KR20040016855A - Method for mounting electronic part on flexible printed wiring board and adhesive sheet for fixing flexible printed wiring board - Google Patents

Abstract

The flexible printed wiring circuit 4 is fixed to the pressure-sensitive adhesive layer surface of the fixing plate 6 having the pressure-sensitive adhesive layer on the surface thereof. Next, the electronic component is mounted on the flexible printed wiring circuit 4. Alternatively, the pressure-sensitive adhesive sheet 5 is first attached to the surface of the flexible printed wiring circuit 4 opposite to the surface on which the electronic component is to be mounted. After fixing the flexible printed wiring circuit 4 to the fixed plate 6 through the pressure-sensitive adhesive sheet 5, the electronic component is mounted on the surface of the flexible printed wiring circuit 4. In the pressure-sensitive adhesive sheet 5 for fixing the flexible printed wiring circuit 4 to the fixed plate 6, a pressure-sensitive adhesive layer is formed on at least one side of the porous substrate. The storage modulus (frequency: 1 Hz) of the pressure-sensitive adhesive layer is set in the range of 10 ³ to 10 ⁶ Hz at a temperature of 0 to 3O < 0 > C. A plurality of convex portions or holes may be formed on the surface of the pressure-sensitive adhesive layer.

Description

Mounting method of electronic component to flexible printed wiring board and adhesive sheet for fixing of flexible printed wiring board {METHOD FOR MOUNTING ELECTRONIC PART ON FLEXIBLE PRINTED WIRING BOARD AND ADHESIVE SHEET FOR FIXING FLEXIBLE PRINTED WIRING BOARD}

In the related art, when electronic wiring circuit boards are manufactured, various electronic components (e.g., ICs and capacitors) are used in mounting devices (e.g., Panasert (Matsushi Electric Industrial Co., Ltd.). Manufactured by Electric Industrial Co., Ltd.) can be automatically mounted on rigid substrates (glass plates, epoxy plates, etc.). In this method, the positional accuracy of the rigid substrate is important when the electronic component is mounted. Therefore, the rigid substrate is inserted between the conveying rails so as not to move and is usually transported.

On the other hand, in recent years, electronic components can be directly mounted (surface mounted) on the surface of the flexible printed wiring circuit (FPC) due to the progress in miniaturization and light weight of electronic devices. The FPC itself (substrate) is not robust. Thus, in the case where an FPC is used, the FPC is not securely fixed even though it is inserted between the conveying rails. Therefore, the positional accuracy of FPC is low. For this reason, the FPC is fixed to the fixed plate, for example by the method shown in Figs. 13A and 13B, and then the electronic component is mounted to the FPC. 13A and 13B are schematic diagrams illustrating typical examples of methods in the art for fixing FPCs. In the method shown in FIGS. 13A and 13B, a perforation 72a provided with an FPC position guide pin 72 on the surface of a mother board 6 (eg, a fixed plate made of aluminum) is provided on the FPC 4. FPC 4 is mounted. Next, the FPC 4 is an adhesive tape 9 (an adhesive tape used in the related art, such as an adhesive tape in which a polyimide film or a fluororesin film is used as a substrate and a pressure-sensitive adhesive layer is formed on one side of the substrate). It is fixed to the parent substrate 6 by using, which is attached to two to four places of each FPC 4 from above. Subsequently, the parent substrate fixing guide pins 71 are fitted to the perforations 71a provided in the mother substrate 6 so that the mother substrate 6 is fixed to the transporting fixing table 8. The mother substrate 6 is inserted between the conveyance rails. In this way, the electronic component is mounted on the FPC.

However, in the process of the art for mounting electronic components as shown in FIGS. 13A and 13B, each of the FPCs is fixed to the holding plate by fixing the edges of the FPC at two to four locations with adhesive tape. Thus, the fixed strength of the FPC is so low that a gap is created between the FPC and the fixed plate. As a result, the positional accuracy of the FPC when the electronic component is mounted on the FPC, in particular, the positional accuracy in the up / down direction is low. In addition, since the narrow adhesive tape is attached to each FPC in several places, a lot of effort and time are required for the attachment or detachment of the FPC, resulting in low workability.

Accordingly, an object of the present invention is a flexible print in which the FPC can be firmly fixed to the fixed plate while the FPC is easily attached to and detached from the fixed plate when the electronic component is mounted on the flexible printed wiring circuit (FPC). The present invention provides a method for mounting an electronic component on a wiring circuit.

Another object of the present invention is to provide a flexible printed wiring circuit in which an electronic component can be mounted to the FPC with high precision while the FPC is attached to and detached from the fixing plate with excellent workability when the electronic component is mounted to the FPC. The present invention provides a mounting method of an electronic component.

Still another object of the present invention is that even if the pressure-sensitive adhesive sheet is heated when the flexible printed wiring circuit (FPC) is easily attached to and detached from the fixing plate, and the electronic component is mounted on the flexible printed wiring circuit, It is to provide a pressure-sensitive adhesive sheet in which the degradation of properties is suppressed or prevented.

Summary of the Invention

The first invention provides a method of mounting an electronic component on a flexible printed wiring circuit. In the above method, when the electronic component is mounted on the surface of the flexible printed wiring circuit, the flexible printed wiring circuit is fixed to the surface of the pressure-sensitive adhesive layer of the fixing plate having the pressure-sensitive adhesive layer on the surface, and then the electronic component is flexible. It is mounted on the surface of the castle printed wiring circuit.

According to the first invention, there is provided a fixing plate having a pressure-sensitive adhesive layer on the surface, wherein the pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer on at least one side of the pressure-sensitive adhesive sheet is a pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet is a It is preferable that a fixing plate attached to one side of the fixing plate can be used so as to be located on the opposite side. In addition, it is preferable that the pressure-sensitive adhesive layer of the fixing plate to which the flexible printed wiring circuit is attached consists of a pressure-sensitive adhesive having good peelability.

The second invention provides a method of mounting an electronic component on a flexible printed wiring circuit. In the above method, when the electronic component is mounted on the surface of the flexible printed wiring circuit, the pressure-sensitive adhesive sheet is first attached to the surface of the flexible printed wiring circuit on the opposite side to the surface on which the electronic component is to be mounted. Thereafter, the flexible printed wiring circuit is fixed to the fixed plate via the pressure-sensitive adhesive sheet, and then the electronic component is mounted on the surface of the flexible printed wiring circuit.

According to the invention as in the second invention, a double-sided pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is formed on both sides of the substrate can preferably be used as the pressure-sensitive adhesive sheet. Porous substrates are preferably used as the substrate. In addition, acrylic pressure sensitive adhesives and / or silicone pressure sensitive adhesives are preferably used as pressure sensitive adhesives forming a pressure sensitive adhesive layer.

In addition, the present invention is used in a method of mounting an electronic component on a flexible printed wiring circuit, and a pressure-sensitive adhesive sheet for fixing the flexible printed wiring circuit to a fixed plate is provided on the opposite side of the surface on which the electronic component is to be mounted. It includes a flexible printed wiring circuit attached to the surface.

The third invention provides a pressure-sensitive adhesive sheet for fixing a flexible printed wiring circuit to a fixed plate when the electronic component is mounted on the surface of the flexible printed wiring circuit. The pressure sensitive adhesive sheet includes a porous substrate and a pressure sensitive adhesive formed on one or more sides of the porous substrate.

In the present invention, the porous substrate composed of the fibrous material is preferably used as the porous substrate. In addition, acrylic pressure sensitive adhesives and / or silicone pressure sensitive adhesives are preferably used as pressure sensitive adhesives forming a pressure sensitive adhesive layer.

The fourth invention provides a pressure-sensitive adhesive sheet for fixing the flexible printed wiring circuit to the fixed plate when the electronic component is mounted on the surface of the flexible printed wiring circuit. The pressure-sensitive adhesive sheet includes a substrate and a pressure-sensitive adhesive layer having a storage modulus (frequency: 1 Hz) in a range of 10 ³ to 10 ⁶ Pa at a temperature of 0 to 300 ° C. and formed on at least one side of the substrate.

In this invention, it is preferable that the tensile strength after mounting an electronic component is 5 N / 15 mm or more. In addition, the substrate is preferably a porous substrate.

The fifth invention provides a pressure-sensitive adhesive sheet for fixing a flexible printed wiring circuit to a fixed plate when the electronic component is mounted on the surface of the flexible printed wiring circuit. The pressure-sensitive adhesive sheet has a pressure-sensitive adhesive layer having a plurality of convex portions or holes formed on the surface thereof.

When the convex portion is formed on the surface of the pressure-sensitive adhesive layer, the convex portion is preferably a linear convex portion. Such linear convex portions may be formed by stripe coating. When the hole is formed on the surface of the pressure-sensitive adhesive layer, the hole is preferably formed by punching the surface of the pressure-sensitive adhesive layer. In addition, the pressure-sensitive adhesive layer may be formed on at least one surface of the sheet-like or film-like substrate having a melting point of 290 ° C or higher from the viewpoint of heat resistance at the time of IR heating or the like.

The present invention also provides an electronic component for flexible printed wiring after the flexible printed wiring circuit is fixed to the fixing plate through any pressure-sensitive adhesive sheet, as in the third and fourth inventions for fixing the flexible printed wiring circuit. A method of mounting an electronic component on a flexible printed wiring circuit, mounted on the surface of the circuit, is included.

The present invention provides a method of mounting an electronic component on a flexible printed wiring circuit (hereinafter referred to as "FPC"), wherein the FPC can be easily fixed to a fixed plate when the electronic component is mounted on the FPC, A method of mounting electronic components that can be mounted with high precision and automatically. In addition, the present invention provides a pressure-sensitive adhesive sheet in which the FPC is easily attached to or detached from the fixing plate, and even if the pressure-sensitive adhesive sheet is heated when the electronic component is mounted on the FPC, the deterioration in adhesive properties is suppressed or prevented. It is about.

1A to 1C are schematic views showing a state in which the FPC is attached to the fixing plate in the first embodiment, FIG. 1A is a plan view, FIG. 1B is a side view, and FIG. 1C shows a deformation view.

2A and 2B are schematic views showing a state in which the FPC is attached to the fixed plate in the second embodiment, Fig. 2A is a plan view, and Fig. 2B is a side view.

3 is a cross-sectional view showing an example of a pressure-sensitive adhesive sheet according to the present invention.

4 is a cross-sectional view showing another example of the pressure-sensitive adhesive sheet according to the present invention.

5 is a cross-sectional view showing still another example of the pressure-sensitive adhesive sheet according to the present invention.

6 is a cross-sectional view showing still another example of the pressure-sensitive adhesive sheet according to the present invention.

7 is a schematic view of the top of a pressure sensitive adhesive sheet for securing an FPC according to FIGS. 5 and 6.

8 is a cross-sectional view showing another example of the pressure-sensitive adhesive sheet according to the present invention.

9 is a cross-sectional view showing still another example of the pressure-sensitive adhesive sheet according to the present invention.

10 is a cross-sectional view showing still another example of the pressure-sensitive adhesive sheet according to the present invention.

FIG. 11 is a schematic view of the top of a pressure sensitive adhesive sheet for securing an FPC according to FIGS. 9 and 10.

It is sectional drawing which shows the other example of the pressure-sensitive adhesive sheet which concerns on this invention.

13A and 13B are schematic diagrams illustrating representative examples of methods in the art for fixing FPCs.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described, referring drawings when needed. 1A and 1B are schematic diagrams illustrating a first embodiment of a method for mounting an electronic component in an FPC according to the present invention. Specifically, FIGS. 1A and 1B are schematic views showing a state in which the FPC is attached to the fixing plate, FIG. 1A is a plan view, and FIG. 1B is a side view. 1A and 1B, reference numeral 4 denotes an FPC, 5 denotes a double-sided pressure-sensitive adhesive sheet provided with the substrate, 51 denotes an upper pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive sheet 5, 6 is a fixed plate 71 denotes a guide pin for fixing the parent substrate, 72 denotes a guide pin for adjusting the FPC position, 71a denotes an insertion hole for fitting to the guide pin 71 for fixing the parent substrate, and 72a denotes a guide pin for adjusting the FPC position Insertion puncture for fitting to 72 is shown, and 8 represents the transport holder. 1A and 1B, the double-sided pressure-sensitive adhesive sheet 5 is laminated on the front side or almost the front side of one side of the fixed plate 6, and the FPC 4 is the pressure-sensitive adhesive layer 51 of the double-sided pressure-sensitive adhesive sheet 5 It is attached to a predetermined part on (). More specifically, the double-sided pressure-sensitive adhesive sheet 5 is attached to one side of the fixing plate 6, but the FPC 4 uses the double-sided adhesive sheet 5 by using the guide pins 72 and perforations 72a for adjusting the FPC position. Is firmly attached to a predetermined portion of the pressure-sensitive adhesive layer 51 on the other side of the substrate. After that, the fixing plate 6 to which the FPC 4 is attached is fixed to the transfer holder 8 by using the guide pin 71 for fixing the mother substrate and the perforation 71a. In addition, the perforation 71a into which the parent substrate fixing guide pin 71 is inserted, and the perforation 72a into which the FPC position adjusting guide pin 72 is inserted, have a double-sided pressure-sensitive adhesive sheet 5 attached to the fixing plate 6. After lamination, it can be formed by perforating the combination of the double-sided pressure-sensitive adhesive sheet 5 and the fixed plate 6.

In this manner, in this embodiment, the FPC is mounted and attached to a predetermined portion of the surface of the pressure-sensitive adhesive layer of the fixed plate having the pressure-sensitive adhesive layer on the surface. Thus, the FPC can be easily fixed to the fixed plate. Also, when the FPC equipped with the electronic component is detached after the electronic component is mounted on the FPC, the FPC equipped with the electronic component is simply separated from the fixing plate having a pressure-sensitive adhesive layer on its surface. That is, no adhesive tape needs to be peeled off. Thus, the FPC can be fixed to or separated from the fixing plate with good workability.

In addition, since the lower surface of the FPC is fixedly secured to the fixed plate through the pressure-sensitive adhesive layer, the FPC can be firmly fixed to the fixed plate. Therefore, there is little or no gap between each FPC and the fixed plate (pressure-sensitive adhesive layer on the surface of the fixed plate). Therefore, when the electronic component is mounted on the FPC, there is no change of position in each FPC, and thus the electronic component can be mounted on the FPC with high positional accuracy.

