KR20040059253A - Alignment Mark Key with Convex and Concave Parts - Google Patents

Alignment Mark Key with Convex and Concave Parts Download PDF

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Publication number
KR20040059253A
KR20040059253A KR1020020085840A KR20020085840A KR20040059253A KR 20040059253 A KR20040059253 A KR 20040059253A KR 1020020085840 A KR1020020085840 A KR 1020020085840A KR 20020085840 A KR20020085840 A KR 20020085840A KR 20040059253 A KR20040059253 A KR 20040059253A
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South Korea
Prior art keywords
alignment mark
convex
key
alignment
search
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KR1020020085840A
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Korean (ko)
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김형원
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동부전자 주식회사
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Priority to KR1020020085840A priority Critical patent/KR20040059253A/en
Publication of KR20040059253A publication Critical patent/KR20040059253A/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • G03F9/7076Mark details, e.g. phase grating mark, temporary mark
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54426Marks applied to semiconductor devices or parts for alignment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: An alignment mark key is provided to reduce search error by enhancing the strength of an optical signal using a search key with convex or concave portions. CONSTITUTION: An alignment mark structure is used for alignment in an exposure process. The alignment mark structure includes a plurality of alignment mark keys(31). One alignment mark key as a search key includes a plurality of convex or concave portions(A). A flat portion(B) is between the convex or concave portions. The convex or concave portions are spaced apart from each other.

Description

다수의 요철이 형성된 정렬마크 키{Alignment Mark Key with Convex and Concave Parts}Alignment Mark Key with Convex and Concave Parts}

본 발명은 반도체소자의 제조에 관한 것으로, 상세하게는 반도체 제조공정의 노광공정에서 정렬(Alignment)하는 데 사용되는 서치마크의 서치신호의 강도를 크게 하기 위한 서치마크의 구조에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture of semiconductor devices, and more particularly, to a structure of a search mark for increasing the intensity of a search signal of a search mark used for alignment in an exposure process of a semiconductor manufacturing process.

반도체를 제조할 경우 보통 15~20회 정도의 노광공정이 반복되는 데, 각각의공정에서 마스크(레티클)와 웨이퍼의 고도의 정렬 및 중첩정밀도가 요구된다. 정렬 및 중첩정밀도란 웨이퍼의 기존회로 패턴에 대해 다음 공정의 회로패턴을 노광할 경우 회로패턴을 얼마나 정확하게 투영할 수 있는가를 나타낸 성능으로서, 일반적으로 노광장치의 정렬마크(alignment mark)와 웨이퍼 스테이지의 정밀도를 이용하여 구현된다.When manufacturing a semiconductor, the exposure process is usually repeated about 15 to 20 times, and each process requires a high degree of alignment and overlapping accuracy of the mask (reticle) and the wafer. Alignment and superposition precision is the performance that shows how accurately the circuit pattern can be projected when the circuit pattern of the next process is exposed to the existing circuit pattern of the wafer. In general, the alignment mark of the exposure apparatus and the precision of the wafer stage It is implemented using.

스테퍼(stepper)에서 정렬마크를 이용하여 웨이퍼를 서치하는 장치로는 다음의 2가지가 주로 사용된다.As a device for searching a wafer using an alignment mark in a stepper, the following two are mainly used.

첫째, LSA(Laser Step Alignment)장치는 웨이퍼에 새겨진 정렬마크를 인식하는 장치의 하나로, He-Ne 레이저를 프로젝션 렌즈(projection lens)를 통과시켜 정렬마크에서 반사되는 빛 중에서 1차 회절광을 신호처리하여 마크센터를 찾는 장치이다.Firstly, the Laser Step Alignment (LSA) device is a device that recognizes alignment marks engraved on a wafer. The He-Ne laser passes a projection lens to signal the first diffracted light from the light reflected from the alignment mark. Device to find the mark center.

둘째, FIA(Field Image Alignment)장치는 광대역광, 예를들어 할로겐램프를 이용하여 웨이퍼로부터 반사되는 이미지신호를 받고, 기준인덱스에 기초한 비교를 통해 정렬마크를 인식하는 장치로서, 거친 정렬마크의 서치에 유리한 장치이다.Second, the FIA (Field Image Alignment) device receives an image signal reflected from a wafer by using broadband light, for example, a halogen lamp, and recognizes the alignment mark through comparison based on a reference index. It is an advantageous device.

이러한 정렬마크 서치장치는 웨이퍼상에 새겨진 정렬마크 또는 서치마크를 이용하여 서치를 한다.Such an alignment mark search apparatus searches by using an alignment mark or a search mark engraved on a wafer.

