KR20040063026A - Alloy that there is no lead ingredient for soldering - Google Patents
Alloy that there is no lead ingredient for soldering Download PDFInfo
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- KR20040063026A KR20040063026A KR1020030000427A KR20030000427A KR20040063026A KR 20040063026 A KR20040063026 A KR 20040063026A KR 1020030000427 A KR1020030000427 A KR 1020030000427A KR 20030000427 A KR20030000427 A KR 20030000427A KR 20040063026 A KR20040063026 A KR 20040063026A
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- Prior art keywords
- soldering
- lead
- free alloy
- alloy
- solder
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Abstract
Description
본 발명은 전기, 전자제품의 생산시 각종 부품을 기판에 고정시키는 납땜(솔다링)공정에서 사용되는 납땜용 무연합금에 관한 것으로, 더욱 상세하게는 인체에 유해한 납(Pb)을 함유하지 않는 것은 물론, 솔다링 공정용해온도를 낮추고, 솔다(solder)의 표면 젖음성을 향상 시킨 Sn-Cu-In의 3원계 납땜용 무연합금에 관한 것이다.The present invention relates to a lead-free alloy for soldering used in the soldering (solaring) process for fixing various components to the substrate in the production of electrical and electronic products, more specifically, it does not contain lead (Pb) harmful to the human body Of course, the present invention relates to a Sn-Cu-In lead-free solder for lowering the melting temperature of the soldering process and improving the surface wettability of the solder.
일반적으로 종래에는 각종 전기, 전자제품의 부품을 기판에 접합고정시키는데 Sn-Pb계 땜납이 가장 많이 사용되어왔다.In general, Sn-Pb-based solders have been most commonly used for bonding and fixing components of various electrical and electronic products to a substrate.
이러한 종래의 땜납은 인쇄회로기판에 탑재된 전자부품 등의 솔다링(soldering) 부위에 균열이 발생하게 되고 산화물이 많이 발생되어 냉땜, 쇼트의 주원인이 되었으며, 이로인해 전자제품등 인쇄회로기판의 신뢰성이 저하되었다.Such conventional solders cause cracks in soldering parts of electronic parts and the like mounted on a printed circuit board, and a lot of oxides are generated, which is a major cause of cold soldering and shorts, and thus reliability of printed circuit boards such as electronic products. This was degraded.
뿐만 아니라, 땜납에 포함된 납(Pb)은 인체에 매우 유해할 뿐 만 아니라 환경오염을 일으키는 환경오염물질이어서 인체를 보호하고 환경오염을 방지하는 차원에서 EU 및 선진국가에서는 납(Pb)의 사용을 전면 금지하고자 이에 대한 법제화가활발하게 진행되고 있는 실정이다.In addition, lead (Pb) contained in the solder is not only very harmful to the human body but also causes environmental pollution. Therefore, the lead and lead countries in the EU and developed countries do not use lead (Pb) in order to protect the human body and prevent environmental pollution. In order to prohibit all, legislation is actively progressing.
이와같은 움직임은 기타 주변국가에도 급속도로 파급되고 있으며, 이에 따라 납이 포함되지 않는 납땜용 무연합금에 관한 연구가 활발히 진행되고 있는 것은 물론이고 실제로 여러가지 계열의 납땜용 무연합금이 개발되어 안출되었다.This movement is rapidly spreading to other neighboring countries. Accordingly, research on lead-free solders containing no lead is being actively conducted, and various lead-free alloys for soldering have been developed.
또한, 인쇄회로기판에 솔다링시 공정용해온도가 낮고, 표면의 젖음성이 불량하게 되면 솔다 냉땜이 발생하게 된다.In addition, when soldering a printed circuit board, when the process melting temperature is low and the surface wettability is poor, solder cold soldering occurs.
이와같은 솔다 냉땜의 원인으로는 도금불량, 산화물, 솔다들뜸, 인쇄불량, 탑재품의 삐틀어짐 솔다의 순도저하 등의 여러가지 가변적인 발생요소가 있겠지만, 그러한 가변적인 발생요소의 문제가 없다고 가정한다면 공정용해 온도를 낮추고, 솔다 젖음성을 향상 시키는 것이 중요하다.The causes of such cold soldering may be various variable factors such as poor plating, oxide, solder lifting, printing defects, twist of payload, and so on. It is important to lower the temperature and improve the wettability of the soda.
따라서, 이와같이 공정용해온도를 낮추고 솔다 젖음성이 우수한 고품질의 신뢰성이 요구되는 납땜용 무연합금의 개발이 절실히 요구되었다.Therefore, there is an urgent need for the development of lead-free alloys for soldering, which require low process melting temperatures and high quality reliability with excellent solder wettability.
