JP3047137B2 - Manufacturing method of humidity sensor - Google Patents

Manufacturing method of humidity sensor

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Publication number
JP3047137B2
JP3047137B2 JP3227415A JP22741591A JP3047137B2 JP 3047137 B2 JP3047137 B2 JP 3047137B2 JP 3227415 A JP3227415 A JP 3227415A JP 22741591 A JP22741591 A JP 22741591A JP 3047137 B2 JP3047137 B2 JP 3047137B2
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JP
Japan
Prior art keywords
moisture
film
electrode
humidity sensor
upper electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3227415A
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Japanese (ja)
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JPH06294765A (en
Inventor
浩之 三田
Original Assignee
グローリー工業株式会社
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Publication of JPH06294765A publication Critical patent/JPH06294765A/en
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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、湿度センサに係り、特
に高分子容量型湿度センサの透湿電極の形成方法に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a humidity sensor, and more particularly to a method for forming a moisture permeable electrode of a polymer capacitance type humidity sensor.

【0002】[0002]

【従来の技術】一般に、湿度の検出は、高分子膜あるい
はセラミックなどからなる感湿膜に水分子が吸着するこ
とによる電気抵抗あるいは容量変化を検出する湿度セン
サが用いられている。
2. Description of the Related Art In general, for detecting humidity, a humidity sensor for detecting a change in electric resistance or capacitance due to adsorption of water molecules on a moisture-sensitive film made of a polymer film or ceramic is used.

【0003】従来の湿度センサの1例として、例えば図
4に製造工程を示すように、熱的に絶縁性の高い石英基
板101の上に、プラチナ薄膜からなる下部電極102
と、ポリイミド膜からなる感湿膜103と、金からなる
上部電極104とを順次積層し、下部電極102と上部
電極104とに挟まれた感湿膜103の湿度による容量
変化を測定するようにしたものがある。
As an example of a conventional humidity sensor, for example, as shown in a manufacturing process in FIG. 4, a lower electrode 102 made of a platinum thin film is formed on a quartz substrate 101 having high thermal insulation.
And a moisture sensitive film 103 made of a polyimide film and an upper electrode 104 made of gold are sequentially laminated, and a capacitance change due to humidity of the moisture sensitive film 103 sandwiched between the lower electrode 102 and the upper electrode 104 is measured. There is something.

【0004】これは従来次のようにして形成されてい
た。
This is conventionally formed as follows.

【0005】まず、図4(a) に示すように、石英基板1
01を用意し、この上にスパッタリング法によりプラチ
ナ薄膜を堆積し、これをパターニングして下部電極10
2を形成する(図4(b) )。
[0005] First, as shown in FIG.
01, a platinum thin film is deposited thereon by sputtering, and is patterned to form a lower electrode 10
2 is formed (FIG. 4B).

【0006】次に、図4(c) に示すようにスピンコート
法によりポリイミド前駆体103pを塗布する。
Next, as shown in FIG. 4C, a polyimide precursor 103p is applied by a spin coating method.

【0007】この後、300〜400℃の熱処理を行う
ことにより、ポリイミド前駆体103pに縮合反応を生
ぜしめ、ポリイミド薄膜からなる感湿膜103を形成す
る(図4(d) )。
Thereafter, a heat treatment at 300 to 400 ° C. is performed to cause a condensation reaction on the polyimide precursor 103p, thereby forming a moisture-sensitive film 103 made of a polyimide thin film (FIG. 4 (d)).

【0008】そして最後に図4(e) に示すように、スパ
ッタリング法により透湿電極として膜厚10〜20nmの
金薄膜からなる上部電極104を形成する。
Finally, as shown in FIG. 4E, an upper electrode 104 made of a gold thin film having a film thickness of 10 to 20 nm is formed as a moisture permeable electrode by a sputtering method.

