KR101082988B1 - Structure of integration for optical detector on rigid-flex hybrid opto-board and method of fabricating the same - Google Patents

Abstract

The present invention relates to an optical device integrated structure on a flexible optical board and a method of manufacturing the same, which can prevent signal loss occurring beyond the position of the optical device. A flexible board formed; A light receiving or light emitting chip mounted on the flexible board; A driving driver mounted on the flexible board to drive the light receiving or light emitting chip; And a waveguide fixed to the flexible board to transmit light from the light receiving or light emitting chip, wherein the light receiving or light emitting chip is mounted on a PCB substrate and fixed to an insertion groove formed in the flexible board.

As a result, the light emitting chip may be accurately mounted on the optical waveguide in the process of mounting the light emitting chip on the flexible board.

Optical element, flexible optical board

Description

Structure of integration for optical detector on rigid optical board and method of manufacturing thereof {Structure of integration for optical detector on rigid-flex hybrid opto-board and method of fabricating the same}

The present invention relates to an optical device integrated structure on a flexible optical board and a method of manufacturing the same, and more particularly to an optical device integrated structure on a flexible optical board and a method of manufacturing the same that can prevent the loss of signals occurring beyond the position of the optical device. It is about.

Many standard methods are used to transfer high-speed data between chips or boards.

This is to prevent data loss due to signal loss in high speed data transmission. However, for the high speed data transmission due to the large amount of data, the optical signal is transmitted to overcome the limitation of the data transmission speed due to the high speed data transmission and to prevent the signal loss due to the signal occlusion between the data. The use of the method has been attempted. However, in order to transmit an optical signal, an optical waveguide or an optical cable should be connected between the light source and the optical receiving element. Many structures have been proposed as a method for connecting such optical waveguides or optical cables, but in order to transmit data between small chips or boards, the optical transmission / reception elements are transferred to a chip or board that needs to be transferred, instead of the conventional optical module packaging type transmission method. Direct implementation methods are being studied. In addition, in order to form an optical waveguide in a limited space inside the system, a flexible optical waveguide in the form of a flexible optical board must be used.

Therefore, in order to solve the above problems, the packaging method of the optical transmission and reception elements should be improved, and in order to use the optical waveguide in a limited space, various optical transmission and reception elements and a method of connecting the flexible optical board are required.

In order to solve the above problems, Korean Patent No. 10-0816062 manufactures a light source and a light receiving device in which a semiconductor chip is mounted, and the light source and the light receiving device use SMT (Surface Mounting Technology) on a flexible optical board. The semiconductor optical device integrated structure on the flexible optical board is implemented in a mounted form.

The semiconductor optical device integrated structure on the flexible optical board includes a rigid and flexible optical board having electrical wiring for transmitting power and data, and a light source and a light receiver that can be fixed to the rigid and flexible optical board and mounted directly inside the same. A connector including an element, an optical waveguide and fiber horizontally aligned with the light source and the optical receiving element, a wire for driving the optical receiving element, and a driver for changing data to be transmitted into an optical signal, The light source, the optical receiving element and the driver are electrically connected through the connector, and the optical signal transmitted from the light source and the optical receiving element is directly transmitted to the optical waveguide and the fiber.

However, the structure and method of mounting the light source and the light receiving device on which the semiconductor chip is mounted on the flexible optical board using the SMT method are as described above, so that the light source and the light receiving device are located at the correct position due to the slight shaking. Is difficult.

If the light source and the light receiving element are not in the correct position, a loss occurs in the signal, which requires a separate correction process.

Therefore, the manufacturing cost increases in manufacturing the semiconductor optical device integrated structure, there is a limit to implement the high-speed communication.

Accordingly, an object of the present invention is to solve the problems derived from the above-described prior art, and the present invention provides an optical device integrated structure on a flexible optical board and a method for manufacturing the same that can prevent signal loss occurring beyond the position of the optical device. The purpose is to provide.

Another object of the present invention is to provide a flexible optical board manufacturing process capable of accurately transmitting light to an optical waveguide.

In order to achieve the above object, the present invention provides a flexible optical board structure includes: a flexible board having a support plate formed thereon; A light receiving or light emitting chip mounted on the flexible board; A driving driver mounted on the flexible board to drive the light receiving or light emitting chip; And a waveguide fixed to the flexible board to transmit light from the light receiving or light emitting chip, wherein the light receiving or light emitting chip is mounted on a PCB and fixed to an insertion groove formed in the flexible board, and the driving driver is bonded to the flexible board. It is characterized in that it is electrically connected to the light receiving or light emitting chip through the wire bonding and the PCB.

