

3 to 5, the DC-DC converter module 100 of the present invention easily discharges the heat source generated in the process of outputting the power amplifier by converting the voltage of the battery into the DC voltage of the low power mode to the outside As can be, such a converter module 100 is composed of a low-temperature simultaneous firing ceramic substrate 110, a converter integrated circuit chip 120, a stacked inductor 130, a passive circuit unit 140 and a heat dissipation unit 150.

That is, the low temperature cofired ceramics substrate 110 is formed by stacking a plurality of ceramic sheets made of a ferrite material up and down, and the substrate 110 is mounted on a main board (not shown).

In addition, the converter integrated circuit chip 120 is electrically connected to a battery (not shown) provided in the terminal and an input terminal to convert a low DC voltage, which is an operating power supplied from the battery, into an AC voltage, and converts it into a high voltage. Next, it is a chip component that functions as an electronic circuit that converts the DC voltage again and outputs it to the power amplifier 3.

The converter integrated circuit chip 120 is electrically connected to the upper pattern layer 121 formed on the upper surface of the uppermost ceramic sheet of the plurality of ceramic sheets constituting the substrate 100.

The converter integrated circuit chip 120 provided on the upper surface of the upper pattern layer 121 may be bonded by any one of a flip chip bonding method and a wire bonding method. In terms of miniaturization of the DC-DC converter module 100, the converter integrated circuit chip 120 may be mounted on the upper pattern layer 121 of the substrate 110 by flip chip bonding.

For example, when the converter integrated circuit chip 120 is bonded to the substrate 110 by flip chip bonding, the substrate 110 has a height of about 0.8 mm and the converter integrated circuit chip 120. ) And the passive circuit unit 140 has a height of about 0.75 mm, the DC-DC converter module 100 of the present invention mounted on the main board has a height of about 1.55 mm, which is a high temperature cofired ceramic (HTCC: High Temperature Cofired Ceramics) 1.9mm (substrate (0.4mm) + component (1.5mm)), the height of formation of the conventional DC-DC converter module 4 consisting of a substrate 12 or a multilayer printed circuit board 22 In comparison, it can be seen that the height can be reduced considerably.

In addition, the multilayer inductor 130 is electrically connected to an output terminal of the converter integrated circuit chip 120 mounted on the substrate 110, and is formed on a portion of the upper surface of the ceramic sheet constituting the substrate 110. It is formed of a conductive pattern 131 to rectify the DC voltage converted by the converter integrated circuit chip 120.

The inductor 130 may include a plurality of conductive patterns 131 formed on at least two ceramic sheets of the plurality of ceramic sheets constituting the low temperature simultaneous firing ceramic substrate 120, and conductive patterns 131 formed on the different layers. ) Is configured as a conductive via hole 132 for electrically connecting up and down.

In addition, the passive circuit unit 140, such as the capacitor C, which smoothes the rectified DC voltage while passing through the inductor 130, may be formed on the other end of the inductor 130 to rectify the DC voltage and the lower surface of the substrate 120. A plurality of upper pattern layers 121a of the uppermost ceramic sheet on which the upper pattern layers 121 are formed are electrically mounted between the lower pattern layers 122 to be formed.

Here, the upper pattern layers 121 and 121a on which the converter integrated circuit chip 120 and the passive circuit unit 140 are mounted are pattern layers formed on the same upper surface of the ceramic sheet.

On the other hand, the heat dissipation unit 150 is an inner layer ground parallel to the upper pattern layer 121 so as to cool the module by smoothly dissipating heat generated from the converter integrated circuit chip 120 to the outside when the terminal is used. 151, and the inner layer ground 151 is electrically connected to the upper pattern layer 121 on which the converter integrated circuit chip 120 as a main heat source is mounted, and the plurality of first conductive via holes 151a. .

Here, the inner layer ground 151 is very thin compared to the thickness of the ceramic substrate, such as the conductive pattern 131 formed on the surface of the ceramic substrate to form the inductor 130, so as to increase the product height of the DC-DC converter module The miniaturization of the terminal is not difficult.

The heat generated during the operation of the converter integrated circuit chip 120 is connected to the upper pattern layer 121 and the inner layer ground through the first conductive via hole 151a having the lower end connected to the inner layer ground 151. Since it is emitted to 151 it is possible to prevent excessive rise in temperature of the converter circuit chip 120 and the passive circuit unit 140.

In addition, the inner layer ground 151 is formed between the uppermost ceramic sheet on which the upper pattern layers 121 and 121a are formed and the multilayer inductor 130.

In addition, the upper pattern layer 121a provided with the passive circuit unit 140 may also easily heat dissipate into the lower pattern layer 122 provided on the lower surface of the substrate 110. And a second conductive via hole 151b are formed between the lower pattern layer 122 and the lower pattern layer 122.

