KR200457224Y1 - Photo transfer line and photo circuit constructure - Google Patents

Abstract

The present invention relates to a direct structure of an optical device and a method of manufacturing the same, and more particularly, to a structure and a method of manufacturing the optical device directly to prevent a signal loss occurring beyond the position of the optical device.

Optical device direct structure according to the present invention is a support plate, a rigid PCB mounted on the support plate; A flexible optical board connected to the rigid PCB and in which an optical waveguide is formed; A ceramic substrate fixed on the rigid PCB, wherein the ceramic substrate is a substrate on which an optical device chip is mounted on a side and a driving driver is mounted on an upper surface thereof, and the optical waveguide of the flexible optical board is connected to the optical device chip. .

In the optical device direct structure according to the present invention, the optical waveguide and the optical device chip directly face each other, thereby preventing optical loss and an error of the optical signal.

Optical element, flexible optical board

Description

Integrated structure of optical waveguide and optical device {PHOTO TRANSFER LINE AND PHOTO CIRCUIT CONSTRUCTURE}

The present invention relates to a direct structure of an optical waveguide and an optical device, and more particularly, to a structure of directing an optical device chip for exchanging accurate signals through an optical waveguide embedded in a flexible optical board.

Many standard methods are used to transfer high-speed data between chips or boards.

This is to prevent data loss due to signal loss in high speed data transmission. However, for the high speed data transmission due to the large amount of data, the optical signal is transmitted to overcome the limitation of the data transmission speed due to the high speed data transmission and to prevent the signal loss due to the signal occlusion between the data. The use of the method has been attempted. However, in order to transmit an optical signal, an optical waveguide or an optical cable should be connected between the light source and the optical receiving element. Many structures have been proposed as a method for connecting such optical waveguides or optical cables, but in order to transmit data between small chips or boards, the optical transmission / reception elements are transferred to a chip or board that needs to be transferred, instead of the conventional optical module packaging type transmission method. Direct implementation methods are being studied. In addition, in order to form an optical waveguide in a limited space inside the system, a flexible optical waveguide in the form of a flexible optical board must be used.

Therefore, in order to solve the above problems, the packaging method of the optical transmission and reception elements should be improved, and in order to use the optical waveguide in a limited space, various optical transmission and reception elements and a method of connecting the flexible optical board are required.

In order to solve the above problems, Korean Patent No. 10-0816062 manufactures a light source and a light receiving device in which a semiconductor chip is mounted, and the light source and the light receiving device use SMT (Surface Mounting Technology) on a flexible optical board. The semiconductor optical device integrated structure on the flexible optical board is implemented in a mounted form.

The semiconductor optical device integrated structure on the flexible optical board includes a rigid and flexible optical board having electrical wiring for transmitting power and data, and a light source and a light receiver that can be fixed to the rigid and flexible optical board and mounted directly inside the same. A connector including an element, an optical waveguide and fiber horizontally aligned with the light source and the optical receiving element, a wire for driving the optical receiving element, and a driver for changing data to be transmitted into an optical signal, The light source, the optical receiving element and the driver are electrically connected through the connector, and the optical signal transmitted from the light source and the optical receiving element is directly transmitted to the optical waveguide and the fiber.

However, the structure and method of mounting the light source and the light receiving device on which the semiconductor chip is mounted on the flexible optical board using the SMT method are as described above, so that the light source and the light receiving device are located at the correct position due to the slight shaking. Is difficult.

If the light source and the light receiving element are not in the correct position, a loss occurs in the signal, which requires a separate correction process. Therefore, the manufacturing cost increases in manufacturing the semiconductor optical device integrated structure, there is a limit to implement the high-speed communication.

In addition, the conventional direct structures have a problem that it is difficult to fix the waveguide in accordance with the optical path because the light emitting chip or the light receiving chip that transmits or receives the optical signal to the waveguide is surface-mounted on the printed circuit board. Accordingly, there is a problem in that the light efficiency is lowered due to the intermediary means for transmitting other light between the optical device chip and the waveguide.

Accordingly, new methods for interlocking the optical waveguide and the optical device chip at the shortest distance are required.

Accordingly, an object of the present invention is to solve the problems derived from the above-described prior art, and the present invention is a structure for integrating an optical waveguide and an optical element in an accurate position so as to prevent signal loss occurring beyond the position of the optical element. The purpose is to provide.

Another object of the present invention is to provide a process for directing an optical waveguide and an optical element at an accurate position so as to accurately transmit light to the optical waveguide.

Another object of the present invention is to provide an optical device mounting chip having a new structure that can accurately transmit an optical signal to an optical waveguide connected to the side of the PCB.