In the present invention, a lens molded of a resin is formed on the PCB substrate so as to focus light emitted from the light emitting chip on the waveguide or to focus light from the waveguide on the light receiving chip. In the flexible optical board, a mold is formed to fix the waveguide while protecting the PCB board on which the driving driver, the light receiving chip, or the light emitting chip is mounted.

In the present invention, the light receiving or light emitting chip is electrically connected to the PCB board through wire bonding, the PCB board is connected to the flexible board, and the flexible board and the driving driver are electrically connected through the wire bonding, and receive or emit light. The chip is connected to the drive driver.

The shape of the lens manufactured by molding the resin may be determined according to the insertion form of the PCB substrate, for example, whether the PCB substrate on which the light receiving or light emitting chip is mounted is inserted in the vertical or horizontal form and the position of the waveguide. For example, when inserted in a horizontal shape and the waveguide is formed on the side of the light receiving or light emitting chip, the lens has an aspherical shape and may be focused on the waveguide through light reflection at the interface between the lens and the mold. As another example, when the lens is inserted in a vertical form, the lens may have a dome shape to condense light onto the waveguide.

According to an aspect of the present invention, a light emitting or light receiving chip is mounted on a surface thereof, and manufacturing a PCB having a lens molded with a resin; Manufacturing a flexible optical board on which a support plate is formed, an optical waveguide is aligned, and a PCB insertion groove is formed; Mounting a driving driver on the flexible optical board, and inserting and fixing a PCB in an insertion groove: forming a molding part for fixing and protecting the driving driver, the PCB, and the optical waveguide on the flexible optical board. It provides a flexible optical board manufacturing method.

In the present invention, the drive driver and the light receiving or light emitting chip comprises the steps of wire bonding the drive driver to the flexible light board; Wire bonding the light receiving or light emitting chip to a PCB; And it is preferably connected through the step of electrically connecting the flexible light board and the PCB.

The present invention in one aspect, the flexible board extending in the longitudinal direction to achieve the above object; A mounting plate having a support plate formed on a lower surface thereof and an optical element mounted on an upper surface thereof; An optical waveguide for connecting optical devices at both ends; It includes a molding to protect the mounting portion, wherein the optical element is a PCB mounted with a light emitting or light-receiving chip is mounted, provides a flexible optical board, characterized in that fixed to the fitting groove formed on the surface of the flexible board.

In the present invention, the light emitting or light receiving chip is electrically connected to the PCB substrate through wire bonding, and is driven by a driving driver mounted on the flexible board through the PCB and the optical board electrical connection.

As described above, the present invention can provide an optical device integrated structure on a flexible optical board and a method of manufacturing the same that can prevent signal loss occurring beyond the position of the optical device.

The present invention also accurately fixes the light-emitting and light-receiving chips connected to each other through the optical waveguide at the portion where the waveguide is formed, thereby eliminating process errors during mounting of the optical device, so that the optical device and the optical waveguide can be accurately aligned.

Other features and operations of the present invention in addition to the above objects will become apparent from the embodiments described below with reference to the accompanying drawings.

The detailed description set forth below in connection with the appended drawings is made with the intention of describing preferred embodiments of the invention, and does not represent the only forms in which the invention may be practiced. It should be noted that the same and equivalent functions included in the spirit or scope of the present invention may be achieved by other embodiments.

Certain features disclosed in the drawings are enlarged for ease of description, and the drawings and their components are not necessarily drawn to scale. However, those skilled in the art will readily understand these details.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of a flexible optical board according to the present invention, FIG. 2 is a side view of the flexible board according to the present invention, and FIG. 3 is a cross-sectional view taken along line AA ′ of the flexible board of FIG. 1. The optical waveguide 140 and the electrical connection line is formed in the middle of the flexible board 120, the optical device 110 that can communicate with each other using the optical waveguide 140 on the upper surface of the flexible board 120. ) Are mounted, and fixing plates 160 are formed on both bottom surfaces of the flexible board for wire bonding or optical device mounting.

4 is a detailed cross-sectional view illustrating an integrated structure of a light emitting or light receiving chip on a flexible optical board according to an exemplary embodiment of the present invention. Referring to FIG. 4, an optical device integrated structure on a flexible optical board according to an embodiment of the present invention includes a COB type optical device 110 in which a light emitting chip or a light receiving chip capable of emitting or receiving light is mounted on a PCB substrate, and Flexible optical board 120 having grooves for mounting the optical device 110, a drive driver 130 for driving the optical device 110, and high-speed data emitted or received by the optical device 110. An optical waveguide 140 serving as a path, a molding unit 150 for fixing the above components, and a fixing plate 160 for preventing component mounting stability on the flexible optical board 120 and bending of the flexible optical board 120. It includes. The fixing plate may be used by adhesively fixing the ceramic substrate to the lower surface of the flexible board.

