KR20040024271A - Device for removing particle on surface of conduction roll - Google Patents

Abstract

PURPOSE: An apparatus for removing foreign materials on the surface of conductor roll is provided to prevent scratch defects of strip by early removing foreign materials stuck to the surface of the conductor roll and cleaning the surface of the roll finely. CONSTITUTION: The apparatus comprises a main frame(10) ascended and descended to the surface of conductor roll according to expansion and contraction of main cylinder(11) installed at an upper side; a driving roll(20) installed at the main frame and closely adhered to the surface of the conductor roll; a removing part comprising a rotation shaft(40) installed at a lower frame(12) of the main frame in a length direction of the conductor roll and connected to the driving roll through pulley and belt, a rotation member(41) vertically rotated with being axially connected to the rotation shaft, an impact means installed at a free end of the rotation member to apply impact to the surface of the conductor roll during descending and remove foreign materials, and an ascending and descending means for ascending and descending the rotation member by receiving rotation force of the driving roll so that foreign materials stuck to the surface of the conductor roll are removed in the removing part; and a brush roll(30) installed at the lower frame, contacted with the conductor roll and connected to the driving roll by means of pulley and belt to brush off foreign materials removed from the removing part.

Description

Device for removing particle on surface of conduction roll}

The present invention relates to a conductive roll for energizing a strip in a plated steel sheet manufacturing process, and more particularly, to a conductive roll surface foreign material removal device for removing foreign substances generated on the surface of the conductive roll.

In general, the plating of steel sheets is carried out by a hot dip plating method in which a strip is deposited in a plating bath of a metal to be fused to form a plating layer, and an electrolytic solution containing ions of metals to be charged and electrodeposited on a steel sheet as an anode. There is an electroplating method for forming a plating layer.

In particular, the electroplating method has no heating and cooling process compared to the hot dip plating method, so that the mechanical properties of the steel sheet can be maintained, and the adhesion is easily controlled because the amount of adhesion is determined by the current density and line speed.

In addition, since the structure of the plating layer is fine, there is no weak alloy layer between the plating layer and the base steel sheet, and one-side plating is possible, so the steel sheet produced by the electroplating method is the mainstream.

Electroplated steel sheet production equipment for producing steel sheets by the electroplating method includes an entrance facility consisting of a payoff reel, a welder, and an entrance looper, a central facility for degreasing, pickling, electroplating and post-treatment, an exit looper and an oil supply facility, It consists of an exit facility consisting of an examination room and a tension reel.

Here, the electroplating apparatus in which the electroplating work is performed on the strip in the central facility is the plating bath 100 containing the electrolyte as shown in FIG. 1, the strip 150 is adhered to the circumferential surface and rotated in the plating bath, and the cathode is energized. The conductive roll 110 and the positive electrode plate 120 is installed below the conductive roll 110.

Therefore, the strip is immersed in the plating bath by the conductive roll and rotated. When a current flows in the conductive roll, the strip adhered to the conductive roll is charged with the negative electrode. The positive electrode electrolyzes the electrolyte, so the zinc cation to be electrodeposited in the electrolyte is negative. Electrode is plated and plated on a strip charged with.

However, the conventional plating apparatus has a problem that the treatment for the metal dust generated during the plating process is not properly made.

That is, when the plating operation is performed at a high speed, the magnetic sludge (Fe, Ni) existing in the plating solution is pressed into the chip position at the rubber position of the conductive roll which rotates in contact with the edge of the strip and is produced and continuously supplied with metal ions. It grows by (magnetic sludge).

These metal ions are grown to chips with high hardness, which causes bending marks on the surface of conductive rolls when switching from zinc-nickel plated steel strips to wide strips, resulting in poor product quality and poor contact between metal strips and conductive rolls. In this case, defects in arc spots due to poor energization are generated.

In addition, due to the huge labor and frequent interruptions to remove chips, product production is disrupted, and time is lost due to chip removal.

