KR200407698Y1 - LED Package Circuit Board with Cooling Structure - Google Patents

LED Package Circuit Board with Cooling Structure Download PDF

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Publication number
KR200407698Y1
KR200407698Y1 KR2020050022957U KR20050022957U KR200407698Y1 KR 200407698 Y1 KR200407698 Y1 KR 200407698Y1 KR 2020050022957 U KR2020050022957 U KR 2020050022957U KR 20050022957 U KR20050022957 U KR 20050022957U KR 200407698 Y1 KR200407698 Y1 KR 200407698Y1
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South Korea
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circuit board
led lamp
led
heat
led package
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KR2020050022957U
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Korean (ko)
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최유진
장혁
이성봉
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티티엠주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

본 고안은 방열구조체를 갖는 엘이디 패키지 회로기판에 관한 것으로 광원소자인 엘이디램프와 엘이디램프가 실장될 회로기판 그리고 엘이디램프에서 발생된 열을 효과적으로 처리하기 위한 방열구조체로 평판형 히트파이프가 포함된 것을 특징으로 한다. 종래 엘이디 패키지 회로기판의 방열구조체로 사용되어지는 열전도성이 우수한 금속판 대신 금속판보다 열전달 능력이 매우 우수한 평판형 히트파이프를 적용하여, 엘이디 패키지 회로기판의 작동온도를 저감시켜 엘이디램프의 동작신뢰성을 확보할 수 있다.The present invention relates to an LED package circuit board having a heat dissipation structure. The LED lamp, which is a light source element, a circuit board on which the LED lamp is to be mounted, and a heat dissipation structure for effectively treating heat generated from the LED lamp, includes a flat heat pipe. It features. Instead of the thermally conductive metal plate that is used as a heat dissipation structure of the conventional LED package circuit board, a flat plate heat pipe that has much higher heat transfer ability than the metal plate is applied, thereby reducing the operating temperature of the LED package circuit board, thereby ensuring operational reliability of the LED lamp. can do.

엘이디램프 패키지,백라이트유닛,평판형 히트파이프LED lamp package, backlight unit, flat heat pipe

Description

방열구조체를 갖는 엘이디 패키지 회로기판{LED Package Circuit Board with Cooling Structure} LED Package Circuit Board with Cooling Structure

도1은 종래 기술에 의한 금속판을 이용한 엘이디 패지지 회로기판의 구조 및 방열원리를 나타내는 종단면도1 is a longitudinal sectional view showing the structure and heat radiation principle of an LED packaged circuit board using a metal plate according to the prior art;

도2은 본 고안의 방열구조체를 갖는 엘이디 패지지 회로기판의 구조 및 방열원리를 나타내는 종단면도Figure 2 is a longitudinal sectional view showing the structure and heat radiation principle of the LED packaged circuit board having a heat dissipation structure of the present invention

도3는 종래 기술에 의한 것(A)과 본 고안(B)에 엘이디 패지지 회로기판의 구조를 나타내는 횡단면도Figure 3 is a cross-sectional view showing the structure of the LED packaged circuit board according to the prior art (A) and the present invention (B)

도4는 본 고안의 방열구조체를 갖는 엘이디 패키지 회로기판의 바람직한 실시예를 나타내는 분해 사시도Figure 4 is an exploded perspective view showing a preferred embodiment of the LED package circuit board having a heat dissipation structure of the present invention