【0009】このようにして形成された感湿センサで
は、透湿電極としての上部電極104を透過して感湿膜
に到達した水分子を容量変化として測定するため、上部
電極の膜質および膜厚は、水分子の透過性および電極自
体の抵抗値に大きく寄与し、センサ特性に大きく影響す
るため高精度に制御する必要がある。すなわち、上部電
極は透湿性の面からは厚いと透湿性が低下して感度が悪
く、また薄いと、電極自体の抵抗が増大し、電力損失が
大きくなる上感度が低下する。
In the humidity sensor thus formed, water molecules that have passed through the upper electrode 104 as a moisture-permeable electrode and reached the moisture-sensitive film are measured as a change in capacitance. Since it greatly contributes to the permeability of water molecules and the resistance value of the electrode itself, and greatly affects the sensor characteristics, it is necessary to control with high precision. That is, when the upper electrode is thicker from the viewpoint of moisture permeability, the moisture permeability decreases and the sensitivity is deteriorated. When the upper electrode is thinner, the resistance of the electrode itself increases, the power loss increases, and the sensitivity decreases.

【0010】このように、透湿性と抵抗の両者を満足す
るには、透湿電極を薄くし、抵抗値が大きくならないよ
うに膜厚の最適値を極めて高精度に制御しなければなら
ない。 しかしながら、このような膜厚の薄い領域で膜
厚制御をする場合、わずかなばらつきで抵抗値は大きく
変化するため、極めて高精度の膜厚制御が必要であり、
現実的には制御不可能であった。
As described above, in order to satisfy both the moisture permeability and the resistance, it is necessary to make the moisture permeable electrode thin and control the optimum value of the film thickness with extremely high precision so as not to increase the resistance value. However, when controlling the film thickness in such a thin region, the resistance value greatly changes with a slight variation, so that extremely high-precision film thickness control is required.
In reality, it could not be controlled.

【0011】[0011]

【発明が解決しようとする課題】このように、従来の方
法では、上部電極が、透湿性の面からは、厚いと透湿性
が低下して感度が悪く、また薄いと、電極自体の抵抗が
増大し、電力損失が大きくなる上感度が低下するという
問題があり、極めて高精度の膜厚制御が必要であるのに
対し、膜厚の薄い領域での制御は極めて困難であり、膜
厚の微妙な変化にも特性が大きく変動するという問題が
あった。
As described above, in the conventional method, when the upper electrode is thicker from the viewpoint of moisture permeability, if the thickness is higher, the moisture permeability is reduced and the sensitivity is poor. If the upper electrode is thinner, the resistance of the electrode itself is reduced. However, there is a problem that the power loss increases and the sensitivity decreases, and extremely high-precision film thickness control is required.On the other hand, control in a thin film thickness region is extremely difficult. There was a problem that the characteristics fluctuated greatly even with subtle changes.

【0012】本発明は前記実情に鑑みてなされたもの
で、測定精度の高い湿度センサを提供することを目的と
する。
The present invention has been made in view of the above circumstances, and has as its object to provide a humidity sensor with high measurement accuracy.

【0013】[0013]

【課題を解決するための手段】そこで本発明では、感湿
膜としての高分子膜の前駆体を塗布したのち、縮合のた
めの熱処理に先立ち、上部電極としての金属膜を十分な
厚さとなるように形成し、この後前駆体縮合のための熱
処理を行うようにしている。
Therefore, according to the present invention, after applying a precursor of a polymer film as a moisture-sensitive film, a metal film as an upper electrode is formed to a sufficient thickness prior to heat treatment for condensation. After that, heat treatment for precursor condensation is performed.

【0014】[0014]

【作用】上記構成によれば、高分子膜の前駆体の縮合に
より発生した水分が表面に出ていく際に、金属電極が多
孔質化し、透湿性の導体膜となる。
According to the above construction, when the moisture generated by the condensation of the precursor of the polymer film comes out to the surface, the metal electrode becomes porous and becomes a moisture-permeable conductor film.

【0015】従って、電極自体の抵抗を大幅に小さくす
ることができかつ透湿性が良好で、特性のばらつきの小
さい湿度センサを得ることができる。
Accordingly, it is possible to obtain a humidity sensor which can greatly reduce the resistance of the electrode itself, has good moisture permeability, and has small variations in characteristics.

