KR20050020037A - Facility and method for coating photoresist on substrates and apparatus for treating a slit-nozzle used in the facility - Google Patents

Abstract

PURPOSE: An apparatus and a method for doping photoresist on a substrate and a slit nozzle processing device therefor are provided to minimize an amount of photoresist consumed when forming beads to a slit nozzle, and reduce a movement path of the slit nozzle. CONSTITUTION: A slit nozzle processing device for an apparatus for doping photoresist on a substrate includes a base, a horizontal movement part for moving the base rectilinearly, and a bead forming part. The bead forming part is coupled with the base to move together with the base, and has a spraying nozzle(140) for supplying photoresist to a slit nozzle(30) for forming beads to the slit nozzle. The bead forming part forms beads at a side part of a discharge hole(32) of the slit nozzle in sequence by moving from an end to the other end of the slit nozzle. Gas spraying parts are provided at both sides(34a,34b) of the discharge hole of the slit nozzle for moving the bead forming part smoothly.

Description

FACILITY AND METHOD FOR COATING PHOTORESIST ON SUBSTRATES AND APPARATUS FOR TREATING A SLIT-NOZZLE USED IN THE FACILITY

The present invention relates to an apparatus and method for manufacturing a flat panel display device, and more particularly, to a device for forming beads in a nozzle for discharging a chemical solution on a substrate for manufacturing a flat panel display device, and to clean the same; It is about a method.

Recently, information processing devices have been rapidly developed to have various types of functions and faster information processing speeds. This information processing apparatus has a display device for displaying the operated information. Until now, a cathode ray tube monitor has been mainly used as a display device, but in recent years, with the rapid development of semiconductor technology, the use of flat panel displays that are light and occupy small space is rapidly increasing. There are various types of flat panel displays, and among them, liquid crystal displays having low power consumption and volume and low voltage driving type are widely used.

Among the processes performed to manufacture the liquid crystal display device, an application process is a process of applying a photoresist, such as a photoresist, on a substrate to the exposure light source. In general, the coating process is performed while discharging the photoresist on the substrate while the slit nozzle is moved at a constant speed from one end of the substrate placed on the coating portion to the other end.

It is important to form beads in the slit nozzle 720 before discharging the photoresist onto the substrate 700. When the photoresist is discharged from the slit nozzle 720 in a state in which no suitable beads are formed in the slit nozzle 720, the photoresist is formed until a predetermined bead is formed in the slit nozzle 720 as shown in FIGS. 1A and 1B. Is applied on the substrate 700 with a non-uniform thickness. FIG. 1A is a plan view of the substrate when the photoresist is ejected to the substrate in a state where no beads are formed in the nozzle, and FIG. 1B is a cross-sectional view taken along the line A-A of FIG. 1A.

Therefore, before the photoresist is discharged onto the substrate 700, a process of forming an appropriate bead in the slit nozzle 720 is performed. In the general coating equipment, the bead forming process is performed until a suitable bead is formed on the side of the discharge portion of the slit nozzle 720 on the rotating roller 740 having the same length as the slit nozzle 720 as shown in FIG. The photoresist is discharged from the slit nozzle 720. The above-described method consumes a large amount of expensive photoresist for forming beads, which becomes even larger as the size of the substrate becomes larger.

In addition, when the photoresist application is completed on one substrate, the nozzle is cleaned by the cleaning liquid before the above-described bead forming process is performed. However, in a typical installation, since the cleaning unit for cleaning the nozzle and the bead forming unit for forming beads in the nozzle are separately disposed, the movement path of the nozzle is long, thereby reducing the throughput and reducing the footprint. Is increased.

An object of the present invention is to provide a coating equipment that can minimize the amount of photoresist consumed when forming beads in a nozzle.

In addition, an object of the present invention is to provide a coating apparatus that can shorten the movement path of the slit nozzle, improve the throughput, and reduce the installation area thereof.

