KR20040061524A - Apparatus for measuring temperature of device in semiconductor device test handler - Google Patents

Abstract

PURPOSE: An apparatus for measuring the temperature of a test handler of a semiconductor device is provided to transfer the heat of a semiconductor device to be tested to a control unit of a heat generation compensating apparatus by making a temperature sensor directly contact the surface of the semiconductor device regardless of the kind of the semiconductor device and by precisely detecting the temperature of the semiconductor device. CONSTITUTION: A temperature detecting unit is installed in a through hole(36) of a push member(35) so that one end of the temperature detecting unit is exposed to the outside of the through hole of the push member. A control unit controls the injection of cooling fluid through a nozzle assembly according to a temperature value transferred from the temperature detecting unit, electrically connected to the temperature detecting unit.

Description

Apparatus for measuring temperature of device in semiconductor device test handler

The present invention relates to a device for measuring the temperature of a semiconductor device in a handler for testing a semiconductor device, and in particular, when performing a temperature test of a semiconductor device by operating a heat compensation device that compensates for a temperature deviation of the semiconductor device under test. The present invention relates to a device temperature measuring device of a semiconductor device test handler capable of accurately measuring the temperature of a semiconductor device under test and transferring the same to a control unit that controls the operation of the heating compensation device.

In general, memory or non-memory semiconductor devices and modules that are appropriately structured on a single substrate are shipped after various tests after production, and handlers automatically process semiconductor devices and modules in such a test process. As a device used to test and transfer a semiconductor device or module to a loading stacker, the picker robot transfers the semiconductor device or module to be tested to a test site and performs a predetermined test. Then, the picker robot transfers the tested semiconductor devices or modules to the unloading stacker and classifies the test results in a designated tray.

In general, many of these handlers not only perform general performance tests at room temperature, but also create high temperature and low temperature extremes in an enclosed chamber through electrothermal heaters and liquefied nitrogen injection systems so that semiconductor devices and modules are subjected to such extreme temperatures. It is also configured to perform high and low temperature tests, which test whether they can perform normal functions under conditions.

However, in performing the test in the handler capable of the temperature test of the semiconductor device as described above, there is a heat generation phenomenon in which predetermined heat is generated in the semiconductor device itself during the test by electrically connecting the semiconductor device to the test socket. As a result, the test may not be performed at the exact temperature desired by the user. This phenomenon is intensified according to the recent trend of miniaturization and high integration of semiconductor devices, and is emerging as a problem that must be solved in a test and actual use environment.

For example, if the user performs the test by setting the temperature inside the chamber to 80 ° C. during the high temperature test, if the semiconductor device itself does not generate heat, it is possible to test at the set test temperature of 80 ° C. However, heat is generated in the semiconductor device during the test. If the temperature deviation is about 15 ℃, the actual test will be made at 95 ℃.

Therefore, the semiconductor devices are tested at a temperature higher than the set test temperature, and thus, the test is not performed within the correct temperature range, thereby causing a problem in yield and reliability.

Recently, in order to solve the temperature deviation problem caused by the self-heating of the device, a heating compensation device for spraying a certain amount of cooling fluid directly from the rear side of the semiconductor device under test has been developed.

However, in order for the heat compensation device to function properly, the temperature of the semiconductor device under test must be accurately measured and transferred to a control unit that controls the operation of the heat compensation device. The type of semiconductor device to be tested is a leaded device such as SOP or QFP. In the case of the BGA type semiconductor device, the ball acts as a lead when the temperature sensor of the semiconductor device is easily and accurately detected by installing a temperature sensor in contact with the lower surface of the semiconductor device near the test socket. Since it is located on the bottom surface, it is difficult to install a temperature sensor on the test socket side, and thus there is a problem that accurate temperature measurement cannot be performed.

Accordingly, the present invention has been made to solve the above problems, irrespective of the type of semiconductor device to be tested, the temperature sensor is directly in contact with the surface of the semiconductor device under test to accurately detect the temperature of the device to control the heating compensation device It is an object of the present invention to provide a device temperature measuring device of a semiconductor device test handler which can be transferred to a unit.