In order to achieve the above object, the present invention is fixed to a flexible optical board including a rigid PCB and an optical waveguide connected to the support plate, the optical substrate is mounted on the side, the optical element chip is mounted on the side, the drive driver is mounted on the upper surface Mounted in the seating groove, the optical waveguide of the flexible optical board provides a structure that is installed to face the optical device chip.

In the present invention, it is preferable that the light guide plate and the optical device chip face each other to form a horizontal alignment at the same height on the support plate. In the practice of the present invention, it is molded with a resin to protect the elements of the flexible optical board and the rigid PCB and to fix the optical axis alignment of the optical element chip and the optical waveguide.

In the present invention, the rigid PCB has a mounting groove formed on the surface corresponding to the bottom shape of the optical substrate can be mounted and fixed in the surface mounting form at the correct position when mounting.

In the present invention, an optical device chip is a light emitting chip and / or a light receiving chip, and when two waveguides are formed, it is preferable that at least one channel consisting of a pair of light emitting chips and a light receiving chip is mounted.

In the present invention, it is preferable to use a ceramic substrate for the optical substrate in order to prevent the optical device from the optical axis alignment due to the bending of the support plate and the rigid board.

In the practice of the present invention, it is preferable that two optical element chips are mounted on the ceramic substrate to exchange light reception and emission signals. In a preferred embodiment of the present invention, the ceramic substrate is formed so that the side on which the optical element is mounted is stepped in the direction of the optical axis to prevent interference between each channel by the light emitted from the substrate.

In accordance with an aspect of the present invention, an optical device chip is mounted on a side surface, and an optical substrate on which a driving driver is mounted on an upper surface thereof is mounted in a mounting groove of a rigid PCB;

Fixing with a support plate a connection between the rigid PCB and the flexible optical board including the optical waveguide; And

Molding the bonded rigid PCB and flexible optical board with resin

It includes a manufacturing method comprising a.

In another aspect of the present invention, the optical substrate according to the present invention is characterized in that the optical device chip is mounted on the side of the rigid substrate, the drive driver is mounted on the upper surface.

In the present invention, the optical substrate refers to a substrate on which light is received and / or emitted, preferably a substrate on which a light emitting chip for converting an electrical signal into a light emission signal and a light receiving chip for converting a received signal into an electrical signal are mounted. do.

In the present invention, the optical substrate is preferably made of a ceramic substrate, in the preferred embodiment of the present invention, the side on which the optical element is mounted is formed stepped in the optical axis direction.

Hereinafter, the present invention will be described in detail with reference to Examples.

The present invention as described above, by manufacturing the optical element directly facing the optical waveguide without any other means, it is possible to minimize the light loss and to prevent the influx of disturbance signals.

The present invention eliminates process errors when mounting an optical device, thereby accurately aligning the optical device with the optical waveguide and preventing the optical device from deviating from the aligned optical axis.

Other features and operations of the present invention in addition to the above object will be apparent through the embodiments described below with reference to the accompanying drawings.

The detailed description set forth below in connection with the appended drawings has been made with the intention of describing preferred embodiments of the invention, and does not represent the only forms in which the invention can be practiced. It should be noted that the same and equivalent functions included in the spirit or scope of the present invention may be achieved by other embodiments.

Certain features disclosed in the drawings are enlarged for ease of description, and the drawings and their components are not necessarily drawn to scale. However, those skilled in the art will readily understand these details.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

1 is a plan view of a ceramic optical substrate mounted on a rigid optical board according to the present invention, Figure 2 is a side view of a ceramic optical substrate according to the present invention, Figure 3 is a plan view of a rigid optical board according to the present invention, Figure 4 Is a side view of the rigid optical board cut along line AA 'of FIG. FIG. 5 is a plan view of a ceramic optical substrate mounted on a rigid optical board, and FIG. 6 is a side view taken along the line AA ′ of FIG. 5. FIG. 7 is a plan view of a flexible optical board according to an embodiment of the present invention, and FIG. 8 is a side view taken along the component BB ′ of FIG. 7. 9 is a plan view of a state mounted to connect the flexible light board and the rigid light board on the support plate according to an embodiment of the present invention, Figure 10 is a side view of the state cut along the line AA 'of FIG.

1 and 2, in the ceramic optical substrate 200, a light emitting chip 22 and a light receiving chip 22 ′ are mounted on a side of a ceramic substrate 20, and the light emitting chip 22 is disposed on an upper surface thereof. ) And a light emitting chip driver IC 21 and a light receiving chip driver IC 21 'for controlling the light receiving chip 22' are mounted. The light-emitting and light-receiving chips are wire bonded 23 on the side of the substrate, and the driver ICs are wire bonded 23 'on the upper surface of the substrate, and are connected to each other through the substrate. The ceramic optical substrate 200 is stepped with respect to the optical axis so as to prevent the light emitting chip 22 and the light receiving chip 22 'from interfering with each other.

