KR20040022973A - Liquid crystal display package - Google Patents

Liquid crystal display package Download PDF

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Publication number
KR20040022973A
KR20040022973A KR1020020054581A KR20020054581A KR20040022973A KR 20040022973 A KR20040022973 A KR 20040022973A KR 1020020054581 A KR1020020054581 A KR 1020020054581A KR 20020054581 A KR20020054581 A KR 20020054581A KR 20040022973 A KR20040022973 A KR 20040022973A
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KR
South Korea
Prior art keywords
liquid crystal
crystal display
substrate
reflective liquid
display package
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KR1020020054581A
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Korean (ko)
Inventor
성기범
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삼성에스디아이 주식회사
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Priority to KR1020020054581A priority Critical patent/KR20040022973A/en
Publication of KR20040022973A publication Critical patent/KR20040022973A/en

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133553Reflecting elements
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133354Arrangements for aligning or assembling substrates
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/34Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 reflector
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2203/00Function characteristic
    • G02F2203/02Function characteristic reflective

Abstract

PURPOSE: A reflection type liquid crystal display package is provided to prevent the liquid crystal display package from being damaged due to thermal stress. CONSTITUTION: A reflection type liquid crystal display package(10) includes a reflective liquid crystal display(16) and a cap connector(20). The reflective liquid crystal display has a semiconductor substrate(12) and a transparent substrate(14) on which a transparent conductive layer(18) is formed. The semiconductor substrate and the transparent substrate are combined with each other. The cap connector is provided on the side of the transparent substrate and electrically connected to the transparent substrate. The reflective liquid crystal display is composed of liquid crystal on silicon. The cap connector includes a housing(22) having a substrate inserting part(24) into which the side of the transparent substrate is inserted, and a conductor(26) that is provide at the inner side of the substrate inserting part and comes into contact with the transparent conductive layer.

Description

반사형 액정 디스플레이 패키지{LIQUID CRYSTAL DISPLAY PACKAGE}Reflective Liquid Crystal Display Package {LIQUID CRYSTAL DISPLAY PACKAGE}

본 발명은 반사형 액정 디스플레이 패키지에 관한 것으로서, 보다 상세하게는 반도체 기판 위에 액정 셀을 형성한 소위 엘코스(LCOS; Liquid Crystal On Silicon, 이하 'LCOS'라 한다)로 불리우는 반사형 액정 디스플레이 패키지에 관한 것이다.The present invention relates to a reflective liquid crystal display package, and more particularly, to a reflective liquid crystal display package called liquid crystal on silicon (LCOS), in which a liquid crystal cell is formed on a semiconductor substrate. It is about.

상기 LCOS는 통상의 액정 디스플레이와 달리 반도체 기판과 투명 기판 사이에 액정을 주입한 것으로서, 각 픽셀의 구성 요소와 스위칭 회로를 고집적으로 배치하여 대략 1인치 정도의 소형 크기로 XGA급 이상의 고해상도를 실현할 수 있으며, 최근 들어 프로젝션 시스템의 디스플레이로 주목을 받고 있다.Unlike conventional liquid crystal displays, the LCOS is a liquid crystal injection between a semiconductor substrate and a transparent substrate. The LCOS is highly integrated with elements and switching circuits of each pixel. In recent years, the display of the projection system has attracted attention.

상기한 LCOS는 대략 50개 정도의 반도체 기판이 정렬된 웨이퍼에 투명 기판을 일체로 조립하고, 조립된 웨이퍼와 투명 기판을 절단하여 개개의 LCOS 셀로 분리한 다음, 각각의 LCOS 셀에 액정을 주입하는 과정으로 제작되며, 완성된 LCOS 셀은 프레임에 실장되어 LCOS 패키지를 구성한다.In the LCOS, a transparent substrate is integrally assembled on a wafer having approximately 50 semiconductor substrates aligned, the assembled wafer and the transparent substrate are cut and separated into individual LCOS cells, and then liquid crystal is injected into each LCOS cell. Produced in the process, the completed LCOS cell is mounted in a frame to form an LCOS package.

도 1은 종래 기술에 따른 LCOS 패키지의 단면도로서, LCOS 패키지(100)는 LCOS 셀(102)과, LCOS 셀(102)을 고정시키는 프레임(104)을 포함한다. 상기한 LCOS 셀(102)은 다수의 금속 패드(106)가 구비된 반도체 기판(108)과 투명 기판(110)이 조립되어 이루어지며, 프레임(104)에는 다수의 본딩 리드(112)가 구비되고, 금속 패드(106)와 본딩 리드(112)는 다수의 본딩 와이어(114)에 의해 연결된다.1 is a cross-sectional view of an LCOS package according to the prior art, wherein the LCOS package 100 includes an LCOS cell 102 and a frame 104 that secures the LCOS cell 102. The LCOS cell 102 is composed of a semiconductor substrate 108 having a plurality of metal pads 106 and a transparent substrate 110 assembled therein, and a plurality of bonding leads 112 are provided at the frame 104. The metal pads 106 and the bonding leads 112 are connected by a plurality of bonding wires 114.