In order to achieve the above object, the slit nozzle processing apparatus of the present invention is a base, a horizontal moving unit for linearly moving the base, is coupled to the base is moved with the base and the slit nozzle to form beads in the slit nozzle It has a bead forming portion having an injection nozzle for supplying the chemical liquid, the bead forming portion is sequentially formed in one side of the discharge portion of the slit nozzle while moving from one end to the other end of the slit nozzle. On both sides of the insertion part of the bead forming part, a gas injection part for injecting gas to both sides of the discharge part of the slit nozzle is provided in order to allow the bead forming part to smoothly move from one end of the discharge part of the slit nozzle to the other end.

Preferably, the injection nozzle has a guide part formed so as to face one side of which a bead is formed among the side parts of the nozzle discharge part.

A cleaning part for cleaning the slit nozzle is provided in the processing apparatus, and the cleaning part is formed on both sides of the housing and the housing having an insertion part coupled to the base and into which a part of the slit nozzle is inserted. And a cleaning liquid spraying portion for injecting a cleaning liquid into a discharge portion of the slit nozzle inserted into the portion. The cleaning unit cleans the slit nozzle while moving from one end of the discharge part of the slit nozzle to the other end. Both sides of the insert of the cleaning unit are provided with a gas injection unit for injecting purge gas into the discharge portion of the slit nozzle inserted into the insert.

Preferably, the bead forming portion and the cleaning portion are disposed adjacent to each other side by side in the longitudinal direction of the slit nozzle, the insertion portion of the bead forming portion and the insertion portion of the cleaning portion are arranged on the same line.

A vertical moving part for moving the bead forming part up and down is provided to the processing apparatus, wherein the vertical moving part is a driving part coupled to the base, and is vertically moved up and down by the driving part, and is supported with the housing bottom of the bead forming part. A rod and a guide part for guiding vertical movement of the bead-forming housing.

The horizontal moving part has a bracket coupled to the base and having a screw hole formed therein, a screw inserted into the screw hole of the bracket, and a motor for rotating the screw, wherein the base rotates the screw as the screw is rotated. Along the straight line.

In addition, the coating apparatus of the present invention is applied to the coating portion is applied to the photoresist on the substrate, the slit nozzle for discharging the photoresist on the substrate, the cleaning unit for cleaning the slit nozzle and the cleaning unit and the It has a processing part which is arrange | positioned side by side in the longitudinal direction of a slit nozzle, and the processing apparatus which has the bead formation part which forms the bead in the said slit nozzle is installed. The treatment apparatus moves from one end of the slit nozzle to the other end to clean the slit nozzle and to form beads in the slit nozzle.

In addition, the coating method of the present invention is the step of transferring the slit nozzle to the processing apparatus, the application process for one substrate in the coating unit, cleaning the slit nozzle, the slit nozzle housing the bead forming unit of the processing apparatus Inserting into the insertion portion formed in the step, the step of spraying the chemical liquid from the injection nozzle formed on the bottom surface of the insert portion to the discharge portion of the slit nozzle, the processing apparatus is moved from one end of the slit nozzle to the other end, and the slit nozzle Moving to the applicator.

The cleaning of the slit nozzle may include inserting the slit nozzle into an insertion part formed in the cleaning part housing of the processing apparatus, spraying the cleaning liquid into the slit nozzle from the cleaning liquid injection part formed on the side of the insertion part. And purging the purge gas from the gas injection unit to the slit nozzle, and moving the processing apparatus from one end of the slit nozzle to the other end.

Further, after the cleaning of the slit nozzle, the slit nozzle may be moved into a bath filled with photoresist, and a step of partially discharging the photoresist from the slit nozzle may be further provided.

Hereinafter, embodiments of the present invention will be described in more detail with reference to FIGS. 3 to 10. The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the elements in the drawings are exaggerated to emphasize a clearer description.

In the present embodiment, the substrate is for manufacturing a flat panel display device, and the flat display device is a liquid crystal display (LCD), a plasma display (PDP), a vacuum fluorescent display (VFD), a field emission display (FED), Or ELD (Electro Luminescence Display).

