KR20040052134A - Humidity sensor for a microwave oven - Google Patents
Humidity sensor for a microwave oven Download PDFInfo
- Publication number
- KR20040052134A KR20040052134A KR1020020079866A KR20020079866A KR20040052134A KR 20040052134 A KR20040052134 A KR 20040052134A KR 1020020079866 A KR1020020079866 A KR 1020020079866A KR 20020079866 A KR20020079866 A KR 20020079866A KR 20040052134 A KR20040052134 A KR 20040052134A
- Authority
- KR
- South Korea
- Prior art keywords
- humidity
- humidity sensor
- microwave oven
- electrode
- lower electrode
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/121—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid for determining moisture content, e.g. humidity, of the fluid
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/083—Oxides of refractory metals or yttrium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/125—Composition of the body, e.g. the composition of its sensitive layer
- G01N27/126—Composition of the body, e.g. the composition of its sensitive layer comprising organic polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
Description
본 발명은 습도센서에 관한 것으로, 보다 상세하게는 전극과 화학반응을 일으키지 않는 접합재료로 접합층을 구성하여, 증착시나 장기간 사용시에도 센서의 신뢰성이 일정하게 유지되도록 하는 전자렌지용 습도센서에 관한 것이다.The present invention relates to a humidity sensor, and more particularly, to a humidity sensor for a microwave oven in which a bonding layer is formed of a bonding material which does not cause a chemical reaction with an electrode, so that the reliability of the sensor is maintained even during deposition or long-term use. will be.
습도센서로는 유기물의 흡습에 의한 유전율 변화를 이용한 정전용량형 습도센서와 반도체 세라믹의 저항변화를 이용한 상대습도센서, 그리고 써미스터를 이용한 절대습도센서 등이 있다. 이 중에서 정전용량형 습도센서가 제작공정이 용이하고, 신뢰성이 우수하여 전자렌지에 많이 사용되고 있다.Humidity sensors include capacitive type humidity sensor using the change of dielectric constant by moisture absorption of organic material, relative humidity sensor using the change of resistance of semiconductor ceramic, and absolute humidity sensor using thermistor. Among them, the capacitive humidity sensor is easy to manufacture and excellent in reliability, so it is widely used in microwave ovens.
도 1은 상기 정전용량형 습도센서의 일반적인 구조를 보이고 있다. 도시된 바에 따르면, 습도센서는 전자렌지 내부의 습도를 감지하기 위한 감습소자(1)와, 상기 감습소자(1)가 감지한 습도값을 보상하기 위한 보상소자(2), 그리고 상기 감습소자(1)와 보상소자(2)를 봉합하는 보호케이스(3)로 구성되고, 상기 감습소자(1)와 보상소자(2)는 서로동일한 구성을 가지고 있다.1 shows a general structure of the capacitive humidity sensor. As shown, the humidity sensor includes a humidity sensing element 1 for sensing humidity in a microwave oven, a compensation element 2 for compensating a humidity value detected by the humidity sensing element 1, and the humidity sensing element ( 1) and a protective case 3 for sealing the compensating element 2, wherein the moisture sensitive element 1 and the compensating element 2 have the same configuration.
상기 감습소자(1) 및 보상소자(2)는 인쇄기판(10,10')위에 설치된다. 상기 인쇄기판(10)위에는 SiO2, Si3O4, SixOy등으로 형성되는 절연막(20,20')이 형성된다. 상기 절연막(20,20')위에는 아래에서 설명할 하부전극(40,40')을 증착하기 위하여 접착층(30,30')이 형성되며, 상기 접착층(30,30')은 티타늄(Ti)을 스퍼터링하여 증착한 후 급속열처리를 실시하므로써 형성된다.The humidity sensing element 1 and the compensation element 2 are provided on the printed circuit boards 10 and 10 '. An insulating film 20, 20 ′ formed of SiO 2 , Si 3 O 4 , Si x O y, or the like is formed on the printed circuit board 10. Adhesive layers 30 and 30 'are formed on the insulating layers 20 and 20' to deposit the lower electrodes 40 and 40 ', which will be described below. The adhesive layers 30 and 30' are formed of titanium (Ti). It is formed by sputtering and deposition followed by rapid heat treatment.
