KR20040012053A - Lift pin for manufacturing semiconductor device - Google Patents
Lift pin for manufacturing semiconductor device Download PDFInfo
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- KR20040012053A KR20040012053A KR1020020045410A KR20020045410A KR20040012053A KR 20040012053 A KR20040012053 A KR 20040012053A KR 1020020045410 A KR1020020045410 A KR 1020020045410A KR 20020045410 A KR20020045410 A KR 20020045410A KR 20040012053 A KR20040012053 A KR 20040012053A
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- lift pin
- electrostatic chuck
- wafer
- spring
- lift
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
본 발명은 반도체 제조장비용 정전척의 리프트 핀에 관한 것으로, 더욱 상세하게는 챔버내에 정전척에 내설되는 다수 리프트 핀으로 접속스프링과 복원스프링을 설치하여, 각 리프트 핀의 상승시 수평상태 및 마모상태에 따라 웨이퍼에 닫는 시간적인 차이를 극복할 수 있도록하여 웨이퍼에 충전된 전하를 원활히 제거할 수 있으며, 리프트 핀의 하강시 스프링의 복원력에 의해 상,하이동홀에 리프트 핀이 걸리는 것을 방지하므로서 원활한 승,하강 작동이 이루어지도록 한 반도체 제조장비용 정전척의 리프트 핀에 관한 것이다.The present invention relates to a lift pin of an electrostatic chuck for semiconductor manufacturing equipment, and more particularly, by installing a connection spring and a restoring spring with a plurality of lift pins built in the electrostatic chuck in the chamber, the lift pins are mounted in a horizontal state and a wear state when each lift pin is raised. As a result, it is possible to smoothly remove the charge charged in the wafer by overcoming the time difference between the wafer and the lift pin, which prevents the lift pin from being caught in the upper and lower moving holes by the spring restoring force when the lift pin is lowered. The present invention relates to a lift pin of an electrostatic chuck for semiconductor manufacturing equipment, in which a lowering operation is performed.
각종 반도체 제조장비에 있어, 웨이퍼(Wafer)를 고정시키고 적절한 온도를 가하기 위해 공정챔버내부에 구비되는 정전척은 그 내부에 승,하강 작동되는 다수의 리프트 핀(LIFT PIN)이 구비되어져 있다.In various semiconductor manufacturing equipment, the electrostatic chuck provided inside the process chamber is provided with a plurality of lift pins (LIFT PIN) to move up and down in order to fix the wafer and apply an appropriate temperature.
이러한 리프트 핀(LIFT PIN)은 웨이퍼를 반송하는 역할과, 웨이퍼에 축적된 전하를 방전하는 역할을 수행하게 되는데,The lift pin serves to convey the wafer and discharge the charge accumulated in the wafer.
이는 챔버내에서 웨이퍼를 가공함에 있어 챔버의 정전척으로 웨이퍼를 밀착시키기 위하여 DC전압을 인가하여 웨이퍼에 필요한 만큼의 전하를 충전하게 되므로, 가공을 마친후 웨이퍼에 접속되어 충전된 전하를 방전시키게 된다.In the process of processing the wafer in the chamber, since the DC voltage is applied to close the wafer to the electrostatic chuck of the chamber to charge the wafer as much as necessary, the wafer is connected to the wafer after processing to discharge the charged charge. .
도 1에 기존의 반도체 제조장비에 구비되는 정전척에 리프트 핀이 결합된 상태를 보인 일부 단면도가 도시되어 있다.1 is a partial cross-sectional view showing a state in which the lift pin is coupled to the electrostatic chuck provided in the existing semiconductor manufacturing equipment.
도 1에 도시된 바와같이 기존의 리프트 핀(100)은 자중체(120)의 상부에 웨이퍼와 맞닿게 되는 접속체(110)가 돌출되고, 자중체(120)의 하부에는 실린더(도면에 미도시됨.)와 연결되는 연결축(130)을 형성하여, 실린더에 의해 각 리프트 핀(100)의 연결축(130)을 밀어올려 상승작동되며, 하강시에는 자중체(120)가 갖는 자체무게에 의해 하강하게 된다.As shown in FIG. 1, the conventional lift pin 100 has a connection body 110 projecting on the upper portion of the magnetic body 120 to contact the wafer, and a cylinder (not shown in the drawing) at the lower portion of the magnetic body 120. The connecting shaft 130 is connected to form a connecting shaft 130 of each lift pin 100 by a cylinder, and the lifting operation is carried out by the cylinder. Descend by
하지만, 기존의 리프트 핀(100)은 조립작업시 각 리프트 핀(100) 접속체(110)의 수평이 맞지 않거나 또는 반복사용에 따른 마모에 의해 접속체(110)의 길이가 상이하게 될 경우, 다수개의 리프트 핀(100)이 동시에 웨이퍼에 닿아 웨이퍼에 인가된 전하를 방전시켜야함에도 불구하고, 다수개의 핀(100) 중 어느하나가 먼저 웨이퍼에 닿게 되므로 웨이퍼에 인가된 전하를 충분히 방전시키지 못하게 되며, 이와같은 상태에서 웨이퍼에 먼저 닿은 핀이 계속적으로 상승하여 웨이퍼를 들어올릴 경우 충분한 방전이 이루어지지 않은 웨이퍼는 정전척에 붙으려는 힘을 유지하고 있어 이러한 힘이 반발력으로 작용하게 되므로 결국 웨이퍼는 위 또는 옆으로 튕겨져 슬라이드되는 현상이 야기되어 웨이퍼가 파손되는 문제점이 발생된다.However, the existing lift pin 100 is when the assembly of the lift pin 100, the connecting body 110 is not horizontal or when the length of the connecting body 110 is different due to wear due to repeated use, Although the plurality of lift pins 100 must simultaneously touch the wafer to discharge the charge applied to the wafer, any one of the plurality of pins 100 first touches the wafer and thus cannot sufficiently discharge the charge applied to the wafer. In this state, if the pin that first touches the wafer continuously rises and lifts the wafer, the wafer that is not sufficiently discharged maintains the force to attach to the electrostatic chuck, and this force acts as a repulsive force. Alternatively, a phenomenon in which the wafer is broken may be caused by being thrown to the side and sliding.
