KR20040073314A - In-line processing apparatus - Google Patents

In-line processing apparatus Download PDF

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Publication number
KR20040073314A
KR20040073314A KR1020040008248A KR20040008248A KR20040073314A KR 20040073314 A KR20040073314 A KR 20040073314A KR 1020040008248 A KR1020040008248 A KR 1020040008248A KR 20040008248 A KR20040008248 A KR 20040008248A KR 20040073314 A KR20040073314 A KR 20040073314A
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South Korea
Prior art keywords
substrate
liquid
temperature
line
processing apparatus
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KR1020040008248A
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Korean (ko)
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KR101078908B1 (en
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시마이후토시
가와타시게루
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도쿄 오카 고교 가부시키가이샤
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    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F9/00—Arrangement of road signs or traffic signals; Arrangements for enforcing caution
    • E01F9/60—Upright bodies, e.g. marker posts or bollards; Supports for road signs
    • E01F9/604—Upright bodies, e.g. marker posts or bollards; Supports for road signs specially adapted for particular signalling purposes, e.g. for indicating curves, road works or pedestrian crossings
    • E01F9/608—Upright bodies, e.g. marker posts or bollards; Supports for road signs specially adapted for particular signalling purposes, e.g. for indicating curves, road works or pedestrian crossings for guiding, warning or controlling traffic, e.g. delineator posts or milestones
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F15/00—Safety arrangements for slowing, redirecting or stopping errant vehicles, e.g. guard posts or bollards; Arrangements for reducing damage to roadside structures due to vehicular impact
    • E01F15/003—Individual devices arranged in spaced relationship, e.g. buffer bollards
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F9/00—Arrangement of road signs or traffic signals; Arrangements for enforcing caution
    • E01F9/60—Upright bodies, e.g. marker posts or bollards; Supports for road signs
    • E01F9/604—Upright bodies, e.g. marker posts or bollards; Supports for road signs specially adapted for particular signalling purposes, e.g. for indicating curves, road works or pedestrian crossings
    • E01F9/619—Upright bodies, e.g. marker posts or bollards; Supports for road signs specially adapted for particular signalling purposes, e.g. for indicating curves, road works or pedestrian crossings with reflectors; with means for keeping reflectors clean
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F9/00—Arrangement of road signs or traffic signals; Arrangements for enforcing caution
    • E01F9/60—Upright bodies, e.g. marker posts or bollards; Supports for road signs
    • E01F9/623—Upright bodies, e.g. marker posts or bollards; Supports for road signs characterised by form or by structural features, e.g. for enabling displacement or deflection
    • E01F9/627—Upright bodies, e.g. marker posts or bollards; Supports for road signs characterised by form or by structural features, e.g. for enabling displacement or deflection self-righting after deflection or displacement
    • E01F9/629—Traffic guidance, warning or control posts, bollards, pillars or like upstanding bodies or structures
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F9/00—Arrangement of road signs or traffic signals; Arrangements for enforcing caution
    • E01F9/60—Upright bodies, e.g. marker posts or bollards; Supports for road signs
    • E01F9/658—Upright bodies, e.g. marker posts or bollards; Supports for road signs characterised by means for fixing

Abstract

PURPOSE: An in-line treatment apparatus is provided, to allow the temperature of the surface of a glass substrate to be uniformly in a short time and to inhibit the generation of particles inducing spot. CONSTITUTION: The in-line treatment apparatus carries out a treatment by returning a substrate by a return line(1) comprising a plurality of rolling hasps, wherein a temperature control means for emitting the liquid for temperature control from the interval of rolling hasps to the back face of the substrate, is set at the under part of the return line. Preferably the temperature control means emits the liquid having a temperature almost similar to that of a treatment solution supplied to the surface of a substrate, and has a slit(4a) for emitting liquid, having a almost similar length to the width of the returned substrate.

Description

인라인식 처리장치{In-line processing apparatus}In-line processing apparatus

본 발명은 유리기판 등의 기판 온도의 조정기능을 갖는 인라인식 처리장치에 관한 것이다.The present invention relates to an inline processing apparatus having a function of adjusting a substrate temperature such as a glass substrate.