상기 접착층(30,30')의 상부에는 전기적으로 연결되는 하부전극(40,40')이 형성되는데 상기 하부전극(40,40')은 백금과 같은 귀금속이 증착되어 형성된다.Lower electrodes 40 and 40 'are electrically connected to the adhesive layers 30 and 30', and the lower electrodes 40 and 40 'are formed by depositing precious metals such as platinum.
상기 하부전극(40,40') 위로는 폴리이미드 박막이 코팅 및 열처리되고, 패터닝되어 유전막(50,50')이 형성된다. 여기서 상기 폴리이미드는 수분을 함유하면 유전율이 변화하는 특성을 가지는 물질이다.A polyimide thin film is coated and heat treated on the lower electrodes 40 and 40 ', and then patterned to form dielectric films 50 and 50'. Herein, the polyimide is a material having a property of changing dielectric constant when water is contained.
또한 상기 유전막(50,50')의 상부에는 금속막을 증착 및 패터닝하여 상부전극(60,60')이 형성된다. 이 때 상기 상부전극(60,60')은 상기 하부전극(40,40')과 달리 콤형태로 형성되는데 이와 같은 형태에서 물분자가 원활히 유전막(50,50') 내부로 통과할 수 있다.In addition, upper electrodes 60 and 60 'are formed by depositing and patterning a metal film on the dielectric layers 50 and 50'. In this case, the upper electrodes 60 and 60 'are formed in a comb shape unlike the lower electrodes 40 and 40'. In this form, water molecules can smoothly pass into the dielectric layers 50 and 50 '.
상기 하부전극(40,40') 및 상부전극(60,60')은 와이어(90,90')로 핀(80,80')에 연결되고, 상기와 같이 제작된 소자는 보호케이스(3)내에 봉합된다. 이때 상기 감습소자(1)측에는 홀(73)을 형성하여 전자렌지 내부의 공기가 유동될 수 있도록 하고, 상기 보상소자(2)측은 질소를 채운 뒤 밀폐된다.The lower electrodes 40 and 40 'and the upper electrodes 60 and 60' are connected to the pins 80 and 80 'by wires 90 and 90', and the device manufactured as described above is a protective case 3. Sutures within. At this time, the humidification element (1) side to form a hole 73 so that the air in the microwave flows, and the compensation element (2) side is filled with nitrogen and then sealed.
도 2는 상기와 같은 구성을 갖는 습도센서의 주위 습도 변화를 검출하기 위한 응용회로로서 감습소자(1), 보상소자(2), 고정저항, 가변저항으로 이루어진 브릿지 회로와 상기 브릿지 회로에 인가되는 전원으로 간단히 구성되는 일 예를 보이고 있다.2 is an application circuit for detecting a change in the ambient humidity of the humidity sensor having the configuration described above is applied to the bridge circuit and the bridge circuit consisting of the damping element (1), the compensation element (2), fixed resistance, variable resistance An example of a simple power supply is shown.
상기 회로에 의할 경우, 전자레인지에서 음식물이 가열되어 수증기가 발생하여, 발생된 수증기가 상기 감습소자(1)와 보상소자(2)에 접촉하게 되면 상기 감습소자(1)는 폴리이미드에 수분이 흡수되어 저항이 변하게 되나 상기 보상소자(2)는 밀폐되어 있어 수분이 흡수되지 않아 저항변화가 생기지 않게 된다. 따라서, 상기 감습소자(1)의 저항변화로 브릿지회로의 출력이 변화하게 되어 습도변화를 검출할 수 있게 된다.In the circuit, food is heated in a microwave oven to generate water vapor. When the generated water vapor comes into contact with the damping element 1 and the compensating element 2, the damping element 1 is moistened with polyimide. The absorption is changed to change the resistance, but the compensation element 2 is sealed so that moisture is not absorbed so that the resistance change does not occur. Therefore, the output of the bridge circuit changes due to the resistance change of the humidity sensing element 1, so that the humidity change can be detected.