【0016】[0016]

【実施例】以下本発明の実施例について図面を参照しつ
つ詳細に説明する。
Embodiments of the present invention will be described below in detail with reference to the drawings.

【0017】図1(a) 乃至図1(e) は本発明実施例の湿
度センサの製造工程を示す図である。 この方法では、
感湿膜としての高分子膜の前駆体に縮合反応を生起する
ための熱処理に先立ち、上部電極としての金属膜を十分
な厚さとなるように形成し、この後前駆体縮合のための
熱処理を行い、高分子膜の前駆体の縮合により発生した
水分が表面に出ていく際に、金属電極が多孔質化し、透
湿性の導体膜となるようにして、電極自体の抵抗を小さ
くしかつ透湿性が良好で、特性のばらつきの小さい湿度
センサを形成することを特徴とするものである。
FIGS. 1 (a) to 1 (e) are views showing the steps of manufacturing a humidity sensor according to an embodiment of the present invention. in this way,
Prior to heat treatment for causing a condensation reaction on the precursor of the polymer film as a moisture-sensitive film, a metal film as an upper electrode is formed to have a sufficient thickness, and then heat treatment for precursor condensation is performed. When the moisture generated by the condensation of the precursor of the polymer film comes to the surface, the metal electrode becomes porous and becomes a moisture-permeable conductor film, thereby reducing the resistance of the electrode itself and reducing the permeability. The present invention is characterized in that a humidity sensor having good wettability and small variation in characteristics is formed.

【0018】まず、図1(a) に示すように、石英基板1
を用意し、この上にスパッタリング法によりプラチナ薄
膜を堆積し、これをパターニングして下部電極2を形成
する(図1(b) )。
First, as shown in FIG.
Is prepared, and a platinum thin film is deposited thereon by a sputtering method, and is patterned to form a lower electrode 2 (FIG. 1B).

【0019】次に、図1(c) に示すようにスピンコート
法によりポリイミド前駆体3pを塗布する。
Next, as shown in FIG. 1C, a polyimide precursor 3p is applied by spin coating.

【0020】ここまでは従来の方法と同様である。Up to this point, it is the same as the conventional method.

【0021】この後、図1(d) に示すように、蒸着また
はスパッタリング法により透湿電極として膜厚30〜1
00nmの金薄膜からなる上部電極4を形成する。
Thereafter, as shown in FIG. 1D, a film having a thickness of 30 to 1 is formed as a moisture-permeable electrode by vapor deposition or sputtering.
An upper electrode 4 made of a 00 nm gold thin film is formed.

【0022】そして最後に、300〜400℃の熱処理
を行って、ポリイミド前駆体3pに縮合反応を生ぜし
め、ポリイミド薄膜からなる感湿膜3を形成すると同時
に、縮合によって発生する水分子によって上部電極4を
多孔質化する(図1(e) )。
Finally, a heat treatment at 300 to 400 ° C. is performed to cause a condensation reaction in the polyimide precursor 3p to form a moisture-sensitive film 3 made of a polyimide thin film. 4 is made porous (FIG. 1 (e)).

【0023】このようにして形成された湿度センサで
は、縮合によって発生する水分子によって上部電極を多
孔質化し、透湿性を高めるとともに電極自体のもつ抵抗
を低減することができる。
In the humidity sensor thus formed, the upper electrode can be made porous by water molecules generated by condensation, thereby increasing the moisture permeability and reducing the resistance of the electrode itself.

【0024】このようにして得られた湿度センサの作用
を図2に示す模式図を参照しつつ説明する。
The operation of the humidity sensor thus obtained will be described with reference to the schematic diagram shown in FIG.

【0025】環境に湿度変化が発生した場合、水分子が
感湿膜中に拡散し、感湿膜中が平衡に達する時間がセン
サの応答時間となる。
When a change in humidity occurs in the environment, the response time of the sensor is the time when water molecules diffuse into the moisture-sensitive film and the moisture-sensitive film reaches equilibrium.