2A and 2B are schematic diagrams illustrating a second embodiment of a method for mounting an electronic component on an FPC in accordance with the present invention. In this embodiment, the double-sided pressure-sensitive adhesive sheet 5 is attached to the surface of the FPC 4 opposite to the surface on which the electronic component is to be mounted (hereinafter sometimes referred to as “fixing plate-attachment surface”) so that the FPC 4 Is firmly attached to a predetermined portion of the fixed plate 6 via the double-sided pressure-sensitive adhesive sheet 5. More specifically, after the fixing plate 6 is fixed to the transport holder 8 by using the guide pin 71 for fixing the mother substrate and the perforation 71a, the double-sided pressure-sensitive adhesive sheet 5 is FPC (4). Affixed to the fixing plate-attaching surface, respectively. Then, by using the FPC positioning guide pin 72 and the perforation 72a, the pressure reduction of the open side of the double-sided pressure-sensitive adhesive sheet 5 in the FPC 4 with the double-sided pressure-sensitive adhesive sheet 5 attached thereto. The adhesive layer is attached to the fixing plate 6 so that the FPC 4 is firmly attached to a predetermined portion on the surface of the fixing plate 6.

In this manner, when the FPC is attached to the fixed plate in this embodiment, the pressure-sensitive adhesive sheet is first attached to the FPC to form a pressure-sensitive adhesive layer on the fixed plate-attached surface of the FPC. Subsequently, the FPC having the pressure-sensitive adhesive layer on the fixing plate-attaching surface is mounted to a predetermined portion of the fixing plate and firmly attached thereto. Thus, the FPC can be easily fixed to the fixed plate. In addition, the separation of each FPC equipped with electronic components after the electronic component is mounted means that the FPC equipped with the electronic component is separated from the fixing plate, and the corresponding pressure-sensitive adhesive sheet attached to the fixing plate-attaching surface of the FPC is peeled off from the fixing plate. Can be achieved by a simple method. That is, the plurality of adhesive tape pieces do not need to be peeled off. Therefore, it is possible to fix the FPC to the fixed plate or to separate the FPC from the fixed plate with excellent workability.

In addition, since the lower surface of each FPC is fixed in whole or in part to the fixed plate via the pressure-sensitive adhesive sheet, there is little or no gap between the FPC and the fixed plate. Therefore, when the electronic component is mounted on the FPC, there is no position change in the FPC, and the electronic component can be mounted on the FPC with high positional accuracy.

In the first embodiment, the case where the pressure-sensitive adhesive sheet 5 is first laminated to the fixing plate 6 is described. In the second embodiment, the pressure-sensitive adhesive sheet 5 is first laminated to the FPC 4. Described. The two embodiments differ in this respect, but have equivalent effects.

In addition, according to the present invention, each FPC 4 can be fixed to a fixed plate by using a pressure-sensitive adhesive sheet 5 having a pressure-sensitive adhesive layer on one or more sides of the substrate. Accordingly, the present invention also includes a pressure-sensitive adhesive sheet that is applied to fix the flexible printed wiring circuit to the fixed plate when the electronic component is mounted on the surface of the flexible printed wiring circuit.

Fixed plate

The fixing plate 6 is not particularly limited as long as the fixing plate is a plate capable of having a pressure-sensitive adhesive layer formed on its surface or a pressure-sensitive adhesive sheet fixed to the surface thereof. As the fixed plate 6, a plate sufficient to ensure flatness such as an aluminum plate, a glass plate, and an epoxy resin plate can be used. However, there is no limitation in the material, shape, and the like of the plate. Material, shape, etc. can be suitably selected according to the mounting apparatus (especially automatic mounting apparatus) for mounting an electronic component in FPC.

In addition, the fixing plate 6 having the pressure-sensitive adhesive layer 51 on its surface has a pressure-sensitive adhesive sheet (pressure-sensitive) such that the surface of the pressure-sensitive adhesive layer is mounted on the opposite side of the surface of the fixing plate as shown in the first embodiment. Adhesive tape, etc.) to the fixing plate. Alternatively, as shown in Fig. 1C, a fixing plate 6 in which the pressure-sensitive adhesive layer 51 composed of the pressure-sensitive adhesive is formed by applying the pressure-sensitive adhesive may be used.

Overview of pressure-sensitive adhesive sheet

As the pressure-sensitive adhesive sheet for forming the pressure-sensitive adhesive layer on the surface of the fixing plate, a single-sided pressure-sensitive adhesive sheet shown in FIG. 3 or a double-sided pressure-sensitive adhesive sheet shown in FIG. 4 may be used. 3 is a cross-sectional view showing an example of a pressure-sensitive adhesive sheet according to the present invention, Figure 4 is a cross-sectional view showing another example of a pressure-sensitive adhesive sheet according to the present invention.

In Fig. 3, reference numeral 1 denotes a pressure-sensitive adhesive sheet for fixing a flexible printed wiring circuit (hereinafter sometimes referred to as "FPC fixing pressure-sensitive adhesive sheet" or simply "pressure-sensitive adhesive sheet"), 2 denotes a reduced pressure The adhesive layer is shown, and 3 represents a base material. In the example of FIG. 3, the FPC fixing pressure sensitive adhesive sheet 1 has a structure in which the pressure sensitive adhesive layer 2 is laminated on one side (cross section) of the substrate 3. In Fig. 4, reference numeral 11 denotes a pressure-sensitive adhesive sheet for fixing FPC, 21 denotes a pressure-sensitive adhesive layer, and 31 denotes a substrate. In the example of FIG. 4, the FPC fixing pressure sensitive adhesive sheet 11 has a structure in which the pressure sensitive adhesive layer 21 is laminated on both sides of the substrate 31. In this manner, according to the present invention, the sheet in which the pressure-sensitive adhesive layer is laminated on one side and / or both sides of the substrate may be used as the pressure-sensitive adhesive sheet 1 or 11 for fixing the FPC. In particular, in the second embodiment, a double-sided pressure-sensitive adhesive sheet as shown in Fig. 4 can be preferably used. Further, a double-sided pressure-sensitive adhesive sheet composed only of the pressure-sensitive adhesive layer can be used.

materials

The base material 3 or 31 in the pressure-sensitive adhesive sheet 1 or 11 is not particularly limited. Examples of the substrate 3 or 31 include a plastic film composed of a plastic material of polyester such as cellophane, polytetrafluoroethylene, polyethylene or polyethylene terephthalate; A rubber sheet composed of natural rubber or butyl rubber; Foams composed of polyurethane or polychloroprene rubber; Metal foil such as aluminum foil or copper foil. However, porous substrates composed of fibrous materials such as paper or nonwovens may also be used preferably.

Solder is typically melted in the process of mounting electronic components, so FPC is exposed to very high temperatures for a short time. For example, there are various conditions in the heating based on infrared rays (IR heating), but a representative example of the heating conditions is a heating condition in which the peak temperature is about 260 ° C as the highest temperature and the holding time of the peak temperature is about 20 seconds. In a pressure-sensitive adhesive sheet such as a pressure-sensitive adhesive tape which has undergone this heating step at a very high temperature, moisture or the like contained in the pressure-sensitive adhesive rapidly expands (gasifies) upon IR heating. For this reason, the FPC and / or the fixed plate may be peeled from the pressure sensitive adhesive sheet such as the pressure sensitive adhesive tape. However, when the porous substrate is used as the substrate 3, 31 of the FPC fixing pressure sensitive adhesive sheet, the pressure sensitive adhesive even if the FPC fixing pressure sensitive adhesive sheet is exposed to high temperature in the heating step (especially the IR heating step). Degradation of the properties can be suppressed or prevented to maintain high pressure-sensitive adhesive properties. That is, even after the heating step at a very high temperature, the FPC and / or the fixed plate remain attached to the pressure-sensitive adhesive sheet. More specifically, when the substrate is a porous substrate, the gaseous component vaporized in the pressure-sensitive adhesive layer may be formed even if the moisture or the like contained in the pressure-sensitive adhesive rapidly expands (vaporizes) in the heating step for melting the solder. Can be released to the outside to inhibit or prevent the FPC from peeling off from the pressure sensitive adhesive layer. Thus, no position change occurs in the FPC even after the heating step, so that the electronic component can be mounted to the FPC with high positional accuracy. That is, when a porous base material is used as a base material, the positional precision with which an electronic component is mounted in FPC can be improved very much.

The porous substrate is not particularly limited in terms of the material of the substrate, as well as various properties such as the shape or diameter (average cell diameter) and density of the pores if the substrate is porous. The porous substrate preferably has an open cell shape to release the vaporized gas component to the outside in the pressure sensitive adhesive layer. That is, when the porous substrate has an open cell-shaped shape, gaseous components (eg, water vapor) vaporized in the pressure sensitive adhesive layer can be released outward from the open end portion of the porous substrate.

In the present invention, examples of porous substrates, in particular porous substrates composed of fibrous materials, include porous paper materials (e.g., paper such as kraft paper, crepe paper, hanji, clay coated paper, fine paper, glassine paper, coolpack paper), Porous fiber materials (e.g. aramid fiber, rayon fiber, acetate fiber, polyester fiber, polyvinyl alcohol fiber, polyamide fiber, polyolefin fiber, fluorine fiber, stainless steel fiber, asbestos, glass fiber fabric, glass fiber, manila Nonwoven or woven fabric based on synthetic or natural fibers such as hemp and pulp). In porous substrates based on fibrous materials, a kind of fibrous material may be used alone, or two or more fibrous materials may be used in combination. In addition, a kind of porous substrate may be used alone, or two or more kinds of porous substrates may be used in combination.

In the present invention, Hanji or nonwoven fabric is preferably used as the porous substrate in view of the anchoring property of the pressure-sensitive adhesive, the breathability of gas components such as water vapor, heat resistance, and the like. In addition, in terms of heat resistance, aramid fibers may preferably be used as the porous substrate. In addition, Hanji or clay coated paper is useful as a porous substrate because it is inexpensive and has heat resistance.

In addition, in the present invention, the porous substrate does not include any additives such as a binder, but is preferably composed of only a fibrous material (fiber component). In particular, porous substrates that are neutral or substantially neutral and contain rayon fibers as a fiber component are preferred. It is preferable that the content of the rayon fiber is high as the porous substrate containing the rayon fiber. For example, the content of rayon fibers may be selected from the range of at least 30% by weight, preferably at least 50% by weight relative to the total fiber components.

The thickness of the substrate (particularly the porous substrate) is not particularly limited. The thickness may be appropriately selected depending on the use. Generally, for example, the thickness is about 25-200 μm (preferably 50-150 μm).

In addition, when paper or nonwoven fabric is used as the porous substrate, the weight per unit area thereof is not particularly limited. For example, the weight per unit area may be about 1 to 300 g / m 2.

Alternatively, sheet-like foams can be used as the porous substrate in the present invention.

Pressure sensitive adhesive layer

Examples of the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 2 or 21 include an acrylic pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, and a rubber-based pressure-sensitive adhesive in which additives such as a tackifying resin are blended with an elastomer. Acrylic pressure sensitive adhesives and silicone pressure sensitive adhesives can preferably be used as pressure sensitive adhesives. Acrylic pressure-sensitive adhesives are preferred from the viewpoint of heat resistance or ease of peeling of FPC after mounting. In particular, when high heat resistance is required, a silicone pressure-sensitive adhesive is preferred. One kind of pressure-sensitive adhesive may be used alone, or two or more pressure-sensitive adhesives may be used in combination.

The acrylic pressure sensitive adhesive contains, as the base polymer, an alkyl (meth) acrylate ester copolymer comprising an alkyl (meth) acrylate ester as the main monomer component. More specifically, acrylic polymers composed of polymers of alkyl (meth) acrylate esters (including copolymers) or copolymers of alkyl (meth) acrylate esters and other monoethylenically unsaturated monomers (copolymerizable monomers) are described. Used as polymers, additives such as crosslinkers (eg crosslinkers) and tackifying resins are blended into the base polymer as needed.

In general, alkyl (meth) acrylate esters having about 4 to 14 carbon atoms of each alkyl group can preferably be used as alkyl (meth) acrylate esters. Specifically, as alkyl (meth) acrylate ester, butyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isononyl (meth) acrylate, lauryl (meth) Acrylate etc. are used preferably. One kind of alkyl (meth) acrylate ester may be used alone, or two or more alkyl (meth) acrylate esters may be used in combination.

These alkyl (meth) acrylate esters are used as the main monomer component. Specifically, the proportion of the alkyl (meth) acrylate ester in the acrylic polymer may be selected from the range of 50% by weight or more (50 to 100% by weight), for example with respect to the total weight of the monomer components. The proportion of the alkyl (meth) acrylate ester is preferably at least 80% by weight, more preferably at least 90% by weight, and optionally at least 97% by weight.

Pressure sensitive adhesive properties to adherends, such as FPC, when not only alkyl (meth) acrylate esters, but also functional group containing copolymerizable monomers copolymerizable with said alkyl (meth) acrylate esters are used as monomer components in acrylic polymers Can improve. Examples of functional group-containing copolymerizable monomers include carboxyl group-containing copolymerizable monomers, nitrogen atom-containing copolymerizable monomers, hydroxyl group-containing copolymerizable monomers, epoxy group-containing polymerizable monomers, mercapto group-containing copolymerizable monomers, and isocyanate group-containing copolymerizable monomers. A monomer can be mentioned. More specifically, examples of the functional group-containing copolymerizable monomer include carboxyl group-containing copolymerizable monomers such as acrylic acid, methacrylic acid, itaconic acid, maleic anhydride, crotonic acid, maleic acid and fumaric acid; Contains nitrogen atoms such as (meth) acrylamide, N-vinylpyrrolidone, (meth) acryloyl morpholine, (meth) acrylonitrile, aminoethyl (meth) acrylate, cyclohexylmaleimide or isopropyl maleimide Copolymerizable monomers; Hydroxyl group-containing copolymerizable monomers such as hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate or glycerol dimethglylate; Epoxy group-containing copolymerizable monomers such as glycidyl (meth) acrylate; Isocyanate group containing copolymerizable monomers, such as 2-methacryloyloxyethyl isocyanate, are mentioned. Mercapto groups and the like may be introduced as functional groups at the ends of the chain transfer agent. Among these functional group-containing copolymerizable monomers, carboxyl group-containing monomers are preferable from the viewpoints of reactivity and versatility. Moreover, acrylic acid and methacrylic acid are mentioned preferably as a carboxyl group-containing copolymerizable monomer.