도5는 본 고안의 방열구조체를 갖는 엘이디 패키지 회로기판의 바람직한 실시예를 나타내는 사시도
도6은 본 고안의 방열구조체인 평판형 히트파이프의 구조를 나타내는 사시도.
도7은 본 고안의 방열구조체인 평판형 히트파이프 외곽 형상을 나타내는 단면도.
도8은 본 고안의 방열구조체인 평판형 히트파이프 내부 중공부의 다양한 형상을 나타내는 단면도.
(도면 주요부분에 대한 부호의 설명)
10;회로기판 11;전극부 12;접속부
20;엘이디램프 21;엘이디하우징 30;히트싱크
40;열계면재료 100;평판형 히트파이프 101;중공부(채널)
102;컨테이너 200;금속판 Figure 5 is a perspective view showing a preferred embodiment of the LED package circuit board having a heat dissipation structure of the present invention
Figure 6 is a perspective view showing the structure of a flat heat pipe that is a heat dissipation structure of the present invention.
7 is a cross-sectional view showing the outer shape of the flat heat pipe of the heat dissipation structure of the present invention.
Figure 8 is a cross-sectional view showing the various shapes of the inner hollow portion of the heat sink structure flat plate heat pipe of the present invention.
(Explanation of symbols for main parts of drawing)
10; circuit board 11; electrode portion 12; connection portion
20; LED lamp 21; LED housing 30; Heat sink
40; thermal interface material 100; flat heat pipe 101; hollow portion (channel)
102; container 200; metal plate

본 고안은 방열구조체를 갖는 엘이디 패키지 회로기판에 관한 것으로, 보다 상세하게는 엘이디램프(20)에서 발생되는 열을 효과적으로 전도, 확산시켜 엘이디 램프(20)가 집중 실장된 영역의 온도를 낮추기 위하여 엘이디램프(20)가 실장된 회로기판 하부에 평판형 히트파이프를 방열구조체로 적용한 방열구조체를 갖는 엘이디 패키지 회로기판에 관한 것이다.The present invention relates to an LED package circuit board having a heat dissipation structure, and more particularly, to effectively conduct and diffuse heat generated from the LED lamp 20 to reduce the temperature of the LED lamp 20 in the concentrated area of the LED An LED package circuit board having a heat dissipation structure in which a flat plate heat pipe is applied as a heat dissipation structure under a circuit board on which the lamp 20 is mounted.

평판형 디스플레이 중 LCD는 자체적 발광 능력이 없기 때문에, 발광을 위한 외부 광원이 필요하다. 이 빛을 제공하여 주는 수단이 백라이트유닛(BLU;Back Light Unit)이다. 백라이트유닛에 사용되는 광원은 냉음극형광램프(CCFL), 외부전극형광램프(EEFL), 면광원(FFL), 발광다이오드(LED)램프 등이 있는데, 최근 들어 엘이디램프 채용이 급증하고 있다.Among flat panel displays, since LCDs do not have their own light emitting capability, an external light source for light emission is required. The means for providing this light is a backlight unit (BLU). The light source used in the backlight unit includes a cold cathode fluorescent lamp (CCFL), an external electrode fluorescent lamp (EEFL), a surface light source (FFL), a light emitting diode (LED) lamp, and the like, and the adoption of LED lamps has recently increased rapidly.

광원소자인 엘이디램프는 고휘도, 저전력소모, 친환경적이라는 장점이 있는 반면, 광효율이 낮은 단점을 가지고 있다. 엘이디램프의 광효율은 대략 20~30%정도로 엘이디램프 1개당 소모전력은 1W정도이다. 32인치 TFT-LCD의 엘이디 백라이트유닛에 사용되는 엘이디램프의 개수는 약 400개이며, 발생되는 열은 280W정도에 달한다. 엘이디램프가 실장된 회로기판에서 발생된 열을 처리하지 못하면, 엘이디램프가 실장된 회로기판과 백라이트 내부의 온도를 상승시켜, 엘이디램프의 동작 불능을 야기할 수 있고, 관련 전자회로 등의 동작 신뢰성을 저하시킬 수 있다. 또한 내부 온도차에 의한 부품이나 케이스에 열응력이 발생되어 제품을 변형을 초래할 수도 있다. LED lamp, which is a light source device, has the advantages of high brightness, low power consumption, and eco-friendliness, while having low light efficiency. The light efficiency of LED lamp is about 20 ~ 30%, and the power consumption per LED lamp is about 1W. The number of LED lamps used in the LED backlight unit of the 32-inch TFT-LCD is about 400, and heat generated is about 280W. Failure to handle the heat generated by the LED lamp mounted circuit board may raise the temperature inside the LED board and the backlight, which may cause the LED lamp to become inoperable and operate reliability of the related electronic circuit. Can be lowered. In addition, thermal stress may be generated in parts or cases due to internal temperature differences, which may cause deformation of the product.