【0026】かりに上部電極が存在しないと考えると、
この応答時間は感湿膜の膜厚x(μm )により決まる。
Considering that the upper electrode does not exist,
This response time is determined by the thickness x (μm) of the moisture-sensitive film.

【0027】一方多孔性の上部電極が存在する場合は深
さ方向のみならず横方向に拡散も必要であるため、膜厚
(xμm )と孔−孔間の平均間隔(yμm )との関係に
より応答時間tを律速する因子は変化する。
On the other hand, when a porous upper electrode is present, it is necessary to diffuse not only in the depth direction but also in the lateral direction, so that it depends on the relationship between the film thickness (x μm) and the average distance between holes (y μm). The factor that determines the response time t varies.

【0028】すなわち、 i)x≧y/2の場合 tはxで律速される。That is, i) In the case of x ≧ y / 2 t is limited by x.

【0029】ii)x<y/2の場合 tはyで律速される。Ii) In the case of x <y / 2 t is limited by y.

【0030】従って、2x≧yを満足するようにすれ
ば、孔の間隔yは応答時間に影響を及ぼさない。
Therefore, if 2x ≧ y is satisfied, the hole interval y does not affect the response time.

【0031】例えばx=1μm のときy≦2μm であれ
ばよい。
For example, when x = 1 μm, it suffices that y ≦ 2 μm.

【0032】図3に上部電極表面のSEM写真を示す。FIG. 3 shows an SEM photograph of the upper electrode surface.

【0033】この写真からも上部電極は多孔質となって
おり、孔の間隔yはy≦2μm を満たしていることがわ
かる。
From this photograph, it can be seen that the upper electrode is porous and the gap y between the holes satisfies y ≦ 2 μm.

【0034】ところでこの孔の大きさあるいは分布は上
部電極の膜厚縮合条件などのより制御可能である。
The size or distribution of the pores can be controlled by controlling the film thickness condensation condition of the upper electrode.

【0035】さらにまた、上記方法によれば、何等工数
を増大することなく形成することができ、上部電極の膜
厚コントロールが不要となるため製造が容易となる。
Further, according to the above-mentioned method, it can be formed without increasing any man-hours, and it is not necessary to control the thickness of the upper electrode, so that the manufacturing becomes easy.

【0036】なお、前記実施例では、上部電極として金
を用いたが、金に限定されることなく、プラチナ、クロ
ムなど他の金属にも適用可能であることはいうまでもな
い。また、感湿膜および下部電極についても適宜変更可
能である。
In the above embodiment, gold is used as the upper electrode. However, it is needless to say that the present invention is not limited to gold but can be applied to other metals such as platinum and chromium. In addition, the moisture-sensitive film and the lower electrode can be appropriately changed.

【0037】さらに、前記実施例では、湿度センサとし
ては容量変化型センサを用いたが、抵抗変化型センサに
も適用可能である。
Further, in the above-described embodiment, a capacitance change type sensor is used as the humidity sensor, but the invention is also applicable to a resistance change type sensor.

【0038】加えて、前記実施例では、感湿膜を下部電
極および上部電極で挟んだサンドイッチ型のセンサにつ
いて説明したが、サンドイッチ型に限定されること無
く、感湿膜の上層に透湿電極を形成する構造のセンサで
あれば適用可能である。
In addition, in the above-described embodiment, the sandwich type sensor in which the moisture sensitive film is sandwiched between the lower electrode and the upper electrode has been described. However, the present invention is not limited to the sandwich type. Any sensor can be applied as long as it has a structure that forms

【0039】[0039]

【発明の効果】以上説明してきたように、本発明によれ
ば、感湿膜としての高分子膜の前駆体を塗布したのち、
縮合のための熱処理に先立ち、上部電極としての金属膜
を十分な厚さとなるように形成し、この後前駆体縮合の
ための熱処理を行うようにしているため、縮合反応によ
って発生した水分子により電極が多孔質化し、透湿性の
導体膜となり、透湿性が良好で、特性のばらつきの小さ
い湿度センサを得ることができる。
As described above, according to the present invention, after applying a polymer film precursor as a moisture-sensitive film,
Prior to heat treatment for condensation, a metal film as an upper electrode is formed to have a sufficient thickness, and then heat treatment for precursor condensation is performed. The electrode becomes porous, becomes a moisture-permeable conductor film, and a humidity sensor having good moisture permeability and small variation in characteristics can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明実施例の湿度センサの製造工程図FIG. 1 is a manufacturing process diagram of a humidity sensor according to an embodiment of the present invention.