그러나 종래기술에 의한 습도센서는 접착층으로서 티타늄을 사용함으로써 이어지는 후속공정에서 화학변화를 일으키는 문제점이 있다. 즉, 상술한 바와 같이접착층이 형성되면, 다음 공정으로 하부전극이 상기 접착층에 형성되는데, 상기 공정은 고온의 열처리를 수반하여 금속막을 증착하는 공정이다. 따라서, 이때 상기 접착층은 고온으로 가열되는데, 티타늄이 고온으로 가열되면, 증착되는 하부전극을 이루는 금속과 화학반응을 하여 새로운 화합물을 형성한다. 예컨데, 하부전극이 백금일 경우 PtxTiy로 되는 소정의 결합구조 변화가 있게 된다.However, the humidity sensor according to the related art has a problem of causing chemical change in subsequent processes by using titanium as an adhesive layer. That is, when the adhesive layer is formed as described above, a lower electrode is formed in the adhesive layer in the following process, which is a process of depositing a metal film with high temperature heat treatment. Therefore, at this time, the adhesive layer is heated to a high temperature, when titanium is heated to a high temperature, a chemical reaction with the metal forming the lower electrode to be deposited to form a new compound. For example, when the lower electrode is platinum, there is a change in a predetermined coupling structure of Pt x Ti y .
그러나 상기 금속과 티타늄의 화합물은 안정하지 못하여 시간이 지남에 따라 결합구조가 달라지게 되어, 접촉저항이 커지고 누설전류를 증가시키게 된다. 따라서 상기 전극이 감응도가 변하게 되어 상기 습도센서의 신뢰성에 문제가 발생하게 된다.However, the compound of the metal and titanium is not stable, the bond structure is changed over time, the contact resistance is increased and the leakage current is increased. Therefore, the sensitivity of the electrode is changed, causing a problem in the reliability of the humidity sensor.
상기 문제점을 해결하기 위한 본 발명은 습도센서를 제조함에 있어, 하부전극 증착시에 접합층과 화학반응이 일어나지 않도록하는 것을 목적으로 한다.The present invention for solving the above problems is to prevent the chemical reaction with the bonding layer during the deposition of the lower electrode in manufacturing the humidity sensor.
본 발명의 또 다른 목적은 습도센서의 하부전극이 시간이 지나더라도 감응도가 열화되지 않도록 하는 것이다.Another object of the present invention is to prevent the sensitivity of the lower electrode of the humidity sensor from deteriorating over time.
도 1은 종래기술에 의한 전자렌지용 습도센서의 단면도.1 is a cross-sectional view of a humidity sensor for a microwave oven according to the prior art.
도 2는 종래기술에 의한 전자렌지용 습도센서의 회로도.Figure 2 is a circuit diagram of a humidity sensor for a microwave oven according to the prior art.
도 3은 본 발명에 의한 전자렌지용 습도센서의 일실시예를 보이는 단면도.Figure 3 is a cross-sectional view showing an embodiment of a humidity sensor for a microwave oven according to the present invention.
* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
101 ..... 감습소자 102 ..... 보상소자101 ..... damping element 102 ..... compensation element
103 ..... 보호케이스 110, 110' ..... 인쇄기판103 ..... Protective case 110, 110 '..... Printed board
120, 120' ..... 절연막 130, 130' ..... 접착층120, 120 '..... insulating film 130, 130' ..... adhesive layer
140, 140' ..... 하부전극 150, 150' ..... 유전막140, 140 '..... lower electrode 150, 150' ..... dielectric film
160, 160' ..... 상부전극 180, 180' ..... 핀160, 160 '..... upper electrode 180, 180' ..... pin
190, 190' ..... 와이어190, 190 '..... wire
상기 문제점을 해결하기 위한 본 발명에 의한 전자렌지용 습도센서는 인쇄기판과; 상기 기판 위에 형성되는 절연막과; 상기 절연막 상부에 탄탈륨옥사이드 (Ta2O5)로 형성되는 접착층; 그리고 상기 접착층 상부에 증착되고 전기적으로 연결되는 하부전극을 포함하여 구성되어; 상기 전극은 증착시에 구조변화가 생기지 않고, 경시적 요소에 관계없이 감응도가 유지되는 것을 특징으로 구성된다.Microwave humidity sensor according to the present invention for solving the above problems is a printed circuit board; An insulating film formed on the substrate; An adhesive layer formed of tantalum oxide (Ta 2 O 5 ) on the insulating layer; And a lower electrode deposited on the adhesive layer and electrically connected to the adhesive layer; The electrode is characterized in that no structural change occurs during deposition and sensitivity is maintained irrespective of the elements over time.
