KR200415289Y1 - packing envelope for semiconductor wafer packing - Google Patents

packing envelope for semiconductor wafer packing Download PDF

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Publication number
KR200415289Y1
KR200415289Y1 KR2020060003221U KR20060003221U KR200415289Y1 KR 200415289 Y1 KR200415289 Y1 KR 200415289Y1 KR 2020060003221 U KR2020060003221 U KR 2020060003221U KR 20060003221 U KR20060003221 U KR 20060003221U KR 200415289 Y1 KR200415289 Y1 KR 200415289Y1
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South Korea
Prior art keywords
welding part
packaging
packaging bag
semiconductor wafer
center
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KR2020060003221U
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Korean (ko)
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박문수
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박문수
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/003—Articles enclosed in rigid or semi-rigid containers, the whole being wrapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/006—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers in stretch films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere

Abstract

본 고안은 반도체웨이퍼포장용 포장봉투에 관한 것으로, 더욱 구체적으로는 반도체웨이퍼가 수용된 보관용기를 포장하게 되는 포장봉투를 펼쳤을때 하단부는 수평면을 이루고 봉투를 직교상태로 직립시킬수 있도록 한 구성으로 보관용기의 포장이 용이하도록 한 반도체웨이퍼포장용 포장봉투에 관한 것이다.The present invention relates to a packaging bag for semiconductor wafer packaging. More specifically, when the packaging bag is opened to package a storage container containing the semiconductor wafer, the lower portion forms a horizontal plane and the bag is orthogonal to the orthogonal state. The present invention relates to a packaging bag for semiconductor wafer packaging that facilitates packaging.

즉, 상향개구된 포장봉투를 구비하되 4면의 필름(10)을 구비하고 그 필름(10)의 양측부를 각각 용착하여 수직용착부(20)를 형성하며 전,후면부(12)(12')사이에 양측면부(14)(14')중앙을 수직으로 반분되게 접은 절첩선(16)이 내입되게하여 전,후면부(12)(12')를 포갠다음 4층으로 겹쳐진 하단부중앙을 용착하여 중점용착부(22)를 형성하고 그 중점용착부(22)를 기준으로 양측의 수직용착부(20)와 맞닿게 수평선을 이루는 수평용착부(24)와 45도의 경사각을 갖는 경사용착부(26)를 2층씩 용착하여서 됨을 특징으로 하는 반도체 웨이퍼포장용 포장봉투이다.That is, provided with an upwardly open packaging bag, provided with a film 10 on four sides, and welded on both sides of the film 10 to form a vertical weld 20, front and rear 12 (12 ') The folding line 16 folded in half of the center of both side portions 14 and 14 'is inserted in between, so that the front and rear portions 12 and 12' are folded, and the center of the lower portion overlapped with four layers is welded. The inclined welding part 26 which has the inclination angle of 45 degrees with the horizontal welding part 24 which forms the welding part 22, and forms the horizontal line in contact with the vertical welding part 20 of both sides with respect to the center welding part 22 with respect to the center welding part 22. The packaging bag for semiconductor wafer packaging, characterized in that by welding two layers each.

웨이퍼, 포장봉투, 수직용착부, 수평용착부, 경사용착부 Wafer, packaging bag, vertical welding part, horizontal welding part, inclined welding part

Description

반도체 웨이퍼포장용 포장봉투{packing envelope for semiconductor wafer packing}Packing envelope for semiconductor wafer packing

도 1은 본 고안의 포장봉투를 펼친 상태 사시도1 is a perspective view of the unfolded packaging bag of the present invention

도 2 내지 도 7은 본 고안의 포장봉투를 구성하기 위한 제조단계를 순차적으로 나타낸 저면 사시도2 to 7 is a bottom perspective view sequentially showing the manufacturing steps for constituting the packaging bag of the present invention

도 8은 본 고안의 수직용착부 단계의 전면도8 is a front view of the vertical welding step of the present invention

도 9는 본 고안의 중점용착부 단계의 전면도9 is a front view of the middle welding step of the subject innovation

도 10은 본 고안의 수평용착부 단계의 전면도10 is a front view of the horizontal welding step of the present invention

도 11은 본 고안의 경사용착부 단계의 전면도11 is a front view of the inclined welding portion step of the present invention

도 12는 본 고안의 포장봉투 평면예시도12 is a plan view of the packaging bag of the present invention

