KR200431627Y1 - The pad for package the electronic parts - Google Patents

The pad for package the electronic parts Download PDF

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Publication number
KR200431627Y1
KR200431627Y1 KR2020060021326U KR20060021326U KR200431627Y1 KR 200431627 Y1 KR200431627 Y1 KR 200431627Y1 KR 2020060021326 U KR2020060021326 U KR 2020060021326U KR 20060021326 U KR20060021326 U KR 20060021326U KR 200431627 Y1 KR200431627 Y1 KR 200431627Y1
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KR
South Korea
Prior art keywords
pad
partition
endothelial
packaging
widthwise
Prior art date
Application number
KR2020060021326U
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Korean (ko)
Inventor
김동삼
Original Assignee
조용호
김동삼
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Priority to KR2020060021326U priority Critical patent/KR200431627Y1/en
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Publication of KR200431627Y1 publication Critical patent/KR200431627Y1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D5/00—Rigid or semi-rigid containers of polygonal cross-section, e.g. boxes, cartons or trays, formed by folding or erecting one or more blanks made of paper
    • B65D5/42—Details of containers or of foldable or erectable container blanks
    • B65D5/44—Integral, inserted or attached portions forming internal or external fittings
    • B65D5/50—Internal supporting or protecting elements for contents
    • B65D5/5028—Elements formed separately from the container body
    • B65D5/5035—Paper elements
    • B65D5/5038—Tray-like elements formed by folding a blank and presenting openings or recesses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/025—Containers made of sheet-like material and having a shape to accommodate contents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

본 고안은 전자부품 포장용 패드로 국내 및 해외 전자 부품 운송 시 전자 부품의 안전한 포장과 신뢰성을 바탕으로 내부의 진동과 외부의 충격에 의한 파손을 방지하며, 별도의 칸막이 부품이 필요치 않고, 저가의 포장비로 작업이 용이하도록 고안된 장치이다.This device is an pad for packaging electronic parts and prevents damage caused by internal vibration and external shock based on safe packaging and reliability of electronic parts when transporting domestic and overseas electronic parts. The device is designed for easy operation.

내피패드와 하부패드로 구성된 본 고안은 민감성 부품부터 외장품질을 요구하는 부품까지 최저의 비용으로 포장이 가능하며, 포장 방법 또한 용이하도록 고안되어 대량 생산에 적합한 전자부품 포장용 패드이다.The present invention, which consists of endothelial pads and lower pads, can be packaged at the lowest cost from sensitive parts to parts requiring exterior quality.

전자부품 포장용 패드, 가장자리 지지대, 장 방향 칸막이, 폭 방향 칸막이, 부품 삽입부, 내피 이탈 방지부, 결합홈Pads for packaging electronic components, edge holders, longitudinal dividers, widthwise dividers, component inserts, endothelial release prevention sections, coupling grooves

Description

전자부품 포장용 패드 {The pad for package the electronic parts}Pad for packaging electronic components {The pad for package the electronic parts}

도1 은 전자부품 포장용 패드의 조립 후 완성된 고안품의 사시도이다.1 is a perspective view of a finished product after assembly of an electronic component packaging pad.

도2 는 전자부품 포장용 패드의 내피패드 전개도이다.2 is an endothelial pad development view of an electronic component packaging pad.

도3 은 고안의 결합부분 상세도이다.Figure 3 is a detailed view of the coupling portion of the design.

도4 는 전자부품 포장용 패드의 사용되는 일 예를 보여주는 사시도이다.4 is a perspective view illustrating an example of use of an electronic component packaging pad.

본 고안은 전자제품 부품 포장 시 제품의 안전한 포장과 보다 용이하게 작업하기 위한 장치이다.The present invention is a device for safe packaging and easier operation of the product when packaging electronic components.

본 고안은 전자부품 포장시 부품이나 제품의 안전한 포장과 보다 용이하게 작업하기 위한 전자부품 포장에 관한 것이다.The present invention relates to the safe packaging of parts or products and the packaging of electronic components for easier operation.

전자제품의 대형화 추세에 맞추어 해당 부품의 크기 또한 대형화되어 박스포장의 안전성과 포장작업의 효율성이 요구됨에 따라 안정적이면서도 손쉽게 포장할 수 있으며, 그 비용 또한 저렴한 부분이 특징이라고 할 수 있다.As the size of electronic products increases, the size of the corresponding parts is also enlarged, which means that the packaging is stable and easy to pack as safety and packaging efficiency are required, and the cost is also low.

대부분의 종래기술은 포장재 가장자리 지지대부분과 칸막이가 일반적인 낱장의 골판지(corrugated cardboard)로 구성되어 있어 내부 진동 및 충격에 의하여 변형되거나 파손되는 부분이 발생하고, 충격 완화가 좋은 제품의 경우 사용재질을 고가의 합성수지를 사용하므로 포장비용의 손실을 초래하는 경우가 대부분이었다.Most of the prior art is composed of a corrugated cardboard of the edge of the packaging material and the partition is a general sheet of corrugated cardboard, which causes deformation or breakage due to internal vibration and impact, and in the case of products with good impact mitigation, the use material is expensive. In most cases, the use of synthetic resins caused loss of packaging costs.