In addition, there is a problem that the chip is placed on the surface of the conductive roll in contact with the zinc-nickel plated steel sheet to excessively wear the conductive roll having a rubber coating layer to reduce the life of the conductive roll.

Accordingly, the present invention has been made to solve the above problems, the surface of the conductive roll to prevent the occurrence of scratch defects of the strip by initially removing the foreign matter adhering to the conductive roll surface, and finely cleaning the roll surface Its purpose is to provide a foreign material removal device.

1 is a schematic view showing a general conductive roll,

2 and 3 are a side view and a plan view showing a state in which the surface foreign matter removing apparatus of the conductive roll according to the present invention is installed on the conductive roll;

Figure 4 is a perspective view of a part of the conductive roll surface foreign matter removal apparatus according to the present invention,

5 is a block diagram of FIG. 4 according to the present invention.

Explanation of symbols on the main parts of the drawings

10: main frame 20: driving roll

21,22: Pulley 23: Chain

30: brush roll 40: rotation axis

41: rotating member 50: fixed bar

51,56,61,66,76: Elastic spring 52: Bracket

53: pressure plate 54: operation bar

57: Cam Roll 58: Cam

59: camshaft 60: housing

62: touch stand 63: air cushion

64: removal edge 65: hole

70: guide holder 71: guide bar

73: fixing bracket 74: polishing pad

75: slit 78: auxiliary touch stand

80: drive cylinder

In order to achieve the above object, the conductive roll surface foreign material removing apparatus of the present invention may include: a removal unit for removing metallic foreign matter adhered to the conductive roll surface and attached to the conductive roll surface, and a fine chip attached to the conductive roll surface. A chip removing portion for removing, and a brush portion for brushing off the conductive roll surface.

In addition, the present invention further includes a driving means for transmitting power to the respective components.

The driving means is preferably made of a driving roll in contact with the surface of the conductive roll so as to use the rotational force of the conductive roll and a pulley and a chain for transmitting the rotational force of the driving roll.

Here, the brush unit may include a brush roll installed on the main frame moving to one side of the conductive roll.

In addition, the removal unit may be made of a removal blade in close contact with the surface of the conductive roll at a predetermined pressure.

The chip removing unit may include a polishing cloth that is in close contact with the surface of the removal roll after the large lump of foreign matter is removed by the removing unit.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic view showing a general conductive roll.

According to the above drawings, the conductive roll 110 has a lower portion deposited in the plating bath 100 in which the electrolyte is contained, so that the strip 150 spanning the conductive roll 110 may be deposited in the solution in the plating bath 100. It is supposed to be. In addition, since the positive electrode plate 120 is installed in the plating bath 100, when a current flows into the conductive roll, the strip closely contacted with the conductive roll is charged with the negative electrode, and the positive electrode plate electrolytically dissolves the electrolyte, so that the zinc cation to be electrodeposited in the electrolyte. Electrode is plated and plated on the strip charged with this cathode.

2 and 3 are a side view and a plan view showing a state in which the surface foreign matter removing device of the conductive roll according to the present invention is installed on the conductive roll, and FIG. 4 is a perspective view of a part of the conductive roll surface foreign material removing apparatus according to the present invention. 5 is a configuration diagram of FIG. 4 according to the present invention.

According to the drawings, the foreign material removing apparatus of the present invention is lowered to the top of the conductive roll 110, that is, the conductive roll 110 between the strips 150 in accordance with the stretching operation of the main cylinder 11 installed on the top. Frame 10, the drive roll 20 is installed on the main frame 10 is in close contact with the surface of the conductive roll 110, the driving roll is installed on the main frame 10 and the rotation of the conductive roll 110 ( Brush portion for brushing off the foreign matter on the surface of the conductive roll 110 by applying the rotational force of 20, Removal unit for removing the foreign matter attached to the surface of the conductive roll 110 by applying the rotational force of the drive roll 20 and And a chip removing unit for removing the microchip on the surface of the conductive roll 110 remaining after being removed by the removing unit.