The ratio of functional group-containing copolymerizable monomer to total monomer components may be about 10% by weight or less (eg 0-10% by weight), preferably 3% by weight or less (0-3% by weight).

In addition, an acrylic polymer can contain a copolymerizable monomer as a monomer component other than the said main monomer and a functional group containing copolymerizable monomer as needed. Examples of such copolymerizable monomers include alkyl having 1 to 3 carbon atoms in each alkyl group such as methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate and isopropyl (meth) acrylate. (Meth) acrylate esters; Alkyl (meth) acrylate esters having 5 to 20 carbon atoms of an alkyl group such as stearyl (meth) acrylate; Vinyl esters such as vinyl acetate; Styrene monomers such as styrene; Α-olefin monomers such as ethylene or propylene.

The proportion of monomer components other than alkyl (meth) acrylate esters serving as the main monomer component in the acrylic polymer may be selected from the range of less than 50% by weight relative to the total weight of the monomer components. However, the ratio is preferably less than 20% by weight, more preferably less than 10% by weight, particularly preferably less than 3% by weight.

In the present invention, it is useful to add a known crosslinker such as an isocyanate compound or an epoxy compound as a crosslinker to improve the retention properties of the pressure-sensitive adhesive, or to add a multifunctional (meth) acrylate to perform photopolymerization. It is useful to do One kind of crosslinker may be used alone, or two or more crosslinkers may be used in combination. Examples of isocyanate compounds as crosslinkers include multifunctional isocyanate compounds having two or more isocyanate groups, that is, diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, phenylene diisocyanate, 1 Aromatic diisocyanates such as, 5-naphthylene diisocyanate, xylene diisocyanate or toluylene diisocyanate; Aliphatic or cycloaliphatic diisocyanates such as hexamethylene diisocyanate, isophorone diisocyanate or 4,4-dicyclohexylmethane diisocyanate; Dimers of diphenylmethane diisocyanate; Reaction products of trimethylolpropane and tolylene diisocyanate; Reaction products of trimethylolpropane and hexamethylene diisocyanate; Polyether polyisocyanate; And polyester polyisocyanates. On the other hand, examples of the epoxy compound include a multifunctional epoxy compound having two or more epoxy groups such as diglycidyl aniline and glycerol diglycidyl ether.

In addition, examples of the multifunctional (meth) acrylate as a crosslinker used for photopolymerization include trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, ethylene glycol di (meth) acrylate, and 1,6 -Hexanediol di (meth) acrylate is mentioned.

The acrylic polymer can be synthesized by general batch polymerization, continuous drop polymerization, split drop polymerization, or the like by using a conventional polymerization method such as emulsion polymerization or solution polymerization with a mixture of monomer components. In the polymerization, conventional or known polymerization initiators can be used. In addition, conventional or known emulsifiers may be used in emulsion polymerization. In addition, polymerization temperature is the range of 30-80 degreeC, for example.

Moreover, when especially high heat resistance (high heat resistance) is needed as a pressure sensitive adhesive agent, the polymer based on ultraviolet irradiation is preferable. In addition, various additives known in the art such as tackifiers, plasticizers, softeners, fillers, colorants (pigments, dyes, etc.), anti-aging agents and antioxidants may be added to the pressure-sensitive adhesive as any component. Examples of adhesion imparting resins include petroleum resins such as aliphatic petroleum resins, aromatic petroleum resins or alicyclic petroleum resins (alicyclic saturated hydrocarbon resins) based on hydrogenated aromatic petroleum resins; Rosin-based resins (rosin or hydrogenated rosin esters); Terpene-based resins (eg, terpene resins, aromatic modified terpene resins, hydrogenated terpene resins or terpene phenol resins); Styrene resins; And coumarone-indene resins.

The pressure sensitive adhesive layer 2 or 21 may be formed by applying the pressure sensitive adhesive to one or more sides of the porous substrate.

The thickness of the pressure-sensitive adhesive layers 2, 21 is not particularly limited. For example, the thickness can be selected from the range of about 10 to 200 μm, preferably from about 20 to 100 μm.

In addition, from the viewpoint of physical properties, the pressure-sensitive adhesive layer preferably has a storage modulus in the range of 10 ³ to 10 ⁶ Hz (frequency: 1 Hz) at a temperature of 0 to 300 ° C. In this case, the pressure-sensitive adhesive layer has a relatively low storage modulus in the use temperature range (for example, a temperature of about 0 ° C. to about 300 ° C.) of the FPC fixing pressure-sensitive adhesive sheet, and the storage modulus in this range. Keep it. Therefore, the change or deterioration of the pressure-sensitive adhesive layer by the temperature can be suppressed or prevented. Therefore, even if the pressure-sensitive adhesive layer is heated (such as IR heating) in the heating step (IR reflow step, etc.), the pressure-sensitive adhesive layer does not soften or harden so that the pressure-sensitive adhesive layer has excellent pressure-sensitive adhesive properties at room temperature. And peelability can be maintained. Therefore, even after the heating step, the FPC does not leave the carrier board. Also, even if the FPC is peeled off the carrier board, no pressure sensitive adhesive component to the pressure sensitive adhesive layer remains in the FPC (ie no adhesive transfer occurs).

In addition, in the present invention, the storage modulus (frequency: 1 Hz) of the pressure-sensitive adhesive layer provided on at least one side of the substrate is 10 ³ to 10 ⁶ Hz (1 × 10 ³ to 1) at a temperature of 0 to 300 ° C. as described above. It is sufficient if the range is 10 ⁶ Hz). In particular, the storage modulus is preferably in the range of 10 ⁴ to 10 ⁶ GPa, optionally in the range of 10 ⁵ to 10 ⁶ GPa.

5 and 6 show another example of the pressure-sensitive adhesive layer. 5 and 6, the pressure-sensitive adhesive layer 2 or the pressure-sensitive adhesive layer 21 is laminated on one side of the substrate 3 or on both sides of the substrate 31 in the FPC fixing pressure-sensitive adhesive sheet 1 or 11. A plurality of convex portions 2a or 21a are formed on the surface of the pressure-sensitive adhesive layer 2 or on the surface of each of the pressure-sensitive adhesive layer 21. Thus, the recesses 2b or 21b corresponding to the convex portions 2a or 21a are formed on the surface of the pressure-sensitive adhesive layer 2 or 21. The convex portions 2a or 21a are linear convex portions as shown in Fig. 7, and the linear concave portions 2b or 21b are formed linearly along the linear convex portions 2a or 21a. 7 is a schematic view of the FPC fixing pressure-sensitive adhesive sheet according to FIGS. 5 and 6 seen from above.

9 and 10 show another example of a pressure sensitive adhesive layer. 9 and 10, the pressure-sensitive adhesive layers 2 and 21 are laminated on one or both sides of the substrate in the pressure-sensitive adhesive sheet 1 or 11 for fixing FPC, and the plurality of holes 2c or 21c are pressure-sensitive. It is formed on the surface of the adhesive layer 2 or the surface of each pressure-sensitive adhesive layer 21. Thus, the non-pore portions 2d or 21d corresponding to the hole portions 2c or 21c are formed on the surface of each pressure-sensitive adhesive layer 2 or 21. The hole portion 2c or 21c is a circular hole portion as shown in Fig. 11, and the non-hole portion 2d or 21d is formed between the circular hole portions 2c or 21c. FIG. 11 is a schematic view of the FPC fixing pressure-sensitive adhesive sheet according to FIGS. 9 and 10 seen from above. FIG.

In the same manner as described above, the plurality of convex portions 2a or 21a or the plurality of holes 2c or 21c are formed by the pressure-sensitive adhesive layer 2 or 21 in the pressure-sensitive adhesive sheet 1 or 11 for fixing the FPC. Is formed on the surface of the s) to increase the surface area of the pressure-sensitive adhesive layer (2 or 21). Further, the distance between the surface of the pressure-sensitive adhesive layer and the bottom or center interior of each convex portion 2a or 21a, or the bottom or center interior of the surface of the pressure-sensitive adhesive layer and non-hole 2d or 21d. The distance (shortest distance) between them is shorter than when the convex portion 2a or 21a or the hole 2c or 21c is not formed. Thus, even if the moisture or the like contained in the pressure-sensitive adhesive suddenly expands (evaporates) in the heating step (especially the IR heating step) for melting the solder, the FPC can suppress or prevent peeling from the pressure-sensitive adhesive layer. . This is because an uneven portion or hole is formed on the surface of the pressure-sensitive adhesive layer to increase the surface area of the pressure-sensitive adhesive layer, and the vaporized gas component in the pressure-sensitive adhesive layer uses the recesses or holes of the pressure-sensitive adhesive layer to Because it can be released.

In addition, when the convex portions 2a or 21a are formed linearly as shown in Fig. 7, the linear concave portions 2b or 21b between the linear convex portions 2a or 21a are formed in one of the pressure-sensitive adhesive layers. A recess is formed between the distal portion and its other distal portion so that the recess has an open end at the distal portion. Thus, even if the upper surface of the concave portion of the pressure-sensitive adhesive layer is covered with FPC, the vaporized gas component in the pressure-sensitive adhesive layer uses the linear shape of the concave portion to open the open portion (even though the entire surface is covered with FPC). From the site) to the outside. Thus, the FPC can further inhibit or prevent delamination from the pressure sensitive adhesive layer.

Therefore, when the FPC fixing pressure-sensitive adhesive sheet according to the present embodiment is used, even if the FPC fixing pressure-sensitive adhesive sheet is exposed to high temperature in the heating step (especially the IR heating step), the deterioration of the pressure-sensitive adhesive property is reduced. It can be further suppressed or prevented to maintain high pressure-sensitive adhesive properties. That is, after the heating step at a very high temperature, the FPC and / or the holding plate remain attached to the pressure sensitive adhesive sheet for fixing the FPC.

In addition, when the pressure-sensitive adhesive sheet for fixing the FPC is attached to the fixing plate and the FPC, it is possible to prevent the cells from being mixed at the interface between the pressure-sensitive adhesive layer and the fixing plate and at the interface between the pressure-sensitive adhesive layer and the FPC.

Therefore, one of the important points regarding the pressure sensitive adhesive sheet for FPC fixing in this embodiment is to increase the surface area of the pressure sensitive adhesive layer. Further, even if the upper surface of the recess of the pressure-sensitive adhesive layer is coated on the FPC, by using the shape of the recess of the pressure-sensitive adhesive layer, gaseous components vaporized in the pressure-sensitive adhesive layer can be released to the outside from the open portion of the recess. In shape, it is another important point to form the recessed part of a pressure-sensitive adhesive layer. That is, the surface shape of the pressure-sensitive adhesive layer is released to the outside from the surface of the pressure-sensitive adhesive layer by using the surface area of which the gaseous gas component increased in the pressure-sensitive adhesive layer and further using the surface shape of the pressure-sensitive adhesive layer. As far as possible, it is not particularly limited.

The cross-sectional shape of each convex portion or each hole portion on the surface of the pressure-sensitive adhesive layer is not particularly limited when the convex portion or the hole portion is at least raised or recessed. For example, the shape may be mountainous or counter-mounted, and may be linear. Such mountainous convex portions include cone-like shapes, cylinder-like shapes, polygonal pyramid-like shapes (e.g., triangular pyramid-like shapes, square pyramid-like shapes), polygonal prism-like shapes (e.g., triangular prism-like shapes or squares). Prism-like shape). On the other hand, an example of a linear convex part is a convex part in which the said mountain-shaped convex part expands linearly. Examples of inverted-shaped holes include inverted cone-like shapes, inverted column-like shapes, inverted polygonal pyramid-like shapes (e.g., inverted triangle pyramid-like shapes or inverted triangle pyramid-like shapes), and inverted polygonal prism-like shapes (e.g. , An inverted triangular prism-like shape or an inverted triangle prism-like shape). On the other hand, the linear hole is a hole in which the inverted hole extends linearly.

Alternatively, the cross-sectional shape of each convex portion may be substantially polygonal in shape (eg, substantially square or substantially triangular), or substantially circular in shape (eg, semi-elliptical or semi-circular). have. Further, the diameters (radius, length of sides, etc.) of each convex portion may be small or large from the bottom surface to the top portion or may be the same. The top may also be flat, pointed, or circular. The cross-sectional shape of each hole may be substantially polygonal in shape (eg, substantially square or substantially triangular) or substantially circular in shape (eg, semi-elliptic or semi-circular). In addition, the diameter (radius or length of the side) of each hole may be smaller or larger from the top to the bottom surface or bottom, or may be the same. Also, when the hole has a bottom surface, the bottom surface may be flat or pointed, or may be circular.

The diameter of each convex portion or each hole portion is not particularly limited, but may be appropriately selected depending on, for example, the size of the FPC. For example, the average diameter or the average length of the sides can be selected from the range of about 0.01 to 10 mm, preferably about 0.05 to 5 mm.

In addition, the height of each convex portion is not particularly limited, but may be appropriately selected depending on the size of the FPC, the thickness of the pressure-sensitive adhesive layer, and the like. For example, the height may be selected from the range of about 0.01 to 0.5 mm, preferably from about 0.03 to 0.1 mm.

The depth of each hole is not particularly limited, but may be appropriately selected depending on the size of the FPC, the thickness of the pressure-sensitive adhesive layer, the thickness of the pressure-sensitive adhesive sheet, and the like. Specifically, the bottom portion of the hole may be formed of a pressure-sensitive adhesive layer or substrate. That is, the hole may be a recessed hole. Alternatively, the apertures can penetrate the substrate and the pressure sensitive adhesive layer opposite the substrate. That is, the hole portion may be a through hole penetrated from one surface to the other surface of the pressure-sensitive adhesive sheet. Also, the hole portion based on the through hole can be easily manufactured by punching.

In addition, the space | interval (width of each recessed part) between convex parts is not specifically limited, It can select suitably according to the magnitude | size of an FPC, etc. For example, the spacing may be selected from the range of about 0.01 to 10 mm, preferably the range of about 0.05 to 5 mm.