이러한 구성의 LCOS 패키지에 있어서, 투명 기판(110)의 내면에는 투명 도전막(116)이 제공되는데, 이 도전막(116)에도 외부 전원이 공급되어야 한다. 따라서, 종래에는 도시한 바와 같이 ITO 또는 EPOXY와 같은 전도성 접착제(118)를 이용하여 투명 도전막(116)에 전원을 공급하거나, Silicon과 같은 전도성 금속 기둥과 시임(shim)을 이용하여 전원을 공급하는 방식을 사용하였다.In the LCOS package having such a configuration, a transparent conductive film 116 is provided on the inner surface of the transparent substrate 110, and an external power source must also be supplied to the conductive film 116. Therefore, in the related art, power is supplied to the transparent conductive film 116 by using a conductive adhesive 118 such as ITO or EPOXY, or by using a conductive metal pillar such as silicon and shim. The method was used.

그런데, 상기한 구성의 LCOS 패키지에 있어서, ITO 및 Epoxy는 열경화성 물질이므로, 열경화시의 열 스트레스로 인해 LCOS 셀이 손상될 우려가 있으며, 열경화에 일정한 시간이 소요됨으로 인해 작업 시간이 증가되며, 작업 공간 협소로 인해 작업이 용이하지 않은 문제점이 있다.By the way, in the LCOS package of the above configuration, since ITO and Epoxy are thermosetting materials, there is a risk that the LCOS cell is damaged due to thermal stress during thermal curing, and the working time is increased due to the constant time required for thermal curing. However, there is a problem that the work is not easy due to the narrow working space.

이에 본 발명은 상기한 문제점을 해결하기 위한 것으로, 본 발명은 작업 시간의 단축이 가능하고, 열 스트레스로 인한 손상을 방지할 수 있는 반사형 액정 디스플레이 패키지를 제공함을 목적으로 한다.Accordingly, the present invention is to solve the above problems, an object of the present invention is to provide a reflective liquid crystal display package that can shorten the working time, and can prevent damage due to thermal stress.

상기한 본 발명의 목적은,The object of the present invention described above,

반도체 기판과, 상기 반도체 기판과 조립되며 내면에는 투명 도전막이 제공되는 투명 기판을 포함하는 반사형 액정 디스플레이와;A reflective liquid crystal display comprising a semiconductor substrate and a transparent substrate assembled with the semiconductor substrate and provided with a transparent conductive film on an inner surface thereof;

상기한 투명 기판의 측면에 설치되며, 투명 도전막에 전기적으로 연결되는 캡형 커넥터;A cap connector installed on a side of the transparent substrate and electrically connected to the transparent conductive film;

를 포함하는 반사형 액정 디스플레이 패키지에 의해 달성된다.It is achieved by a reflective liquid crystal display package comprising a.

본 발명의 바람직한 실시예에 의하면, 상기한 반사형 액정 디스플레이는 LCOS로 이루어지며, 상기 캡형 커넥터는 투명 기판의 측면이 삽입되는 기판 삽입부를 구비하는 하우징과, 상기 기판 삽입부의 내면에 제공되어 상기한 투명 도전막과 접촉되는 Au 등의 전도체를 포함한다. 이때, 상기 전도체는 투명 도전막과의 확실한 접촉을 위해 스프링 구조로 제공할 수 있으며, 하우징은 2개의 분할체로 구성할 수도 있다.According to a preferred embodiment of the present invention, the reflective liquid crystal display is made of LCOS, and the cap connector is provided on the inner surface of the substrate insert and a housing having a substrate insert into which a side of the transparent substrate is inserted. And a conductor such as Au in contact with the transparent conductive film. At this time, the conductor may be provided in a spring structure for reliable contact with the transparent conductive film, the housing may be composed of two divided bodies.

도 1은 종래 기술에 의한 반사형 액정 디스플레이 패키지의 단면도.1 is a cross-sectional view of a reflective liquid crystal display package according to the prior art.

도 2는 본 발명의 일실시예에 의한 반사형 액정 디스플레이 패키지의 단면도.2 is a cross-sectional view of a reflective liquid crystal display package according to an embodiment of the present invention.

도 3은 본 발명의 다른 실시예에 의한 반사형 액정 디스플레이 패키지의 단면도.3 is a cross-sectional view of a reflective liquid crystal display package according to another embodiment of the present invention.