The main frame 10 is the lower frame 12 is bent in the same way as the curved surface of the conductive roll 110, so that when the entire approach to the surface of the conductive roll 110, each component installed in the lower frame 12 is The conductive roll 110 can be evenly contacted.

First, the driving roll 20 is axially coupled to the lower frame 12 in the longitudinal direction of the conductive roll 110, and the lower surface protrudes slightly lower than the lower frame 12 so that the lower frame 12 is conductive. When approaching the roll 110 is in close contact with the surface of the conductive roll 110.

And in order to transmit the rotational force of the drive roll 20, as shown in Figure 3, the drive shaft 20 is provided with a drive pulley 21 is installed on the rotating shaft and the driven shaft pulley 22 is installed on the rotating shaft of each component Each pulley has a structure connected via a chain 23.

Therefore, when the driving roll 20 is rotated along the conducting roll 110, power is transmitted to each component through the pulley and the chain 23 to perform the brush work and the foreign matter removal work.

The brush part is installed in the longitudinal direction of the conductive roll 110 at the outermost end of the lower frame 12 is made of a brush roll 30 in contact with the surface of the conductive roll 110 when the main frame 10 is lowered.

As mentioned, the driven pulley 22 is installed on the rotating shaft of the brush roll 30 and connected to the driving pulley 21 via the chain 23 to be rotated.

Reference numeral 31 is a bracket on which the brush roll 30 and the driving roll 20 are supported.

In addition, the removal unit receives the power from the driving roll 20 to periodically impact the surface of the conductive roll 110 to remove the foreign material slightly larger in size, the length of the conductive roll 110 in the lower frame 12 Rotating shaft 40 which is installed in the direction, and the rotating member 41 is axially coupled to the rotating shaft 40 to be rotated up and down, the free end of the rotating member 41 is installed when the falling roll 110 Impact means for removing the foreign matter and impact on the surface and the lifting means for lifting up and down the rotation member 41 receives the rotational force of the drive roll (20).

Looking at the lifting means as shown in Figure 4 fixed bar 50 fixed to the rotating shaft 40, and the elastic spring (51) elastically installed between the fixed bar 50 and the rotating member (41) ), The pressing plate 53, which is supported inside the bracket 52 installed on the lower frame 12, is placed vertically on the pressing plate 53, and vertically fixed to the pressing plate 53, and penetrates the bracket 52. The operating bar 54 is extended to the upper portion, the operating bar 54, the elastic spring 56 is elastically installed between the upper flange 55 and the upper end of the bracket 52, which is installed on the operating bar 54 Cam roll 57, a cam 58 engaged with the cam roll 57, a cam shaft 59 is fixedly installed and rotatably mounted to the main frame 10, this cam shaft 59 It is installed in the drive pulley 21 and the chain includes a driven pulley 22 connected to.

Accordingly, when the cam 58 is rotated, the operating roll 54 is moved up and down while the cam roll 57 follows the gradient of the cam 58 to raise and lower the rotating member 41.

In addition, the impact means includes a housing 60 which is installed at the free end of the pivot member 41, and a touch table 62 which is installed at the lower end of the housing 60 so as to be lifted and lowered via a spring 61. In addition, the air cushion 63 is installed in the touch stand 62, and the removal blade 64 is installed in the longitudinal direction of the conductive roll 110 along a predetermined interval on the bottom surface of the touch stand 62.

The removal blade 64 is installed so as to be lifted and lowered in the hole 65 formed in the touch stand 62, and the elastic spring 66 is inserted into the hole 65 to apply an elastic force to the removal blade 64. It is.

In addition, the touch stand 62 is curved in an arc shape, and is supported by a chip removing unit to the outside, which will be described later.