예를 들면, 유리기판에 도포한 레지스트액을 노광하는 경우 유리기판의 표면에 온도차가 있으면 기판 표면에 있어서의 처리액의 휘발 속도가 부분적으로 변해, 그 영향으로 표면의 레지스트 현상 화학처리 속도에 차가 생겨 얼룩이 발생한다.For example, in the case of exposing a resist liquid applied to a glass substrate, if there is a temperature difference on the surface of the glass substrate, the volatilization rate of the processing liquid on the surface of the substrate is partially changed. Smears occur.

상기 문제를 개선하기 위해서, 종래에는 칠러 유닛과 연결된 온도조정척(chuck)을 클린룸 내에 설치하여 이 온도조정 척에 유리기판을 밀착시켰지만, 이것으로는 시간이 너무 많이 걸린다. 따라서, 유리기판의 표면과 이면의 전후 좌우에 간격을 두고 온도조정 공기를 분출하는 노즐을 배치하는 것이 제안되어 있다(특허문헌 1).In order to solve the above problem, conventionally, a temperature adjusting chuck connected to the chiller unit was installed in a clean room to adhere the glass substrate to the temperature adjusting chuck, but this takes too much time. Therefore, it has been proposed to arrange nozzles for ejecting temperature-controlled air at intervals on the front, rear, left, and right sides of the glass substrate and the back surface (Patent Document 1).

[특허문헌][Patent Documents]

(특허문헌 1) 일본국 특허공개 제2002-72492호 단락 0002~0006(Patent Document 1) Japanese Patent Laid-Open No. 2002-72492 Paragraph 0002 to 0006

특허문헌 1에 개시되는 바와 같이 온도조정 공기를 유리기판의 표면 및 이면에 내뿜으면 단시간 안에 유리기판의 표면 온도를 균일하게 할 수 있다.As disclosed in Patent Literature 1, when temperature-controlled air is blown onto the front and back surfaces of the glass substrate, the surface temperature of the glass substrate can be made uniform within a short time.

그러나 이 방법에서는, 파티클(particle)을 감아올려 이것이 기판 표면에 부착된다는 새로운 문제가 발생한다. 특히 유리기판이 대형화되고 있는 현재, 얼룩의 발생은 큰 문제가 되고 있다.In this method, however, a new problem arises that the particles are rolled up and attached to the substrate surface. Especially as glass substrates become larger in size, the occurrence of spots is a big problem.

도 1은 본 발명의 인라인식 처리장치의 사시도이다.1 is a perspective view of an inline treatment apparatus of the present invention.

도 2는 동 인라인식 처리장치의 측면도이다.2 is a side view of the inline processing apparatus.

도 3은 다른 실시예의 인라인식 처리장치의 평면도이다.3 is a plan view of an inline processing apparatus of another embodiment.

부호의 설명Explanation of the sign

1…반송라인, 2…연속형 굴림쇠, 3…온도조정 수단, 4…온도조정 액체 분출노즐, 4a…슬릿(slit), 5…칠러(chiller), 6…현상액 공급노즐, 7a…유리기판의 이면(裏面)에 접촉되는 부분, 7…불연속형 굴림쇠.One… Return line, 2... Continuous chuck, 3... Temperature adjusting means; Temperature-controlled liquid jet nozzle, 4a... Slit, 5.. Chiller, 6... Developer supply nozzle, 7a... Part which contacts the back surface of a glass substrate, 7.. Discontinuous chucks.

상기 과제를 해결하도록 본 발명의 인라인식 처리장치는 다수의 굴림쇠로 된 반송라인에 의해 기판을 반송하면서 처리를 행하는 인라인식 처리장치에 있어서, 상기 반송라인의 아래쪽에는 온도조정용 액체를 굴림쇠 사이로부터 기판 이면에 내뿜는 온도조정 수단을 설치하였다.In-line processing apparatus of the present invention to solve the above problems is an in-line processing apparatus for carrying out the process while conveying the substrate by a conveying line made of a plurality of chucks, the temperature adjustment liquid in the lower portion of the conveying line The temperature adjusting means which blows out on the back surface of the board | substrate was installed.