도2는 종래 엘이디가 실장된 실장된 엘이디 패키지 회로기판을 나타낸다. 엘이디램프(20)에서 발생하는 열의 대부분은 엘이디하우징(21) 내에 삽입되어 있는 히트싱크슬러그를 통하여 회로기판(10) 상의 접속부(12)으로 전달되어, 다시 회로기판(10) 하부의 알루미늄 등 열전도성이 우수한 금속판(200)으로 전도되어 금속판(200) 배면의 넓은 면적을 통하여 외부로 열을 방출하게 된다. 이러한 구조는 열전도도가 우수한 금속을 이용함으로 엘이디램프가 밀집된 영역에서 발생된 열을 빠른 시간내에 금속판 전면으로 전도,확산시켜 단위면적당 발열량을 저감시킬 수 있지만, 기존 열전도성이 우수한 금속의 열전도계수 향상에 한계성이 있기 때문에, 단위면적당 발열량을 저감시키는 데에는 한계가 있다. 2 shows a mounted LED package circuit board on which a conventional LED is mounted. Most of the heat generated by the LED lamp 20 is transferred to the connecting portion 12 on the circuit board 10 through the heat sink slug inserted in the LED housing 21, and again, the thermoelectric such as aluminum under the circuit board 10 Conducted by the excellent metal plate 200, the heat is released to the outside through a large area of the back surface of the metal plate 200. This structure can reduce the heat generation per unit area by conducting and diffusing heat generated in the area where the LED lamp is concentrated to the front of the metal plate in a short time by using the metal with excellent thermal conductivity, but improving the thermal conductivity of the metal having excellent thermal conductivity. Because of this limitation, there is a limit to reducing the amount of heat generated per unit area.

상기 종래 기술의 한계점을 해결하기 위하여, 종래 엘이디 패키지 회로기판의 방열구조체로 사용되어지는 열전도성이 우수한 금속판 대신 금속판보다 열전달 능력이 매우 우수한 평판형 히트파이프를 적용하여, 엘이디 패키지 회로기판의 작동온도를 저감시켜 엘이디램프의 동작신뢰성을 향상시키는 것이다.In order to solve the limitations of the prior art, by using a flat plate heat pipe having a better heat transfer ability than a metal plate instead of a metal plate having excellent thermal conductivity, which is used as a heat dissipation structure of a conventional LED package circuit board, the operating temperature of the LED package circuit board This is to improve the operational reliability of the LED lamp.

상기의 목적을 달성하기 위한 본 고안은 광원소자인 엘이디램프와 엘이디램프가 실장될 회로기판 그리고 엘이디램프에서 발생된 열을 효과적으로 처리하기 위한 방열구조체를 포함하여 이루진 것을 특징으로 한다.
상기 방열구조체는 외곽 단면 형상이 다면체이고 내부에 적어도 한개 이상의 단일폐곡선을 갖는 중공부가 형성된 평판형 히트파이프인 것을 특징으로 한다.
또한 외부로의 방열량을 증가시키기 위하여 엘이디 패키지 회로기판의 방열구조체인 평판형 히트파이프 응축부 영역 외부 일면에 히트싱크가 결합되어지는 것을 특징으로 한다.
상기 평판형 히트파이프 응축 영역 외부 일면과 히트싱크의 결합 계면에 방열그리스 등 열계면재료가 포함되어 구성될 수 있다.The present invention for achieving the above object is characterized by comprising a heat dissipation structure for effectively treating the heat generated from the LED lamp and the LED lamp as the light source element is mounted and the LED lamp.
The heat dissipation structure is characterized in that the outer cross-sectional shape is a polyhedron and a flat heat pipe having a hollow portion having at least one single closed curve therein.
In addition, in order to increase the amount of heat dissipation to the outside, the heat sink is coupled to one surface outside the area of the flat heat pipe condensation unit, which is a heat dissipation structure of the LED package circuit board.
A thermal interface material such as a heat dissipation grease may be included at a coupling interface between the outer surface of the flat heat pipe condensation region and the heat sink.