이하, 첨부도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명의 일실시예에 따른 커넥터를 갖는 반사형 액정 디스플레이 패키지(이하, 편의상 'LCOS 패키지'라 한다)를 도시한 것이다.2 illustrates a reflective liquid crystal display package having a connector according to an embodiment of the present invention (hereinafter, referred to as an "LCOS package" for convenience).

본 발명의 LCOS 패키지(10)는 액정층(미도시함)을 사이에 두고 반도체 기판(12)과 투명 기판(14)이 조립된 LCOS 셀(16)을 포함한다. 물론, 도시하지는 않았지만, 상기 LCOS 셀을 지지하는 프레임 또는 구동 회로 기판을 포함하는 것은 자명하다.The LCOS package 10 of the present invention includes an LCOS cell 16 in which a semiconductor substrate 12 and a transparent substrate 14 are assembled with a liquid crystal layer (not shown) therebetween. Of course, although not shown, it is obvious to include a frame or drive circuit board that supports the LCOS cell.

여기에서, 상기 투명 기판(14)의 내면에는 전술한 바와 같이 투명 도전막(18)이 제공되는데, 본 발명에서는 상기 투명 도전막(18)에 외부 전원을 공급하기 위해 캡형 커넥터(20)를 구비한다.Here, a transparent conductive film 18 is provided on the inner surface of the transparent substrate 14 as described above. In the present invention, a cap-type connector 20 is provided to supply external power to the transparent conductive film 18. do.

본 실시예의 커넥터(20)는 도시한 바와 같이 수지재의 하우징(22)을 포함한다. 상기 하우징(22)은 투명 기판(14)의 측면을 삽입 고정하는 것으로, 기판 삽입부(24)를 구비한다. 도 2에는 하우징(22)의 양 측면이 개방된 상태로 도시되어 있지만, 하우징의 양 측면을 폐쇄 상태로 형성하는 것도 가능하다.The connector 20 of this embodiment includes the resin housing 22 as shown. The housing 22 inserts and fixes a side surface of the transparent substrate 14 and includes a substrate inserting portion 24. Although both sides of the housing 22 are shown in an open state in FIG. 2, it is also possible to form both sides of the housing in a closed state.

이러한 구성의 커넥터(20) 내부, 즉 기판 삽입부(24)의 내면에는 투명 기판(14)의 투명 도전막(18)과 접촉되는 전도체(26)가 구비되는데, 상기한 전도체(26)는 Au로 이루어질 수 있으며, 투명 도전막(18)과의 양호한 접촉을 위해 스프링 구조로 형성된다.Inside the connector 20, that is, the inner surface of the substrate inserting portion 24, a conductor 26 is provided in contact with the transparent conductive film 18 of the transparent substrate 14. The conductor 26 is formed of Au. It may be made of, and is formed in a spring structure for good contact with the transparent conductive film 18.

상기한 전도체(26)는 도시한 바와 같이 하우징(22)의 후벽을 통해 하우징(22)의 외부로 인출되며, 이 인출된 단부는 도시하지 않은 프레임 또는 구동 회로 기판의 전기 단자에 전기적으로 접속된다. 이를 위해, 상기 인출 단부에는 별도의 커넥터를 구비할 수도 있다.The conductor 26 is drawn out of the housing 22 through the rear wall of the housing 22 as shown, and the drawn end is electrically connected to an electrical terminal of a frame or drive circuit board, not shown. . To this end, the lead end may be provided with a separate connector.

상기한 구성을 갖는 커넥터(20)는 LCOS 셀(16)의 투명 기판(14) 측면을 삽입고정하는 간단한 작업에 의해 설치가 완료된다.The connector 20 having the above-described configuration is completed by a simple operation of inserting and fixing the side surface of the transparent substrate 14 of the LCOS cell 16.

도 3은 본 발명에 따른 캡형 커넥터의 다른 실시예를 도시한 것으로, 커넥터(20')의 외형을 구성하는 하우징(22')을 2개의 분할체(22'a,22'b)로 분할 구성하고, 상기한 각각의 분할체(22'a,22'b)를 힌지 결합하되, 토션 스프링(28)을 사용하여 상기 분할체(22'a,22'b)의 선단부가 텐션 지지되도록 구성한 것이다. 물론, 분할형 하우징(22')의 기판 삽입부(24') 내면에도 전도체(26')가 구비되어 있는 것은 당연하다.3 shows another embodiment of the cap-shaped connector according to the present invention, in which the housing 22 'constituting the external shape of the connector 20' is divided into two divided bodies 22'a and 22'b. The hinges are coupled to each of the partitions 22'a and 22'b, but the torsion springs 28 are used to tension the end portions of the partitions 22'a and 22'b. . Of course, the conductor 26 'is also provided on the inner surface of the substrate inserting portion 24' of the split housing 22 '.

