KR20040041945A - Plasma display apparatus - Google Patents

Abstract

PURPOSE: A plasma display device is provided to reduce a noise by a vibration of a printed circuit board and to improve a degree of a free arrangement of a circuit accessory. CONSTITUTION: A plasma display device comprises a base chassis(110), a plasma display panel(140) adhered to a front surface of the base chassis, a plurality of integrated circuit(130) fixed to a rear surface of the base chassis and driving the plasma display panel, a fixing device for fixing the integrated circuit at the rear surface of the base chassis, and a printed circuit board(120) mounted on the rear of the integrated circuit and connected with the plurality of the integrated circuit. The fixing device comprises a plurality of receiving grooves(111) formed at the rear surface of the base chassis to insert one side part of the integrated circuit, and an adhesive(134) fixing one side part of the integrated circuit at a bottom surface of the receiving grooves.

Description

Plasma display apparatus

The present invention relates to a plasma display device, and more particularly, by implementing a driving circuit of a plasma display panel (PDP) without a heat sink, the thickness thereof can be reduced, and the degree of freedom of arrangement of circuit components is improved. The present invention relates to a plasma display device capable of reducing noise.

The plasma display device displays an image using a gas discharge phenomenon, and is excellent in various display capacities such as display capacity, brightness, contrast, afterimage, and viewing angle, and is capable of replacing a cathode ray tube (CRT) with a thin and large display. It is attracting attention as a device that can be used.

Such a plasma display device includes a driving circuit for driving a PDP. These drive circuits control high voltages and large currents, and therefore use a large amount of circuit components such as large-capacity semiconductor elements. Recently, in order to improve the reliability and productivity of the PDP driving circuit, a hybrid integrated circuit in which various semiconductor devices are integrated on a single substrate has been used.

In the hybrid integrated circuit, since heat generating elements are concentrated therein, high heat is generated during driving. The heat generated in this way degrades the driving characteristics of circuit components such as semiconductor devices. In particular, since the plasma display device is configured to form an image in a narrow space in a narrow space, unlike a cathode ray tube, a heat sink or a separate cooling device for dissipating heat generated in an integrated circuit to the outside is required.

FIG. 1 is an exploded perspective view schematically illustrating an example of a conventional plasma display apparatus using a heat sink.

Referring to the drawings, a conventional plasma display apparatus includes a base chassis 10, a PDP 40 attached to the front surface of the base chassis 10 and including a front substrate 41 and a rear substrate 42; The printed circuit board 20 is fixed to the rear surface of the base chassis 10 and has a plurality of integrated circuits 30 attached thereto. Here, the PDP 40 and the base chassis 10 are attached to each other by the adhesive force of the double-sided adhesive layer 50. Unexplained reference numeral 60 denotes a stand device for raising the PDP set and supporting the load.

The integrated circuit 30 includes an integrated circuit board 31, a plurality of circuit parts 32 attached on the integrated circuit board 31 to face the printed circuit board 20, and the circuit parts ( And a heat sink 34 installed on the integrated circuit board 31 to which the 32 is not attached and dissipating heat generated from the circuit component 32. Here, the integrated circuit 30 and the printed circuit board 20 are electrically connected to each other by inserting the connection pin 33 of the integrated circuit 30 into the connection hole 21 of the printed circuit board 20.

By the way, in the conventional plasma display device configured as described above, a heat sink 34 that occupies a large volume is used to dissipate heat generated in the integrated circuit 30. Thus, the overall width of the plasma display device becomes large, which is contrary to the consumer's demand for thinning the display device.

In addition, the large volume of heat dissipation plates 34 lowers the degree of freedom for the arrangement of circuit components 32 attached to the integrated circuit 30.

In addition, vibration generated in the integrated circuit 30 when the circuit component 32 is driven is directly transmitted to the printed circuit board 20, thereby generating a noise problem due to the vibration of the printed circuit board 20.

The present invention has been made to solve the above problems, and by implementing the driving circuit of the PDP without a heat sink, it is possible to reduce the thickness, improve the degree of freedom of arrangement of the circuit components and reduce the noise due to vibration of the printed circuit board It is an object to provide a display device.

1 is an exploded perspective view schematically showing an example of a conventional plasma display device;

2 is a partial exploded perspective view schematically showing a plasma display device according to the present invention;

Figure 3 is a partially exploded perspective view schematically showing another embodiment of the integrated circuit holding means according to the present invention.

<Brief description of symbols for the main parts of the drawings>

110,210 Base chassis 111 Receptacle

120 Printed circuit board 121

131 Integrated Circuit Board 132 Circuit Components

Connection pin 134 Adhesive

140 ... PDP141 ... Front Board

142 Back panel 150 Double-sided adhesive layer

211 ... frame

In order to achieve the above object, a plasma display device according to the present invention comprises: a base chassis; A plasma display panel attached to a front surface of the base chassis; A plurality of integrated circuits fixed to a rear surface of the base chassis to drive the plasma display panel; Fixing means for fixing the integrated circuit to a rear surface of the base chassis; And a printed circuit board installed at the rear of the integrated circuit and electrically connected to the integrated circuit.