본 발명은 상기와 같은 시대적 요구에 부응하고자 안출한 것으로, 전자제품등의 인쇄회로기판에 전자부품을 탑재시 사용되는 솔다링 공정에서 Sn-Cu에 인듐(In) 원소를 첨가하여서된 Sn-Cu-In 3원계 납땜용 무연합금을 제조함으로써,The present invention has been made to meet the demands of the times, Sn-Cu by adding an indium (In) element to Sn-Cu in the soldering process used when mounting electronic components on printed circuit boards, such as electronic products -In lead-free solder for ternary soldering,
납을 함유하지 않아 납으로부터 발생하는 피해를 방지하여 주고, 제4원소를 첨가하지 않고서도 3원소 만으로도 충분히 공정용해온도를 낮추고 솔다 젖음성이 우수한 고품질 고품격의 인체에 무해한 납땜용 무연합금을 제공하고자 함에 그 목적을 둔 것이다.Since it does not contain lead, it prevents damage from lead, and even without adding 4th element, it lowers process dissolution temperature sufficiently with only 3 elements and provides high quality and high quality lead-free solder that is harmless to human body. The purpose is to.
상기와 같은 목적을 달성하기 위한 본 발명을 실시예에 의해 상세히 설명하면 다음과 같다.When explaining the present invention in detail by the embodiment for achieving the above object as follows.
본 발명은 구성원소가 Sn-Cu 에 인듐(In)을 첨가하여서 제조된 Sn-Cu-In 3원계 납땜용 무연합금 조성물이다.The present invention is a lead-free alloy composition for soldering Sn-Cu-In ternary system produced by adding indium (In) to the Sn-Cu.
여기서 상기 Sn-Cu-In 3원계 납땜용 무연합금의 조성비는, 구리(Cu)는 1.0~2.5중량%이며, 인듐(In)은 0.001~1.5중량%이며, 나머지 잔량이 주석(Sn)으로 조성된 것이다.Here, the composition ratio of the lead-free alloy for Sn-Cu-In ternary soldering is copper (Cu) is 1.0 to 2.5% by weight, indium (In) is 0.001 to 1.5% by weight, the remaining amount is composed of tin (Sn) It is.
상기와 같은 화학조성으로 합금시킨 본 발명의 Sn-Ag-In 3원계 납땜용 무연합금은 공정용해온도를 227℃ 이하로 낮추고, 솔다 젖음성을 높임으로써 솔더빌리티를 향상 시킬 수가 있으며, 인쇄회로기판에 탑재된 전자부품을 솔다링시 인쇄회로기판과 탑재된 전자부품의 솔다열충격으로 인한 손상을 최소화 할 수가 있기 때문에 솔다 냉땜을 감소시킴으로써 전자제품의 사용수명을 연장 시킬 수가 있는 것이다.The lead-free alloy for Sn-Ag-In ternary solder of the present invention alloyed with the above chemical composition lowers the process dissolution temperature to 227 ° C or lower, and improves solder wettability, thereby improving solderability on printed circuit boards. When soldering the mounted electronic components, the damage caused by the thermal shock of the printed circuit board and the mounted electronic components can be minimized, thereby reducing the solder cold soldering, thereby extending the service life of the electronic products.
또한, 종래의 솔다링 작업시 발생하는 납의 증발로 인한 인체에 치명적인 손상을 방지 할 수가 있어서 환경친화적인 것이다.In addition, it is environmentally friendly to prevent damage to the human body caused by the evaporation of lead generated during the conventional soldering operation.
상기와 같은 화학조성으로 합금시킨 본 발명의 Sn-Cu-In 3원계 납땜용 무연합금은 종래의 땜납(화학조성이 Sn:62~64중량%, Pb:35.784중량%이상, Sb:0.10중량%이하, Cu:0.03중량%이하, Bi:0.03중량%이하, Zn:0.002중량%이하, Fe:0,02중량%이하, Al:0.002중량%이하)을 비교예로 하여 솔다링 부위의 균열발생율과, 인장강도,젖음성, 산화량을 비교시험한 결과 아래표와 같은 결론을 얻을 수가 있었다.The lead-free alloy for Sn-Cu-In ternary soldering of the present invention alloyed with the above chemical composition is conventional solder (chemical composition: Sn: 62-64 wt%, Pb: 35.784 wt% or more, Sb: 0.10 wt% Cu: 0.03% or less, Bi: 0.03% or less, Zn: 0.002% or less, Fe: 0.02% or less, Al: 0.002% or less) as a comparative example. As a result of comparing the tensile strength, the wettability, and the amount of oxidation, the following conclusions were obtained.