이러한 구성의 커넥터(20')는 상기한 토션 스프링(28)의 사용으로 인해 전도체(26')와 투명 도전막(18)의 전기적 접촉을 더욱 확실하게 유지할 수 있으며, 조립시에는 토션 스프링(28)이 설치된 분할체(22'a,22'b)의 후단부를 눌러 선단부를 최대한 개방시킨 후 투명 기판(14)에 고정하면 조립이 완료되므로, 전술한 도 2의 실시예에 비해 커넥터 조립시에 발생할 수 있는 투명 도전막의 손상을 억제할 수 있는 효과가 있다.The connector 20 'of this configuration can more reliably maintain the electrical contact between the conductor 26' and the transparent conductive film 18 due to the use of the torsion spring 28 described above, and the torsion spring 28 during assembly. Assembly is completed by pressing the rear ends of the partitions 22'a and 22'b provided with the) and opening the front end as much as possible, and then fixing them to the transparent substrate 14, thus assembling the connector as compared to the above-described embodiment of FIG. There is an effect that can suppress damage to the transparent conductive film that may occur.

상기에서는 본 발명의 바람직한 실시예에 대하여 설명하였지만, 본 발명은 이에 한정되는 것이 아니고 특허청구범위와 발명의 상세한 설명 및 첨부한 도면의 범위 안에서 여러 가지로 변형하여 실시하는 것이 가능하고 이 또한 본 발명의 범위에 속하는 것은 당연하다.Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

이와 같이 캡형 커넥터를 갖는 본 발명에 따르면 투명 도전막에의 전기적 연결 작업이 용이하고, 열 스트레스로 인한 손상을 방지할 수 있는 효과가 있다.Thus, according to the present invention having a cap-type connector, the electrical connection to the transparent conductive film is easy, there is an effect that can prevent damage due to thermal stress.

또한, 투명 도전막에의 전기적 연결이 안정적으로 이루어져 불량율을 줄일 수 있으며, 공정단순화로 생산성을 높일 수 있다.In addition, since the electrical connection to the transparent conductive film is stable, defect rate can be reduced, and productivity can be increased by simplifying the process.

Claims (6)

반도체 기판과, 상기 반도체 기판과 조립되며 내면에는 투명 도전막이 제공되는 투명 기판을 포함하는 반사형 액정 디스플레이와;A reflective liquid crystal display comprising a semiconductor substrate and a transparent substrate assembled with the semiconductor substrate and provided with a transparent conductive film on an inner surface thereof; 상기한 투명 기판의 측면에 설치되며, 상기 투명 도전막에 전기적으로 연결되는 캡형 커넥터;A cap connector installed on a side of the transparent substrate and electrically connected to the transparent conductive film; 를 포함하는 반사형 액정 디스플레이 패키지.Reflective liquid crystal display package comprising a. 제 1항에 있어서, 상기 반사형 액정 디스플레이는 LCOS로 이루어지는 반사형 액정 디스플레이 패키지.The reflective liquid crystal display package according to claim 1, wherein the reflective liquid crystal display is made of LCOS. 제 1항에 있어서, 상기 캡형 커넥터는 투명 기판의 측면이 삽입되는 기판 삽입부를 구비하는 하우징과, 상기 기판 삽입부의 내면에 제공되어 상기한 투명 도전막과 접촉되는 전도체를 포함하며, 상기한 전도체는 하우징의 외부로 인출되는 반사형 액정 디스플레이 패키지.The method of claim 1, wherein the cap-shaped connector includes a housing having a substrate insert portion into which the side of the transparent substrate is inserted, and a conductor provided on the inner surface of the substrate insert portion to contact the transparent conductive film. Reflective liquid crystal display package drawn out of the housing. 제 3항에 있어서, 상기 하우징은 토션 스프링에 의해 힌지 결합된 2개의 분할체로 이루어지는 반사형 액정 디스플레이 패키지.The reflective liquid crystal display package according to claim 3, wherein the housing is composed of two partitions hinged by a torsion spring. 제 3항 또는 제 4항에 있어서, 상기 전도체는 Au로 이루어지는 반사형 액정디스플레이 패키지.The reflective liquid crystal display package according to claim 3 or 4, wherein the conductor is made of Au. 제 3항 또는 제 4항에 있어서, 상기 전도체는 기판 삽입부의 내면으로부터 돌출 형성된 스프링 구조로 제공되는 반사형 액정 디스플레이 패키지.The reflective liquid crystal display package according to claim 3 or 4, wherein the conductor is provided in a spring structure protruding from an inner surface of the substrate insert.
KR1020020054581A 2002-09-10 2002-09-10 Liquid crystal display package KR20040022973A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9756924B2 (en) 2013-12-06 2017-09-12 In Sang Jang Cosmetic mask

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9756924B2 (en) 2013-12-06 2017-09-12 In Sang Jang Cosmetic mask

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