KR20040023450A - The structure of laser diode and the manufacturing method for laser pointer - Google Patents

Abstract

PURPOSE: A laser diode structure for use in a laser pointer and a method for manufacturing the same are provided to reduce the manufacturing cost by simplifying the manufacturing processes with changing the laser diode manufacturing process. CONSTITUTION: A laser diode structure for use in a laser pointer includes a sub-mount photodiode complex chip(1), a laser diode chip(2), a gold wire(3) and a stem(4). The laser diode structure is characterized in that a collimating lens, a supporting member and a laser diode among a conventional laser pointer are integrated with one by simplifying the processes with applying a new chip in place of the conventional laser diode chip construction.

Description

STRUCTURE OF LASER DIODE AND THE MANUFACTURING METHOD FOR LASER POINTER}

To change the manufacturing method of the laser diode, to lower the manufacturing cost in manufacturing the laser pointer, and to easily induce the application in the module.

The present invention relates to a structure of a laser diode for light pointer and a method of manufacturing the same. In particular, as in the structure of FIG. 1a, a complicated process in the fabrication of a conventional laser pointer is changed to the structure of FIG. 1b of the present invention. By changing the manufacturing method of the diode, it is possible to reduce the laser diode manufacturing cost and to supply a low-cost laser pointer.

The conventional laser pointer structure adjusts the direction of the laser light, the module part (circuit part), the laser diode, the light path mechanism that adjusts the distance from the light source to the focus lens, and allows the light source and the focus lens to be in a straight line, and is dispersed. It consists of a collimating lens that collects light into one point. The laser diode applied to the conventional laser pointer is manufactured as shown in FIG. 2A in the order specified in FIG. 3 to have a laser pointer structure as shown in FIG. 1A. On the other hand, according to the present invention by combining the conventional instrument and the focus lens into a single instrument

The biggest difference between the conventional laser pointer and the laser diode applied to the laser pointer of the present invention is to shorten the process of the laser pointer manufacturing process and to lower the laser diode manufacturing cost.

The present invention is intended to simplify the manufacturing complexity of the conventional laser pointer manufacturing process, the object of the present invention, in the process of manufacturing a laser diode conventional silicon or silicon carbide (Silicon Carbide) submount and photodiode To separate the submount and photodiode in the 90 ° direction as shown in FIG. 2A, and to integrate the chipset by making the silicon submount unit and the photodiode into a composite chip as shown in FIG. By simplifying the structure and the process, and by applying the epoxy mold process designed in the lens of Figure 3b instead of the cans of Figure 3a to reduce the manufacturing step in the future laser pointer assembly, it is possible to manufacture the ultra-low cost laser pointer.

Figure 1a is a laser pointer structure according to the prior art

1b is a laser pointer structure according to the present invention

Figure 2a is a structure diagram of a laser diode according to the prior art

2b is a diagram illustrating the internal structure of a laser diode according to the present invention;

Figure 3a is a laser diode manufacturing process according to the prior art

Figure 3b is a laser diode manufacturing process chart according to the present invention

Figure 4a is a complete laser diode manufacturing according to the prior art

Figure 4b is a complete laser diode manufacturing in accordance with the present invention

<Explanation of symbols about main part of drawing>

1: submount photodiode composite chip 2: laser diode chip

3: gold wire 4: stem 5: photodiode chip

6 submount 7 power supply module 8 condenser lens support mechanism

9 Condensing Lens 10 Epoxy Package 11 Lens Part

Hereinafter, preferred embodiments of the present invention will be described based on the accompanying drawings.

Figure 3b is a manufacturing process of the laser diode in one embodiment of the present invention.

Mounting the submount-photodiode composite chip on the block surface of the stem, as shown in FIG. 3B;

Mounting a laser diode chip on the submount photodiode composite chip;

Connecting the bonding pads of the submount-photodiode composite chip and the blocks of the stems and the leads of the stems with gold wires, and the bonding pads of the laser diode chip and the leads of the stems with gold wires;

Molding a portion of the formed chipset and stem with an epoxy resin.

That is, the present invention can innovatively simplify the manufacturing process of the user by changing the configuration of the chipset and the sealing method to the epoxy molding method to manufacture the laser diode for the pointer.

By changing the laser diode manufacturing process, the raw material cost and manufacturing process can be simplified to lower the manufacturing cost, and the laser pointer manufacturing process can be simplified to mass-produce the low cost laser pointer.

Claims (3)

Process of molding conventional cans with epoxy resin The conventional method in the configuration of the focusing lens (Collimating lens) is fixed using a mechanism, but according to the present invention the process of condensing the laser by forming a lens at the end of the package in the epoxy molding process instead of the cans 2A integrated structure of a laser diode chip, a submount, and a photodiode composite chip that change the internal structure of the laser diode from the internal structure of FIG. 2A to the structure of FIG. 2B