The optical device 110 converts the data received through the driving driver 130 into the form of light and transmits the data, or receives the data in the form of light and converts the data into an electrical signal. That is, when the optical device 110 is a light emitting device, it emits light to transmit data. When the optical device 110 is a light receiving device, light is received to receive data. It is mounted to emit light in a direction perpendicular to the horizontal plane of the flexible optical board 120, or to receive light incident in the vertical direction.

The optical device 110 includes a light emitting or light receiving semiconductor chip 111 capable of converting data into a light form or receiving data in a light form and converting it into an electrical signal, and a PCB substrate 112 on which the semiconductor chip 111 is mounted. ), A first wire 113 electrically connecting the semiconductor chip 111 and the PCB substrate 112, and the semiconductor chip 111 is isolated from an external environment on the PCB substrate 112, and the semiconductor The first resin molding 114 may be configured to facilitate emission or absorption of light generated from the chip 111 or received light.

In this case, the first resin molding 114 reflects light emitted through the optical waveguide 140 or a structure capable of reflecting and condensing the light emitted from the semiconductor chip 111 to the optical waveguide 140. The semiconductor chip 111 has a structure capable of condensing. That is, the first resin molding 114 has an aspherical surface, for example, a quarter sphere shape, and performs a role such as a prism or parabolic.

The flexible optical board 120 includes electrical wiring for transmitting power and data, and may be implemented in the form of a general FPC B (flexible printed curcuit board). In addition, a part of the flexible optical board 120 is provided with an insertion groove 125 to be mounted in the form in which the optical device 110 is inserted. Although not shown in the drawing, the insertion groove 125 exposes an electrical circuit pattern of the flexible optical board 120 to be electrically connected to the optical device 110.

The driving driver 130 is for driving the optical device 110, and transmits high-speed data to the optical device 110 or data of the electrical signal received through the optical device 110. In addition, the driving driver 130 is electrically connected to the flexible optical board 120 through the second wire 135.

The optical waveguide 140 is a high-speed data path that is emitted from the optical device 110 or received by the optical device 110. The optical waveguide 140 may be implemented by a general optical fiber 141, and the substantially optical waveguide path is an optical fiber core 142 in the optical fiber 141.

The molding part 150 is for mounting, aligning, and fixing the above components, and may be formed using an epoxy resin used for molding a general semiconductor device.

As described above, in the optical device integrated structure on the flexible optical board of the present invention, unlike the integrated structure in which the optical device is mounted using SMT on the conventional flexible optical board, the flexible optical board 120 is the optical device 110 Equipped with an insertion groove 125 that can be inserted into the insertion groove 125, the optical device 110 is inserted in the form, the optical device 110 can be mounted in the correct position. Accordingly, the probability of occurrence of signal loss is reduced, and the reliability of the optical device integrated structure on the flexible optical board is improved.

In addition, it is possible to omit the SMT process for mounting the optical device 110 it is possible to reduce the manufacturing cost of the optical device integrated structure.

5A to 5C are cross-sectional views illustrating a method of manufacturing an optical device integrated structure on a flexible optical board according to an embodiment of the present invention.

First, an optical device and a driving driver are mounted on both ends, and a mounting part on which a support plate 160 is formed is provided on the lower surface, and a flexible optical board 120 having an optical waveguide 140 connecting optical elements is prepared in the middle.

Insertion grooves 125 for aligning the optical elements are formed at both ends of the optical waveguide 140, and the optical element 110 molded by receiving or light-emitting chip surface mounted on the PCB is inserted and fixed. After the driving driver for driving the optical device 110 is mounted and wire-bonded, the molding unit 150 is formed by using an epoxy resin used for molding a general semiconductor device, and thus the optical device 110 and the driving driver are formed. 130 and the optical waveguide 140 are fixed.

6 is a cross-sectional view illustrating an optical device integrated structure on a flexible optical board according to another embodiment of the present invention.

Referring to FIG. 6, the optical device integrated structure on the flexible optical board according to another embodiment of the present invention is similar to the optical device integrated structure on the flexible optical board shown in FIG. 4. However, only the mounting form of the optical device 110 is different.