3 is a view schematically showing a coating equipment 1 according to a preferred embodiment of the present invention. Referring to FIG. 3, the coating device 1 of the present invention has a slit nozzle 30, an application part 10, and a treatment part 20. The application part 10 is a part that provides a space where a process of applying a chemical liquid such as a photoresist is directly performed on the substrate 40. When the substrate 40 is placed in the coating unit 10, the slit nozzle 30 moves from one end of the substrate 40 to the other end to discharge the photoresist onto the substrate 40. The processing unit 20 cleans the slit nozzle 30 that has been applied to one substrate, and forms beads in the slit nozzle 30 before performing the application process to the next substrate. In part, there is a processing apparatus 24 for performing the above-described process and a bath 22 filled with photoresist.

4 is a perspective view of the slit nozzle 30 of the present invention. The slit nozzle 30 is a part for supplying a photoresist. The slit nozzle 30 is gradually reduced in width and extends from the discharge part 36 and the discharge part 36 having the discharge port 32 formed at the end thereof, and has a rectangular parallelepiped body part 38. The slit nozzle 30 is formed to have a length similar to one side of the substrate, the discharge port 32 is formed of a slit. The discharge part 36 has both side surfaces 34a and 34b, and beads to be described later are formed only on one side 34a.

FIG. 5 is a front view of the processing apparatus 24 of the present invention, and FIG. 6 is a perspective view of the bead forming unit 100 and the cleaning unit 200 in the processing apparatus 24 of FIG. Referring to FIG. 5, the processing apparatus 24 includes a base 400, a bead forming part 100, a cleaning part 200, a horizontal moving part 500, and a vertical moving part 300.

The base 400 has a horizontal portion 420 made parallel to the bottom and a vertical portion 440 made perpendicular to the bottom. The washing part 200 is installed on the horizontal part 420 on one side of the base 400 based on the vertical part 440, and the bead forming part 100 is located on the other side of the vertical part 440. Is installed in conjunction with

The bead forming part 100 has a housing 180 and an injection nozzle 140 as a part of forming a bead on one side 34a of the discharge part before the slit nozzle 30 is moved to the applicator 10. Referring to FIG. 6, an insertion part 120 into which a part of the discharge part 36 of the slit nozzle is inserted is formed on the upper surface of the housing 180. Insertion portion 120 has both sides 122 and bottom surface 124, each side 122 is inclined inclined portion 122a and vertical to be positioned below the inclined portion to provide a wider width upwards It has the vertical part 122b which is a surface. The side surface 122 of the insertion portion is formed in a shape corresponding to the discharge portion 36 of the slit nozzle inserted into the insertion portion 120. The bottom surface 124 of the insertion part is formed flat, and the injection nozzle 140 protruding upward is installed at the center of the bottom surface 124. The injection nozzle 140 is a portion for injecting the photoresist into the discharge portion 36 of the slit nozzle in order to form beads on the one side 34a of the slit nozzle discharge portion.

FIG. 7 is a cross-sectional view illustrating a spray nozzle 140 spraying a photoresist to one side 34a of the discharge part of the slit nozzle inserted into the inserting part 120. Referring to FIG. 7, the spray nozzle 140 has a horizontal portion 142 and a guide portion 144. The horizontal portion 142 is formed flat in a position opposite to the discharge port 32 of the slit nozzle, the guide portion 144 is extended so as to be inclined upward from one end of the horizontal portion 142 to one side of the discharge portion of the slit nozzle ( It is formed to face 34a). The injection hole 146 of the injection nozzle is formed from a part of the guide part 144 to a part of the horizontal part 142.

First, when one end of the ejection portion 36 of the slit nozzle is inserted into the insertion portion 120 of the bead forming portion, photoresist is ejected from the ejection opening 146 of the ejection nozzle, and as shown in FIG. 144 is ejected in a direction toward the discharge portion one side 34a of the slit nozzle, and thus beads are formed in the discharge portion one side 34a of the slit nozzle. The bead forming unit 100 is moved in a straight line such that the discharge unit 36 of the slit nozzle is inserted into the insertion unit 120 sequentially from one end to the other end, and the injection nozzle 140 continuously sprays the photoresist.