상기 전극은 백금으로 형성되는 것이 바람직하다.The electrode is preferably formed of platinum.
또한 상기 절연막은 SiO2, Si3O4, SixOy중 어느 하나로 형성되는 것이 바람직하다.In addition, the insulating film is preferably formed of any one of SiO 2 , Si 3 O 4 , Si x O y .
도 3은 본 발명에 의한 전자렌지용 습도센서의 일실시예를 보이고 있다. 도시된 바에 따르면, 습도센서는 전자렌지 내부의 습도를 감지하기 위한 감습소자(101)와, 상기 감습소자(101)가 감지한 습도값을 보상하기 위한 보상소자(102), 그리고 상기 감습소자(101)와 보상소자(102)를 봉합하는 보호케이스(103)로 구성되고, 상기 감습소자(101)와 보상소자(102)는 서로동일한 구성을 가지고 있다.Figure 3 shows an embodiment of a humidity sensor for a microwave oven according to the present invention. As shown, the humidity sensor includes a humidity sensing element 101 for sensing humidity in a microwave oven, a compensation element 102 for compensating for a humidity value detected by the humidity sensing element 101, and the humidity sensing element ( 101 and the protection case 103 for sealing the compensation element 102, the damping element 101 and the compensation element 102 has the same configuration.
상기 감습소자(101) 및 보상소자(102)는 인쇄기판(110,110')위에 설치된다. 상기 인쇄기판(110,110')위에는 SiO2, Si3O4, SixOy등으로 형성되는 절연막(120,120')이 형성된다. 상기 절연막(120,120')위에는 아래에서 설명할 하부전극(140,140')을 증착하기 위하여 접착층(130,130')이 형성되며, 상기 접착층(130,130')은 탄탈륨옥사이드(Ta2O5)을 스퍼터링하여 증착한 후 급속열처리를 실시하므로써 형성된다.The humidity sensing element 101 and the compensation element 102 are installed on the printed circuit boards 110 and 110 '. The insulating substrates 120 and 120 'formed of SiO 2 , Si 3 O 4 , Si x O y, and the like are formed on the printed circuit boards 110 and 110 ′. Adhesive layers 130 and 130 'are formed on the insulating layers 120 and 120' to deposit the lower electrodes 140 and 140 'which will be described below. The adhesive layers 130 and 130' are formed by sputtering tantalum oxide (Ta 2 O 5 ). It is formed by performing rapid heat treatment afterwards.
상기 접착층(130,130')의 상부에는 전기적으로 연결되는 하부전극(140,140')이 형성되는데 상기 하부전극(140,140')은 백금과 같은 귀금속이 증착되어 형성된다.Lower electrodes 140 and 140 'electrically connected to the adhesive layers 130 and 130' are formed, and the lower electrodes 140 and 140 'are formed by depositing a noble metal such as platinum.
상기 하부전극(140,140') 위로는 폴리이미드 박막이 코팅 및 열처리되고, 패터닝되어 유전막(150,150')이 형성된다. 여기서 상기 폴리이미드는 수분을 함유하면 유전율이 변화하는 특성을 가지는 물질이다.A polyimide thin film is coated and heat-treated on the lower electrodes 140 and 140 ', and patterned to form dielectric layers 150 and 150'. Herein, the polyimide is a material having a property of changing dielectric constant when water is contained.