Although the space | interval (width of each non-hole part) between hole parts is not specifically limited, It can select suitably according to the magnitude | size of an FPC, etc .. For example, the spacing can be selected from the range of about 0.1 to 10 mm, preferably from about 0.5 to 5 mm.

The convex portion or the hole portion may be formed over the entire surface of the surface of the pressure-sensitive adhesive layer, or may be partially formed in one place or a plurality of places on the surface. When the convex portion or the hole portion is partially formed, it is preferable that the convex portion or the hole portion is formed at a portion including at least a predetermined portion to which the FPC is attached.

Further, the convex portion or the hole portion may be formed regularly, and the convex portion or the hole portion may be formed in the linear mode from the whole plan view.

Of course, the concave portion or the non-hole portion has a shape corresponding to the convex portion or the hole portion, and the concave portion or the non-hole portion is formed at the portion corresponding to the convex portion or the hole portion. That is, the bottom portion of the recess is formed by the pressure-sensitive adhesive layer at the bottom, and the wall portion of the recess is formed by the pressure-sensitive adhesive layer of the convex portion. The upper portion of the non-pore portion is formed as the upper surface of the pressure-sensitive adhesive layer, and the back portion of the non-pore portion is formed as the wall surface of the hole portion.

When the convex portion is provided in the pressure-sensitive adhesive layer, the thickness (average thickness, or the thickness between the lowermost portion and the upper portion of the convex portion) of the pressure-sensitive adhesive layer is not particularly limited. For example, the thickness may be selected from the range of about 10 to 200 μm, preferably from about 20 to 100 μm.

5 and 6, the pressure sensitive adhesive layers 2 and 21 are formed from linear irregularities, and the pressure sensitive adhesive layer forms the bottom of the recess. Although the pressure-sensitive adhesive layer is not formed at the bottom of the recess, for example, the substrate forms the bottom of the recess, similar effects can be obtained in each of these embodiments. Specifically, the cross-section of the pressure-sensitive adhesive layer is acid-shaped, that is, as shown in FIG. 8, a pressure-sensitive adhesive layer having an acid cross-section is formed on the substrate so that the convex portion is formed from the pressure-sensitive adhesive layer having an acid cross-section. Although formed, it can have a similar effect. 8 is sectional drawing which shows the other example of the pressure-sensitive adhesive sheet which concerns on this invention. In Fig. 8, reference numeral 12 denotes a pressure-sensitive adhesive sheet, 22 denotes a pressure-sensitive adhesive layer, and 32 denotes a substrate. The pressure sensitive adhesive layer 22 is partially formed on both sides of the substrate 32 such that the cross section of each pressure sensitive adhesive layer 22 is acid-shaped.

Similarly, pressure sensitive adhesive layers 2 and 21 in FIGS. 9 and 10 are formed by apertures penetrating through pressure sensitive adhesive layers 2 and 21, respectively. Thus, there is no bottom in each hole. However, even if the pressure-sensitive adhesive layer is formed at the bottom of the hole, or the substrate forms the bottom of the hole, similar effects can be obtained in each of these embodiments. Specifically, the pressure-sensitive adhesive layer in which the cross-section of the pressure-sensitive adhesive layer is in the acid shape, that is, the pressure-sensitive adhesive layer in which the cross-section is in the acid shape is formed on the substrate so that the cross section of the non-pore portion is in the acid shape, as shown in FIG. Although formed from, it can have a similar effect. 12 is sectional drawing which shows the other example of the pressure-sensitive adhesive sheet which concerns on this invention. In Fig. 12, reference numeral 13 denotes a pressure-sensitive adhesive sheet, 23 denotes a pressure-sensitive adhesive layer, and 33 denotes a substrate. The pressure-sensitive adhesive layer 23 is partially formed in an acid shape in cross section on both sides of the substrate 33.

Composition of pressure-sensitive adhesive sheet

The pressure-sensitive adhesive sheet 1, 11, 12 or 13 according to the present invention can be produced as follows. That is, for example, one or more sides (one or both sides) of the substrate, in particular the porous substrate, are coated with a pressure sensitive adhesive composition comprising a pressure sensitive adhesive, such as an acrylic pressure sensitive adhesive, which is crosslinked by heating as necessary. Or based on ultraviolet irradiation. The pressure sensitive adhesive layer is then formed on one or more sides of the substrate (especially the porous substrate). In addition, if desired, the pressure-sensitive adhesive layer may be coated with a release liner. Thus, the pressure-sensitive adhesive sheet according to the present invention may be a double-sided pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on both sides of a substrate such as a porous substrate, or a single-sided pressure-sensitive adhesive having a pressure-sensitive adhesive layer on one side of a substrate such as a porous substrate. The adhesive sheet may also be used.

In order to form linear convex portions on the surface of the pressure-sensitive adhesive layer, a method in which the pressure-sensitive adhesive composition is applied by stripe coating is preferred. Alternatively, after the pressure-sensitive adhesive layer is formed, the pressure-sensitive adhesive layer may be subjected to surface treatment to form convex portions on the surface of the pressure-sensitive adhesive layer. In the above method, it is also preferable to form a pressure-sensitive adhesive layer having a double-block portion on its surface.

When the holes are formed in the pressure sensitive adhesive layer, the holes (particularly the holes based on the through holes) can be formed by punching the pressure sensitive adhesive layer. Punching (perforation, etc.) may be performed prior to polymerization by crosslinking treatment or ultraviolet irradiation. Alternatively, after the pressure-sensitive adhesive layer is formed, the pressure-sensitive adhesive layer may be surface treated to form holes in the surface of the pressure-sensitive adhesive layer. In this way, it is also possible to form a pressure-sensitive adhesive layer having holes in its surface.

The pressure-sensitive adhesive sheet according to the present invention is preferably a double-sided pressure-sensitive adhesive sheet. Further, in the case of a double-sided pressure-sensitive adhesive sheet, the pressure-sensitive adhesives in the individual pressure-sensitive adhesive layers laminated on both sides of the porous substrate may be different or the same.

By using such a pressure-sensitive adhesive sheet, a fixing plate having a pressure-sensitive adhesive layer on the surface as shown in the first embodiment can be produced. 1A, 1B, 2A, and 2B, the double-sided pressure-sensitive adhesive sheet 5 including the porous substrate as the substrate is used to attach the fixing plate 6 and the FPC 4 to attach the fixing plate 6 and the FPC 4. 4) is provided between. That is, the fixed plate 6 and the FPC 4 are attached via the double-sided pressure-sensitive adhesive sheet 5. In particular, in FIGS. 1A to 1C, even when the double-sided pressure-sensitive adhesive sheet 5 or the pressure-sensitive adhesive layer 51 including the porous substrate as the base material is laminated on the entire surface of one side of the fixing plate 6, the double-sided pressure reduction is explained. The adhesive sheet 5 or the pressure-sensitive adhesive layer 51 may be attached only to a predetermined portion of one surface of the fixing plate 6 (for example, a portion to which the FPC mounts and a peripheral portion thereof).

On the other hand, as in the second embodiment, by using such a pressure-sensitive adhesive sheet, a pressure-sensitive adhesive sheet for attaching the FPC to the fixing plate when the electronic component is mounted on the surface of the FPC is used to fix the FPC to which the fixing plate-attachment of the FPC is attached. It can manufacture. In particular, although FIG. 2 illustrates the case where the double-sided pressure-sensitive adhesive sheet 5 including the porous substrate as the base is attached to the entire surface of one side of the FPC 4, the double-sided pressure-sensitive adhesive sheet 5 is the FPC 4. May be partially attached to one side of the

According to the invention, the pressure-sensitive adhesive sheet may be a single-sided pressure-sensitive adhesive sheet (pressure-sensitive adhesive tape) provided with a substrate, in particular a single-sided pressure-sensitive adhesive sheet comprising a porous substrate as the substrate. In this case, the surface of the base material side of the pressure-sensitive adhesive tape can be attached to the front surface or a predetermined portion of the fixing plate by using the pressure-sensitive adhesive to form a fixing plate having the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape on the surface thereof. Thus, the FPC can be fixedly attached to the surface of the pressure sensitive adhesive layer.

Further, in order to easily peel off the pressure-sensitive adhesive sheet from the fixing plate to which the pressure-sensitive adhesive sheet is attached without damaging the pressure-sensitive adhesive sheet itself, the tensile strength of the pressure-sensitive adhesive sheet is 5 N / 15 mm or more (for example, 5 to 5 mm). 150 N / 15 mm), preferably 8 N / 15 mm or more (eg, 8 to 50 N / 15 mm). In particular, the tensile strength of the pressure-sensitive adhesive sheet is preferably 5 N / 15 mm or more (preferably 8 N / 15 mm or more) even after the electronic component is mounted. That is, in the present invention, after the electronic component is mounted on the FPC through the heating step, the pressure-sensitive adhesive sheet attached to the fixing plate is peeled off from the fixing plate, and the PFC on which the electronic component is mounted is also peeled off from the fixing plate. Therefore, the tensile strength of the pressure-sensitive adhesive sheet after the electronic component is mounted is important. Therefore, after the electronic component is mounted, the pressure-sensitive adhesive sheet has a peel strength in this range, and the pressure-sensitive adhesive sheet can be easily peeled from the fixed plate without damage, so that the peelability of the pressure-sensitive adhesive sheet can be improved. Thus, the fixing plate can be reused.

Also, in the present invention, after the electronic component is mounted on the FPC, in order to peel off the FPC with the electronic component from the pressure-sensitive adhesive layer (i.e., to improve the pickup property of the FPC), the pressure-sensitive adhesive layer and the FPC between Adhesive force is 7 N / 20 mm or less (for example, 0.5-7 N / 20 mm), Preferably it is 1-6 N / 20 mm. Further, when the double-sided pressure-sensitive adhesive sheet is used as shown in Figs. 1A and 1B, the adhesive force between the pressure-sensitive adhesive sheet and the fixing plate may be selected from a range similar to the adhesive force between the pressure-sensitive adhesive sheet and the FPC. According to the present invention, the adhesive force in the pressure-sensitive adhesive sheet can be adjusted by appropriately selecting the kind of the pressure-sensitive adhesive, the kind of the additive added thereto, the blending ratio of the additive, and the like.

Further, although the guide pins 71 and 72, the transport holder 8, and the like are not particularly limited, they can be appropriately selected according to the mounting device (especially, the automatic mounting device) for mounting the electronic component on the FPC.

In this manner, the FPC can be fixed to the fixed plate by a simple method of mounting and attaching the FPC to the pressure-sensitive adhesive layer provided on the fixed plate as shown in the first embodiment according to the method of the present invention. Alternatively, as shown in the second embodiment, the pressure-sensitive adhesive sheet is first attached to the fixing plate-attaching surface of the FPC. Thus, unlike in the art, there is no need to attach an adhesive tape. In addition, when the FPC is to be removed from the fixing plate, the FPC mounted with the electronic component may be easily removed. Thus, unlike in the art, there is no need to remove the adhesive tape. Therefore, the workability in attaching and peeling FPC to and from the fixing plate is greatly improved so that the FPC can be quickly attached to and peeled from the fixing plate, and the manufacturing cost can be reduced.

In addition, since the front surface of the FPC can be fixedly attached to the fixing plate, the FPC can be firmly attached and there is little or no gap between the fixing plate (especially the pressure-sensitive adhesive layer formed on the surface of the fixing plate) and the FPC. Therefore, when the electronic component is mounted on the FPC, the position change in the FPC does not occur. Thus, the electronic component can be mounted with high positional accuracy.

In addition, as described above, the adhesive properties based on the pressure-sensitive adhesive of the pressure-sensitive adhesive layer hardly or at all deteriorate even after the heating step (eg, IR heating step). Thus, no change in position in the FPC occurs after heating. Thus, the electronic component can be mounted on the FPC with high positional accuracy. That is, the positional accuracy at which the electronic component is mounted on the FPC can be greatly improved. In addition, when a pressure-sensitive adhesive sheet (in particular, a double-sided pressure-sensitive adhesive sheet) including a porous substrate as a substrate is used as the pressure-sensitive adhesive sheet for FPC fixing, a gas component such as water vapor generated after the heating step as described above Silver may be released out of the system through the porous substrate. Therefore, little or no adhesion decreases. Thus, fixation of the FPC to a predetermined site can be maintained. In addition, after the electronic component is mounted on the FPC, the FPC can be easily peeled off from the pressure-sensitive adhesive layer on the surface of the fixing plate.

In addition, when the pressure-sensitive adhesive layer has a specific storage modulus in a specific temperature range, deformation or deterioration of the pressure-sensitive adhesive layer can be further prevented even after the heating step (eg, IR heating step) as described above. Thus, the adhesive properties and peelability based on the pressure-sensitive adhesive layer are maintained in good condition even after heating. Also, no detachment or residual pressure-sensitive adhesive is caused in the FPC. In addition, even after heating, the position change does not appear in the FPC, so that the electronic component can be mounted to the FPC with high position accuracy.

In addition, when the tensile strength of the pressure-sensitive adhesive sheet after the electronic component is mounted on the FPC is 5N / 15 mm or more, the pressure-sensitive adhesive sheet itself can be easily peeled from the fixing plate without damage after the electronic component is mounted on the FPC.

Further, when the adhesive force between the pressure-sensitive adhesive layer and the FPC is 7 N / 20 mm or less, the pickup property in which the FPC fixed to the fixed plate is separated can be improved.

In particular, when the uneven portion or hole is formed on the surface of the pressure-sensitive adhesive layer, gaseous components such as water vapor generated after the heating step may be formed by using recesses or holes in the surface of the pressure-sensitive adhesive layer (eg, through ), And when the substrate is a porous substrate, can be released out of the system through the porous substrate. Thus, little or no adhesion is reduced so that the fixation of the FPC to the predetermined site can be further maintained. In addition, the FPC can be easily peeled from the pressure-sensitive adhesive sheet after the electronic component is mounted on the FPC.

Therefore, the method according to the present invention is very useful as a method of mounting an electronic component on a flexible printed wiring circuit.

In addition, the pressure-sensitive adhesive sheet according to the present invention is very useful as a pressure-sensitive adhesive sheet for fixing a flexible printed wiring circuit.

In addition, the electronic component to be mounted on the FPC is not particularly limited. Examples of electronic components include ICs, capacitors, connectors, resistors, and LEDs (Light Emitting Diodes).