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

A : 포장봉투 10 : 필름A: packaging bag 10: film

12,12' : 전,후면부 14,14' : 양측면부12,12 ': Front and rear 14,14': Both sides

16 : 절첩선 18 : 개구부16: folding line 18: opening

20 : 수직용착부 22 : 중점용착부20: vertical welding part 22: middle welding part

24 : 수평용착부 26 : 경사용착부24: horizontal welding part 26: inclined welding part

30 : 보관용기30: storage container

본 고안은 반도체웨이퍼포장용 포장봉투에 관한 것으로, 더욱 구체적으로는 반도체웨이퍼가 수용된 보관용기를 포장하게 되는 포장봉투를 펼쳤을때 하단부는 수평면을 이루고 봉투를 직교상태로 직립시킬수 있도록 한 구성으로 보관용기의 포장이 용이하도록 한 반도체웨이퍼포장용 포장봉투에 관한 것이다.The present invention relates to a packaging bag for semiconductor wafer packaging. More specifically, when the packaging bag is opened to package a storage container containing the semiconductor wafer, the lower portion forms a horizontal plane and the bag is orthogonal to the orthogonal state. The present invention relates to a packaging bag for semiconductor wafer packaging that facilitates packaging.

일반적으로 반도체웨이퍼의 제조공정은 다결정실리콘을 높은 온도에서 녹여 액체상태로 만들었다가 단결정봉으로 성장시키는 공정과, 가공된 단결정봉을 웨이퍼 형태로 만들기 위해 일정두께로 절단하는 공정과, 웨이퍼의 두께와 평탄도를 균일하게 만드는 공정과, 웨이퍼를 가열한 다음 급격히 냉각시켜 결정본래의 저항률을 갖도록 하는 공정과, 에칭, 연마 및 검사공정을 거쳐 보관용기에 수용한 다음 포장봉투로 포장하여 출하하게 된다.In general, the manufacturing process of semiconductor wafers is a process of melting polycrystalline silicon at a high temperature to make it into a liquid state and growing it into a single crystal rod, cutting the processed single crystal rod to a predetermined thickness to form a wafer, and After the process of making the flatness uniform, the process of heating the wafer and then rapidly cooling it to have the original resistivity, and etching, polishing and inspecting process, it is accommodated in a storage container and then packaged in a packing bag and shipped.

상기와 같은 반도체웨이퍼는 습기, 먼지, 광선 등에 의해 민감한 반응을 나타내므로 보관용기를 밀봉상태로 포장하기 위한 포장봉투는 폴리에틸렌필름, 나일 론필름, 폴리에틸렌과 폴리프로필렌 라미네이트필름, LLDPE(Liner low Denity Poly Ethylene)필름 또는 다수의 복합층을 형성하는 필름등을 사용하여 수분, 광선등이 포장봉투내로 침투하는 것을 방지토록 하고 있다.Since the semiconductor wafers exhibit sensitive reactions due to moisture, dust, light, etc., the packaging bags for packing the storage containers in a sealed state include polyethylene film, nylon film, polyethylene and polypropylene laminate film, and LLDPE (Liner low Denity Poly). Ethylene films or films forming multiple composite layers are used to prevent moisture and light from penetrating into packaging bags.

이렇게 포장봉투의 재질은 다양하게 구비되어 사용되고 있으나 포장봉투의 구성시에 필름을 포개어 상측 개구부이외의 주연부를 용착하되 필름이 2층 겹쳐진 하단부를 일직선으로 용착하여 사각형태의 웨이퍼포장용기를 포장할 수 있게 되어 있지만, 하단부는 평탄하지않은 상태로 펼쳐지므로 포장봉투를 직립시키는데 웨이퍼보관용기가 포장봉투의 바닥면 일측에 불안정하게 담겨지게 되므로 포장봉투를 펼쳐서 포장하는 작업시간이 많이 걸리고 포장상태도 좋지 않게 되는 문제점이 있었다.The material of the packaging bag is used in various ways. However, when constructing the packaging bag, the film can be stacked to weld the periphery portion other than the upper opening. Although the lower part is unfolded in an uneven state, the packaging bag is erected so that the wafer storage container is unstable on one side of the bottom of the packaging bag. There was a problem.