또한 상기 유전막(150,150')의 상부에는 금속막을 증착 및 패터닝하여 상부전극(160)이 형성된다. 이 때 상부전극(160,160')은 하부전극(140,140')과 달리 콤형태로 형성되는데 이와 같은 형태에서 물분자가 원활히 유전막(50,50') 내부로 통과할 수 있다.In addition, an upper electrode 160 is formed by depositing and patterning a metal layer on the dielectric layers 150 and 150 ′. In this case, the upper electrodes 160 and 160 'are formed in a comb shape unlike the lower electrodes 140 and 140'. In this form, water molecules can smoothly pass into the dielectric layers 50 and 50 '.
상기 하부전극(140,140') 및 상부전극(160,160')은 와이어(190,190')로 핀(180,180')에 연결되고, 상기와 같이 제작된 소자는 보호케이스(103)내에 봉합된다. 이때 감습소자(101)측에는 홀(173)을 형성하여 전자렌지 내부의 공기가 유동될 수 있도록 하고, 보상소자(102)측은 질소를 채운뒤 밀폐된다.The lower electrodes 140 and 140 'and the upper electrodes 160 and 160' are connected to the pins 180 and 180 'by wires 190 and 190', and the device manufactured as described above is sealed in the protective case 103. At this time, by forming a hole (173) on the side of the humidification element 101 to allow the air in the microwave flows, the compensation element 102 is sealed after filling the nitrogen.
다음에는 본 발명에 의한 습도센서의 작용을 설명한다. 상기 습도센서에 의할 경우, 전자레인지에서 음식물이 가열되어 발생된 수증기가 감습소자(101)와 보상소자(102)에 접촉하게 될 경우, 상기 감습소자(101)는 폴리이미드에 수분이 흡수되어 저항이 변하게 되나 상기 보상소자(102)는 질소로 밀폐된 보호케이스(103)내에 위치하고 있어 수분이 흡수되지 않아 저항변화가 생기지 않게 된다. 따라서, 상기 감습소자(101)의 저항변화로 브릿지회로의 출력이 변화하게 되어 습도변화를 검출할 수 있게 된다.Next, the operation of the humidity sensor according to the present invention will be described. In the humidity sensor, when water vapor generated by heating food in the microwave comes into contact with the dampening element 101 and the compensating element 102, the dampening element 101 absorbs moisture in the polyimide. The resistance is changed, but the compensation element 102 is located in the protective case 103 sealed with nitrogen, so that moisture is not absorbed so that resistance change does not occur. Therefore, the output of the bridge circuit is changed by the resistance change of the humidity sensing element 101, so that the humidity change can be detected.
이상에서 살펴본 바에 의하면 본 발명은 전자렌지용 습도센서의 접합층의 재료를 탄탈륨옥사이드로 구성하여, 접합층이 하부전극을 구성하는 금속과 반응을 하지 않게 하는 것을 기술적 사상으로 하고 있음을 알 수 있다.As described above, it can be seen that the present invention has a technical idea that the material of the bonding layer of the humidity sensor for a microwave oven is composed of tantalum oxide so that the bonding layer does not react with the metal constituting the lower electrode. .
이러한 기술적 사상의 범주 내에서 당업계의 통상의 지식을 가진 자가 다양한 방법으로 변형 사용될 수 있음은 물론이다. 상기 전자렌지용 습도센서는 다양한 방법으로 제작되고 있으므로, 상술한 실시예에 따른 습도센서의 구성에 국한되지 아니하고, 전극을 절연막에 증착시키기 위한 접착층이 형성되는 모든 습도센서에 사용가능할 것이다.Those skilled in the art can be used in a variety of ways within the scope of these technical ideas. Since the humidity sensor for the microwave oven is manufactured by various methods, the humidity sensor is not limited to the configuration of the humidity sensor according to the above-described embodiment, and may be used for all humidity sensors in which an adhesive layer for depositing an electrode on an insulating film is formed.