엘이디램프(20)에서 발생된 열(Q)은 회로기판(10)을 통하여 평판형히트파이프(100)로 전달된다. 전달된 열은 평판형히트파이프(100) 내부 채널(101)의 증발부영역에 있는 액상의 작동유체에 전달되고, 액상의 작동유체가 기상으로 변화하여 응축부를 통하여 외부로 방열되어진다. 방열된 기상의 작동유체는 다시 액상으로 변화하여 내부 채널(101)의 모세관력에 의하여 증발부로 귀환된다. 이러한 일련의 열전달 과정이 연속적으로 발생되어 엘이디램프(20)에서 발생한 열을 외부로 방열하여 엘이디 패키지 회로기판의 온도를 저온으로 유지할 수 있다.
(실시예)
이하, 본 고안의 바람직한 실시예를 첨부한 도면을 참조하여 상세히 설명한다.
본 고안의 상세한 설명은 상기에서 기술된 내용이 철저하고 완전해 질 수 있도록 그리고 당업자에게 본 고안의 사상과 특징이 충분히 전달될 수 있도록 하기 위해 제공되는 것이다. 첨부된 도면에 있어서, 본 고안의 특징을 명확하게 전달 하기 위하여 일부 도면은 과장적으로 도시되었고, 부가적으로 추가되는 부품에 대해서는 생략한 것도 있다.
도2를 참조하여, 본 고안의 방열구조체를 갖는 엘이디 패키지 회로기판은 엘이디램프(20)와 그것이 실장되는 회로기판(10) 그리고 엘이디램프(20)에서 발생되는 열을 외부로 방열하는 수단인 평판형 히트파이프(100)가 일체형으로 결합되어 구성된다.
평판형 히트파이프로 전달된 엘이디램프(20)에서 발생한 열의 방열 촉진을 위하여 히트싱크(30)가 구비될 수 있다. 그리고 히트싱크(30)가 결합되는 평판형 히트파이프(100) 계면에 열저항을 줄여주고 접착성을 부여하기 위한 열계면재료(40)가 도포된다.
도3을 참조하여, 상기 평판형 히트파이프(100) 단면은 내부에 단일폐곡선을 갖는 중공부(101)가 적어도 1개 이상 형성된다.
도4을 참조하여, 엘이디램프(20)는 회로기판(10) 상에 열전도성이 우수한 금속 재질로 형성된 접속부(12)에 연결되고 전원 인가를 위한 양쪽 전극이 전극부(11)에 납땜으로 결합된다. 엘이디램프(20)가 결합되는 접속부(12)에 열저항 저감을 위하여 방열그리스 등 열계면재료가 도포되어질 수 있다.
도5를 참조하여, 평판형히트파이프(100)로 전달된 엘이디램프(20)에서 발생한 열의 방열 촉진을 위한 히트싱크(30)는 회로기판(10) 반대측에 위치되며, 전면에 일체형으로 결합되거나, 일부분에 단락되어 결합될 수 있다.
도6을 참조하여, 본 고안의 방열구조체를 갖는 엘이디 패키지 회로기판의 방열구조체인 평판형 히트파이프(100)는 외곽 형상이 다면체이고 내부에 단일 폐곡선을 갖는 중공부가 적어도 1개 이상 형성된 컨테이너(102)에 작동유체를 주입하고 양단이 냉간압접되어 형성된다.
도7을 참조하여, 상기 평판형 히트파이프(100)의 외곽 형상은 단면체로 형성된 다양한 모양으로 형성되어 질 수 있다.
도8을 참조하여, 상기 평판형 히트파이프(100)에 형성된 중공부(101)은 그 단면이 단일폐곡선을 갖는 형태로 다양하게 형성될 수 있다. 내부 작동유체의 모세관력 증가를 위하여 모서리 구조가 첨자 형태이거나 요철 형태로 형성된다.
이상에서 설명한 본 고안은 전술한 실시예와 첨부도면에 한정되는 것이 아니라 본 고안의 기술적 사상을 벗어나지 않는 범위내에서 다른 형태로 다양하게 구현될 수 있음을 밝혀둔다.The heat Q generated by the LED lamp 20 is transferred to the flat plate heat pipe 100 through the circuit board 10. The transferred heat is transferred to the working fluid in the liquid phase in the evaporation region of the inner channel 101 of the flat plate heat pipe 100, and the working fluid in the liquid phase changes to the gaseous phase and radiates to the outside through the condensation part. The working gas of the heat-dissipated gaseous phase is changed back to the liquid phase and is returned to the evaporation unit by capillary force of the inner channel 101. Such a series of heat transfer processes are continuously generated to heat the heat generated from the LED lamp 20 to the outside to maintain the temperature of the LED package circuit board at a low temperature.
(Example)
Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail.
The detailed description of the present invention is provided to ensure that the above-described contents are thoroughly and completely, and that the spirit and features of the present invention can be sufficiently delivered to those skilled in the art. In the accompanying drawings, in order to clearly convey the features of the present invention, some of the drawings are exaggerated, and additional parts may be omitted.