본 고안은 이러한 문제점을 해결하기 위하여 4면으로 구비된 필름의 양측부를 각각 용착하여 4각 형태로 만들되 전후면부사이에 양측면부 중앙을 수직으로 반분되게 접어 하단부의 중앙은 4층으로 겹쳐지게 용착한 중점용착부를 형성하고 그 중점용착부를 기준으로 양측에 수평선과 45도의 경사선으로 방향으로 각각 2층씩 용착한 포장봉투를 구성하여 포장봉투를 펼쳤을때 바닥면이 수평면을 이루도록 하면서 바닥면과 직각으로 직립된 상태가 되는 반도체 웨이퍼 포장용 포장봉투를 제공함에 있다.In order to solve this problem, the present invention welds both sides of the film provided with four sides, respectively, to form a quadrangular shape, but folds the center of both side portions vertically between the front and rear portions, and welds the center of the lower portion to overlap with four layers. Form the center welding part, and form the packing bags welded on each side by horizontal line and 45 degree inclination line on both sides based on the center welding part, so that the bottom surface forms a horizontal plane when the packing bags are unfolded and is perpendicular to the floor The present invention provides a packaging bag for packaging a semiconductor wafer which is in a finished state.

본 고안의 반도체웨이퍼포장용 포장봉투(A)는 상향개구부(18)를 갖고 습기 및 광선등을 차단할 수 있는 필름재질로 구성하게 된다. The semiconductor wafer packaging bag A of the present invention has an upward opening 18 and is made of a film material capable of blocking moisture and light.

이러한 필름(10)을 4면으로 구비하여 필름(10)의 양측부를 각각 용착하여 수직용착부(2)에 의해 4각 형태로 만들되 전,후면부(12)(12')사이에 양측면부(14)(14')중앙을 수직으로 반분되게 접은 절첩선(16)이 내입되게 하여 전,후면부(12)(12')를 포갠다음 4층으로 겹쳐진 하단부 중앙 부분을 용착하여 중점용착부(22)를 형성하고 그 중점용착부(22)를 기준으로 양측의 수직용착부(20)와 맞닿게 수평선을 이루는 수평용착부(24)와 45도의 경사각을 갖는 경사용착부(26)를 2층씩 용착한 포장봉투(A)를 구성한다.The film 10 is provided on four sides, and both sides of the film 10 are welded to each other to form a quadrangular shape by the vertical welding part 2, and the two side parts 14 between the front and rear parts 12 and 12 '. (14 ') the center folded vertically in half folded fold line 16 is embedded, and the front and rear parts (12, 12') are folded, and then the center part of the lower part overlapped by four layers is welded. And weld the horizontal welding part 24 which forms a horizontal line with the vertical welding part 20 of both sides with respect to the center welding part 22, and the inclined welding part 26 which has an inclination angle of 45 degree | times by 2 layers. A packaging bag A is comprised.

상기에서 경사용착부(26)는 펼쳤을때 중점용착부(22)방향으로 수평으로 높여지게 하고 바닥면에서 절첩되는 측부면이 바닥면 주연부에서 직각으로 절곡되어 직립된 상태로 반도체웨이퍼가 수용된 보관용기(30)를 담아 포장할 수 있게 되어 있다.When the inclined welding part 26 is extended, the storage container in which the semiconductor wafer is accommodated is raised horizontally in the direction of the middle welding part 22 and the side surface folded at the bottom surface is bent at a right angle at the periphery of the bottom surface. (30) can be packed.

이와 같이 된 본 고안은 반도체웨이퍼포장용 포장봉투(A)에 관한 것으로, 4면의 필름(10)양측부를 각각 용착하고 하단부는 수평용착부(24)와 경사용착부(26)가 형성된 형태로 되고 양측면부(14)(14')가 전,후면부(12)(12')의 포개어진 사이에 절첩되어 있는 상태로 구비되어 있는 포장봉투(A)를 이용하여 웨이퍼가 수용된 보관용기(30)를 포장하게 된다.The present invention as described relates to a packaging bag for packaging a semiconductor wafer (A), the two sides of the film 10 of the four sides are respectively welded and the lower end is formed in the form of the horizontal welding portion 24 and the inclined welding portion 26 is formed The storage container 30 in which the wafer is accommodated using the packaging bag A provided with both side portions 14 and 14 'folded between the front and rear portions 12 and 12'. Will be packed.