본 발명에 따르면, 전극을 절연판에 증착하는 경우 탄탈륨옥사이드(Ta2O5)가접착층을 형성하므로, 종래 기술에 의한 티타늄(Ti)과는 달리, 전극을 이루는 금속과 화학반응하지 않게 된다. 따라서 전극을 증착하는 경우 및 장시간 사용하는 경우에 화학구조의 변화가 생기지 않아 상기 전극의 감응도가 일정하게 유지되고, 성능이 저하되지 않는다.According to the present invention, when the electrode is deposited on the insulating plate, tantalum oxide (Ta 2 O 5 ) forms an adhesive layer, unlike titanium (Ti) according to the prior art, it does not chemically react with the metal forming the electrode. Therefore, no change in chemical structure occurs when the electrode is deposited and when it is used for a long time so that the sensitivity of the electrode is kept constant and the performance is not deteriorated.
또한, 상기 전극형성후 후속되는 유전막 형성공정의 산화분위기에서 상기 티타늄은 산소확산에 의해 산화가 잘 되어 접촉저항커지는 단점이 있으나 탄탈륨옥사이드(Ta2O5)는 산소의 확산에 대한 저항성이 커, 접촉저항을 줄일 수 있는 장점이 있다.In addition, in the oxidation atmosphere of the subsequent dielectric film forming process after the electrode formation, the titanium is well oxidized by oxygen diffusion, so that the contact resistance increases, but tantalum oxide (Ta 2 O 5 ) has a high resistance to diffusion of oxygen. There is an advantage to reduce the contact resistance.
상술한 바와 같이, 전극의 감응도가 일정하게 유지되고, 접촉저항이 줄어들게 되면, 습도센서의 내구성 및 신뢰성이 증가하므로 장기간 사용하는 경우에도 정확한 습도감지를 할 수 있게 된다.As described above, when the sensitivity of the electrode is kept constant and the contact resistance is reduced, the durability and reliability of the humidity sensor are increased, so that accurate humidity detection can be performed even when used for a long time.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020079866A KR20040052134A (en) | 2002-12-13 | 2002-12-13 | Humidity sensor for a microwave oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020079866A KR20040052134A (en) | 2002-12-13 | 2002-12-13 | Humidity sensor for a microwave oven |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20040052134A true KR20040052134A (en) | 2004-06-19 |
Family
ID=37345892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020020079866A KR20040052134A (en) | 2002-12-13 | 2002-12-13 | Humidity sensor for a microwave oven |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20040052134A (en) |
-
2002
- 2002-12-13 KR KR1020020079866A patent/KR20040052134A/en not_active Application Discontinuation
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6463789B2 (en) | Gas sensor | |
| KR910006223B1 (en) | Gas sensor and method for production thereof | |
| US20070062812A1 (en) | Gas sensor and method for the production thereof | |
| US20020136664A1 (en) | Absolute humidity sensor | |
| JP2542643B2 (en) | Sensor manufacturing method | |
| JP2000081354A (en) | Electric temperature sensor having at least one layer or multilayer and its manufacture | |
| Ménil et al. | Screen-printed thick-films: from materials to functional devices | |
| WO2004095013A1 (en) | A thin semiconductor film gas sensor device | |
| WO2000074082A1 (en) | Resistive hydrogen sensing element | |
| KR20040052134A (en) | Humidity sensor for a microwave oven | |
| JP3047137B2 (en) | Manufacturing method of humidity sensor | |
| JP3412341B2 (en) | Nitrogen oxide detector | |
| JPH11354302A (en) | Thin-film resistor element | |
| JPH0658900A (en) | Moisture sensor | |
| JP3045896B2 (en) | Ozone sensor manufacturing method | |
| JPH04273050A (en) | Gas sensor | |
| US20050023138A1 (en) | Gas sensor with sensing particle receptacles | |
| RU2114422C1 (en) | Semiconductor gas sensor | |
| JPH05322821A (en) | Gas sensor | |
| CN100359323C (en) | Humidity sensor for microwave oven | |
| WO1999061870A1 (en) | Method of manufacturing sensor and resistor element | |
| JPH08292167A (en) | Ozone sensor | |
| US20090052152A1 (en) | Electronic Sensor | |
| JP2003232763A (en) | Gas sensor and its manufacturing method | |
| KR101848764B1 (en) | Micro temperature sensor and fabrication method of the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Withdrawal due to no request for examination |