상기와 같이 본 발명의 Sn-Cu-In 3원계 납땜용 무연합금은 비교예에 의한 종래의 땜납과 비교할때,As described above, the lead-free alloy for Sn-Cu-In ternary solder of the present invention is compared with the conventional solder according to the comparative example,
솔다링 부위의 균열발생율 비교실험에 있어서는, 본 발명의 납땜용 무연합금은 2.5%인데 비해 비교예는 무려 40%로서 본 발명의 납땜용 무연합금이 솔다링 부위의 균열발생율이 적은 것을 알 수 있다.In the comparative experiment of crack incidence of the soldering portion, the lead-free alloy for soldering of the present invention was 2.5%, while the comparative example was as much as 40%, indicating that the lead-free alloy for soldering of the present invention had a small cracking rate of the soldering portion. .
그리고 상온 20℃에서 행해진 인장강도의 비교실험에 있어서는, 본 발명의 납땜용 무연합금은 인장강도가 6.5㎏/㎟인데 비해 비교예는 4.8㎏/㎟ 밖에 안되는 것으로서 본 발명의 납땜용 무연합금이 인장강도가 훨씬 강한 것을 알 수 있다.In the comparative experiment of tensile strength at 20 ° C., the lead-free alloy for soldering of the present invention had a tensile strength of 6.5 kg / mm 2, while the comparative example had only 4.8 kg / mm 2. It can be seen that the strength is much stronger.
또한, 227℃에서 행해진 젖음성의 비교실험에 있어서는, 본 발명의 납땜용 무연합금은 약 2.4초에 젖음에 비해 비교예는 4.0초인 것으로서 본 발명의 납땜용 무연합금의 젖음성이 훨씬 좋은 것을 알 수 있다.In addition, in the comparative experiments of the wettability performed at 227 ° C, the lead-free alloy for soldering of the present invention was about 4.0 seconds compared to the wettability in about 2.4 seconds, and it can be seen that the wettability of the lead-free alloy for soldering of the present invention was much better. .
한편, 산화량의 비교실험에 있어서는, 본 발명의 납땜용 무연합금을 비교예와 비교할때 약 1/3정도 밖에 산화물이 발생하지 않게 되는 것으로서 본 발명의 납땜용 무연합금은 산화량이 적어서 소모량을 줄여주고 납땜불량이 매우 적은 것을 알 수 있다.On the other hand, in the comparative experiment of the amount of oxidation, the lead-free alloy for soldering of the present invention produces only about one third of the oxide as compared with the comparative example, and the lead-free alloy for soldering of the present invention is less oxidized, thus reducing the consumption. It can be seen that the soldering defect is very low.
상기와 같은 본 발명의 Sn-Cu-In 3원계 납땜용 무연합금은 제4의 원소를 첨가하지 않고서도 공정용해온도를 227℃까지 낮추어주고 솔다 젖음성을 향상 시켜줌으로써 인쇄회로기판과 탑재된 전자부품의 솔다 열충격으로 인한 손상을 감소 시킬수가 있어서 전자제품의 사용수명을 연장 시킬 수가 있다.The lead-free alloy for Sn-Cu-In ternary solder of the present invention as described above reduces the process melting temperature to 227 ° C. and improves solder wettability without adding a fourth element, thereby improving printed circuit boards and mounted electronic components. Solder can reduce damage due to thermal shock, prolonging the service life of the electronics.
또한, 납을 전혀 함유하지 않았기 때문에 솔다링 작업시 납 가스 중독에 의한 환경적인 악영향을 받지 않게됨으로써 환경친화적이어서 안심하고 작업에 임할 수 있는 등의 여러가지 효과가 있는 매우 획기적인 발명이다.In addition, since it does not contain any lead, it is a very innovative invention with various effects, such as being environmentally friendly and working on the work in peace, by not being adversely affected by lead gas poisoning during the soldering operation.
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| KR1020030000427A KR20040063026A (en) | 2003-01-04 | 2003-01-04 | Alloy that there is no lead ingredient for soldering |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100754710B1 (en) * | 2000-09-14 | 2007-09-03 | 삼성전자주식회사 | Method and system for registering/deleting standard short-message in private wire/wireless switching system |
| CN101812613A (en) * | 2010-05-20 | 2010-08-25 | 广州市安达汽车零件有限公司 | Bearing bush antifriction layer |
-
2003
- 2003-01-04 KR KR1020030000427A patent/KR20040063026A/en not_active Application Discontinuation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100754710B1 (en) * | 2000-09-14 | 2007-09-03 | 삼성전자주식회사 | Method and system for registering/deleting standard short-message in private wire/wireless switching system |
| CN101812613A (en) * | 2010-05-20 | 2010-08-25 | 广州市安达汽车零件有限公司 | Bearing bush antifriction layer |
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