도1은 정렬마크의 일반적 구조를 도시하고 있다. 도1에 도시된 바와같이, 종래 스태퍼의 정렬마크는 마스크상에 크롬(Crome) 유무로 형성되는 다수의 키(11)들로 구성되며, 키(11)의 형태는 오목 형상의 클리어키(Clear Key) 또는 볼록 형상의 다크키(Dark Key)가 있다.1 shows the general structure of an alignment mark. As shown in Figure 1, the alignment mark of the conventional stepper is composed of a plurality of keys (11) formed on the mask with or without chrome (chrome), the shape of the key 11 is a concave shaped clear key ( Clear Key) or Convex Dark Key.

도2a는 정렬마크를 스캐닝할 경우에 나타나는 신호를 도시하고 있다. 도2a에 도시된 바와같이, 정렬마크의 각 키(11)에서 반사되는 신호의 패턴을 감지함으로써, 정렬마크의 서치가 이루어진다. 그런데, 네모난 패턴이 균일하게 배렬되어 있는 정렬마크 구조에서, 정상적인 서치를 할 경우에는 서치신호가 도2a와 같이 신호의 구별이 확실하고 강도도 크게 나타나서 서치마크의 서치가 용이하지만, 서치마크 주변의 패턴이 서치마크에 너무 가까이 배치되는 경우 등에는 주변 패턴의 노이즈 신호가 함께 서치장치에 의해 감지되고, 이는 도2b에서와 같이 서치마크의 신호강도를 상대적으로 약화시켜, 서치를 어렵게 만들게 된다. 이러한 문제는, 서치의 정확도를 떨어뜨려 서치에러를 유발하는 원인이 되고 있다.Fig. 2A shows a signal appearing when scanning an alignment mark. As shown in Fig. 2A, the alignment mark is searched by detecting the pattern of the signal reflected from each key 11 of the alignment mark. However, in the alignment mark structure in which the square patterns are arranged uniformly, when the normal search is performed, the search signal is clearly distinguished and the intensity is large as shown in FIG. 2A. If the pattern is arranged too close to the search mark, the noise signal of the surrounding pattern is also detected by the search apparatus, which relatively weakens the signal strength of the search mark as shown in FIG. 2B, making the search difficult. Such a problem causes the search accuracy to drop, causing a search error.

본 발명은 이러한 문제를 해결하기 위한 것으로, 서치마크에서 반사되어 검출되는 회전신호의 강도를 크게 함으로써, 노광공정에서 정렬마크의 서치에러를 감소시키는 것을 목적으로 한다.The present invention has been made to solve such a problem, and aims to reduce the search error of the alignment mark in the exposure process by increasing the intensity of the rotation signal reflected and detected by the search mark.

도1은 정렬마크의 일반적 구조의 평면도,1 is a plan view of a general structure of an alignment mark;

도2a는 정상적 정렬마크를 스캐닝할 경우에 나타나는 신호,Figure 2a is a signal appearing when scanning the normal alignment mark,

도2b는 주변 패턴에 의하여 상대적으로 강도가 감소된 정렬마크의 신호, 그리고2b shows a signal of an alignment mark whose intensity is relatively reduced by a peripheral pattern, and

도3은 본 발명에 따른 정렬마크의 구조를 도시하고 있다.3 shows the structure of an alignment mark according to the present invention.

- 도면의 주요부분에 대한 부호의 설명 --Explanation of symbols for the main parts of the drawings-

11: 종래의 정렬마크키 31: 개선된 정렬마크키11: conventional alignment mark key 31: improved alignment mark key

A : 볼록부 B : 오목부A: convex portion B: concave portion

이러한 목적을 달성하기 위하여 본 발명은 정렬마크를 구성하는 볼록 또는 오목 형상의 키에 격자 또는 바둑판 형태의 볼록 또는 오목 형상의 다수 요철부를 형성시켜 각 키로부터 반사되는 신호의 강도를 크게 할 수 있는 정렬마크의 구조를 제공한다.In order to achieve this object, the present invention provides an alignment that can increase the intensity of the signal reflected from each key by forming a plurality of convex or concave portions in the shape of lattice or checkerboard on the convex or concave keys constituting the alignment mark. Provide the structure of the mark.

이하, 첨부도면을 참조하여 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

도3은 본 발명에 따른 정렬마크의 구조를 도시하고 있다. 도3에 도시된 바와같이, 정렬마크의 하나의 키(31)에 격자형태 또는 바둑판 형태로 다수의 요철부가 형성되어 있다. 여기서, 요철부는 볼록 형상의 돌출부이거나, 또는 오목 형상의 함몰부로 구성될 수 있다. 정렬마크에서 반사되는 빛 중에서 1차 회절광을 신호처리하여 마크센터를 찾는 장치의 경우에 오목부분이나 볼록부분의 간격이 좁을수록 1차 회절광의 강도는 크게 된다. 이러한 원리를 이용하여, 도3의 확대도에서와 같이, 하나의 마크 키(31)에 다수의 요철부를 형성시켜 키(31) 내부에 형성된 다수의 요철부로부터 검출되는 1차회절광들이 중첩됨으로써, 하나의 키(31)에서 얻을 수 있는 1차 회절광의 전체신호의 강도는 증가된다.3 shows the structure of an alignment mark according to the present invention. As shown in Fig. 3, a plurality of irregularities are formed in one key 31 of the alignment mark in the form of a grid or a checkerboard. Here, the uneven portion may be a convex protrusion or a concave depression. In the case of a device for finding the mark center by signal processing the first diffracted light from the light reflected from the alignment mark, the narrower the gap between the concave portion and the convex portion, the greater the intensity of the first diffracted light. By using this principle, as shown in the enlarged view of FIG. 3, by forming a plurality of uneven portions in one mark key 31, the first diffraction light detected from the plurality of uneven portions formed inside the key 31 is superimposed. , The intensity of the entire signal of the first-order diffracted light obtained from one key 31 is increased.