1 is a cross-sectional view showing a main portion of a test site of a handler to which a device temperature measuring device according to the present invention is applied;

FIG. 2 is a block diagram schematically illustrating a configuration of a heat compensation device of the handler of FIG. 1.

Figure 3 is a partial cutaway perspective view showing a part cut to show the configuration of the main part of the device temperature measuring apparatus of the present invention

Explanation of symbols on the main parts of the drawings

10: test chamber 20: test board

25: test socket 30: push unit

35: push member 36: through hole

40: carrier 56: nozzle assembly

100: temperature sensing unit 101: sensor holder

102: temperature sensor 103: compression coil spring

200: control unit T: test tray

S: semiconductor element

In order to achieve the above object, the present invention provides a test in which a sealed chamber, a means for bringing the inside of the chamber into a predetermined temperature state of low temperature and high temperature, and a plurality of test sockets to which semiconductor elements are connected and tested are installed. A board, a push unit which is installed in the chamber so as to be moved forward and backward and connects the semiconductor elements to each test socket of the test board, and is formed to protrude from the push unit, and a through hole is formed at the center thereof to form each semiconductor element of the test tray. A handler comprising a plurality of push members for pushing the nozzle and a nozzle assembly for injecting a cooling fluid toward the semiconductor device through the through holes of the push member, wherein the push member is exposed so that one end is exposed to the outside of the through hole of the push member. Is fixedly installed in the through hole of the push member when the A temperature sensing unit contacting the semiconductor element to detect a temperature of the semiconductor element; An apparatus temperature measuring device of a semiconductor device test handler, comprising a control unit electrically connected to the temperature sensing unit to control injection of a cooling fluid through the nozzle assembly according to a temperature value transmitted from the temperature sensing unit. To provide.

Hereinafter, a preferred embodiment of a device temperature measuring device of a semiconductor device test handler according to the present invention will be described in detail with reference to the accompanying drawings.

1 and 2 are views for explaining the configuration of the handler and the heating compensation device to which the device temperature measuring apparatus of the present invention is applied, and FIG. 3 is a view for explaining the structure of the device temperature measuring apparatus of the present invention.

First, as illustrated in FIG. 1, a test board 20 in which a plurality of test sockets 25 are arranged is installed in a test chamber 10 that is installed to be sealed behind a handler, and inside the test chamber 10. A push unit 30 for connecting the semiconductor elements S mounted on the carrier 40 of the test tray T to the test socket 25 is installed to be able to move back and forth.

In the push unit 30, the same number of push members 35 as the number of semiconductor elements mounted on the test tray T are formed to protrude toward the test board 20, and the push member 35 is formed at the center of the push unit 35. The through hole 36 is formed.

The nozzle unit receives a cooling fluid mixed with liquefied nitrogen and dry air from the outside into the push unit 30 and sprays the semiconductor element S under test through the through holes 36 of the push members 35. Assembly 56 is installed.

On the other hand, Figure 2 is a view for explaining the configuration of the heating compensation device for correcting the temperature deviation of the semiconductor device by spraying a cooling fluid to the semiconductor device through the nozzle assembly 56 during the temperature test, the heating compensation device is a liquid nitrogen ( Liquefied nitrogen source 51 for supplying LN2), dry air source 52 for supplying dry air, and liquefied nitrogen and dry air source 52 supplied from liquefied nitrogen source 51. And a mixer 53 for mixing and supplying the mixture to the nozzle assembly 56, and controlling the supply of liquid nitrogen and dry air from the liquefied nitrogen supply source 51 and the dry air supply source 52 to the mixer 53. It consists of two control valves 54 and 55.

The operation of the first and second control valves 54 and 55 is controlled by the control unit 200, and the control unit 200 is electrically connected to the temperature sensing unit 100 installed in the push member 35. Connected to control the operation of the first and second control valves 54 and 55 based on temperature information transmitted by the temperature sensing unit 100 in real time.

As shown in FIG. 3, the temperature sensing unit 100 is installed in the sensor holder 101 fixed inside the through hole 36 of the push member 35 and movable in a predetermined amount in the sensor holder 101. And a bar-shaped temperature sensor 102 whose one end is exposed to the outside of the through hole 36, and one end of which is supported by the sensor holder 101 and the other end of which is supported by the stop of the temperature sensor 102. The compression coil spring 103 is inserted into the sensor 102 and elastically supports the temperature sensor 102 with respect to the sensor holder 101. Reference numeral 104 is a stopper for limiting the movement of the temperature sensor 102 to prevent the temperature sensor 102 from being separated from the sensor holder 101.