Gas injecting portions 160 are formed on the inclined portions 122a of both sides of the insertion portion 100 of the bead forming portion 100. The gas injection unit 160 has both sides of the discharge portion of the slit nozzle so that the bead forming unit 100 moves smoothly from one end of the slit nozzle 30 to the other end while the slit nozzle 30 is inserted into the insertion unit 120. It is the part which inject | pours high pressure gas to 34a, 34b. As a gas, nitrogen gas which is an inert gas may be used. Referring to FIG. 8, the discharge part side surfaces 34a and 34b of the slit nozzle are inserted into the insertion part 120 while maintaining a minute gap with the side surface 122 of the insertion part, and the gas injection part 160 is inserted into the insertion part 120. The side surface 122 is formed in the center of the groove 162 and the thinly recessed circularly and has an injection hole 164 for injecting air. Both sides 122a and 122b of the insertion portion of the bead forming unit may be smoothly moved along the slit nozzle 30 while maintaining the same distance as the slit nozzle 30 by the air pressure injected through the injection hole 164.

The cleaning unit 200 is a portion for cleaning the slit nozzle 30 that has been applied to one substrate 40 in the application unit 10. Referring to FIG. 6 again, the cleaning unit 200 has a housing 280, a cleaning liquid injection unit 244, and a purge gas injection unit 264. An insertion part 220 into which a part of the discharge part 36 of the slit nozzle is inserted is formed on the upper surface of the housing 280. The insertion part 220 of the cleaning part is disposed in line with the insertion part 120 of the bead forming part when viewed from above. Insertion portion 220 is reduced in width toward the bottom, has a shape corresponding to the discharge portion 36 of the slit nozzle.

The insertion part 220 is formed with the front groove 240 and the rear groove 260 spaced apart from each other by a predetermined distance. The front groove 240 is a portion in which the slit nozzle 30 is cleaned with a cleaning liquid, and the rear groove 260 is a process for removing the cleaning liquid attached to the slit nozzle 30 and drying the slit nozzle 30. It is part. Each side portion 242 of the front groove 240 is composed of a vertical surface 242a and a vertical surface 242a in which the injection hole 244, which is a cleaning liquid injection unit, is formed, and is inclined inwardly. A discharge hole 246 through which the cleaning liquid used for cleaning the slit nozzle 30 is discharged is formed at the bottom of the front groove 240. The injection hole 244 may be formed as a slit or may be formed as at least one circular hole. Thinner may also be used as the cleaning liquid. The rear groove 260 is formed in the same shape as the front groove 240 described above. Injection holes 264, which are purge gas injection units for injecting purge gas, are formed in the vertical surface 262a of the rear groove side, and purge gases injected from the injection holes 264 are formed in the bottom of the rear grooves 260. An exhaust hole 266 to be exhausted is formed. Nitrogen gas (N ₂ ) may be used as the purge gas.

When the discharge part 36 of the slit nozzle is inserted into the insertion part 220 of the cleaning part, the part where the front groove 240 and the rear groove 260 are formed and the discharge part side surfaces 34a and 34b of the slit nozzle are formed. A space is formed between). First, a thinner is sprayed from the injection hole 244 formed in the front groove 240 to the discharge part 36 of the slit nozzle to clean the discharge part 36 of the slit nozzle. The cleaning unit 200 performs the cleaning process while continuously moving along the longitudinal direction of the slit nozzle 30 so that the cleaning is performed from one end to the other end of the discharge part 36 of the slit nozzle. While purging is performed by the thinner, purge gas is injected from the injection hole 264 formed in the rear groove 260 to the discharge portion 36 of the slit nozzle to remove the thinner adhered to the discharge portion 36 of the slit nozzle. The discharge part 36 of the slit nozzle is dried.

That is, according to the processing apparatus 24 of the present invention, the purge and purge process of cleaning the discharge portion 36 of the slit nozzle with thinner while the cleaning portion 200 is moved from one end of the discharge portion 36 of the slit nozzle to the other end. The process of washing with gas takes place simultaneously.

When the cleaning of the slit nozzle 30 is completed, the slit nozzle 30 is transferred to the bath 22. When the slit nozzle 30 is cleaned with a thinner, bubbles are partially generated by inserting a thinner into the discharge port 32 of the slit nozzle. In order to remove this, the slit nozzle 30 ejects a predetermined amount of the photoresist in the bath 22.