In addition, when the converter integrated circuit chip 120 operates, the heat transferred to the inner layer ground 151 side is transferred to the lower pattern layer 122 to extend to the outer edge of the inner ground 151 to radiate heat. The third conductive via hole 151c may also be formed between the extension part 152 and the lower pattern layer 122.

On the other hand, the upper end and the lower end of the conductive pattern 131 constituting the stacked inductor 130 of the low-temperature co-fired substrate 110 is an upper pattern layer 121a and a lower pattern layer on which the passive circuit unit 140 is mounted. And electrically connected to the second conductive via hole 151c connecting therebetween.

FIG. 6 is a Smith chart showing a simulation result of an inductor employed in a heat-dissipating DC-DC converter module of the present invention.

The inductor 130 for rectifying the DC voltage requires 4.7 μH. As a result of the analysis as in Equation 1, it can be seen that there is no characteristic change even when the inner layer 151 is inserted into the inductor 130 with 4.7619 μH. , And the result of the measurement was 4.4 μH.

[Equation 1]

L = X _L / 2πf

= 29.92 / (2 * π 1 * 10 ⁶ )

  = 4.7619 [μH]

Where L is an inductor value and X _{L is a} reactance value. f: Frequency.

In addition, when the converter integrated circuit chip 120 is operated, heat generated by a current flowing up to 600 mA through the inner layer ground 151 may not only be discharged to the outside, but also the influence of noise may be reduced.

According to the present invention as described above, a high-capacity inductor is formed in a low-temperature simultaneous firing substrate, and a converter integrated circuit chip and a passive circuit unit are mounted on the substrate to modularize and heat generated during operation of the converter integrated circuit chip to the outside is easy. In this way, the manufacturing cost of manufacturing the DC-DC converter module can be reduced, and the miniaturized design of the terminal adopting the DC-DC converter module can be reduced. Effect is obtained.

While the invention has been shown and described with respect to specific embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit or scope of the invention as set forth in the claims below. I would like to know that those who have knowledge of Easily know.

1 is a circuit diagram in which a general DC-DC converter module is applied to a power amplifier.

Figure 2 (a) (b) is a configuration diagram of a general DC-DC converter module.

3 is a block diagram of a DC-DC converter module for easy heat dissipation according to the present invention.

Figure 4 (a) (b) is a perspective view of the inductor and the heat dissipating portion except for the ceramic sheet in the easy heat dissipation DC-DC converter module according to the present invention.

5 is a cross-sectional view of an inductor and a heat dissipation part in which a ceramic sheet is excluded in a heat dissipation DC-DC converter module according to the present invention.

FIG. 6 is a Smith chart showing a simulation result of an inductor employed in a heat-dissipating DC-DC converter module of the present invention.

Explanation of symbols on the main parts of the drawings

110: substrate 120: converter integrated circuit chip

121,121a: upper pattern layer 122: lower pattern layer

130: stacked inductor 131: conductive pattern

140: passive circuit unit 150: heat dissipation unit

151a, 151b, 151c: first, second and third conductive via holes

Claims (5)

In the converter module for converting the voltage of the battery to a DC voltage of the low power mode and outputting, A low temperature simultaneous firing ceramic substrate in which a plurality of ceramic sheets are laminated; A converter integrated circuit chip electrically connected to an upper pattern layer formed on an uppermost ceramic sheet of the substrate to convert a DC voltage supplied from the battery into a predetermined DC voltage and output the predetermined DC voltage; A multilayer inductor having one end connected to an output terminal of the converter integrated circuit chip and rectifying the converted DC voltage formed in a conductive pattern on a portion of an upper surface of the ceramic sheet; A passive circuit unit mounted on the substrate to be electrically connected between the other end of the stacked inductor and the lower pattern layer; A heat dissipation unit having an inner ground connected through the upper pattern layer and a plurality of first conductive via holes to dissipate heat generated from the converter integrated circuit chip to the outside; -DC converter module. The method of claim 1, The multilayer inductor may include a plurality of conductive patterns formed on at least two ceramic sheets of the plurality of ceramic sheets constituting the low temperature co-fired ceramic substrate, and a conductive pattern for electrically connecting the conductive patterns formed on the different layers. Easy heat dissipation DC-DC converter module, characterized in that consisting of via holes. The method of claim 1,  The inner layer ground is easy to heat dissipating DC-DC converter module, characterized in that formed between the uppermost ceramic sheet and the laminated inductor is formed. The method of claim 1, The DC-DC converter module for easy heat dissipation, characterized in that the second conductive via hole is formed between the upper pattern layer and the lower pattern layer provided with the passive circuit unit. The method of claim 1, An extension part is formed on an outer edge of the inner ground, and a third conductive via hole is formed between the extension part and the lower pattern layer.