공기가 아니라 액체를 사용함으로써 파티클의 발생이 억제될 뿐만 아니라 온도조정에 필요한 시간도 단축할 수 있다.The use of liquid rather than air not only suppresses particle generation, but also shortens the time required for temperature adjustment.

또한, 상기 온도조정 수단으로부터 분출되는 액체의 온도는 기판 표면에 공급되는 처리액과 거의 동일하게 하는 것이 처리 얼룩(현상 얼룩) 등을 방지하는 면에서 보다 바람직하다.In addition, the temperature of the liquid ejected from the temperature adjusting means is more preferably the same as that of the processing liquid supplied to the substrate surface in terms of preventing processing stains (developing stains) and the like.

또한, 기판 이면 전체에 온도조정용 액체를 공급하여 신속하고 또한 균일한 온도조정을 행하기 위해서는 온도조정 수단이 반송되는 기판의 폭과 거의 같은 길이의 액체 분출용 슬릿을 갖는 것이 바람직하다.In addition, in order to supply the temperature adjusting liquid to the entire back surface of the substrate and to perform a quick and uniform temperature adjustment, it is preferable that the temperature adjusting means has a liquid ejection slit of approximately the same length as the width of the substrate to be conveyed.

더욱이, 반송 굴림쇠(롤러)에는 기판 이면에 접촉되는 부분이 축방향으로 거리를 두고 설치된 불연속형 굴림쇠와 전면이 기판 이면에 접촉되도록 축방향으로 동일 지름으로 된 연속형 굴림쇠가 있지만, 연속형 굴림쇠를 사용함으로써 기판 이면에 공급된 온도조정액이 기판 이면 전체에 고루 퍼지기 때문에 반송 굴림쇠로서는 일부에 반드시 연속형 굴림쇠를 배치하는 것이 바람직하다.Moreover, the conveyance chuck (roller) has a discontinuous chuck provided with a portion in contact with the back surface of the substrate at an axial distance and a continuous chuck having the same diameter in the axial direction so that the front surface is in contact with the back surface of the substrate. Since the temperature adjustment liquid supplied to the back surface of a board | substrate is spread evenly across the board | substrate back surface by using a type | mold | column type | mold, it is preferable to arrange a continuous type type | mold in a part as a conveyance type | mold.

이하에 본 발명의 실시형태를 첨부 도면을 토대로 설명한다. 도 1은 본 발명의 인라인식 처리장치의 사시도, 도 2는 동 인라인식 처리장치의 측면도이다.EMBODIMENT OF THE INVENTION Below, embodiment of this invention is described based on an accompanying drawing. 1 is a perspective view of an inline processing apparatus of the present invention, Figure 2 is a side view of the inline processing apparatus.

도면 중 1은 반송라인으로, 이 반송라인(1)은 다수의 굴림쇠(2)를 유리기판(W)의 반송방향을 따라 등간격으로 배치하고 있다. 굴림쇠(2)는 축방향에 따른 모든 개소에 있어서 동일 지름으로 된 연속형 굴림쇠로서 유리기판(W)의 이면에 전면적으로 접촉된다. 또한, 다수의 연속형 굴림쇠(2)는 도시하지 않는 모터에 의해 동일 주기로 회전된다.In the figure, 1 is a conveyance line, and this conveyance line 1 arrange | positions many chucks 2 at equal intervals along the conveyance direction of the glass substrate W. As shown in FIG. The chuck 2 is a continuous chuck having the same diameter in all places along the axial direction and is brought into full contact with the rear surface of the glass substrate W. FIG. In addition, many continuous type | formers 2 are rotated by the same period by the motor which is not shown in figure.