상기 목적을 달성하기 위한 본 고안은 몸체, 십자형 칸막이의 두 가지로 구성되며, 모든 지지대와 포장영역을 구성하는 부분은 별도의 접착제나 부수적인 부자재를 사용하지 않는 원초적인 골판지를 채택하고 있어, 재활용 측면에서도 탁월한 경쟁력을 가지고 있다.The present invention for achieving the above object is composed of two kinds of body, cross-shaped partition, and all the support and the packaging constituting part adopts the original corrugated cardboard that does not use a separate adhesive or ancillary subsidiary materials, recycling side Has an excellent competitive edge.

상기 목적을 달성하기 위한 본 고안은 내피패드와 하부패드의 두 가지로 구성되며, 모든 지지대와 포장영역을 구성하는 부분은 별도의 접착제(glue)나 추가적인 부자재를 사용하지 않는 원초적인 골판지만으로 조립되는 구조를 채택하고 있어, 재활용 측면에서도 탁월한 경쟁력을 가지고 있다.The present invention for achieving the above object is composed of two types of endothelial pad and the lower pad, all the support and the packaging area constituting the structure is assembled from the original corrugated cardboard only without using a separate glue (glue) or additional auxiliary materials It has a competitive edge in terms of recycling.

또한, 물류 이동상의 진동이나 충격에 의해 내칸막이나 가장자리 지지대(40)가 파손되지 않으며, 회로기판 부품이나 민감한 부품에도 저가의 포장비로 사용할 수 있게 고안된 것이 그 특징이다.In addition, the partition or edge support 40 is not damaged by the vibration or impact of the logistics movement, it is characterized in that it is designed to be used at a low cost of packaging circuit board components or sensitive components.

도1은 크게 나누어 볼 때 몸체부(2)와 포장 영역(40), 폭방향 기둥(5), 장방향 접지 벽면(20), 십자형 폭방향 접지 칸막이(10), 십자형 장방향 접지 칸막이(15)로 구성된다.Fig. 1 shows the body part 2, the packing area 40, the widthwise post 5, the longitudinal ground wall 20, the crosswise widthwise ground partition 10, and the crosswise longitudinal grounding partition 15 in large divisions. It is composed of

도1 은 크게 나누어 볼 때 가장자리 지지부(40)와 부품삽입부(35), 내피 이탈 방지부(10), 칸막이 고정부(5), 폭 방향 칸막이(33), 장 방향 칸막이(31), 경계부(32)로 구성된다.Fig. 1 shows the edge support part 40, the component insert part 35, the endothelial release prevention part 10, the partition fixing part 5, the width direction partition 33, the longitudinal direction partition 31, and the boundary part when divided broadly. It consists of 32.

조립 완성된 제품은 조립된 내피패드(52)를 하부패드(51)에 삽입하면 내피 이탈 방지부(10)가 내피 벽면(15)을 누르고 있는 형태로 고정된다.When the assembled product is inserted into the assembled endothelial pad 52 to the lower pad 51, the endothelial release prevention portion 10 is fixed in the form of pressing the endothelial wall surface 15.

전자부품은 부품삽입부(35)에 놓이게 되며, 내부 진동이나 충격에 의하여 부품삽입부(35)의 영역을 넘지 않도록 장 방향 칸막이(31)에 칸막이 고정부(5)를 눌러서 고정하는 한편, 폭 방향 칸막이(33)는 교차되는 장 방향 칸막이(31)의 경계부(32)에 의하여 칸막이 유동을 방지하는 구조로 고안되어 있는 것이 그 특징이다.The electronic component is placed in the component insertion part 35, and is fixed by pressing the partition fixing part 5 on the longitudinal partition 31 so as not to exceed the area of the component insertion part 35 by internal vibration or shock, The directional partition 33 is characterized by being designed to prevent partition flow by the boundary portion 32 of the intersecting longitudinal partition 31.

도2 는 고안의 내피패드 평면도를 나타낸 것으로 하부패드와 조립전의 내피 벽면(15)과 장 방향 칸막이(31), 폭 방향 칸막이(33), 칸막이 고정부(5), 경계부(32)를 나타내고 있으며, 제품의 형태와 크기에 따라 장 방향 칸막이(31)와 폭 방향 칸막이(33)이로 구성되어 있다.Fig. 2 shows a plan view of the endothelial pad of the present invention, which shows the endothelial wall surface 15, the longitudinal partition 31, the widthwise partition 33, the partition fixing portion 5, and the boundary portion 32 before assembly with the lower pad. According to the shape and size of the product, the longitudinal partition 31 and the widthwise partition 33 are configured.