In more detail, the optical device 110 ′ is inserted into the insertion groove 125 ′ on the flexible optical board 120 ′ such that the light emitting direction or the light receiving direction is directed toward the optical waveguide 140 ′. do.

The optical device 110 ′ is mounted on the PCB substrate 112 ′ with the semiconductor chip 111 ′ electrically connected to each other through a wire, and isolates the semiconductor chip 111 ′ from the external environment and emits light. It consists of a 2nd resin film 114 'which makes light reception easy.

In this case, the second resin film 114 ′ may be configured to condense light emitted from the semiconductor chip 111 ′ to the optical waveguide 140 ′ or to receive light that enters through the optical waveguide 140 ′. It is made of a structure that can be focused to the semiconductor chip (111 '). That is, the second resin film 114 ′ has a shape of a dome, and serves as a convex lens.

1 is a plan view of a flexible optical board according to the present invention,

2 is a side view of a flexible optical board according to the present invention;

3 is a cross-sectional view taken along line AA ′ of FIG. 1;

4 is a cross-sectional view illustrating an optical device integrated structure on a flexible optical board according to an embodiment of the present invention.

5A through 5C are cross-sectional views illustrating a method of manufacturing an optical device integrated structure on a flexible optical board according to an embodiment of the present invention.

6 is a cross-sectional view illustrating an optical device integrated structure on a flexible optical board according to another embodiment of the present invention.

<Description of Signs for Main Parts of Drawings>

110; Optical device 120; Flexible optical board

130; Drive driver 140; Optical waveguide

150; Molding unit 160; fixture

Claims (12)

A flexible board having a rigid support plate formed thereon; A PCB substrate on which a light receiving or light emitting chip is mounted; A driver driver mounted on the flexible board to drive the light receiving or light emitting chip; And A waveguide fixed to the flexible board to transmit light from the light receiving or light emitting chip; Including; The PCB board on which the light receiving or light emitting chip is mounted is fixed to an insertion groove formed in the flexible board. The PCB substrate has a flexible optical board connection structure, characterized in that the lens formed with a resin molded to focus the light emitted from the light emitting chip on the waveguide or the light from the waveguide to the light receiving chip. delete The flexible optical board connection structure of claim 1, wherein a mold for fixing the waveguide is formed on the flexible optical board to protect the driving driver and the PCB substrate on which the light receiving or light emitting chip is mounted. The light receiving or light emitting chip of claim 1 or 3, wherein the light receiving or light emitting chip is electrically connected to the driving driver through wire bonding of the PCB substrate, electrical connection of the PCB substrate and the flexible board, and wire bonding of the flexible board and the driving driver. Flexible optical board connection structure. 4. The flexible optical board connection structure of claim 1 or 3, wherein the lens has an aspherical shape or a dome shape. A strip-shaped flexible board extending in the longitudinal direction; Mounting parts formed at both ends of the flexible board, and having a support plate formed on a lower surface thereof, and an optical element mounted on an upper surface thereof; An optical waveguide for connecting optical devices at both ends mounted on the mounting unit; A molding part to protect the mounting part; Including; The optical device is a PCB molded by mounting a light emitting or light receiving chip, is fixed to the fitting groove formed on the surface of the flexible board, The optical device is an optical board, characterized in that the resin is molded to form a lens. The optical board of claim 6, wherein the light emitting chip is aligned on one side of the optical waveguide and the light receiving chip is aligned on the other side of the optical waveguide. delete The optical board according to claim 6 or 7, wherein the light emitting or light receiving chip is mounted on a PCB substrate so as to be horizontal to the optical board, and the lens is a panabolic type aspherical lens. The optical board according to claim 6 or 7, wherein the light emitting or light receiving chip is mounted on a PCB substrate so as to be perpendicular to the optical board, and the lens has a dome shape. Manufacturing an optical device in which a light emitting or light receiving chip is mounted on a surface of a PCB substrate and molded with a resin; Manufacturing a flexible board at both ends of which a support plate is formed, and a mounting portion in which an optical element insertion groove is formed on an upper surface thereof, and an optical element mounted at both ends in the middle thereof; Mounting a driving driver on the flexible board and inserting and fixing an optical device in an insertion groove; and Forming a molding part for molding the mounting part; Flexible optical board manufacturing method comprising a. The method of claim 11, further comprising electrically connecting the driver to the light receiving or light emitting chip. The connection comprises wirebonding a drive driver to the flexible board; Wire-bonding the light receiving or light emitting chip to the PCB; And electrically connecting the flexible board and the PCB substrate.

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