반송라인(1)의 아래쪽에는 온도조정 수단(3)을 배치하고 있다. 온도조정 수단(3)은 연속형 굴림쇠(2)와 굴림쇠(2) 사이에 배치되는 2개의 온도조정 액체 분출노즐(4)와 이 노즐(4)에 온도조정된 액체(현상액 또는 물)를 공급하는 칠러(5)로된다. 온도조정 액체 분출노즐(4)의 윗면에는 유리기판(W)의 이면을 향해 온도조정 액체를 분출하는 슬릿(4a)가 형성되고, 이 슬릿(4a)의 길이는 유리기판(W)의 폭과 거의 동일하게 설정되어 있다. 또한, 칠러(5) 대신에 히터를 사용해도 된다.The temperature adjustment means 3 is arrange | positioned under the conveyance line 1. As shown in FIG. The temperature regulating means 3 comprises two temperature regulating liquid jet nozzles 4 arranged between the continuous chuck 2 and the chuck 2 and the liquid (developing liquid or water) temperature-controlled by the nozzle 4. To chiller 5 to supply it. On the upper surface of the temperature adjusting liquid jet nozzle 4, a slit 4a for ejecting the temperature adjusting liquid toward the rear surface of the glass substrate W is formed, and the length of the slit 4a is equal to the width of the glass substrate W. It is set almost identically. In addition, a heater may be used instead of the chiller 5.

또한, 반송라인(1)의 위쪽에는 반송방향으로 거리를 두고 현상액 공급노즐(6)을 2개 배치하고 있다. 현상액 공급노즐(6)으로부터 현상액이 유리기판(W)에 공급되는 시점에서 유리기판(W)의 온도조정이 이루어져 있는 것이 바람직하기 때문에, 이 실시예에 있어서는 유리기판(W)의 반송방향을 기준으로 하여 상류쪽에 현상액 공급노즐(6)을, 하류쪽에 온도조정 액체 분출노즐(4)를 배치하고 있다.In addition, two developer solution supply nozzles 6 are arranged above the conveying line 1 at a distance in the conveying direction. Since the temperature of the glass substrate W is preferably adjusted at the time when the developer is supplied from the developer supply nozzle 6 to the glass substrate W, in this embodiment, the conveyance direction of the glass substrate W is referred to. As a result, the developer supply nozzle 6 is disposed upstream and the temperature adjusting liquid jet nozzle 4 is disposed downstream.

도 3은 다른 실시예의 인라인식 처리장치의 평면도로서, 이 실시예에 있어서는 반송라인(1)을 구성하는 굴림쇠를 모두 연속형 굴림쇠(2)로 하지 않고, 유리기판(W)의 이면에 접촉되는 부분(7a)가 축방향으로 거리를 두고 설치된 불연속형 굴림쇠(7)을 혼성하고 있다. 즉, 불연속형 굴림쇠(7)의 부분(7a)가 Z자형상이 되도록 복수의 불연속형 굴림쇠(7)을 배치하고, 이들 불연속형 굴림쇠(7) 사이에 연속형 굴림쇠(2)를 배치하고 있다. 이와 같이 불연속형 굴림쇠(7)을 설치하여 비용절감을 꾀하더라도, 그 사이에 연속형 굴림쇠(2)를 배치함으로써 온도조정액을 기판 이면의 전면에 고루 퍼지게 할 수 있다.FIG. 3 is a plan view of an inline processing apparatus of another embodiment, in this embodiment, all of the protrusions constituting the conveying line 1 are not the continuous type protrusions 2, but on the rear surface of the glass substrate W. FIG. The part 7a which contacts is hybridizing the discontinuous type | mold 7 provided with the axial distance. In other words, a plurality of discontinuous bumps 7 are disposed so that the portion 7a of the discontinuous bumps 7 is Z-shaped, and the continuous bumps 2 are disposed between the discontinuous bumps 7. Is placed. In this way, even if the discontinuous type gasket 7 is provided to reduce the cost, the continuous type gasket 2 can be disposed therebetween so that the temperature adjusting liquid can be spread evenly over the front surface of the substrate.