As shown in FIGS. 3 and 4, the rigid PCB 300 is a conventional printed circuit board and has a shape corresponding to the plane of the substrate so that the ceramic optical substrate 200 may be fitted to the surface and mounted at the correct position. The groove 201 is formed. The rigid optical board 300 is stepped with respect to the optical axis similarly to the ceramic optical substrate 200 so that the light emitting chip 22 and the light receiving chip 22 'do not interfere with each other when the flexible optical board is in contact with the flexible optical board.

As shown in FIGS. 5 and 6, the ceramic optical substrate 200 is fitted to and fixed to the surface of the mounting groove 201 formed on the surface of the rigid PCB 300. An adhesive paste may be applied between the ceramic optical substrate 200 and the rigid PCB 300 to further solidify the bonding between the optical substrate 200 and the rigid PCB.

As shown in FIG. 7 and FIG. 8, the flexible optical board 400 is formed with a light emitting light guide tube 41 and a light receiving wave guide 41 ′. A light guide tube is a channel through which light can be guided, for example, an optical fiber. The flexible optical board 400 is stepped on the optical axis so that the light emitting waveguide 41 and the light receiving waveguide 41 'do not interfere with each other when they are in contact with the rigid PCB 300.

As shown in FIGS. 9 and 10, the flexible optical board 400 and the rigid PCB 300 are connected to each other on the fingerboard 500. The flexible optical board 400 and the rigid PCB 300 are bonded to and fixed to the support plate 500, and are mounted on the optical waveguides 41 and 41 ′ and the ceramic optical substrate 200 of the flexible optical board 400. The light emitting chip 22 and the light receiving chip 22 'are positioned at the same height to be aligned horizontally. In addition, the flexible optical board 400 and the rigid optical board 300 are formed with a molding part 600 in which a resin is molded at a portion where the flexible optical board 400 and the rigid optical board 400 are connected to each other and are fixed to each other, thereby protecting the chip and the printed circuit.

1 is a plan view of a ceramic optical substrate mounted on a rigid optical board according to the present invention.

2 is a side view of a ceramic optical substrate according to the present invention.

3 is a plan view of a rigid light board according to the present invention.

FIG. 4 is a side view of the rigid optical board cut along line AA ′ of FIG. 3.

5 is a plan view of a ceramic optical substrate mounted on a rigid optical board.

FIG. 6 is a side view taken along component AA ′ of FIG. 5.

7 is a plan view of a flexible optical board according to an embodiment of the present invention.

FIG. 8 is a side view taken along the component BB ′ of FIG. 7.

9 is a plan view of a state mounted to connect the flexible light board and the rigid light board on a support plate according to an embodiment of the present invention.

FIG. 10 is a side view of a state cut along line AA ′ of FIG. 9.

<Description of Signs for Main Parts of Drawings>

22, 22 '; Optical device 400; Flexible optical board

21, 22 '; Drive driver 41,41 '; Optical waveguide

600; Molding part 500; Support plate

Claims (10)

In the support plate, a flexible optical board including a rigid PCB and an optical waveguide is fixed to be connected to each other, wherein an optical substrate on which the optical device chip is mounted on the side and a driving driver is mounted on the upper surface is mounted, and the optical waveguide is an optical device. And fixed to face the chip, wherein the optical device chip is mounted on at least two sides of the optical substrate, and the optical device chip is aligned stepwise on a surface perpendicular to the optical axis. The optical board mounting structure of claim 1, wherein the optical waveguide and the optical device chip are horizontally aligned at the same height on the support plate. The optical board mounting structure of claim 1, wherein the optical substrate is a ceramic optical substrate. The optical board mounting structure of claim 1 or 3, wherein the driving driver is wire-bonded to the upper surface of the substrate, and the optical device chip is wire-bonded to the side of the substrate to be interconnected. The optical board mounting structure according to claim 1 or 2, wherein the rigid PCB has a mounting groove formed thereon into which the optical substrate is fitted. delete The optical board mounting structure of claim 1 or 2, wherein the flexible optical board and the rigid PCB are molded by resin. delete delete The light emitting chip and the light receiving chip are mounted on the side, and the driving driver is mounted on the upper surface to emit and receive the light horizontally on the mounting surface of the substrate, and the side is stepped so that the mounted light emitting chip and the light receiving chip are stepped on the optical axis. Optical module.

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