The vertical moving part 300 is a part for adjusting the vertical height of the bead forming part 100. The bead forming unit 100 is lowered to be disposed below the cleaning unit 200 when the cleaning process is in progress, and the bead forming unit 100 is elevated to be disposed above the cleaning unit 200 when the bead forming process is performed. The vertical moving part 300 includes a driving part 340 for raising and lowering the support rod 320 and the support rod 320, one end of which is coupled to the lower surface of the bead forming part 100, and a vertical of the bead forming part 100. It has a guide portion 360 to guide the movement. The driver 340 is mounted on the horizontal portion 420 of the base, and a hydraulic cylinder may be used. In order to guide the vertical movement of the bead forming unit 100, at least one protrusion 364 protruding vertically and vertically is formed at one side of the vertical part 440 of the base, and the side of the housing 180 of the bead forming part is described above. A groove 362 having a shape corresponding to the protrusion 364 may be formed. In addition, although not shown, a stopper for limiting the moving range of the bead forming portion may be provided.

The horizontal moving part 500 is a part for moving the base 400 provided with the bead forming part 100 and the cleaning part 200 from one end of the slit nozzle 30 to the other end. Referring to FIG. 9, which is a perspective view of the horizontal moving part 500, the horizontal moving part 500 has a screw 540, a motor 520, a bracket 560, and a guide part 580. In the center of the bracket 560 is formed a through screw hole 562 for inserting the screw 540, the upper surface is formed with screw holes 564 for coupling with the base 400. A motor 520 for rotating the screw 540 is coupled to one end of the screw 540, and a fixing block 530 is coupled to the other end of the screw 540 to prevent the screw 540 from moving. Therefore, when the screw 540 is rotated, the bracket 560 coupled with the base 400 is moved along the screw 540.

The guide part 580 is used to guide the linear movement of the base 400 and has a guide rail 582, fixed blocks 584, and a moving block 586. The guide rails 582 are respectively installed on both sides of the screw 540 in parallel with the screws 540, and fixed blocks 584 are coupled to both ends of the guide rails 582. The moving block 586 is coupled to the guide rail 582 and moved along the guide rail 582, and fixedly coupled to the base 400.

Hereinafter, the process of apply | coating photoresist on a board | substrate using the coating installation 1 of this invention is demonstrated. Referring to FIG. 10, which is a flowchart sequentially showing a coating method, the slit nozzle 30 having completed the coating process for one substrate is transferred from the coating unit 10 to the processing unit 24 of the processing unit 20. (Step S10). Thereafter, the process of cleaning the slit nozzle is performed (step S20). The bead forming unit 100 of the processing apparatus is lowered to a position lower than the washing unit 200, and the discharge portion 36 of the slit nozzle is inserted into the washing unit inserting unit 220 of the processing apparatus (step S21). Thinner is injected from the injection hole 244 formed in the front groove 240 to clean the discharge portion 36 of the slit nozzle, and nitrogen gas is injected from the injection hole 264 formed in the rear groove 260 to discharge the slit nozzle. The discharge part 36 is dried (step S22 S23). In order to clean the whole from one end to the other end of the discharge part 36 of the slit nozzle, the cleaning part 200 is linearly moved by the horizontal moving part 500 (step S24).

When the cleaning process is completed, the slit nozzle 30 is moved to the bath 22 in which the photoresist is accommodated, and the slit nozzle 30 ejects a predetermined amount of photoresist in the bath 22 to remain in the discharge port 36. The thinner is discharged (step S30).

Thereafter, a process of forming a bead on one side 34a of the discharge portion of the slit nozzle is performed (step S40). The slit nozzle 30 is moved back to the processing apparatus 24. The bead forming part 100 is elevated by the vertical moving part 300, and the slit nozzle 30 is inserted into the insertion part 120 of the bead forming part (step S41). High-pressure air is injected from the gas injection part 164 toward the discharge side surfaces 34a and 34b of the slit nozzle, and a photoresist is injected from the injection nozzle 140 to the discharge part side 34a of the slit nozzle (step) S42, S43). In order to form beads from one end to the other end of the discharge part 36 of the slit nozzle, the bead forming part 100 is linearly moved by the horizontal moving part 500 (step S44). When the bead formation is completed in the discharge portion 36 of the slit nozzle, the slit nozzle 30 is moved to the application portion 10 to apply a photoresist on the substrate 40 (step S50).