도3 은 하부패드에 가장자리 지지대(40)의 상세결합 부분에 대한 상태를 표시한 것으로, 가장자리 지지대(40)를 사각 형태로 접은 다음 접착제(glue)나 테이프(tape)가 아닌 하부패드 자체의 결합 홈(28)에 고정 장치(26)를 위쪽 방향으로 접어 끼워 넣는 구조로 고안되어져 있으며, 그 형태는 삼각형이나 사다리꼴의 다각형으로 구성된 것을 특징으로 한다.Figure 3 shows the state of the detailed engagement portion of the edge support 40 on the lower pad, folding the edge support 40 in a square shape, and then joining the lower pad itself, not glue or tape. It is designed to fold the fixing device 26 in the upward direction in the groove 28, the shape is characterized in that consisting of a triangular or trapezoidal polygon.

도4 에서와 같이 내피패드(52)가 하부패드(51)에 결합하여 도1 과 같은 전자부품 포장용 패드가 완성되고, 전자부품 포장용 패드가 외부 골판지 박스(corrugated cardboard box ;50) 내부에 다단 적재되도록 고안되어 있으며, 상하 적재 하중을 가장자리 지지대(40)와 내피 벽면(15), 그리고 장 방향 칸막이(31)와 폭 방향 칸막이(33)가 포장된 전자부품이나 제품을 안전하게 지탱하는 구조로 고안되어 있다.As shown in FIG. 4, the endothelial pad 52 is coupled to the lower pad 51 to complete an electronic component packaging pad as shown in FIG. 1, and the electronic component packaging pad is stacked in an external corrugated cardboard box 50 in multiple stages. It is designed to securely support the electronic component or product packed with edge support 40, endothelial wall surface 15, and the longitudinal partition 31 and the widthwise partition 33 in the vertical loading load. have.

이상에서 설명한 바와 같이, 본 고안은 전자부품의 포장용 패드로 국내 및 해외의 부품 수출 시 종래의 기술보다 저가의 비용과 간편한 조립 구조로 고안되어 있어 작업성이 매우 좋고, 외부의 충격이나 마찰에 의한 파손을 방지하게 되어 내부 포장 제품의 신뢰성 확보가 증대되는 효과를 기대할 수 있다.As described above, the present invention is designed as a pad for packaging electronic components and has a low cost and simple assembly structure compared to the conventional technology when exporting parts in Korea and abroad. Preventing damage can be expected to increase the reliability of the inner packaging product.

Claims (5)

내피패드(52)에 제품 삽입부(35)와 접지 후 장 방향 칸막이(31)와 폭 방향 칸막이(33)가 상부로 돌출되고 하부패드(51)의 결합홈(28)과 고정 장치(26)에 의해 고정된 가장자리 지지대(40) 내부에 내피패드가 결합하며, 장 방향 칸막이(31)의 유동을 방지하기 위해 칸막이 고정부(5)를 눌러 고정하는 방식이 특징인 전자부품 포장용 패드 After the product insertion part 35 and the ground in the endothelial pad 52, the longitudinal partition 31 and the widthwise partition 33 protrude upwards, and the engaging groove 28 and the fixing device 26 of the lower pad 51. The endothelial pad is coupled to the inside of the edge support 40 fixed by the electronic component packaging pad, which is characterized by pressing the partition fixing part 5 to prevent the flow of the longitudinal partition 31. 제1항에 있어,The method of claim 1, 장 방향 칸막이(31)와 폭 방향 칸막이(33)에 칸막이 유동을 방지하기 위해 잘려있지 않은 "ㄷ"자 형태의 칸막이 고정부(5)를 칸막이 상부에서 눌러 고정하는 방식이 특징인 전자부품 포장용 패드Pad for packaging electronic components, characterized by a method of pressing and holding the "c" shaped partition fixing portion 5, which is not cut, to prevent partition flow from the longitudinal partition 31 and the widthwise partition 33 from the upper part of the partition. 포장용 패드의 몸체에 고정 장치(26)와 결합 홈(28)으로 가장자리 지지대(40)을 고정하는 체결 방식을 갖춘 것이 특징인 전자부품 포장용 패드Pad for packaging electronic components, characterized in that it has a fastening method for fixing the edge support 40 by the fixing device 26 and the coupling groove 28 on the body of the packaging pad. 하부패드에 내피패드 삽입 후 이탈 방지를 위해 내피패드의 내피 벽면(15)과 장 방향 칸막이(31), 폭 방향 칸막이(33)의 가장자리를 고정해주는 내피 이탈 방지부(10)를 특징으로 하는 전자부품 포장용 패드The endothelial detachment prevention part 10 is characterized by fixing the edge of the endothelial wall surface 15, the longitudinal partition 31, and the widthwise partition 33 of the endothelial pad to prevent separation after the endothelial pad is inserted into the lower pad. Component Packaging Pads 삭제delete
KR2020060021326U 2006-08-07 2006-08-07 The pad for package the electronic parts KR200431627Y1 (en)

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KR2020060021326U KR200431627Y1 (en) 2006-08-07 2006-08-07 The pad for package the electronic parts

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KR2020060021326U KR200431627Y1 (en) 2006-08-07 2006-08-07 The pad for package the electronic parts

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