The fixing means includes a plurality of accommodating grooves formed on a rear surface of the base chassis such that one side of the integrated circuit to which the circuit component is not attached is inserted, and one side of the integrated circuit on the bottom surface of the accommodating groove. It may be an adhesive to fix it.

The adhesive is preferably made of a thermally conductive material.

In addition, the fixing means may be a plurality of frames that are installed on the rear surface of the base chassis, the one side of the integrated circuit to which the circuit components are not attached is fixed to support the rear surface of the base chassis.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a partial exploded perspective view schematically showing a plasma display device according to the present invention.

Referring to the drawings, a plasma display device according to an exemplary embodiment of the present invention includes a base chassis 110, a front substrate 141, and a rear substrate 142 attached to a front surface of the base chassis 110. And a plurality of integrated circuits 130 fixed to the rear surface of the base chassis 110 to drive the PDP 140 and installed at the rear of the integrated circuit 130. ) And a printed circuit board 120 electrically connected thereto. The PDP 140 and the base chassis 110 are attached to each other by the adhesive force of the double-sided adhesive layer 150. The integrated circuit 130 is fixed to the rear surface of the base chassis 110 by fixing means to be described later.

The integrated circuit 130 includes an integrated circuit board 131 and a plurality of circuit components 132 attached on the integrated circuit board 131 to face the printed circuit board 120. The integrated circuit 130 and the printed circuit board 120 are electrically connected to each other by inserting the connection pin 133 into the connection hole 121.

As shown in FIG. 2, the fixing means includes a receiving groove 110 formed on a rear surface of the base chassis 110 so that one side of the integrated circuit 130 to which the circuit component 132 is not attached can be inserted. And an adhesive 134 fixing one side of the integrated circuit 130 to the bottom surface 111a of the receiving groove 111. In this case, the adhesive 134 is preferably made of a large thermally conductive material so that heat generated in the integrated circuit 130 can be smoothly transferred to the base chassis 110.

On the other hand, Figure 3 is a partially separated perspective view schematically showing another embodiment of the integrated circuit holding means according to the present invention. Here, the same reference numerals as the reference numerals shown in FIG. 2 denote the same members having the same configuration and operation, and thus repeated descriptions thereof will be omitted.

As shown, the fixing means is installed on the back of the base chassis 210, one side of the integrated circuit 130, the circuit component 132 is not attached to the back of the base chassis 210 It may also be a frame 211 fixedly supported to contact.

According to the exemplary embodiment of the present invention configured as described above, as shown in FIGS. 2 and 3, since the integrated circuit 130 to which the plurality of circuit components 132 are attached is directly attached to the base chassis 110 and 210. By using the base chassis 110, 210 as a heat sink, heat generated in the integrated circuit 130 may be effectively radiated through the base chassis 110, 210.

In addition, since the driving circuit of the PDP 140 without the heat sink 34 (FIG. 1) is implemented, the width from the back surface of the base chassis 110 and 210 to the printed circuit board 120 can be reduced. Therefore, the plasma display apparatus can be thinned, and further, material costs and manufacturing costs can be reduced.

Furthermore, the vibration generated in the integrated circuit 130 is directly transmitted to the base chassis 110, 120 due to the driving of the circuit components 132, and because the base chassis 110, 120 is fixed to an external wall or floor, Noise can be greatly reduced.

According to the plasma display device of the present invention as described above has the following advantages.

First, since the integrated circuit is directly fixed to the base chassis and the printed circuit board is electrically connected to the integrated circuit at the rear of the integrated circuit, the driving circuit of the PDP without the heat sink can be realized, so that the plasma display device can be thinned and the material cost can be reduced. And manufacturing cost can be reduced.

Second, since there is no heat sink, the degree of freedom for arranging circuit components is improved.

Third, since the vibration generated in the integrated circuit is transmitted to the base chassis fixed to the outer wall or the bottom surface, it is possible to reduce the noise caused by the vibration.

Although the present invention has been described with reference to the embodiments illustrated in the accompanying drawings, it is merely an example, and those skilled in the art may realize various modifications and equivalent other embodiments therefrom. Will understand. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (4)

A base chassis; A plasma display panel attached to a front surface of the base chassis; A plurality of integrated circuits fixed to a rear surface of the base chassis to drive the plasma display panel; Fixing means for fixing the integrated circuit to a rear surface of the base chassis; And a printed circuit board disposed behind the integrated circuit and electrically connected to the plurality of integrated circuits. The method of claim 1, The fixing means includes a plurality of accommodating grooves formed on a rear surface of the base chassis such that one side of the integrated circuit to which the circuit component is not attached is inserted, and one side of the integrated circuit on the bottom surface of the accommodating groove. A plasma display device, characterized in that the adhesive for fixing. The method of claim 2, And said adhesive is made of a thermally conductive material. The method of claim 1, And the fixing means is a plurality of frames installed on a rear surface of the base chassis and supporting and fixing one side of the integrated circuit to which the circuit component is not attached to contact the rear surface of the base chassis.