According to the apparatus of the present invention, there is an effect that can reduce the amount of photoresist consumed during the bead forming process of forming a bead in the nozzle.

In addition, according to the coating equipment of the present invention, since the washing portion and the bead forming portion are integrally formed, the equipment area is reduced, and the movement path of the slit nozzle is short, so that the throughput can be improved.

1A is a plan view of a substrate when discharging a photoresist to the substrate in a state where no beads are formed in the slit nozzle;

1B is a cross-sectional view taken along the line A-A of FIG. 1A;

2 shows a general method for forming beads in a slit nozzle;

3 is a view schematically showing a coating equipment according to an embodiment of the present invention;

4 is a perspective view of the slit nozzle of FIG. 3;

5 is a front view of the processing apparatus of FIG. 3;

6 is a perspective view of the bead forming unit and the cleaning unit in the processing apparatus of FIG.

7 is a view showing a spray nozzle for spraying a photoresist to one side of the discharge portion of the slit nozzle;

8 is a cross-sectional view showing a state in which a slit nozzle is inserted into an insertion portion of the bead forming portion;

9 is a perspective view of a horizontal moving unit; And

10 is a flowchart showing sequentially an application method according to an embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

10: coating part 20: processing part

22 bath 24 processing device

30: slit nozzle 36: slit nozzle discharge portion

100: bead forming portion 120: bead forming portion insertion portion

140: injection nozzle 160: gas injection unit

200: cleaning unit 220: cleaning unit insertion unit

240: front groove 244: cleaning liquid injection unit (injection hole)

260: rear groove 264: purge gas injection unit (injection hole)

300: vertical moving part 320: support rod

340: cylinder 360: guide

400: base 500: horizontal moving part

520: motor 540: screw

560: bracket 580: guide part

Claims (21)