Hereinafter, the present invention will be described in more detail with reference to Examples. However, the present invention is not limited to these examples. In addition, the term "part" in the following description means parts by weight.

Example 1

Acrylic rubber (trade name "SH4280", manufactured by Torayrayex Co., Ltd.) was dissolved in toluene to prepare a solution having a content of 15% by weight of the base polymer. 5 parts of isocyanate-based crosslinkers (trade name "Coronate L", manufactured by Nippon Polyurethane Industry Co. Ltd.) are added to the part, and the pressure-sensitive adhesive composition is mixed by mixing. The pressure-sensitive adhesive composition was applied to a separator and then dried in a hot air dryer at 130 ° C. for 5 minutes to form a pressure-sensitive adhesive layer (pressure-sensitive pressure-sensitive adhesive layer) having a thickness of 50 μm. Manufactured by a porous substrate of aramid fibers (trade name "Nomex", EI DePont de Nemours & Co.), wherein the layer is used as the porous substrate. Thus, a double-sided pressure-sensitive adhesive sheet comprising a porous substrate as a substrate was prepared, and then one side of the double-sided pressure-sensitive adhesive sheet was attached to an aluminum plate to have a pressure-sensitive adhesive layer on the surface thereof. A stationary plate was prepared.

Example 2

2.0 parts of benzoyl peroxide and toluene were mixed and stirred in 100 parts of a silicone polymer (trade name "SH4280" Dow Corning Toaray Silicone Co., Ltd.) to prepare a pressure-sensitive adhesive composition. The adhesive composition was applied to the separator and then dried in a hot air dryer for 5 minutes at 170 ° C. to form a 25 μm thick pressure sensitive adhesive layer (pressure sensitive adhesive layer), which acts as a porous substrate. Therefore, a double-sided pressure-sensitive adhesive sheet comprising a porous substrate as a substrate was prepared, and then one side of the double-sided pressure-sensitive adhesive sheet was attached to an aluminum plate to have a pressure-sensitive adhesive layer on the surface thereof. A stationary plate was prepared.

Example 3

100 parts of 2-ethylhexyl acrylate and 2 parts of 2-hydroxyethyl acrylate at 60 to 80 ° C. in 210 parts of toluene together with 0.2 parts of benzoyl peroxide and 0.01 parts of trimethylolpropane triacrylate (crosslinked binder) under nitrogen substitution. Solution polymerization was carried out while stirring to prepare a pressure-sensitive adhesive solution having a viscosity of about 120 poise, a polymerization rate of 99.2%, and a solid content of 30.0% by weight. To 100 parts of this solution, 5 parts of isocyanate-based crosslinked product (manufactured by the trade name "Colonate L" Nippon Polyurethane Industry Limited) were added and mixed to prepare a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition is applied to the separator, followed by drying in a hot air dryer at 40 ° C. for 5 minutes, and further drying at 130 ° C. for 5 minutes to form a pressure-sensitive adhesive layer having a thickness of 50 μm (pressure sensitive adhesive layer). ) Was formed. This pressure sensitive adhesive layer was transferred to both sides of a nonwoven fabric (weight per unit area: 23 g / m 2) of rayon fibers used as the porous substrate. Thus, a double-sided pressure-sensitive adhesive sheet containing a porous substrate as a substrate was prepared. Then, one side of the double-sided pressure-sensitive adhesive sheet was attached to the aluminum plate to prepare a fixed plate having a pressure-sensitive adhesive layer on the surface thereof.

Comparative Example 1

An aluminum plate was used as the stationary plate. That is, unlike Examples 1 to 3, the fixing plate according to Comparative Example 1 was composed of only an aluminum plate, and did not have pressure-sensitive adhesive properties on its surface.

Evaluation I

For the fixed plate according to each of Examples 1 to 3 and Comparative Example 1, the time required for fixing the FPC, the gap between the FPC and the fixed plate when the FPC is attached to the fixed plate, and the time required for peeling the FPC are as follows. Measured by the method to evaluate the workability and fixation of the FPC.

Time required to fix the FPC

For the fixing plates according to Examples 1 to 3, six FPCs were arranged on one fixing plate each having a pressure-sensitive adhesive layer on its surface as shown in FIGS. 1A and 1B, and then the pressure reduction formed on the surface of the fixing plate. The adhesive layer was mounted and pressed by hand to adhere to the pressure sensitive adhesive layer. Thus, the FPC was fixed to the fixed plate.

On the other hand, for the fixed plate according to Comparative Example 1, as shown in Figs. 13A and 13B, six FPCs were arranged on one fixed plate, and then mounted on the fixed plate. An adhesive tape (adhesive tape having a silicone pressure-sensitive adhesive applied to one side of a substrate made of polyimide) was attached to four corner portions of each FPC. Thus, the FPC was fixed to the fixed plate.

The time (seconds) required to fix the FPC to the fixed plate was measured. The evaluation results are shown in the column "Time required to fix the FPC" in Table 1.

Gap between FPC and fixing plate

For each fixed plate that is manufactured in the measurement of the time required to fix the FPC, and for each fixed plate to which the FPC is fixed, the gap between each FPC and the fixed plate is measured so that the gap between the FPC and the fixed plate when the FPC is attached to the fixed plate. (Mm) was investigated. The evaluation results are shown in the column "Gap between FPC and fixed plate" in Table 1.

Time required to separate FPC

After measuring the gap between each FPC and the fixed plate, the electronic component was mounted on the FPC. After the mounting was completed, the FPC equipped with the electronic components was separated with tweezers. In addition, for the fixed plate according to Comparative Example 1, the adhesive tape attached to the four corners of each FPC was peeled off, and then the FPC with the electronic component mounted thereon was separated with tweezers.

The time required to detach the FPC from the plate was measured in seconds. The evaluation results are shown in the column "Time required to separate FPC" in Table 1.

Example 1 Example 2 Example 3 Comparative Example 1 Number of seconds required to freeze FPC 30 30 30 120 Number of seconds required to split FPC 15 15 15 60 Gap between FPC and fixing plate (mm) 0-0.1 0-0.1 0-0.1 0.5

From Table 1, in the fixed plate which has the pressure-sensitive adhesive layer on the surface according to Examples 1 to 3, the time required for mounting and the time required for separation are very short, and workability is excellent. In addition, there is little gap between each FPC and the fixed plate. The FPC is firmly attached to the fixed plate so that the position change does not occur in the FPC.

Example 4

100 parts of 2-ethylhexyl acrylate and 2 parts of 2-hydroxyethyl acrylate at 60 to 80 ° C. in 210 parts of toluene together with 0.2 parts of benzoyl peroxide and 0.01 parts of trimethylolpropane triacrylate (crosslinked binder) under nitrogen substitution. Solution polymerization was carried out while stirring to prepare a pressure-sensitive adhesive solution having a viscosity of about 120 poise, a polymerization rate of 99.2%, and a solid content of 30.0% by weight. To 100 parts of this solution was added 0.5 parts of an epoxy-based crosslinked product (trade name "Tetrad" manufactured by Mitsubishi Gas Chemical Company, Inc.), mixed and decompressed. A sex adhesive composition was prepared. The pressure-sensitive adhesive composition is applied to the separator, and then dried in a hot air dryer at 40 ° C. for 5 minutes, and further dried at 130 ° C. for 5 minutes to form a pressure-sensitive adhesive layer having a thickness of 50 μm (pressure sensitive adhesive layer). ) Was formed. This pressure sensitive adhesive layer was transferred to both sides of a nonwoven fabric (weight per unit area: 23 g / m 2) of rayon fibers used as the porous substrate. A double-sided pressure-sensitive adhesive sheet each containing a porous substrate as a substrate was prepared. Then, one side of the double-sided pressure-sensitive adhesive sheet was attached to the opposite side of the FPC on which the electronic component was mounted. Therefore, an FPC with a pressure-sensitive adhesive sheet for fixing the FPC to the fixing plate was prepared.

Example 5

2.0 parts of benzoyl peroxide and toluene were mixed and stirred in 100 parts of a silicone polymer (trade name "SH4280" Dow Corning Toaray Silicone Co., Ltd.) to prepare a pressure-sensitive adhesive composition. The adhesive composition was applied to the separator and then dried in a hot air dryer for 5 minutes at 170 ° C. to form a 25 μm thick pressure sensitive adhesive layer (pressure sensitive adhesive layer), which was used as the porous substrate. On both sides of the porous aramid fibers (trade name "Nomex 411", manufactured by DuPont Teijin Advanced Papers Limited). A pressure-sensitive adhesive sheet was prepared Next, one side of the double-sided pressure-sensitive adhesive sheet was fixed on the fixing plate in the same manner as in Example 4. A pressure-sensitive adhesive sheet is attached to the FPC was prepared for.

Comparative Example 2

FPC was used without any pressure-sensitive adhesive sheet attached. That is, unlike Examples 4 to 5, each FPC according to Comparative Example 2 is composed of FPC only, and no pressure-sensitive adhesive sheet is attached to the surface.

Evaluation II

For the FPCs according to the above Examples 4 to 5 and Comparative Example 2, the time required for bonding the pressure-sensitive adhesive sheet to the FPC, the time required for fixing the FPC to the fixing plate, the time required for separating the FPC from the fixing plate, and from the FPC The time required for peeling off the pressure-sensitive adhesive sheet, the gap between the FPC and the fixing plate when the FPC was bonded to the fixing plate, the appearance of the pressure-sensitive adhesive sheet after IR heating, and the peelability of the pressure-sensitive adhesive sheet were measured by the following method. Workability and fixation of FPC were evaluated.

Time required for adhesion of pressure-sensitive adhesive sheet to FPC

Example 4 and Example 5, when manufacturing the FPC with a pressure-sensitive adhesive sheet for fixing to the fixed plate, the one side of the double-sided pressure-sensitive adhesive sheet comprising the prepared porous substrate as a substrate to mount the electronic component of the FPC Although attached to the opposite side of the face, the time (seconds) required for attaching the pressure-sensitive adhesive sheet to this FPC was measured. The evaluation results are shown in the column "Required time for attaching the pressure-sensitive adhesive sheet" in Table 2.

Time required to fasten the FPC to the mounting plate

For the FPC to which the pressure-sensitive adhesive sheet was adhered according to Examples 4 and 5, respectively, six FPCs were arranged on one fixing plate as shown in FIGS. 2A and 2B, and then mounted on the fixing plate, and hand The adhesive was pressed by pressing. FPC was fixed to the fixed plate.

Meanwhile, for the FPC according to Comparative Example 2, as shown in FIGS. 13A and 13B, six FPCs were arranged on one fixing plate, and then mounted on the fixing plate and adhered to the portions of four corners on one FPC. The FPC was fixed to the fixed plate by attaching a tape (adhesive tape coated with a silicone pressure-sensitive adhesive to one side of the substrate based on polyimide).

The time (seconds) required for fixing to the fixed plate of this FPC was measured. The evaluation results are shown in the column "Fixed time required for FPC" in Table 2.

Time required to separate FPC from the mounting plate

After fixing the FPC according to Examples 4, 5 and Comparative Example 2 to the fixed plate, the electronic component was mounted on the FPC, and after the mounting was completed, the FPC with the electronic component was separated by tweezers. Further, after peeling off the adhesive tape attached to the four corners of the FPC to the FPC according to Comparative Example 2, the FPC equipped with the electronic component was separated with tweezers.

The time required to separate this FPC from the fixed plate was measured. The evaluation result is shown in the column of "time required for separation of FPC" in Table 2.

Time required to separate the pressure-sensitive adhesive sheet from the FPC

In each of Examples 4 and 5, a pressure-sensitive adhesive sheet for fixing the FPC to the fixing plate is laminated to each FPC. Therefore, the time (second) required for peeling a pressure-sensitive adhesive sheet from FPC was measured. The evaluation results are shown in the column "Time required for peeling the pressure-sensitive adhesive sheet" in Table 2.

Clearance between the FPC and the fixing plate when attaching the FPC to the fixing plate

For the FPC manufactured in the measurement of the time required to fix the FPC to the fixed plate and fixed to the fixed plate, the clearance in mm between the FPC and the fixed plate is measured, and the gap between the FPC and the fixed plate when the FPC is attached to the fixed plate (mm ) Was investigated. The evaluation results are shown in the column labeled "Gap between FPC and fixed plate" in Table 2.

Appearance of pressure-sensitive adhesive sheet after IR heating

After the FPCs according to Examples 4, 5 and Comparative Example 2 were fixed to the fixed plate, electronic components were mounted on the respective FPCs. After the mounting was completed, the appearance of the pressure-sensitive adhesive sheet was visually observed. In addition, IR heating (heating based on infrared rays) was performed at the time of mounting. The evaluation results are shown in the column "Appearance of the pressure-sensitive adhesive sheet" in Table 2.

Peelability of Pressure Sensitive Adhesive Sheet

In the measurement of the time required to peel the pressure-sensitive adhesive sheet from the FPC, the peelability of the pressure-sensitive adhesive sheet from the FPC was investigated. The evaluation results are shown in the column "Releasability of the pressure-sensitive adhesive sheet" in Table 2.

Example 4 Example 5 Comparative Example 2 Time required to attach the pressure-sensitive adhesive sheet in seconds 30 30 - Number of seconds required to freeze FPC 20 20 120 Number of seconds required to split FPC 10 10 60 Time (seconds) required to peel off the pressure-sensitive adhesive sheet 20 20 - Total time required (seconds) 80 80 180 Gap between FPC and fixing plate (mm) <0.1 <0.1 0.5 Appearance of pressure-sensitive adhesive sheet Good Good - Peelability of Pressure Sensitive Adhesive Sheet Good Good -

From Table 2, when using the FPCs according to Examples 4 and 5 with a pressure-sensitive adhesive sheet, the total time required, such as the time required for attaching the FPC to the fixed plate and the time required to separate the FPC from the fixed plate, is greatly reduced. It can shorten and it is excellent in workability. In addition, there is little gap between the FPC and the fixed plate, and the FPC is firmly adhered to the fixed plate so that the positional change of the FPC does not occur. Therefore, the electronic component can be mounted on the FPC with excellent precision.