Preferably, the removal blade 64 is bent in the opposite direction of rotation of the conductive roll 110 to facilitate removal, so that the blade forms a line.

Therefore, when the rotating member 41 is raised and lowered, the removal blade 64 selectively hits the conductive roll 110 to remove foreign substances attached to the surface of the conductive roll 110 and at this time with the conductive roll 110. The impact is mitigated by a spring 61 installed in the housing 60, an air cushion 63 inside the touch stand 62, and an elastic spring 66 mounted on the removal blade 64.

On the other hand, the chip removing unit is installed on the guide bar 70 and the guide bar 71, the guide bar 71, which is installed in the upper and lower ends of the guide holder 70 installed at both ends of the housing 60, and separated Polishing pad which is installed under the upper flange 72, the fixing bracket 73 is installed at the bottom of the guide bar 71, the both fixing brackets 73 to the lower portion of the touch stand 62 to prevent (74), the slit 75 is cut in the longitudinal direction to the polishing pad 74, the removal blade 64 is protruding, and the elastic spring elastically installed between the fixing bracket 73 and the outer peripheral surface of the housing (60) 76).

Unexplained reference numeral 67 is an air inlet for injecting air into the air cushion 63, and reference numeral 77 is an installation bracket for fixing the polishing pad 74 to the fixing bracket.

In this case, it is preferable to further install the auxiliary touch stand 78 with the slit 75 formed between the polishing pad 74 and the touch stand 62.

According to the present embodiment, as shown in Fig. 2 and 3, two rotating shafts 40 are installed on one main frame 10, and one removal unit at each end of one rotating shaft 40 is provided. It can be seen that and the chip removal portion and the remaining rotation shaft 40 is provided with a pair of removal portion and chip removal portion at each end, respectively, because each structure is the same, the rest of the description will be replaced by the above description.

On the other hand, the removal unit and the chip removal unit may vary the position in the conductive roll 110 according to the width of the strip 150, for this purpose, as shown in Figure 3 on the lower frame 12 The driving cylinder 80 connected to the coaxial 40 is installed, and the rotating shaft 40 moves forward and backward as the expansion and contraction operation of the driving cylinder moves the rotating member 41 installed on the rotating shaft 40. The removal part and the chip removal part installed in the member 41 may move to a position corresponding to the edge part of the strip 150.

Hereinafter will be described the operation of the present invention.

When the width of the strip 150 proceeds to the conductive roll 110 or when the surface defects are generated by chip generation, it is possible to operate the device through a switch operation of the control panel so that foreign matters on the surface of the conductive roll 110 may occur. Will be removed.

According to the switch signal, the main cylinder 11 is extended to lower the main frame 10 connected to the main cylinder 11, and the main frame 10 descends to the surface of the conducting roll 110 to lower the frame ( 12) is as close to the conductive roll 110 as possible.

When the main frame 10 is lowered in this way, the driving roll 20 on which the lower frame 12 is installed is in close contact with the surface of the conductive roll 110, and the brush roll 30 installed on the lower frame 12 also has the surface of the conductive roll 110. Is in contact with.

If the conductive roll 110 is continuously rotated in this state, the driving roll 20 in close contact with the surface of the conductive roll 110 also rotates together with the conductive roll 110, and the rotational force of the driving roll 20 is driven by the driving roll 20. It is transmitted to the driven pulley 22 of each component via the drive pulley 21 and the chain 23 installed on the rotating shaft of the) to operate the component.

First, referring to the operation of the removal unit, the driven pulley 22 installed on the cam shaft 59 of the removal unit is connected to the drive pulley 21 via a chain 23 to receive the rotational force of the drive roll 20. As the cam shaft 59 rotates, the cam 58 installed on the cam shaft 59 rotates, and the cam roll 57 which is in contact with the cam 58 moves along the gradient of the cam 58 to form a cam roll ( Raise and lower the operating bar 54 is installed 57.

