KR20040038577A - slurry .omitted - Google Patents

slurry .omitted Download PDF

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Publication number
KR20040038577A
KR20040038577A KR1020020067603A KR20020067603A KR20040038577A KR 20040038577 A KR20040038577 A KR 20040038577A KR 1020020067603 A KR1020020067603 A KR 1020020067603A KR 20020067603 A KR20020067603 A KR 20020067603A KR 20040038577 A KR20040038577 A KR 20040038577A
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South Korea
Prior art keywords
stirring
alcohol
separation layer
condition
water
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KR1020020067603A
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Korean (ko)
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강대일
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주식회사 테크월드
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Priority to KR1020020067603A priority Critical patent/KR20040038577A/en
Publication of KR20040038577A publication Critical patent/KR20040038577A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

PURPOSE: A high purity abrasive extracting method from semiconductor slurry and an apparatus thereof are provided to maximize extraction effect. CONSTITUTION: Water-soluble oil is removed from collected semiconductor slurry. The first stirring process is performed under the first condition of mixing alcohol of 40-60 % and a refinement solution of 2-10 % with a solid of 20-30 %. At this time, the solid is formed from the collected semiconductor slurry by removing the water-soluble oil. The first upper and lower layer out of the first three-step separation layer are removed after the first precipitation process. The second stirring process is performed on the first center layer of the first three-step separation layer under the second condition. The second upper and lower layer out of the second three-step separation layer are removed after the second precipitation process. The third stirring process is performed on the second center layer of the second three-step separation layer under the third condition. At this time, the second and third condition are the same as the first condition. The fourth stirring process is sequentially performed. A high purity abrasive is formed into powder by sequentially performing a cleaning and drying process.

Description

반도체 slurry로부터 고 순도 연마제 회수 방법 및 그 장치.{omitted}Method for recovering high purity abrasive from semiconductor slurry and apparatus therefor.

본 발명은 반도체 폐 슬러리로 부터 고품질 연마제를 회수하는 방법 및 그 장치에 관한 것이다.The present invention relates to a method and apparatus for recovering a high quality abrasive from a semiconductor waste slurry.

보다 상세하게는 폐기 처분되어지고 있는 반도체 슬러리는 대부분 수용성인데 고품질 연마제와 수용성 오일과 Si , Fe2O3,기타 분순물로 혼합된 상태의 슬러리를 각각 성분별로 분리하되 분리효과를 극대화 시키기 위해 알코올에 정제용액으로 비이온계 계면활성제 2∼5%, 분산제 0.5∼3%를 사용하므로 입자간 표면을 매끄럽게 한 뒤 1차, 2차, 교반 및 진동, 편심 회전운동, 기울이기 운동 등을 통하여 비중차이를 효과적으로 관리하므로 고품질 연마제를 다른 성분으로부터 완전 분리하여 고 순도로 회수하는 방법에 관한 것이다.More specifically, most of the semiconductor slurries that are disposed of are water soluble, and the slurry of high quality abrasives, water-soluble oils, and Si, Fe 2 O 3 , and other impurities are separated for each component, but alcohol is used to maximize separation effect. Since non-ionic surfactants are used in the refining solution 2-5% and dispersant 0.5-3%, the surface between particles is smoothed and then the specific gravity is obtained through primary, secondary, stirring and vibration, eccentric rotation, and tilting. Effective management of the difference relates to a method of recovering high quality abrasives from other components with high purity.

종래 정제기술은 물로 세정을 하므로 폐수발생이 극심하고 성분간 분리, 즉 고품질 연마제 Si , Fe2O3,기타 분순물의 분리가 정확하게 이루어지지않아 재생하여도 효용가치가 거의 없어 시멘트 원료정도에 사용되는 것에 불과하였다.Conventional refining technology cleans with water, so waste water generation is severe and separation between components, namely, high quality abrasives Si, Fe 2 O 3 , and other impurities are not precisely produced. It was nothing.

따라서 본 발명의 목적은 알코올과 반응하여 분리효과를 극대화 시킬 수 있는 정제용액을 사용하고 세정장비, 건조기, 입도 분급기가 취합 된 플랜트를 사용하므로 고 순도의 연마제를 회수하여 0.1∼1㎛, 1∼5㎛, 5∼15㎛등의 입도로 분류하여 용도별, 파우더 상태로 제조하는 것이다.Therefore, the object of the present invention is to use a purification solution that can maximize the separation effect by reacting with alcohol and to use a plant in which cleaning equipment, a dryer, and a particle size classifier are used to recover high purity abrasives from 0.1 to 1㎛, 1 to 1 It is classified into particle sizes such as 5 µm and 5 to 15 µm to produce powders for each use.

본 발명에 사용되는 정제용액의 특징은 알코올 용액 안에서 입자간 매끄러운 막을 잘 형성 시켜주고, 초 미립입자의 엉킴 상태에서도 침투가 용이하여 침전반응을 시키면 비중 차이 방식에서 층간 분리가 잘 이루어지게 한다.The characteristics of the purification solution used in the present invention is to form a smooth membrane between particles in the alcohol solution well, and easy to penetrate even in the entangled state of the ultra-fine particles to make the separation between layers in the specific gravity difference method.