In the apparatus for processing a slit nozzle for discharging a chemical liquid on a substrate for manufacturing a flat panel display device, A base; A horizontal moving unit for linearly moving the base; And A bead forming unit having an injection nozzle coupled to the base and moving with the base, and supplying the chemical liquid to the slit nozzle to form a bead in the slit nozzle, The bead forming unit is a slit nozzle processing apparatus, characterized in that for forming a bead on one side of the discharge portion of the slit nozzle while moving from one end of the slit nozzle. The method of claim 1, The bead forming portion further comprises a housing having an insertion portion into which the discharge portion of the slit nozzle is inserted, the upper surface, And the injection nozzle is formed to protrude upward from a bottom surface of the insertion part. The method of claim 2, The bead forming portion is formed on both sides of the insertion portion, and the bead forming portion further comprises a gas injection portion for injecting gas to both sides of the discharge portion of the slit nozzle inserted into the insertion portion to move smoothly Nozzle processing unit. The method of claim 1, The injection nozzle has a slit nozzle processing apparatus characterized in that it has a guide portion formed to face one side of the bead is formed of the side of the slit nozzle discharge. The method of claim 1, The apparatus further comprises a cleaning unit for cleaning the slit nozzle. The method of claim 5, The cleaning unit, A housing coupled to the base, the housing having an insertion portion into which a portion of the slit nozzle is inserted; A cleaning liquid spraying part formed on both sides of the inserting portion and injected into the ejecting portion of the slit nozzle inserted into the inserting portion; The cleaning liquid injection unit is a slit nozzle processing apparatus, characterized in that for cleaning the slit nozzle while moving from one end of the discharge portion of the slit nozzle to the other end. The method of claim 6, Slit nozzle processing apparatus, characterized in that the insertion portion is formed on the bottom discharge line for discharging the cleaning liquid. The method of claim 6, And the cleaning part further comprises a gas injection part which is formed on both sides of the insertion part and injects purge gas into the discharge part of the slit nozzle inserted into the insertion part. The method of claim 5, And the bead forming unit and the cleaning unit are disposed adjacent to each other side by side in the longitudinal direction of the slit nozzle. The method of claim 9, The bead forming portion and the cleaning portion further includes a housing having an insertion portion into which the discharge portion of the slit nozzle is inserted, And the insertion portion of the bead forming portion and the insertion portion of the cleaning portion are arranged on the same line. The method of claim 10, The apparatus further comprises a vertical moving portion for moving the bead forming portion up and down. The method of claim 11, The vertical moving unit, A driving unit coupled to the base; A support rod vertically moved up and down by the driving unit and coupled to the housing bottom of the bead forming unit; And And a guide part for guiding vertical movement of the housing of the bead forming part. The method of claim 1, The horizontal moving unit, A bracket coupled to the base and having a screw hole formed therein; A screw inserted into the screw hole of the bracket; And And a motor for rotating the screw, And the base is linearly moved along the screw as the screw is rotated. In the equipment for applying a photoresist on a substrate for manufacturing a flat panel display device, An application unit on which a process of applying photoresist on a substrate is performed; A slit nozzle for discharging a photoresist on the substrate; And A processing unit having a cleaning unit for cleaning the slit nozzle and a bead forming unit disposed side by side in the longitudinal direction of the cleaning unit and the slit nozzle and having a bead forming unit in the slit nozzle, and disposed on one side of the coating unit Provided with Wherein the processing apparatus is moved from one end of the slit nozzle to the other end, the coating equipment, characterized in that to clean the slit nozzle and to form a bead in the slit nozzle. The method of claim 14, The bead forming unit, A housing including an insertion portion into which the discharge portion of the slit nozzle is inserted and having both side surfaces and a bottom surface; It is formed so as to protrude from the bottom surface of the insert portion, and has an injection nozzle for forming a bead by injecting the chemical liquid to the discharge portion of the slit nozzle, The spray nozzle is characterized in that the coating portion characterized in that it has a guide portion formed to face one side of the bead is formed of the nozzle discharge portion. The method of claim 14, The cleaning unit, A housing coupled to the base, the housing having an insertion portion into which a portion of the slit nozzle is inserted; A cleaning liquid injection unit formed on both sides of the insertion unit and spraying a cleaning liquid to the slit nozzle inserted into the insertion unit; And And a gas injection part formed on both sides of the insertion part and spraying purge gas to the slit nozzle inserted into the insertion part. The method of claim 14, The facility further includes a bath disposed on one side of the processing unit, And the slit nozzle removes the cleaning liquid remaining in the discharge portion, and discharges a predetermined amount of the chemical liquid in the bath to fill the chemical liquid in the discharge portion. In the method for applying a photoresist on a substrate for manufacturing a flat panel display device, Transferring the slit nozzle, which has been applied to one substrate in the applicator, to the processing apparatus; Inserting the slit nozzle into an insertion portion formed in the bead forming housing of the processing apparatus; Injecting the chemical liquid into the discharge portion of the slit nozzle from the injection nozzle formed on the bottom surface of the insert; Moving the processing device from one end of the slit nozzle to the other end; And Applicable method comprising the step of moving the slit nozzle to the applicator. The method of claim 18, The method further includes the step of cleaning the slit nozzle prior to the step of inserting the slit nozzle into an insert formed in the bead forming housing of the processing apparatus, Cleaning the slit nozzle, Inserting the slit nozzle into an insertion portion formed in the cleaning portion housing of the processing apparatus; Spraying the cleaning liquid into the slit nozzle from the cleaning liquid spraying unit formed on the side of the insert; Injecting purge gas into the slit nozzle from a gas injection part formed at a side of the insertion part; And And the processing apparatus is moved from one end of the slit nozzle to the other end. The method of claim 19, The method after the step of cleaning the slit nozzle, And the slit nozzle is moved into a bath filled with photoresist and partially ejecting the photoresist from the slit nozzle. The method of claim 19, And the insertion portion of the bead forming portion and the insertion portion of the cleaning portion are arranged on the same line.