Example 6

Acrylic rubber (trade name "Rheocoat R5000" manufactured by Toray Cortex Company Limited) was dissolved in toluene to prepare a solution having a content of base polymer of 15% by weight. To 100 parts of this solution, 5 parts of isocyanate-based crosslinked product (manufactured by the trade name "Coronate L" Nippon Polyurethane Industry Co., Ltd.) were added and mixed to prepare a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition was applied to the separator and then dried in a hot air dryer at 130 ° C. for 5 minutes to form a pressure-sensitive adhesive layer (pressure sensitive adhesive layer) having a thickness of 50 μm. This pressure sensitive adhesive layer was transferred to both sides of the porous substrate (made by the trade names "Nomex" E. Dupont de Nemo and & Co.) of aramid fibers used as the porous substrate. Thus, a double-sided pressure-sensitive adhesive sheet containing a porous substrate as a substrate was prepared.

Example 7

Toluene with 50 parts of 2-ethylhexyl acrylate, 50 parts of ethyl acrylate, 5 parts of methyl methacrylate and 5 parts of 2-hydroxyethyl acrylate together with 0.4 part of 2,2'-azobisisobutylonitrile under nitrogen substitution. Solution polymerization was carried out with stirring at 60 to 80 ° C. in 210 parts to prepare a pressure sensitive adhesive solution having a viscosity of about 120 poise, a polymerization rate of 99.2%, and a solid content of 30.0% by weight. To 100 parts of this solution, 5 parts of isocyanate-based crosslinked product (manufactured by the trade name "Coronate L" Nippon Polyurethane Industry Co., Ltd.) were added and mixed to prepare a pressure-sensitive adhesive composition. After applying the pressure-sensitive adhesive composition to the separator, it is dried for 5 minutes at 40 ℃ in a hot air dryer, followed by drying for 5 minutes at 130 ℃ to obtain a pressure-sensitive adhesive layer (pressure-sensitive adhesive layer) of 50 ㎛ thickness Formed. This pressure-sensitive adhesive layer was transferred to both sides of the nonwoven fabric (weight 23 g / m 2 per unit area) of the rayon fibers used as the porous substrate to prepare a double-sided pressure-sensitive adhesive sheet containing the porous substrate as the substrate.

Example 8

Acrylic rubber (trade name "Rheocoat R5000" manufactured by Toray Cortex Company Limited) was dissolved in toluene to prepare a solution having a content of base polymer of 15% by weight. To 100 parts of this solution, 5 parts of isocyanate-based crosslinked product (manufactured by the trade name "Coronate L" Nippon Polyurethane Industry Co., Ltd.) were added and mixed to prepare a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition was applied to the separator and then dried in a hot air dryer at 130 ° C. for 5 minutes to form a pressure-sensitive adhesive layer (pressure sensitive adhesive layer) having a thickness of 50 μm. This pressure sensitive adhesive layer was transferred to both sides of the porous substrate (weight 23 g / m 2 per unit area) of the aramid fibers used as the porous substrate. Thus, a double-sided pressure-sensitive adhesive sheet containing a porous substrate as a substrate was prepared.

Example 9

A preliminary mixture of 70 parts of isononyl acrylate, 28 parts of butyl acrylate, 2 parts of acrylic acid and 0.1 part of 2,2-dimethoxy-2-phenylacetphenone (photopolymerization initiator) was partially polymerized by exposure to ultraviolet light under a nitrogen atmosphere. . Thus, a coatable syrup having a viscosity of about 300 poise was prepared. 0.4 parts of trimethylolpropane triacrylates (crosslinked binders) were added to 100 parts of this syrup, and mixed to prepare a pressure-sensitive adhesive composition. After apply | coating a pressure-sensitive adhesive composition to a separator, 900mJ / cm <2> ultraviolet-rays were irradiated with the high pressure mercury lamp of the light intensity of 5mW / cm <2> under a nitrogen gas atmosphere, and photopolymerization process was carried out. Drying treatment was performed at 130 ° C. for 5 minutes in a hot air dryer to form a pressure sensitive adhesive layer (pressure sensitive adhesive layer) having a thickness of 50 μm. This pressure sensitive adhesive layer was transferred to one side of a nonwoven fabric (weight 14 g / m 2 per unit area) of rayon fibers used as the porous substrate.

In addition, a preliminary mixture consisting of 100 parts of isononyl acrylate and 0.3 part of 2,2-dimethoxy-2-phenylacetphenone (photopolymerization initiator) was partially polymerized by exposure to ultraviolet light under a nitrogen atmosphere, and the viscosity was about 200 poise. A coatable syrup was prepared. To 100 parts of this syrup, 0.2 parts of trimethylolpropane triacrylate (crosslinked binder) was added and mixed to prepare a pressure-sensitive adhesive composition. Thereafter, the pressure-sensitive adhesive composition is directly transferred to the non-woven fabric side of the non-woven fabric (ray porous substrate) of the rayon fiber on the opposite side of the non-woven fabric to which the pressure-sensitive adhesive layer has been transferred, and has a high intensity of 5 mW / cm 2 at a light intensity under a nitrogen gas atmosphere. UV light of 900 mJ / cm 2 was irradiated with a mercury lamp to perform photopolymerization treatment. Subsequently, drying treatment was performed at 130 ° C. for 5 minutes in a hot air dryer to prepare a double-sided pressure-sensitive adhesive sheet (120 μm in thickness of the sheet) including the porous substrate as the substrate.

Example 10

2.0 parts of benzoyl peroxide and toluene were mixed and stirred in 100 parts of a silicone polymer (trade name "SH4280" Dow Corning Toaray Silicone Co., Ltd.) to prepare a pressure-sensitive adhesive composition. The adhesive composition was applied to the separator and then dried in a hot air dryer for 5 minutes at 170 ° C. to form a 25 μm thick pressure sensitive adhesive layer (pressure sensitive adhesive layer), which was used as the porous substrate. Delivered to one side of the clay coated paper.

In addition, the pressure-sensitive adhesive composition is applied to the surface of the clay coated paper on the opposite side of the clay coated paper to which the pressure-sensitive adhesive layer has been transferred, and then dried in a hot air dryer at 170 ° C. for 5 minutes to reduce the pressure on both sides to include the porous substrate as a substrate. The adhesive sheet (120 micrometers in thickness of the sheet) was produced.

Evaluation Ⅲ

A polyimide film ("Katon 100H", DuPont-Toray Co., Limited) having a thickness of 25 μm on one side of each pressure-sensitive adhesive sheet according to Examples 6 to 10 and , Commonly used as a substrate for FPC), and the separator was peeled off to form an adhesive tape having a width of 20 mm and a length of 100 mm. The pressure-sensitive adhesive tape was reciprocated once with a 2 kg roller each as an adherend and laminated to a polyimide film and an aluminum plate similar to those used above, aged for 30 minutes under conditions of a temperature of 23 ° C. and a relative humidity of 50%. It heated by infrared rays (IR heating). After that, the 90 ° peel adhesion (pressure-sensitive adhesive property), the presence / expansion at the time of IR heating (expansion / peelability at the time of IR heating), the peelability (peelability), and the FPC at the time of FPC peeling Damage such as warpage or bending (prevention of damage during peeling) was measured and evaluated by the following method. The results are shown in Table 3.

90 ° peel adhesion

For adhesive tape adhered to a polyimide film or an aluminum plate, aged (initial) for 30 minutes under conditions of a temperature of 23 ° C. and a relative humidity of 50% (initial), and heated by infrared radiation (IR heating) after aging (After IR heating) was prepared. For these tapes, pressure-sensitive adhesive properties were evaluated by measuring a 90 ° peel strength (N / 20 mm) at a rate of 300 mm / min with a tensile tester under conditions of a temperature of 23 ° C. and a relative humidity of 50%. In addition, the evaluation results are shown in the columns of the corresponding "initial" and "after IR heating" in "polyimide" and "aluminum" of "90 ° peel adhesion" in Table 3.

Whether or not to expand / detach during IR heating

After IR heating, the presence or absence of swelling / peeling between the polyimide film and the pressure-sensitive adhesive layer and between the aluminum plate and the pressure-sensitive adhesive layer was visually observed to evaluate the swelling / peeling resistance at 1R heating. The evaluation result is shown in the column "the presence or absence of expansion / peeling at the time of IR heating" in Table 3.

Peelability

Peelability (peelability) when peeling a polyimide film as an adherend from an adhesive tape and peelability (peelability) when peeling an adhesive tape from an aluminum plate were confirmed by hand feeling to evaluate peelability. . The evaluation results are shown in the columns "Initial" and "After IR heating" in the "polyimide" and "aluminum" of the corresponding "peelability" in Table 1, respectively.

Damage such as bending or bending of the FPC when peeling the FPC

After peeling an FPC from an adhesive tape, damage, such as the bending or bending of an FPC, was visually confirmed and the damage prevention property at the time of peeling was evaluated. The evaluation result is shown in the column of "the presence or absence of the curvature / bending at the time of FPC peeling" in Table 3.

Example 6 7 8 9 10 90 ° peeling strength (N / 20㎜) Polyimide Early 1.5 4.5 2.3 4.0 5.5 IR heating 1.6 4.8 2.5 4.2 5.5 aluminum Early 1.6 5.5 2.5 5.5 5.5 IR heating 1.8 6.0 2.7 5.5 5.5 Peelability Polyimide Early Good Good Good Good Good IR heating Good Good Good Good Good aluminum Early Good Good Good Good Good IR heating Good Good Good Good Good Whether or not to expand / detach during IR heating radish radish radish radish radish Bending / Bending in FPC Peeling radish radish radish radish radish

From Table 3, each of the adhesive tapes according to Examples 6 to 10 is a pressure-sensitive adhesive tape for fixing the FPC when the electronic component is mounted on the FPC, which is very important for peeling and preventing expansion / peeling during IR heating. Have sex. In addition, the pressure-sensitive adhesive tape can prevent bending or bending of the FPC when the FPC is peeled off, and maintains proper pressure-sensitive adhesive properties to the FPC even after IR heating.

Example 11

97 parts of 2-ethylhexyl acrylate and 3 parts of acrylic acid were subjected to solution polymerization by stirring at 60 to 80 ° C. in 210 parts of toluene together with 0.3 parts of 2,2′-azobisisobutylonitrile under nitrogen substitution to obtain about 120 poises. A pressure sensitive adhesive solution having a viscosity, a polymerization rate of 99.2% and a solids content of 32.3% by weight was prepared. To 100 parts of this solution, 2 parts of isocyanate-based crosslinkers (trade name "tetrad" manufactured by Mitsumishi Gas Chemical Co., Ltd.) were added and mixed to prepare a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition was applied to the separator and then dried in a hot air drier at 120 ° C. for 2 minutes to form a pressure-sensitive adhesive layer (pressure sensitive adhesive layer) having a thickness of 50 μm. This pressure-sensitive adhesive layer was transferred to both sides of the nonwoven fabric (weight 23 g / m 2 per unit area) of the rayon fibers used as the porous substrate to prepare a double-sided pressure-sensitive adhesive sheet containing the porous substrate as the substrate.

In addition, 0.5 parts of an epoxy-based crosslinked product (trade name "tetrad" manufactured by Mitsumishi Gas Chemical Co., Ltd.) was added to 100 parts of the pressure-sensitive adhesive solution, and mixed to prepare a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition was applied to the release paper, and then dried in a hot air dryer at 120 ° C. for 3 minutes to form a pressure-sensitive adhesive layer (pressure sensitive adhesive layer) having a thickness of 50 μm. The pressure sensitive adhesive layer is transferred to the nonwoven side of the pressure sensitive adhesive sheet having the pressure sensitive adhesive layer on the FPC side to include a porous substrate having a pressure sensitive adhesive layer on the carrier board side and a pressure sensitive adhesive layer on the FPC side as the substrate. A pressure sensitive adhesive sheet was produced.

Example 12

Anti-aging agent-containing pressure-sensitive adhesive was added by adding 2 parts of anti-aging agent (trade name "Irganox 1010" manufactured by Ciba-Geigy Ltd.) to 100 parts of the pressure-sensitive adhesive solution in Example 11. Adhesive solution was prepared. Including the pressure-sensitive adhesive layer on the carrier board side and the pressure-sensitive adhesive layer on the FPC side and including a porous substrate as the substrate in the same manner as in Example 11 except that the anti-aging agent-containing pressure-sensitive adhesive solution was used as the pressure-sensitive adhesive solution. A double-sided pressure-sensitive adhesive sheet was prepared.

Example 13

Porous substrate of aramid fibers (trade name "Nomex", EI DePont de Nemours & Co. Double-sided pressure-sensitive adhesive comprising as a substrate a porous substrate having a pressure-sensitive adhesive layer on the carrier board side and a pressure-sensitive adhesive layer on the FPC side, in the same manner as in Example 11 except that Sheets were prepared.

Example 14

A preliminary mixture consisting of 98 parts of butyl acrylate, 2 parts of acrylic acid and 0.1 part of 2,2-dimethoxy-2-phenylacetphenone (photopolymerization initiator) was partially polymerized by exposure to ultraviolet light under a nitrogen atmosphere. Thus, a coatable syrup having a viscosity of about 300 poise was prepared. 0.4 parts of trimethylolpropane triacrylates (crosslinked binders) were added to 100 parts of this syrup, and mixed to prepare a pressure-sensitive adhesive composition. After apply | coating a pressure-sensitive adhesive composition to a separator, 900mJ / cm <2> ultraviolet-rays were irradiated with the high pressure mercury lamp of the light intensity of 5mW / cm <2> under a nitrogen gas atmosphere, and photopolymerization process was carried out. Drying treatment was performed at 130 ° C. for 5 minutes in a hot air dryer to form a pressure sensitive adhesive layer (pressure sensitive adhesive layer) having a thickness of 50 μm. This pressure sensitive adhesive layer was transferred to one side of a nonwoven fabric (weight 14 g / m 2 per unit area) of rayon fibers used as the porous substrate.