Referring to Figure 2, the LED package circuit board having a heat dissipation structure of the present invention is a flat plate which is a means for radiating heat generated from the LED lamp 20, the circuit board 10 and the LED lamp 20 mounted thereon to the outside The type heat pipe 100 is configured to be integrally coupled.
The heat sink 30 may be provided to promote heat dissipation of heat generated from the LED lamp 20 transferred to the flat heat pipe. A thermal interface material 40 is applied to the interface of the flat heat pipe 100 to which the heat sink 30 is coupled to reduce heat resistance and provide adhesion.
Referring to FIG. 3, at least one hollow portion 101 having a single closed curve is formed in a cross section of the flat heat pipe 100.
Referring to FIG. 4, the LED lamp 20 is connected to the connection part 12 formed of a metal material having excellent thermal conductivity on the circuit board 10, and both electrodes for power supply are soldered to the electrode part 11. do. A thermal interface material such as a heat dissipation grease may be applied to the connection portion 12 to which the LED lamp 20 is coupled to reduce heat resistance.
5, the heat sink 30 for promoting heat dissipation of heat generated from the LED lamp 20 transferred to the flat plate heat pipe 100 is located on the opposite side of the circuit board 10, or integrally coupled to the front surface It can be shorted to a part and combined.
Referring to FIG. 6, the flat heat pipe 100, which is a heat dissipation structure of an LED package circuit board having a heat dissipation structure of the present invention, has a polyhedral outer shape and has at least one hollow portion having a single closed curve therein. It is formed by injecting a working fluid into the) and cold ends of both ends.
Referring to FIG. 7, the outer shape of the flat heat pipe 100 may be formed in various shapes formed as a cross-section.
Referring to FIG. 8, the hollow portion 101 formed in the flat heat pipe 100 may have various cross-sections in the form of a single closed curve. In order to increase the capillary force of the internal working fluid, the corner structure is formed in a subscript or irregularities.
The present invention described above is not limited to the above-described embodiment and the accompanying drawings, it will be understood that it can be variously implemented in other forms within the scope without departing from the spirit of the present invention.