즉, 웨이퍼보관용기(30)를 포장하기 위해 포장봉투(A)를 펼치는 경우에 전,후면부(12)(12')와, 양측면부(14)(14')가 서로 대향된 상태로 네모서리를 각각 4각 형태를 이루게 됨과 아울러 포장봉투(A)하단부의 중점용착부(22)가 포장봉투(A)의 바닥면 중앙에 높여지면서 경사용착부(26)가 중점용착부(22)와 수직용착부(20)하단을 수평으로 연결하는 수평선을 이루면서 바닥면을 수평으로 만들고 바닥면주연부에서 측부면과 직각으로 절곡되는 형태가 되므로 사각의 웨이퍼보관용기(30)를 담게 되는 포장봉투(A)를 직립상태로 유지하면서 수평을 이루는 바닥면에 의해 안정적으로 담아 포장할 수 있게 되므로 포장작업이 용이하고 포장시간을 단축시킬수 있게 된다.That is, when the packaging bag A is unfolded to wrap the wafer storage container 30, the front and rear parts 12 and 12 'and the two side parts 14 and 14' are opposite to each other. Each form a square, and the center welding portion 22 of the lower end of the packing bag (A) is raised to the center of the bottom surface of the packing bag (A) while the inclined welding portion 26 is perpendicular to the center welding portion 22. Packaging bags (A) that contain a rectangular wafer storage container (30) to form a horizontal to form a horizontal line connecting the lower end of the welded portion (20) and bend at a right angle with the side surface at the bottom peripheral portion (A) While maintaining the upright state can be packed in a stable by the horizontal bottom surface packaging is easy and the packaging time can be shortened.

이와 같이 본 고안의 반도체 웨이퍼포장용 포장봉투는 그 구조가 간단하면서 웨이퍼가 수용된 보관용기를 포장하기 위해 포장봉투를 펼쳤을때 바닥면이 평면을 이루면서 네모서리를 가진 측부면이 바닥면에서 직교로 절곡되어 직립상태를 유지하는 구성에 의해 포장작업이 간편하고 신속하게 할수 있고 양호한 포장상태를 유지할수 있는 이점이 있다.As described above, the packaging bag for semiconductor wafer packaging according to the present invention is simple in structure, and when the packaging bag is unfolded to package the storage container containing the wafer, the bottom surface is flat and the side surface having four corners is bent at right angles from the bottom surface. By the configuration of maintaining the upright state, the packaging operation can be easily and quickly, there is an advantage that can maintain a good packaging state.

Claims (1)

상향개구된 포장봉투를 구비하되 4면의 필름(10)을 구비하고 그 필름(10)의 양측부를 각각 용착하여 수직용착부(20)를 형성하며 전,후면부(12)(12')사이에 양측면부(14)(14')중앙을 수직으로 반분되게 접은 절첩선(16)이 내입되게하여 전,후면부(12)(12')를 포갠다음 4층으로 겹쳐진 하단부중앙을 용착하여 중점용착부(22)를 형성하고 그 중점용착부(22)를 기준으로 양측의 수직용착부(20)와 맞닿게 수평선을 이루는 수평용착부(24)와 45도의 경사각을 갖는 경사용착부(26)를 2층씩 용착하여서 됨을 특징으로 하는 반도체 웨이퍼포장용 포장봉투It is provided with an upwardly open packaging bag, including four films 10, and welding both sides of the film 10 to form a vertical weld 20, between the front and rear parts 12, 12 '. The center of both sides (14) and (14 ') is folded into the folded fold line 16 vertically in half, and the front and rear portions (12) and (12') are folded. (22) and the horizontal welding portion 24 forming a horizontal line in contact with the vertical welding portion 20 on both sides with respect to the center welding portion 22 and the inclined welding portion 26 having an inclination angle of 45 degrees. Packaging bags for semiconductor wafer packaging, characterized in that they are welded layer by layer
KR2020060003221U 2006-02-06 2006-02-06 packing envelope for semiconductor wafer packing KR200415289Y1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102127717B1 (en) * 2019-01-04 2020-06-29 에스케이실트론 주식회사 Wafer cassette packing film and wafer cassette packing apparatus using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102127717B1 (en) * 2019-01-04 2020-06-29 에스케이실트론 주식회사 Wafer cassette packing film and wafer cassette packing apparatus using the same

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