요철부의 형상은 바둑판 형태로 구성된다. 그리고, 하나의 요철은 직사각형의 볼록부(A)와 평면부(B)로 구성되며, 볼록부(A)와 볼록부(A) 사이에 하나의 평면부(B)가 위치하도록 한다. 또한, 하나의 마크 키(31)에 포함되는 요철부의 수는 가능하면 많게 한다.The shape of the uneven portion is configured in the form of a checkerboard. And, one unevenness is composed of a rectangular convex portion (A) and a planar portion (B), so that one planar portion (B) is located between the convex portion (A) and the convex portion (A). In addition, the number of uneven parts contained in one mark key 31 is made as large as possible.

한편, 반사되는 신호를 직접 검출하는 방식에서는, 예를들어 볼록형태의 마크 키가 형성된 부분인 볼록부의 수직 반사광량을 크게 하고, 기저면을 형성하는 평면부의 수직 반사광량을 줄이는 구조를 선택할 수 있다. 이 경우, 평면부에 입사하는 광을 산란시키는 다수의 요철부를 평면부에 형성시켜 평면부의 검출광량을 상대적으로 감소시킨다. 그런데, 이 경우에는, 주변 패턴에 의하여 검출되는 신호의 이상 증가에 따른 서치 에러를 효과적으로 줄일 수는 없다. 따라서, 반사광을 이용하는 장치에서, 서치에러를 감소시키는 방법은 볼록부에 반사광량을 증가시키는 물질을 도포하는 방법 등을 이용할 필요가 있다.On the other hand, in the method of directly detecting the reflected signal, for example, the structure of increasing the vertical reflected light amount of the convex portion, which is a portion in which the convex mark key is formed, and reducing the amount of vertical reflected light of the planar portion forming the base surface can be selected. In this case, a large number of irregularities that scatter light incident on the plane portion is formed in the plane portion to relatively reduce the amount of detection light of the plane portion. In this case, however, the search error caused by an abnormal increase in the signal detected by the peripheral pattern cannot be effectively reduced. Therefore, in the apparatus using the reflected light, the method of reducing the search error needs to use a method of applying a substance that increases the amount of reflected light to the convex portion.

이러한 정렬마크 구조에 따르면, 서치마크에서 반사되어 검출되는 신호의 강도가 크게 되어, 다수의 공정이 수행되는 노광공정의 정렬공정의 정렬에러를 감소시킬 수 있다.According to the alignment mark structure, the intensity of the signal reflected and detected by the search mark is increased, thereby reducing the alignment error of the alignment process of the exposure process in which a plurality of processes are performed.

Claims (5)

반도체 제조공정의 노광공정에서 정렬(Alignment)하는 데 사용되는 정렬마크의 키 구조에 있어서,In the key structure of the alignment mark used to align in the exposure process of the semiconductor manufacturing process, 격자 형태로 배열되는 다수의 요철부를 포함하는 것을 특징으로 하는 요철이 형성된 정렬마크 키.Alignment mark key formed with irregularities, characterized in that it comprises a plurality of irregularities arranged in a grid form. 제1항에 있어서, 상기 요철부는According to claim 1, wherein the uneven portion 볼록부인 것을 특징으로 하는 요철이 형성된 정렬마크 키.Alignment mark key formed with irregularities, characterized in that the convex portion. 제1항에 있어서, 상기 요철부는According to claim 1, wherein the uneven portion 오목부인 것을 특징으로 하는 요철이 형성된 정렬마크 키.Alignment mark key formed with irregularities, characterized in that the recess. 제2항 또는 제3항에 있어서, 상기 요철부는According to claim 2 or 3, wherein the uneven portion 일정한 간격으로 이격되어 배열되는 것을 특징으로 하는 요철이 형성된 정렬마크 키.Alignment mark key formed with irregularities, characterized in that arranged at regular intervals apart. 제4항에 있어서, 상기 요철부는The method of claim 4, wherein the uneven portion 직육면체 형상인 것을 특징으로 하는 요철이 형성된 정렬마크 키.Alignment mark key formed with irregularities, characterized in that the rectangular parallelepiped shape.
KR1020020085840A 2002-12-28 2002-12-28 Alignment Mark Key with Convex and Concave Parts KR20040059253A (en)

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