That is, when the cam roll 57 proceeds to the top dead center of the cam 58, the cam roll 57 descends to lower the operating bar 54. When the cam roll 57 moves to the bottom dead center of the cam 58, the operating bar 54 is pressed. The operating bar 54 rises again according to the return force of the elastic spring compressed between the 54 and the bracket. As the cam shaft 59 continues to rotate, the operating bar 54 moves up and down. It will continue.

As the operating bar 54 moves up and down, the pressing plate 53 installed on the lower side of the operating bar 54 presses the rotating member 41 which is in contact with the lower side, so that the rotating member 41 is centered on the rotating shaft 40. Is rotated down.

At this time, when the rotating member 41 is rotated downward, the elastic spring 61 elastically installed between the rotating member 41 and the fixed bar 50 is compressed, and again according to the repeated descending movement of the operating bar 54. When the operating bar 54 is lifted up, the pressing plate 53 is also lifted to release the pressed state of the rotating member 41, and the rotating member 41 is caused by the elastic return force of the compressed elastic spring 61 as described above. It will be rotated up again and lifted up.

The lifting and lowering motion of the pivot member 41 is repeatedly operated in conjunction with the lifting and lowering motion of the operation bar 54 according to the rotation of the cam 58.

As the rotating member 41 is repeatedly moved up and down, the removal part installed at the free end of the rotating member 41 repeatedly contacts the surface of the conductive roll 110 to remove foreign substances and fine chips on the surface of the conductive roll 110. Done.

That is, the touch stand 62 elastically installed at the lower portion of the housing 60 of the remover has a removal blade 64 protruding from the lower portion thereof, so that the slit 75 formed on the auxiliary touch stand 78 and the polishing pad 74 is removed. When the housing 60 is lowered as the pivot member 41 descends while the end of the removal blade 64 protrudes downward, the removal blade 64 exerts an impact on the surface of the conductive roll 110. In addition, the foreign matter attached to the surface of the conductive roll 110 is removed by the removal blade 64 while the conductive roll 110 rotates.

At this time, as the removal blade 64 is in contact with the conductive roll 110, the impact applied to the conductive roll 110 is the elastic spring 66 between the touch stand 62 and the removal blade 64 is installed. Elastic force by the elastic force of the elastic spring 61 installed between the touch stand 62 and the housing 60 and the air cushion 63 installed inside the touch stand 62, To prevent damage.

On the other hand, after the impact of the removal blade 64 and the removal of foreign matters by the removal blade 64 is first performed fine chip removal by the polishing pad 74, the removal blade 64 is first conducted As the rotating member 41 descends after contacting the roll 110, the conductive roll 110 enters inward through the slits 75 formed on the teeth 62 and the polishing pad 74 from below, and thus the polishing pad ( 74 is in contact with the surface of the conductive roll (110).

Therefore, the secondary microchip removal operation by the polishing pad 74 is made.

In this way, the removal blade 64 first removes the foreign matter from the surface of the conductive roll 110 while the rotating member 41 is completed, and the removal blade 64 continues to fall when the rotating member 41 descends. Pressed by the (110) while pressing the elastic spring 66 is inserted into the touch stand 62 and the polishing pad 74 is in contact with the conductive roll 110 surface to remove the fine chips that were not removed by the removal blade 64 It will be removed continuously.

When the rotating member 41 is raised again, the removal blade 64 protrudes out of the polishing pad 74 through the slit 75 by the elastic force of the spring 66.

As the lifting member 41 moves up and down, the foreign matter removal operation by the removal blade 64 and the polishing pad 74 as described above is repeatedly performed to remove the chips attached to the surface of the conductive roll 110.

The foreign substances thus removed are dropped from the conductive roll 110, and foreign substances such as microchips that fall from the conductive roll 110 and adhere to the surface of the conductive roll 110 are surfaced by the brush roll 30. Eliminated

The brush roll 30 is positioned at the end of the lower frame 12 in the rotational direction of the conductive roll 110 to brush the surface of the conductive roll 110 through the removal portion and the chip removal portion.