In FIG. 3, the reference numeral 40 denotes a carrier for fixing the semiconductor element on the test tray T (see FIG. 1), and the carrier 40 may release the semiconductor element and the body 41 having the induction hole 42 at the center thereof. It consists of a pair of latches 43 (latch) that are securely fixed.

The device temperature measuring device of the present invention configured as described above operates as follows.

When the operation of the handler is started, the interior of the test chamber 10 is brought to a predetermined temperature by its cooling means (not shown) and heating means (not shown), and then the test tray T on which the semiconductor elements are mounted is It is drawn into the test chamber 10 and is aligned between the test board 20 and the push unit 30.

When the alignment between the test tray T and the push unit 30 is performed, the push unit 30 moves backward so that each push member 35 moves the carriers 40 of the test tray T to the test board 20. Then, the semiconductor element S mounted on each carrier 40 is connected to the test socket 25 of the test board 20 to start the test.

When the push member 35 pushes the carrier 40 and connects it to the test socket 25 as described above, the temperature sensor 102 of the temperature sensing unit 100 has an induction hole 42 formed in the center of the carrier 40. By contacting the back surface of the semiconductor device (S not formed) through the), the temperature sensor 102 transmits the temperature of the semiconductor device to the control unit 200 in real time during the test.

In addition, the control unit 200 controls the first and second control valves 54 and 55 based on the temperature information transmitted by the temperature sensor 102 as described above to supply the liquid nitrogen and dry air to the mixer 53. The cooling fluid is injected into the semiconductor device S through the nozzle assembly 56 so that the temperature of the semiconductor device is in a desired state.

On the other hand, since the temperature sensor 102 is movably installed in the sensor holder 101 and is supported by the compression coil spring 103, the temperature sensor 102 is pushed backward when the temperature sensor 102 comes into contact with the semiconductor element S. Since the compression coil spring 103 is compressed, the impact caused by the contact between the end of the temperature sensor 102 and the semiconductor device S may be alleviated.

Thus, according to the present invention, since the temperature sensor can measure the temperature while directly contacting the back surface of the semiconductor device under test, that is, in the case of the BGA type semiconductor device, the ball is not formed, the type of semiconductor device to be tested Regardless, the temperature measurement can be made easily and accurately, so that the heat compensation device can perform an accurate function, thereby improving test reliability.

Claims (3)

A sealed board, means for bringing the inside of the chamber into a predetermined temperature state at a low temperature and a high temperature, a test board having a plurality of test sockets to which semiconductor elements are connected and tested, and installed in the chamber so as to be movable forward and backward And a push unit for connecting semiconductor elements to each test socket of the test board, a plurality of push members formed to protrude from the push unit and having a through hole formed at the center to push each semiconductor element of the test tray, and the push member. In the handler comprising a nozzle assembly for injecting a cooling fluid toward the semiconductor element through the through hole of, A temperature sensing unit installed in the through hole of the push member so that one end thereof is exposed to the outside of the through hole of the push member, the temperature sensing unit detecting the temperature of the semiconductor element by contacting the semiconductor element when the push member pushes the semiconductor element; An apparatus temperature measuring device of a semiconductor device test handler, comprising a control unit electrically connected to the temperature sensing unit to control injection of a cooling fluid through the nozzle assembly according to a temperature value transmitted from the temperature sensing unit. . The method of claim 1, wherein the temperature sensing unit is a bracket that is fixedly installed in the through hole of the push member, the bar shape is provided to be movable in a certain amount on the bracket and one end thereof is exposed to the outside of the through hole in contact with the semiconductor element And a temperature sensor, and an elastic member elastically supporting the temperature sensor with respect to the bracket. The device temperature measuring apparatus of claim 2, wherein the elastic member is a compression coil spring inserted into a temperature sensor so that one end thereof is supported by one side of the bracket and the other end thereof is supported by a temperature sensor. .