KR20040070870A - 고휘도 백색 발광 소자 - Google Patents
고휘도 백색 발광 소자 Download PDFInfo
- Publication number
- KR20040070870A KR20040070870A KR1020030007084A KR20030007084A KR20040070870A KR 20040070870 A KR20040070870 A KR 20040070870A KR 1020030007084 A KR1020030007084 A KR 1020030007084A KR 20030007084 A KR20030007084 A KR 20030007084A KR 20040070870 A KR20040070870 A KR 20040070870A
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- emitting diode
- white light
- phosphor
- diode chip
- Prior art date
Links
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K7/00—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves
- F16K7/12—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm
- F16K7/14—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat
- F16K7/17—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat the diaphragm being actuated by fluid pressure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K27/00—Construction of housing; Use of materials therefor
- F16K27/02—Construction of housing; Use of materials therefor of lift valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/12—Actuating devices; Operating means; Releasing devices actuated by fluid
- F16K31/126—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a diaphragm, bellows, or the like
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (3)
- 파장 범위 400nm∼200nm의 빛을 발광하는 적어도 하나의 자외선 발광 다이오드 칩과.파장 범위 480nm∼401nm의 빛을 발광하는 적어도 하나의 청색 발광 다이오드 칩과,상기 자외선 발광 다이오드 칩과 청색 발광 다이오드 칩 위에 도포되어, 상기 자외선 발광 다이오드 칩과 청색 발광 다이오드 칩에서 방출되는 빛을 백색광으로 변환시키는 형광체를 포함하는 고휘도 백색 발광 소자.
- 제1항에 있어서,상기 형광체가 파장범위 200nm~500nm 내의 빛을 여기광으로 사용하는 것을 특징으로 하는 고휘도 백색 발광 소자.
- 제2항에 있어서,상기 형광체가 (Sr,Ba)2SiO4:Eu, Mg4(F)GeO6:Mn4+, Sr4Al4O25:Eu2+, BaMg2Al16O27:Eu2+, Y2O2S:Eu, SBO:Eu 및 YAG 중에서 선택되는 것을 특징으로 하는 고휘도 백색 발광 소자.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0007084A KR100529591B1 (ko) | 2003-02-05 | 2003-02-05 | 고휘도 백색 발광 소자 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0007084A KR100529591B1 (ko) | 2003-02-05 | 2003-02-05 | 고휘도 백색 발광 소자 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20030003317U Division KR200312452Y1 (ko) | 2003-02-05 | 2003-02-05 | 고휘도 백색 발광 소자 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040070870A true KR20040070870A (ko) | 2004-08-11 |
KR100529591B1 KR100529591B1 (ko) | 2005-11-17 |
Family
ID=37359083
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2003-0007084A KR100529591B1 (ko) | 2003-02-05 | 2003-02-05 | 고휘도 백색 발광 소자 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100529591B1 (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100687417B1 (ko) * | 2006-11-17 | 2007-02-27 | 엘지이노텍 주식회사 | 형광체의 제조방법 |
WO2008026851A1 (en) * | 2006-08-29 | 2008-03-06 | Seoul Semiconductor Co., Ltd. | Light emitting device |
WO2017105143A1 (ko) * | 2015-12-18 | 2017-06-22 | 엘지이노텍 주식회사 | 형광체 및 이를 구비한 발광 소자 |
KR20180136727A (ko) * | 2017-06-15 | 2018-12-26 | 엘지이노텍 주식회사 | 조명 모듈 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI479641B (zh) | 2010-09-20 | 2015-04-01 | 英特明光能股份有限公司 | 發光元件及其製作方法 |
KR102273653B1 (ko) * | 2014-08-29 | 2021-07-06 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
KR102256594B1 (ko) * | 2014-10-07 | 2021-05-26 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
-
2003
- 2003-02-05 KR KR10-2003-0007084A patent/KR100529591B1/ko active IP Right Grant
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008026851A1 (en) * | 2006-08-29 | 2008-03-06 | Seoul Semiconductor Co., Ltd. | Light emitting device |
KR100687417B1 (ko) * | 2006-11-17 | 2007-02-27 | 엘지이노텍 주식회사 | 형광체의 제조방법 |
WO2017105143A1 (ko) * | 2015-12-18 | 2017-06-22 | 엘지이노텍 주식회사 | 형광체 및 이를 구비한 발광 소자 |
KR20170073350A (ko) * | 2015-12-18 | 2017-06-28 | 엘지이노텍 주식회사 | 형광체 및 이를 구비한 발광 소자 |
US10336936B2 (en) | 2015-12-18 | 2019-07-02 | Lg Innotek Co., Ltd. | Phosphor and light emitting device having the same |
KR20180136727A (ko) * | 2017-06-15 | 2018-12-26 | 엘지이노텍 주식회사 | 조명 모듈 |
Also Published As
Publication number | Publication date |
---|---|
KR100529591B1 (ko) | 2005-11-17 |
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