In addition, a preliminary mixture consisting of 100 parts of isononyl acrylate and 0.3 part of 2,2-dimethoxy-2-phenylacetphenone (photopolymerization initiator) was partially polymerized by exposure to ultraviolet light under a nitrogen atmosphere, and the viscosity was about 200 poise. A coatable syrup was prepared. To 100 parts of this syrup, 0.2 parts of trimethylolpropane triacrylate (crosslinked binder) was added and mixed to prepare a pressure-sensitive adhesive composition. Thereafter, the pressure-sensitive adhesive composition is directly transferred to the non-woven fabric side of the non-woven fabric (ray porous substrate) of the rayon fiber on the opposite side of the non-woven fabric to which the pressure-sensitive adhesive layer has been transferred, and has a high intensity of 5 mW / cm 2 at a light intensity under a nitrogen gas atmosphere. UV light of 900 mJ / cm 2 was irradiated with a mercury lamp to perform photopolymerization treatment. Subsequently, drying treatment was performed at 130 ° C. for 5 minutes in a hot air dryer to prepare a double-sided pressure-sensitive adhesive sheet (120 μm in thickness of the sheet) including the porous substrate as the substrate.

Evaluation Ⅳ

For each of the pressure-sensitive adhesive sheets of Examples 11 to 14 described above, the storage elastic modulus, tensile strength, 90 ° peel adhesive force, pick-up property of FPC after IR heating, peelability of pressure-sensitive adhesive sheet after IR heating, and IR heating The presence / absence (expansion / peelability at the time of IR heating) with or without expansion / detachment was measured and evaluated by the following method. These results are shown in Table 4.

Storage modulus

The pressure-sensitive adhesive composition (pressure-sensitive adhesive composition according to the FPC side pressure-sensitive adhesive layer) prepared by the production method according to Examples 11 to 14 was applied to the separator, and the drying treatment was performed at a predetermined temperature and time in the hot air dryer, respectively. A pressure sensitive adhesive layer (pressure sensitive adhesive layer) having a thickness of 100 μm was produced, respectively, and the pressure sensitive adhesive layer was laminated to prepare a sheet having a thickness of about 1 mm. The sheet was punched to a predetermined size to obtain a measurement sample, and the storage elastic modulus was used for the sample using "ARES" manufactured by Leometrics Corporation. The geometry was parallel plate, frequency was 1 Hz, temperature was 0 and It measured on 250 degree conditions. In addition, the evaluation result is shown in the column of the "storage elastic modulus" of Table 4.

The tensile strength

Each pressure-sensitive adhesive sheet obtained in Examples 11 to 14 was processed to a width of 20 mm and aged for 30 minutes at 23 ° C. and 50% relative humidity under conditions of 100 mm between chucks (initial stage). And the intensity | strength (N / 15mm) at the time of breaking at a speed | rate of 300 mm / min with the tensile tester about what heated after infrared (IR heating) (after IR heating) was measured. In addition, the evaluation result is shown in the corresponding column of each "initial stage" and "after IR heating" in the "tensile strength" of Table 4.

90 ° peel adhesion

Each pressure-sensitive adhesive sheet obtained in Examples 11 to 14 was attached to one surface thereof with a polyimide film having a thickness of 25 µm ("Capton 100H" manufactured by Toray DuPont, commonly used as a substrate for FPC). It peels, It is made into the adhesive tape of width 20mm and the length 100mm, The said adhesive tape is made into a to-be-adhered agent, It adheres by reciprocating 1 round with a polyimide film, an aluminum plate, and a 2 kg roller, respectively, as mentioned above, and also at 23 degreeC Tensile tester under conditions of 23 ° C. and 50% relative humidity for those aged for 30 minutes under conditions of a relative humidity of 50% (initial stage) and then those heated by infrared rays (IR heating) (after IR heating). 90 degree peeling strength (N / 20mm) was measured by the speed | rate of 300 mm / min by the following. In addition, the evaluation result is shown in the corresponding column of each "initial stage" and "after IR heating" in "polyimide" and "aluminum" of "90 degree peeling adhesive force" of Table 4, respectively.

Pickup of FPC after IR heating

Using an aluminum carrier board as the carrier board, as shown in FIGS. 1A and 1B, each of six FPCs is positioned with respect to one carrier board, and then placed on a pressure-sensitive adhesive layer formed on the surface of the carrier board. The adhesive was pressed by hand and adhered to fix the FPC to the carrier board. Thereafter, IR heating was performed, and immediately after IR heating and after cooling to room temperature, the FPC was peeled off from the pressure-sensitive adhesive sheet, and the ease of peeling at the time of peeling and the stress to the FPC were visually confirmed (by hand feel), Pickup properties of the FPC were evaluated. In addition, the evaluation result is shown in the corresponding column of "immediately after IR heating" and "after room temperature cooling" of "pickup property of FPC after IR heating" of Table 4, respectively.

Peelability of the pressure-sensitive adhesive sheet after IR heating

After measurement of the pick-up property of the FPC after the IR heating, the peelability (peelability) at the time of peeling off the pressure-sensitive adhesive sheet from the aluminum carrier board was visually confirmed (by hand feel) to determine the pressure-sensitive adhesive sheet. Peelability was evaluated. In addition, the evaluation result is shown in the column of "the peelability of the pressure-sensitive adhesive sheet after IR heating" of Table 4, respectively.

IR expansion / detachment when heated

In the measurement of the pick-up property of the FPC after the IR heating, the presence or absence of expansion / peeling between the pressure-sensitive adhesive sheet and the aluminum carrier board during the IR heating or after the heating was visually observed, and the expansion / irradiation at the time of IR heating was observed. Peeling prevention was evaluated. In addition, the evaluation result is shown in the column of "the presence or absence of expansion / peeling at the time of IR heating" of Table 4.

Example 11 12 13 14 Storage modulus (× 10 ⁵ kPa) 0 ℃ 3.5 3.4 3.5 4.0 300 ℃ 4.2 4.2 4.2 4.2 Tensile Strength (N / 15mm) Early 12 12 39 12 After IR heating 9 11 40 9 90 ° peeling strength (N / 20㎜) Polyimide Early 2.0 2.0 1.8 3.5 After IR heating 1.7 1.9 1.6 3.3 aluminum Early 3.5 3.6 3.4 5.8 After IR heating 3.8 3.8 3.7 5.9 Pickup of FPC after IR heating Immediately after IR heating Good Good Good Good After cooling to room temperature Good Good Good Good Peelability of Pressure Sensitive Adhesive Sheet After IR Heating Good Good Good Good Whether or not to expand / detach during IR heating radish radish radish radish

From Table 4, since each of the pressure-sensitive adhesive sheets of Examples 11 to 14 has a storage elastic modulus (frequency: 1 Hz) of the pressure-sensitive adhesive layer at a temperature of 0 to 300 ° C and is in the range of 10 ³ to 10 ⁶ Hz, the IR Even if heating is performed, deterioration of the pressure-sensitive adhesive layer does not occur, and the pickup property of the FPC is good. Moreover, since the tensile strength of a pressure-sensitive adhesive sheet is also 5 N / 15 mm or more, the peelability of the pressure-sensitive adhesive sheet is also good. Moreover, since a porous base material is used as a base material, it has expansion / peeling prevention property at the time of IR heating. Therefore, each of the pressure-sensitive adhesive sheets of Examples 11 to 14 is very important as an adhesive tape for fixing the FPC at the time of mounting the electronic components in the FPC, the pick-up property of the FPC, the peelability of the pressure-sensitive adhesive sheet, and the IR heating. It has all of the expansion / exfoliation properties.

Example 15

Acrylic rubber (trade name "Leocoat R5000" manufactured by Toray Cortex Co., Ltd.) was dissolved in toluene to prepare a solution having a content of the base polymer of 15% by weight. To 100 parts of this solution, 5 parts of isocyanate crosslinked product (trade name "Colonate L" manufactured by Nippon Polyurethane Industry Co., Ltd.) were added and mixed to prepare a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition was applied to both sides of a porous substrate (trade name "Nomex" manufactured by DuPont) by aramid fibers used as a porous substrate, using an applicator with a spacer of 2 mm pitch, and then 130 in a hot air dryer. After drying for 5 minutes, a pressure-sensitive adhesive layer (pressure-sensitive pressure-sensitive adhesive layer) having a thickness of 50 µm was formed to prepare a double-sided pressure-sensitive adhesive sheet (tape thickness: 150 µm) containing a porous substrate as a substrate. . In the double-sided pressure-sensitive adhesive sheet containing the base material, a pressure-sensitive adhesive is spray-coated, and a pressure-sensitive adhesive layer having a linear convex portion is formed on the surface thereof.

And one side of the said double-sided pressure-sensitive adhesive sheet was bonded to the aluminum plate, and the fixed plate which has a linear convex part on the surface with a pressure-sensitive adhesive layer was produced.

Example 16

A pressure-sensitive adhesive composition was prepared by mixing and stirring 2.0 parts of benzoyl peroxide and toluene to 100 parts of a silicone polymer (trade name "SH4280" manufactured by Toray Dow Corning Silicone Co., Ltd.). The pressure-sensitive adhesive composition was applied to both sides of the polyimide film substrate (nonporous substrate) using an applicator with a spacer of 2 mm pitch, and then dried at 170 ° C. in a hot air dryer for 5 minutes, A pressure-sensitive adhesive layer (pressure-sensitive pressure-sensitive adhesive layer) having a thickness of 50 µm was formed to prepare a double-sided pressure-sensitive adhesive sheet (tape thickness: 150 µm) with a substrate. As said double-sided pressure-sensitive adhesive sheet with a base material, a pressure-sensitive adhesive is striped coated, and a pressure-sensitive adhesive layer having a linear convex portion on the surface is formed.

Then, one side of the double-sided pressure-sensitive adhesive sheet was bonded to an aluminum plate to prepare a fixing plate having a pressure-sensitive adhesive layer having a linear convex portion on its surface.

Example 17

100 parts of 2-ethylhexyl acrylate and 2 parts of acrylic acid were mixed in 210 parts of toluene with 0.2 parts of benzoyl peroxide and 0.01 parts of trimethylolpropanetriacrylate (crosslinked compound) and stirred at 60 to 80 ° C. under nitrogen substitution. A polymerization treatment was carried out to prepare a pressure-sensitive adhesive solution (pressure-sensitive pressure-sensitive adhesive solution) having a viscosity of about 120 poise, a polymerization rate of 99.2%, and a solid content of 30.0% by weight, and an isocyanate-based crosslinked product (trade name) "colonate L" in 100 parts of this solution. "5 parts of Japan Polyurethane Industries, Ltd.) was added and mixed to prepare a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition was applied to both sides of the polyimide film substrate (nonporous substrate) using an applicator with a spacer having a 2 mm pitch, and then dried at 130 ° C. for 5 minutes in a hot air dryer. A pressure-sensitive adhesive layer (pressure-sensitive pressure-sensitive adhesive layer) having a thickness of 50 µm was formed to prepare a double-sided pressure-sensitive adhesive sheet (tape thickness: 150 µm) with a substrate. As said double-sided pressure-sensitive adhesive sheet with a base material, a pressure-sensitive adhesive is striped coated, and a pressure-sensitive adhesive layer having a linear convex portion on the surface is formed.

Then, one side of the double-sided pressure-sensitive adhesive sheet was bonded to an aluminum plate to prepare a fixing plate having a pressure-sensitive adhesive layer having a linear convex portion on its surface.

Comparative Example 3

An aluminum plate was used as the fixing plate. That is, the fixing plate according to Comparative Example 3 is composed only of aluminum plates, and as in Examples 15 to 17, the surface does not have a pressure-sensitive adhesive layer.

Rating V

For the fixed plates according to the above embodiments 15 to 17, the time required for fixing the FPC, the gap between the FPC and the fixed plate when the FPC is bonded to the fixed plate, the time required for the separation of the FPC, and the expansion / detachment upon IR heating The presence or absence was measured by the following method, and workability and the fixed state of FPC were evaluated.

Time required for fixing the FPC

For the fixing plates according to Examples 15 to 17, as shown in Figs. 1A and 1B, with respect to one fixing plate having a pressure-sensitive adhesive layer on its surface, each of six FPCs was positioned, and then the surface of the fixing plate was The FPC was fixed to the fixed plate by placing on the formed pressure-sensitive adhesive layer and pressing by hand to adhere.

On the other hand, for the fixed plate according to Comparative Example 3, as shown in Figs. 13A and 13B, after positioning six FPCs with respect to one fixed plate, respectively, and put them on the fixed plate, four corners with respect to one FPC An adhesive tape (adhesive tape coated with a silicone pressure-sensitive adhesive on one side of the substrate by polyimide) was attached to the FPC to fix the FPC to the fixing plate.

The time (seconds) required for fixing this FPC to the fixed plate was measured. The evaluation results are shown in the column "Time required for FPC fixation" in Table 5.

Gap between FPC and fixed plate

The gap (mm) between the FPC and the fixed plate was measured by measuring the gap (mm) between the FPC and the fixed plate with respect to the fixed plate on which the FPC manufactured in the measurement of the time required for fixing the FPC was fixed. Investigate. The evaluation result is shown in the column of "space | interval of FPC and a fixed plate" in Table 1. In FIG.

Time required for separation of FPC

After the measurement of the gap between the FPC and the fixed plate, mounting of the electronic component to the FPC was performed. After completion of the mounting, the FPC to which the electronic component was mounted was separated with tweezers. In addition, regarding the fixing plate which concerns on the comparative example 3, after peeling the adhesive tape attached to four corners of FPC, the FPC with which the electronic component was mounted was removed with tweezers.

The time (seconds) required for separation of the FPC from the fixed plate was measured. The evaluation results are shown in the column "Time required for FPC separation" in Table 5.

IR expansion / detachment when heated

In addition, after measuring the gap between the FPC and the fixed plate, IR heating is performed, and after IR heating, the presence or absence of expansion / peel between the aluminum plate and the pressure-sensitive adhesive layer is visually observed to prevent expansion / peeling during IR heating. Sex was evaluated. The said evaluation result is shown in the column of "the presence or absence of expansion / peeling at the time of IR heating" of Table 5.

Example 15 Example 16 Example 17 Comparative Example 3 Number of seconds required to freeze FPC 30 30 30 120 Number of seconds required to split FPC 15 15 15 60 Gap between FPC and fixing plate (mm) 0-0.1 0-0.1 0-0.1 0.51 Whether or not to expand / detach during IR heating radish radish radish radish

From Table 5, the fixing plate in which the pressure-sensitive adhesive layer having the linear convex portions on the surface of Examples 15 to 17 was formed, the time required for mounting and the time required for separation were very short, and workability was excellent. In addition, there is almost no gap between the FPC and the fixed plate, and the FPC is firmly adhered to the fixed plate and does not cause positional shift of the FPC. Moreover, even if IR heating is performed, expansion and peeling do not occur between the aluminum plate and the pressure-sensitive adhesive layer, and a state of being firmly fixed is maintained, and it has expansion / peeling prevention property at the time of IR heating. Therefore, the electronic component can be mounted to the flexible printed wiring circuit with high accuracy.