삭제delete

본 고안에 의한 방열구조체를 갖는 엘이디 패키지 회로기판은 엘이디램프에서 발생되는 열을 엘이디 패키지 회로기판의 방열구조체인 평판형히트파이프를 통하여 외부로 방열시켜, 종래 금속판을 이용한 것보다 방열 성능이 우수하여, 엘이디 패키지 회로기판의 저온유지를 통한 엘이디램프의 동작신뢰성을 크게 향상시킬 수 있다.The LED package circuit board having the heat dissipation structure according to the present invention radiates heat generated from the LED lamp to the outside through a flat plate heat pipe, which is a heat dissipation structure of the LED package circuit board, so that the heat dissipation performance is superior to that of the conventional metal plate. In addition, the reliability of the LED lamp can be greatly improved by maintaining the LED package circuit board at low temperature.

Claims (5)

엘이디램프(20) 및 엘이디램프하우징(21), 엘이디램프(20)가 실장될 회로기판(10) 그리고 엘이디램프에서 발생된 열을 처리하기 위한 방열구조체를 포함하여 이루진 엘이디백라이트유닛의 광원 공급 수단인 엘이디 패키지 회로기판에 있어서,Supply light source of LED backlight unit including LED lamp 20, LED lamp housing 21, circuit board 10 on which LED lamp 20 will be mounted, and heat dissipation structure for treating heat generated from LED lamp. In the LED package circuit board which is a means, 방열구조체가 평판형히트파이프(100)인 것을 특징으로 하는 방열구조체를 갖는 엘이디 패키지 회로기판.LED package circuit board having a heat dissipation structure, characterized in that the heat dissipation structure is a flat plate heat pipe (100). 제1항에 있어서, 평판형히트파이프(100)의 외곽 단면 형상은 다면체이고 내부에 적어도 한개 이상의 단일폐곡선을 갖는 중공부가 형성된 것을 특징으로 하는 방열구조체를 갖는 엘이디 패키지 회로기판.2. The LED package circuit board of claim 1, wherein an outer cross-sectional shape of the flat plate heat pipe 100 is a polyhedron and a hollow portion having at least one single closed curve is formed therein. 제1항에 있어서, 평판형히트파이프 응축부 외부의 일면에 적어도 1개 이상의 히트싱크가 구비되어지는 것을 특징으로 하는 방열구조체를 갖는 엘이디 패키지 회로기판.The LED package circuit board of claim 1, wherein at least one heat sink is provided on one surface of the plate heat pipe condenser. 제3항에 있어서, 히트싱크 일측에 강제대류 유발 수단인 냉각팬이 적어도 1개 이상 결합되는 것을 특징으로 하는 방열구조체를 갖는 엘이디 패키지 회로기판.4. The LED package circuit board of claim 3, wherein at least one cooling fan, which is a forced convection inducing means, is coupled to one side of the heat sink. 삭제delete
KR2020050022957U 2005-08-09 2005-08-09 LED Package Circuit Board with Cooling Structure KR200407698Y1 (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100791982B1 (en) * 2006-06-19 2008-01-04 티티엠주식회사 Printed circuit board incorporated with heatpipe and manufacturing method thereof
KR100895516B1 (en) 2007-02-23 2009-04-30 주식회사 선문씨티에스 A LED Lighting Lamp
KR100920111B1 (en) * 2008-12-19 2009-10-01 주식회사 지앤에이치 Heat sink device of light emitting diode module for lighting equipment
KR100963966B1 (en) * 2007-11-21 2010-06-15 현대모비스 주식회사 ??? unit and optical source module therewith
KR101232148B1 (en) * 2006-03-15 2013-02-12 엘지디스플레이 주식회사 Back Light Unit
KR20170089792A (en) * 2017-06-16 2017-08-04 최승진 Printed circuit board for LED with heat sink structure

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101232148B1 (en) * 2006-03-15 2013-02-12 엘지디스플레이 주식회사 Back Light Unit
KR100791982B1 (en) * 2006-06-19 2008-01-04 티티엠주식회사 Printed circuit board incorporated with heatpipe and manufacturing method thereof
KR100895516B1 (en) 2007-02-23 2009-04-30 주식회사 선문씨티에스 A LED Lighting Lamp
KR100963966B1 (en) * 2007-11-21 2010-06-15 현대모비스 주식회사 ??? unit and optical source module therewith
KR100920111B1 (en) * 2008-12-19 2009-10-01 주식회사 지앤에이치 Heat sink device of light emitting diode module for lighting equipment
KR20170089792A (en) * 2017-06-16 2017-08-04 최승진 Printed circuit board for LED with heat sink structure

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