도 1은 본 발명의 반도체 폐slurry 재생 플랜트 개략도.1 is a schematic view of a semiconductor waste slurry recycling plant of the present invention.

도 2는 본 발명에서 교반용으로 사용되어지는 교반기와 침전조를 도시한 도면.2 is a view showing a stirrer and a settling tank which is used for stirring in the present invention.

도 3은 교반 후 반응을 시키기 위한 침전조를 도시하는 개략도.3 is a schematic diagram showing a precipitation tank for reacting after stirring.

도 4는 정제용액 및 알코올을 저장하는 탱크를 도시하는 도면.4 shows a tank for storing purified solution and alcohol.

도 5는 최종정제분리를 위한 세정장비를 도시하는 도면.Figure 5 shows the cleaning equipment for the final purification separation.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1. 폐 슬러리 저장드럼 38. 세정장비 54. 접시형 팬1. Waste slurry storage drum 38. Cleaning equipment 54. Dish pan

(부호설명은 도1에 도시 되어 있슴)(Code description is shown in Figure 1)

본 발명은 반도체slurry에 알코올과 정제용액을 투입하여 여러 가치 복합 성분으로 구성된 slurry를 성분별로 각각 분리 시킴으로 고품질의 연마제의 소재를 회수하여 이를 다시 건조 및 입도별 분리를 통해 고품질연마제로서 본래의 목적에 재 사용토록 하는 방법에 관한 것이다.The present invention recovers the material of high quality abrasives by separating the slurry composed of various value complex components by each component by adding alcohol and refining solution to the semiconductor slurry, and recovering the material of the high quality abrasives, and then drying and separating the particles by particle size for the original purpose. It is about how to reuse.

본 발명을 이용하여 반도체 slurry를 재생할 경우 종래의 재생 방법들이 수반하고 있는 단점들을 해결할 뿐만 아니라 동시에 반도체 FAB, CMP 공정에서 제조비용을 절감 할 수 있게 된다.In the case of regenerating the semiconductor slurry using the present invention, as well as solving the disadvantages of the conventional regeneration methods, it is possible to reduce the manufacturing cost in the semiconductor FAB, CMP process.

본 발명에 의한 slurry로부터의 대략적인 고품질 연마제 회수 방법은 다음과 같다.The approximate high quality abrasive recovery method from the slurry according to the present invention is as follows.

〈실시 예 1〉<Example 1>

우선 폐 슬러리를 수거한 드럼 용기에서 상부 층에 액상으로 존재하는 수용성 오일을 펌핑 하여 제거한 후 여러 가지 복합성분으로 구성된 고형물을 알코올과 정제용액과 함께 1차 교반(7)을 시킨 후 침전조(10)에 저장시켜 약 1∼5 시간 정도 반응 시간을 주게 되면 입자간 정제액의 특징으로 매끄러운 막이 도포 된 상태가 되어 비중차이로 침전될 때 분리 효과가 중진된다.First, the waste slurry is collected by pumping and removing the water-soluble oil present in the liquid phase in the upper layer in the drum container, and then the solid material composed of various complex components is subjected to the first stirring (7) together with the alcohol and the purification solution, followed by the settling tank (10). If the reaction time is given for about 1 to 5 hours, the separation effect is enhanced when the membrane is precipitated due to the specific gravity difference.

순수알코올만 사용하여 교반 분리할 경우 중간층의 고품질 연마제의 순도는 약 50∼60% 정도로 매우 낮으나 본 발명의 방식으로 실시할 경우 약80∼85% 정도로 순도가 높아진다.When stirring alone using pure alcohol, the purity of the high quality abrasive of the intermediate layer is very low, about 50 to 60%, but when the method of the present invention is carried out, the purity is about 80 to 85%.

〈실시예 2〉<Example 2>

1차 교반에서 나온 중간층 고형물을 2차 교반 공정에서 역시 알코올에 정제용액을 함께 교반기(14)에 투입 시켜 교반 후 침전조(17) 에 저장시키고 1∼5시간반응을 주면 비중차이로 분리가 더욱 뚜렷이 나타나 이때 중간층 고품질 연마제의 순도는 약 85∼ 95 %에 이르게 된다.In the second stirring process, the intermediate layer solids obtained from the first stirring were also added to the stirrer 14 together with alcohol in the alcohol, and then stored in the settling tank 17 after stirring and reacted for 1 to 5 hours. In this case, the purity of the interlayer high quality abrasive reaches about 85 to 95%.

[실시예 3]Example 3

2차 교반 후 3차 교반에서도 동일조건을 주어 교반하게 되면 중간층의 고품질 연마제의 순도는 약 95%∼98%정도 수준까지 올라갔다.After the second stirring and the same conditions were applied under the third stirring, the purity of the high quality abrasive in the intermediate layer was raised to the level of about 95% to 98%.