또한, 실시예에서는 본 발명의 인라인식 처리장치를 현상처리시 기판의 온도조정에 사용하였지만 이것에 한정되지는 않는다. 예를 들면 레지스트 도포의 전처리로서 사용해도 된다.In addition, although the inline processing apparatus of this invention was used for temperature adjustment of the board | substrate at the time of image development in an Example, it is not limited to this. For example, you may use as a pretreatment of resist coating.

이상 설명한 바와 같이 본 발명의 인라인식 처리장치에 의하면, 반송라인의 아래쪽에 온도조정용 액체를 굴림쇠 사이로부터 기판 이면에 내뿜는 온도조정 수단을 설치했기 때문에 파티클의 발생을 억제하면서 단시간에 균일한 온도조정을 행할 수 있다.As described above, according to the inline processing apparatus of the present invention, since the temperature adjusting means is provided at the lower part of the conveying line to flush the liquid for temperature adjustment from the chuck to the back surface of the substrate, uniform temperature adjustment in a short time while suppressing generation of particles. Can be done.

특히, 공급하는 온도조정용 액체의 온도를 기판 표면에 공급되는 처리액(현상액 등)과 거의 동일하게 하고 또한 기판 이면에 전면적으로 공급함으로써 더욱이 처리 얼룩을 억제하는 것이 가능해진다.In particular, by making the temperature of the liquid for temperature adjustment supplied be almost the same as the processing liquid (developing liquid etc.) supplied to the surface of a board | substrate, and fully supplying to the back surface of a board | substrate, it becomes possible to suppress a process stain further.

일반적으로 현상 얼룩은 나트륨 램프를 사용한 육안 검사로 판정하고 있지만, 본 발명의 장치를 사용하여 현상한 경우 상기 검사에서 얼룩은 인지되지 않았다.In general, development stains are determined by visual inspection using a sodium lamp, but when developed using the apparatus of the present invention, stains were not recognized in the inspection.

Claims (4)

다수의 굴림쇠로 된 반송라인에 의해 기판을 반송하면서 처리를 행하는 인라인식 처리장치에 있어서, 상기 반송라인의 아래쪽에는 온도조정용 액체를 굴림쇠 사이로부터 기판 이면에 내뿜는 온도조정 수단을 설치한 것을 특징으로 하는 인라인식 처리장치.An inline processing apparatus for carrying out a process while conveying a substrate by means of a conveying line made of a plurality of chucks, characterized in that a temperature adjusting means is provided below the conveying line to flush the liquid for temperature regulation from the chuck to the back surface of the substrate. Inline processing unit. 제1항에 있어서, 상기 온도조정 수단은 기판 표면에 공급되는 처리액과 거의 동일 온도의 액체를 분출하는 것을 특징으로 하는 인라인식 처리장치.The in-line processing apparatus according to claim 1, wherein the temperature adjusting means ejects a liquid having substantially the same temperature as the processing liquid supplied to the substrate surface. 제1항 또는 제2항에 있어서, 상기 온도조정 수단은 반송되는 기판의 폭과 거의 같은 길이의 액체 분출용 슬릿을 갖는 것을 특징으로 하는 인라인식 처리장치.The in-line treatment apparatus according to claim 1 or 2, wherein the temperature adjusting means has slits for ejecting liquid having a length substantially equal to the width of the substrate to be conveyed. 제1항 내지 제3항 중 어느 한 항에 있어서, 상기 반송라인은 기판 이면에 접촉되는 부분이 축방향으로 거리를 두고 설치된 불연속형 굴림쇠와 전면이 기판 이면에 접촉되도록 축방향으로 동일 지름으로 된 연속형 굴림쇠와의 혼성인 것을 특징으로 하는 인라인식 처리장치.According to any one of claims 1 to 3, wherein the conveying line is the same diameter in the axial direction so that the discontinuous type chuck and the front surface is in contact with the back surface of the substrate and the portion in contact with the back surface of the substrate is axially distanced. In-line processing apparatus characterized in that the hybrid with the continuous continuous chuck.
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