Example 18

Acrylic rubber (trade name "Leocoat R5000" manufactured by Toray Cortex Co., Ltd.) was dissolved in toluene to prepare a solution having a content of the base polymer of 15% by weight. To 100 parts of this solution, 5 parts of isocyanate crosslinked product (trade name "Colonate L" manufactured by Nippon Polyurethane Industry Co., Ltd.) were added and mixed to prepare a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition was applied to both sides of a porous substrate (trade name "Nortex" DuPont) made of aramid fibers used as the porous substrate, and then dried at 130 ° C. for 5 minutes in a hot air dryer to obtain a thickness of 50 Forming a pressure-sensitive adhesive layer (pressure-sensitive pressure-sensitive adhesive layer) of μm to prepare a double-sided pressure-sensitive adhesive sheet (tape thickness: 150㎛) with a substrate, and further punching the substrate-sided double-sided pressure-sensitive adhesive sheet, A double-sided pressure-sensitive adhesive sheet (tape thickness: 150 占 퐉) with a substrate was prepared by a porous substrate having a pressure-sensitive adhesive layer having a form of a hole (through hole) penetrating to another surface.

Then, one side of the double-sided pressure-sensitive adhesive sheet was bonded to an aluminum plate to prepare a fixed plate having a pressure-sensitive adhesive layer having a hole in its surface.

Example 19

2.0 parts of benzoyl peroxide and toluene were mixed and stirred with 100 parts of silicone polymers (brand name "SH4280" made by Toray Dow Corning Silicone Co., Ltd.), and the pressure-sensitive adhesive composition was prepared. After apply | coating the said pressure sensitive adhesive composition on both surfaces of a polyimide film base material (non-porous base material), it dry-processes for 5 minutes at 170 degreeC in a hot air dryer, and a 50-micrometer-thick pressure-sensitive adhesive layer (pressure-sensitive adhesive) Layer), a double-sided pressure-sensitive adhesive sheet with a substrate (tape thickness: 150 µm) was produced, and a punching process was performed on the double-sided pressure-sensitive adhesive sheet with a substrate to penetrate the surface to another surface ( A double-sided pressure-sensitive adhesive sheet (tape thickness: 150 mu m) with a substrate was prepared by a porous substrate on which a pressure-sensitive adhesive layer having a form of a through hole was formed.

Then, one side of the double-sided pressure-sensitive adhesive sheet was bonded to an aluminum plate to prepare a fixed plate having a pressure-sensitive adhesive layer having a hole in its surface.

Example 20

100 parts of 2-ethylhexyl acrylate and 2 parts of acrylic acid were dissolved in 210 parts of toluene, with 0.2 parts of benzoyl peroxide and 0.01 parts of trimethylolpropanetriacrylate (crosslinked compound) coexisting with nitrogen at 60-80 ° C while stirring. A polymerization treatment was conducted to prepare a pressure sensitive adhesive solution (a pressure sensitive pressure sensitive adhesive solution) having a viscosity of about 120 poise, a polymerization rate of 99.2%, and a solid content of 30.0% by weight, and an isocyanate-based crosslinked product (trade name) "colonate L" in 100 parts of this solution. "5 parts of Japan Polyurethane Industries, Ltd.) was added and mixed to prepare a pressure-sensitive adhesive composition. After apply | coating the said pressure sensitive adhesive composition on both surfaces of a polyimide film base material (non-porous base material), it is made to dry at 130 degreeC for 5 minutes in a hot air dryer, and the pressure-sensitive adhesive layer of 50 micrometers in thickness (pressure-sensitive adhesive) Layer), a double-sided pressure-sensitive adhesive sheet with a substrate (tape thickness: 150 µm) was produced, and a punching process was performed on the double-sided pressure-sensitive adhesive sheet with a substrate to penetrate the surface to another surface ( A double-sided pressure-sensitive adhesive sheet (tape thickness: 150 mu m) with a substrate was prepared by a porous substrate on which a pressure-sensitive adhesive layer having a form of a through hole was formed.

Then, one side of the double-sided pressure-sensitive adhesive sheet was bonded to an aluminum plate to prepare a fixed plate having a pressure-sensitive adhesive layer having a hole in its surface.

Comparative Example 4

An aluminum plate was used as the fixing plate. That is, the fixing plate according to Comparative Example 4 is composed of only aluminum plates, and as in Examples 18 to 20, the surface does not have a pressure-sensitive adhesive layer.

Evaluation VI

For the fixed plates according to the above Examples 18 to 20, the time required for fixing the FPC, the gap between the FPC and the fixed plate when the FPC is bonded to the fixed plate, the time required for the separation of the FPC, and the expansion / detachment upon IR heating The presence or absence was measured by the method similar to the method in the evaluation V, and workability and the fixed state of FPC were evaluated. The results are shown in Table 6.

Example 15 Example 16 Example 17 Comparative Example 3 Number of seconds required to freeze FPC 30 30 30 120 Number of seconds required to split FPC 15 15 15 60 Gap between FPC and fixing plate (mm) 0-0.1 0-0.1 0-0.1 0.51 Whether or not to expand / detach during IR heating radish radish radish radish

From Table 6, the fixing plate in which the pressure-sensitive adhesive layer having a hole portion is formed on the surface of Examples 18 to 20 has a very short time required for mounting and a time required for separation, and is excellent in workability. In addition, there is little gap between the FPC and the fixed plate, the FPC is firmly adhered to the fixed plate, and does not cause the position change of the FPC. In addition, expansion and peeling do not occur between the aluminum plate and the pressure-sensitive adhesive layer during IR heating, and a state of being firmly fixed is maintained, and it has expansion / peeling prevention property during IR heating. Therefore, the electronic component can be mounted to the flexible printed wiring circuit with high accuracy.

Although this invention was detailed also demonstrated with reference to the specific embodiment, it is clear for those skilled in the art that various changes and correction can be added without deviating from the mind and range of this invention.

The present application is based on the following Japanese patent application, the contents of which are incorporated herein by reference.

Japanese Patent Application No. 2001-119430 filed April 18, 2001

Japanese Patent Application No. 2001-119431 filed April 18, 2001

Japanese Patent Application No. 2001-151846 filed May 22, 2001

Japanese Patent Application No. 2001-151850 filed May 22, 2001

Japanese Patent Application No. 2001-151853, filed May 22, 2001

Japanese Patent Application No. 2001-176838 filed June 12, 2001

According to the method of the present invention, it is easy to attach and peel the flexible printed wiring circuit to the fixing plate, so that the time required for attaching and peeling can be reduced. In addition, the flexible printed wiring circuit can be firmly fixed to the fixing plate. Therefore, the flexible printed wiring circuit is attached to the fixed plate with excellent workability. Can be separated. In addition, electronic components can be mounted with high precision in a flexible printed wiring circuit. In addition, when the electronic component is mounted on the flexible printed wiring circuit, even if the flexible printed wiring circuit is heated, it is possible to suppress or prevent the deterioration of the pressure-sensitive adhesive characteristics.

Claims (43)

Forming a pressure-sensitive adhesive layer on the surface of the fixing plate, Fixing the flexible printed wiring circuit to the surface of the fixing plate having the pressure-sensitive adhesive layer, and Mounting electronic components on the surface of the flexible printed circuit The mounting method of the electronic component to a flexible printed wiring circuit comprising a. The method of claim 1, And forming a pressure-sensitive adhesive layer over the entirety of the fixed plate. The method of claim 1, And forming a pressure-sensitive adhesive layer only on a part of the surface of the fixed plate to which the flexible printed wiring circuit is fixed. The method of claim 1, Attaching a substrate, and a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer to one or more sides of the substrate, onto the fixing plate, wherein the pressure-sensitive adhesive layer is positioned on the opposite side of the fixing plate. Method of mounting electronic components on wiring circuits. The method of claim 4, wherein And forming a plurality of convex portions on a surface of the pressure-sensitive adhesive layer. The method of claim 5, A method of mounting an electronic component on a flexible printed wiring circuit, further comprising linearly forming a plurality of convex portions in the plane of the pressure-sensitive adhesive sheet. The method of claim 6, A method of mounting an electronic component on a flexible printed wiring circuit, the method further comprising the step of forming a linear convex portion by stripe coating. The method of claim 4, wherein A method of mounting an electronic component on a flexible printed wiring circuit, further comprising forming a plurality of holes in the surface of the pressure-sensitive adhesive layer. The method of claim 8, A method of mounting an electronic component on a flexible printed wiring circuit, further comprising the step of forming a hole by punching. The method of claim 4, wherein A pressure-sensitive adhesive sheet has a substrate and a mounting method of an electronic component on a flexible printed wiring circuit having the pressure-sensitive adhesive layer on both surfaces of the substrate. The method of claim 4, wherein A method for attaching an electronic component to a flexible printed wiring circuit, wherein the substrate is a porous substrate. The method of claim 1, The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is at least one acrylic pressure-sensitive adhesive and silicone pressure-sensitive adhesive. Attaching the pressure-sensitive adhesive sheet to the surface of the flexible printed wiring circuit, the surface opposite to the surface on which the electronic component is to be mounted Fixing the flexible printed wiring circuit to the fixed plate through the pressure-sensitive adhesive sheet, and Mounting an electronic component on a surface of the flexible printed wiring circuit A method of mounting an electronic component on a flexible printed wiring circuit comprising a. The method of claim 13, And attaching a pressure-sensitive adhesive sheet having a substrate and a pressure-sensitive adhesive layer disposed on both sides of the substrate to the flexible printed wiring circuit. The method of claim 14, Forming a plurality of convex portions on the surface of the pressure-sensitive adhesive layer. The method of claim 15, A method of mounting an electronic component on a flexible printed wiring circuit, further comprising linearly forming a plurality of convex portions in the plane of the pressure-sensitive adhesive sheet. The method of claim 16, A method of mounting an electronic component on a flexible printed wiring circuit, the method further comprising the step of forming a linear convex portion by stripe coating. The method of claim 14, A method of mounting an electronic component on a flexible printed wiring circuit, further comprising forming a plurality of holes in the surface of the pressure-sensitive adhesive layer. The method of claim 18, A method of mounting an electronic component on a flexible printed wiring circuit, further comprising the step of forming a hole by punching. The method of claim 14, A method for attaching an electronic component to a flexible printed wiring circuit, wherein the substrate is a porous substrate. The method of claim 14, The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is at least one acrylic pressure-sensitive adhesive and silicone pressure-sensitive adhesive. A pressure-sensitive adhesive sheet applied for fixing a flexible printed wiring circuit to a fixed plate when an electronic component is mounted on the surface of the flexible printed wiring circuit, the pressure-sensitive adhesive sheet formed on a porous substrate and at least one side of the porous substrate. Pressure-sensitive adhesive sheet comprising a layer. The method of claim 22, A pressure-sensitive adhesive sheet wherein the porous substrate is made of a fibrous material. The method of claim 22, A pressure sensitive adhesive sheet wherein the pressure sensitive adhesive forming the pressure sensitive adhesive layer is at least one acrylic pressure sensitive adhesive and a silicone pressure sensitive adhesive. The method of claim 22, A pressure-sensitive adhesive sheet, wherein the pressure-sensitive adhesive layer has a plurality of convex portions formed on its surface. The method of claim 25, A pressure-sensitive adhesive sheet wherein the convex portion is formed linearly in the plane of the pressure-sensitive adhesive sheet. The method of claim 26, A pressure-sensitive adhesive sheet in which the linear convex portions are formed by the striped coating. The method of claim 22, A pressure-sensitive adhesive sheet having a plurality of holes formed in the pressure-sensitive adhesive layer thereof. The method of claim 28, A pressure-sensitive adhesive sheet in which a plurality of hole portions are formed by punching. The method of claim 22, Pressure-sensitive adhesive sheet whose melting point of the porous substrate is at least 290 ° C. The method of claim 22, The pressure-sensitive adhesive sheet having a storage modulus at a frequency of 1 Hz of the pressure-sensitive adhesive layer in the range of 10 ³ to 10 ⁶ Hz at a temperature of 0 to 300 ° C. The method of claim 22, Pressure-sensitive adhesive sheet having a tensile strength of 5 N / 15 mm or more. A pressure-sensitive adhesive sheet applied for fixing a flexible printed wiring circuit to a fixed plate when an electronic component is mounted on the surface of the flexible printed wiring circuit, the pressure-sensitive adhesive sheet being formed on the substrate and at least one side of the substrate and having a frequency of 1 kHz. The pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer having a storage modulus in the range of 10 ³ to 10 ⁶ Pa at a temperature of 0 to 300 ° C. The method of claim 33, wherein Pressure-sensitive adhesive sheet having a tensile strength of 5 N / 15 mm or more. The method of claim 33, wherein A pressure-sensitive adhesive sheet wherein the substrate is a porous substrate. 36. The method of claim 35 wherein A pressure-sensitive adhesive sheet wherein the porous substrate is made of a fibrous material. The method of claim 33, wherein A pressure sensitive adhesive sheet wherein the pressure sensitive adhesive forming the pressure sensitive adhesive layer is at least one acrylic pressure sensitive adhesive and a silicone pressure sensitive adhesive. The method of claim 33, wherein A pressure-sensitive adhesive sheet, wherein the pressure-sensitive adhesive layer has a plurality of convex portions formed on its surface. The method of claim 38, A pressure-sensitive adhesive sheet wherein the convex portion is formed linearly in the plane of the pressure-sensitive adhesive sheet. The method of claim 39, A pressure-sensitive adhesive sheet in which the linear convex portions are formed by the striped coating. The method of claim 33, wherein A pressure-sensitive adhesive sheet having a plurality of holes formed in the pressure-sensitive adhesive layer thereof. 42. The method of claim 41 wherein A pressure-sensitive adhesive sheet in which a plurality of hole portions are formed by punching. The method of claim 33, wherein The pressure-sensitive adhesive sheet whose melting point of the substrate is 290 ° C or higher.