[실시예 4]Example 4

순도 95%∼98%의 고품질 연마제는 2∼5%의 불순물마저 제거하기위해 세정장비의 접시모양 펀에 약 0.5∼3mm 두께로 얇게 주입한 후 복합진동을 주었더니 비중이 비슷하여 1, 2, 3차 교반에서 분리가 잘 일어나지 않았던 것도 불순물이 정제 용액의 특성으로 인해 잘 분리되어 그 순도가 99.9% 이상이 되었다.High-quality abrasives with purity of 95% ~ 98% were injected thinly into the dish-shaped fern of cleaning equipment with a thickness of about 0.5 ~ 3mm to remove 2 ~ 5% impurities. In the third stirring, the separation did not occur well, but the impurities were well separated due to the characteristics of the purification solution, and the purity became more than 99.9%.

본 발명과 같이 세정액을 알코올로 사용하고 상기 정제용액을 사용하게 되면When the cleaning solution is used as alcohol and the purification solution is used as in the present invention

(1) 성분별 분리가 잘 이루어져 고품질 연마제를 고 순도로 회수할 수 있게 되고(1) Good separation of components allows high quality abrasives to be recovered with high purity

(2) 물을 사용치 않으므로 폐수발생이 전혀 없고(2) Because no water is used, there is no waste water generation

(3) 폐 슬러리를 태워서 회수하는 방식이 아니므로 재생소재의 품질을 더욱 향상 시키고 그을음으로 인한 공해문제도 없다.(3) Since the waste slurry is not burned and recovered, the quality of recycled materials is further improved and there is no pollution problem due to soot.

(4) 반도체 공정에서 재생된 소재를 원래의 목적에 다시 사용됨으로(4) the material recycled in the semiconductor process is reused for its original purpose.

(5) 채광으로 인한 자연훼손 억제 효과도 있다.(5) It also has the effect of suppressing the natural damage caused by mining.

Claims (2)

(1) 수거된 반도체 슬러리로부터 수용성오일을 제거한 뒤 알코올과 정제용액을 사용하되 혼합구성비를 수용성오일이 제거된 고형물(20∼30%)에 알코올 40∼60%, 정제용액 2∼10%를 사용하는 1차 교반 공정.(1) After removing the water-soluble oil from the collected semiconductor slurry, use alcohol and refining solution, but use 40 ~ 60% of alcohol and 2 ~ 10% of refining solution in solid (20 ~ 30%) from which water-soluble oil is removed. Primary stirring step. (2) 1차 교반 공정에서 침전반응 후 3단 분리층 중 상부층과 하부층을 제거하고 중간층의 고형물을 2차 교반하되 청구(1)항의 조건으로 혼합비를 구성하여 교반하는 2차 교반공정.(2) Secondary stirring step of removing the upper and lower layers of the three-stage separation layer after the precipitation reaction in the first stirring process and stirring the solids of the intermediate layer for the second time to form a mixing ratio under the conditions of claim (1). (3) 2차 교반 공정에서 침전반응 후 역시3단 분리층 중 상부층과 하부층을 제거한 후 중간층의 고형물을 3차 교반기에 알코올과 정제용액을 청구항(1)의 혼합구성비로 투입하여 교반하되 연속 교반하여 4차 교반기에 연속 주입시키는 공정.(3) After the precipitation reaction in the second stirring process, after removing the upper and lower layers of the three-stage separation layer, the solids of the intermediate layer were added to the tertiary stirrer by stirring the alcohol and the refining solution in the mixing ratio of claim (1), followed by continuous stirring. Continuous injection into the fourth stirrer. (4) 4차 교반기로 부터 교반된 원료를 세정장비로 투입하여 세정장비의 복합운동을 통해 1, 2, 3차 교반 공정에서 분리가 안 이루어진 비슷한 비중을 가졌으나 성분이 다른 소재를 완전 분리시키는 공정.(4) The raw material stirred from the 4th stirrer was put into the cleaning equipment, and the composite material of the cleaning equipment had a similar specific gravity that was not separated in the 1st, 2nd, and 3rd stirring processes, but completely separated materials having different components. fair. (5) 세정장비로부터 분리 정제된 고순도, 고품질 연마제를 건조기를 통해 파우더형태로 제조하는 공정.(5) Process of manufacturing purified and purified high purity, high quality abrasives in powder form through a dryer. (6) 파우더 형태로 된 고순도, 고품질 연마제를 분급기를 통과하여 0.1∼1㎛, 1∼5㎛, 5∼15㎛ 등으로 입도별 분급하는 공정.(6) A step of classifying the high-purity, high-quality abrasives in powder form into 0.1-1 탆, 1-5 탆, 5-15 탆, etc., through a classifier. 정제용액으로 비이온계 계면활성제 2∼5%, 분산제 0.5∼3%을 사용한다.As the purification solution, 2 to 5% of nonionic surfactant and 0.5 to 3% of dispersant are used.
KR1020020067603A 2002-10-28 2002-10-28 slurry .omitted KR20040038577A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101111649B1 (en) * 2009-09-28 2012-02-14 영창케미칼 주식회사 Reclaiming process of abrasive and reclaimed abrasive

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101111649B1 (en) * 2009-09-28 2012-02-14 영창케미칼 주식회사 Reclaiming process of abrasive and reclaimed abrasive

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