【図2】同湿度センサの模式図FIG. 2 is a schematic diagram of the humidity sensor.

【図3】上部電極を構成する金の組織のSEM写真を示
す図
FIG. 3 is a view showing an SEM photograph of a gold structure constituting an upper electrode.

【図4】従来例の湿度センサの製造工程図FIG. 4 is a manufacturing process diagram of a conventional humidity sensor.

【符号の説明】[Explanation of symbols]

1 基板 2 下部電極 3 感湿膜 4 上部電極 101 基板 102 下部電極 103 感湿膜 104 上部電極 DESCRIPTION OF SYMBOLS 1 Substrate 2 Lower electrode 3 Moisture sensitive film 4 Upper electrode 101 Substrate 102 Lower electrode 103 Moisture sensitive film 104 Upper electrode

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 基板表面に、感湿膜となる高分子膜の前
駆体を塗布する前駆体塗布工程と、 この前駆体の上層に電極を形成する電極形成工程と、 前記前駆体に縮合反応を生起するように熱処理を行う熱
処理工程とを含むことを特徴とする湿度センサの製造方
法。
1. A precursor coating step of coating a precursor of a polymer film to be a moisture-sensitive film on a substrate surface; an electrode forming step of forming an electrode on an upper layer of the precursor; and a condensation reaction with the precursor. A heat treatment step of performing a heat treatment so as to cause the humidity.
JP3227415A 1991-09-06 1991-09-06 Manufacturing method of humidity sensor Expired - Fee Related JP3047137B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3227415A JP3047137B2 (en) 1991-09-06 1991-09-06 Manufacturing method of humidity sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3227415A JP3047137B2 (en) 1991-09-06 1991-09-06 Manufacturing method of humidity sensor

Publications (2)

Publication Number Publication Date
JPH06294765A JPH06294765A (en) 1994-10-21
JP3047137B2 true JP3047137B2 (en) 2000-05-29

Family

ID=16860487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3227415A Expired - Fee Related JP3047137B2 (en) 1991-09-06 1991-09-06 Manufacturing method of humidity sensor

Country Status (1)

Country Link
JP (1) JP3047137B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102507669A (en) * 2011-11-18 2012-06-20 中国科学院上海微系统与信息技术研究所 Structure improvement and making method of humidity sensor on basis of polyimide and filler corrosion
CN103207215A (en) * 2012-01-16 2013-07-17 中国科学院上海微系统与信息技术研究所 Improved humidity sensor based on polyimide

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002328110A (en) * 2001-04-27 2002-11-15 Yamatake Corp Electrostatic capacity sensor
WO2010113711A1 (en) * 2009-03-31 2010-10-07 アルプス電気株式会社 Capacitive humidity sensor and manufacturing method therefor
CN103713022B (en) * 2013-12-07 2015-12-09 太原理工大学 Polydimethylsiloxanemicro-thin micro-thin film capacitive biosensor preparation method
JP6624928B2 (en) * 2015-12-25 2019-12-25 株式会社チノー Method for manufacturing porous electrode
JP7231501B2 (en) * 2019-06-26 2023-03-01 ルビコン株式会社 Humidity sensor and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102507669A (en) * 2011-11-18 2012-06-20 中国科学院上海微系统与信息技术研究所 Structure improvement and making method of humidity sensor on basis of polyimide and filler corrosion
CN103207215A (en) * 2012-01-16 2013-07-17 中国科学院上海微系统与信息技术研究所 Improved humidity sensor based on polyimide

Also Published As

Publication number Publication date
JPH06294765A (en) 1994-10-21

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