The rotational force of the brush roll 30 is transmitted through the drive pulley 21 installed on the drive roll 20 and the driven pulley 22 installed on the rotating shaft of the brush roll 30 and the chain 23 connecting each pulley. do.

On the other hand, according to the width of the strip 150, the portion of the strip 150 edge contacting the conductive roll 110 may be different, and in this case, by rotating the drive cylinder connected to the rotating shaft 40 installed by rotating the shaft 40 The position of the rotating member 41 installed in the) can be finely adjusted, and thus foreign substances can be removed as a whole against the surface of the conductive roll 110.

According to the conductive roll surface foreign material removal device of the plated steel sheet manufacturing process according to the present invention as described above, it is possible to effectively remove the metallic foreign substances, chips, etc. adhered to the conductive roll surface, the plated steel sheet by the metal dust and metal chips It is effective to prevent dents and bending defects generated in the product, thereby increasing the quality of the product.

In addition, the mechanical removal of the metallic foreign matter has the advantage of reducing the time and effort required for the removal operation.

In addition, it is possible to remove the foreign matter in the line work state has the effect of maximizing the production capacity.

Claims (4)

A main frame which is lowered to the surface of the conductive roll according to the expansion and contraction operation of the main cylinder installed at the upper portion; A driving roll installed on the main frame and in close contact with the conductive roll surface; It is installed in the lower frame of the main frame in the longitudinal direction of the conducting roll and connected to the driving roll through the pulley and the belt, and the rotating member pivotally coupled to the rotating shaft and installed at the free end of the rotating member. It is attached to the surface of the conductive roll, including impact means for removing the foreign matter and impact on the surface of the conductive roll during the lowering and lifting and lowering means for raising and lowering the rotating member by receiving the rotational force of the driving roll Removal unit for removing the foreign matter; The brush unit is installed on the lower frame and a brush roll for contacting the conductive roll and connected to the driving roll via a pulley and a belt, to brush off the foreign matter removed from the removal unit. Conductive roll surface foreign matter removal device of the plated steel sheet manufacturing process comprising a. The method of claim 1, wherein the impact means is a housing installed at the free end of the rotating member, the touch base which is installed to be lowered via a spring via the housing, the air cushion installed inside the touch base, Conductive roll surface debris removal device of the plated steel sheet manufacturing process including a removal blade which is installed in the longitudinal direction of the conductive roll along the predetermined distance on the bottom of the touch stand. According to claim 1, wherein the elevating means is fixed to the rotating shaft, the elastic spring elastically installed between the fixed bar and the rotating member, is supported on the inside of the bracket installed on the lower frame is placed on the rotating member An operating bar vertically fixed on the pressing plate and the pressing plate and extending upward through the bracket, an elastic spring elastically installed between the operating bar upper flange and the upper end of the bracket, a cam roll installed on the operating bar, and the cam roll. Removes foreign substances on the conductive roll surface of the plated steel sheet manufacturing process including a cam engaged with the cam shaft, a cam shaft fixedly installed and rotatably installed on the main frame, and a driven pulley installed on the cam shaft and connected to the driving pulley and the chain. Device. According to claim 1, The guide holder is installed at both ends of the housing provided at the free end of the rotating member and the guide bar is installed through the guide holder to move up and down, the upper flange is installed on the top of the guide bar to prevent separation, A fixing bracket installed at a lower end of the guide bar, a polishing pad disposed on both lower fixing brackets, and a slit in which the removal blade is protruded by being cut in the longitudinal direction to the polishing pad, and the fixing bracket; Conductive roll surface debris removal device of the plated steel sheet manufacturing process further comprising a chip removing unit for removing the microchip of the conductive roll surface, including an elastic spring elastically installed between the outer peripheral surface of the housing.