또한, 리프트 핀(100)의 하강동작시 리프트 핀(100)의 자중체(120) 무게에만 의존하여 하강작동을 행함에 따라 리프트 핀(100)의 접속체(110)가 정전척(200)의 상,하이동홀(HOLE(210))에 걸리거나 기타 이물질에 의해 하강작용이 원활이 이루어지지 못하여 장비 에러가 발생되는 문제점을 갖게 된다.In addition, when the lowering operation of the lift pin 100 is lowered depending on the weight of the self-weight 120 of the lift pin 100, the connecting body 110 of the lift pin 100 of the electrostatic chuck 200 Up and down movement hole (HOLE 210) or fall due to the other foreign matter is not smoothly made has a problem that the equipment error occurs.
이에, 본 발명은 전술한 종래 정전척의 리프트 핀이 갖는 제반적인 문제점을해결하고자 창안된 것으로,Accordingly, the present invention was devised to solve the general problems of the conventional lift pin of the electrostatic chuck,
본 발명의 목적은 챔버내에 위치되는 정전척의 다수 리프트 핀에 접속스프링과 복원스프링을 설치하여, 각 리프터 핀의 상승시 수평상태 및 마모상태에 따른 웨이퍼에 닫는 시간적인 차이를 극복할 수 있도록하여 웨이퍼에 충전된 전하를 원활히 제거할 수 있으며, 리프트 핀의 하강시 스프링의 복원력에 의해 상,하이동홀에 핀이 걸리는 것을 방지하므로서 원활한 승,하강 작동을 통해 웨이퍼를 정확히 분리할 수 있는 반도체 제조장비용 정전척의 리프트 핀을 제공함에 있다.An object of the present invention is to install a connecting spring and a restoring spring on a plurality of lift pins of the electrostatic chuck located in the chamber, so that the lifter pins can overcome the time difference of closing the wafer according to the horizontal state and the wear state when each lifter pin is raised. For semiconductor manufacturing equipment that can remove the charge charged in smoothly and prevent the pin from being caught in the up and down movement hole by the spring's restoring force when the lift pin is lowered. Providing a lift pin for an electrostatic chuck.
도 1은 종래 반도체 제조장비용 정전척에 리프트 핀이 결합된 상태를 보인 일부 단면도이다.1 is a partial cross-sectional view showing a state in which a lift pin is coupled to an electrostatic chuck for a conventional semiconductor manufacturing equipment.
도 2는 본 발명에 따른 반도체 제조장비용 정전척의 리프트 핀의 전체 구성을 나타낸 측면도 및 주요부를 발췌한 도면이다.Figure 2 is a side view showing the overall configuration of the lift pin of the electrostatic chuck for semiconductor manufacturing equipment according to the present invention and a view taken from the main part.
도 3은 본 발명에 따른 반도체 제조장비용 정전척의 리프트 핀의 작용상태도이다.3 is an operational state diagram of the lift pin of the electrostatic chuck for semiconductor manufacturing equipment according to the present invention.
<도면주요부위에 대한 부호의 설명><Explanation of symbols for major parts of drawing>
1 : 리프트 핀2 : 접속스프링1: Lift Pin 2: Connection Spring
3 : 복원스프링4 : 정전척3: restoration spring 4: electrostatic chuck
5 : 웨이퍼11 : 접속체5 wafer 11 connector
12 : 자중체 13 : 연결축12: self-weight 13: connecting shaft
41 : 상,하이동홀41: upper and lower movement hall
상기한 목적을 달성하기 위한 본 발명의 구체적인 수단으로는;As a specific means of the present invention for achieving the above object;
접속체와 자중체와 연결축으로 구성되는 다수의 리프트 핀이 챔버 내부에 구비되는 정전척의 상,하이동홀에 설치되는 반도체 제조장비에 있어서,In the semiconductor manufacturing equipment installed in the upper and lower movement holes of the electrostatic chuck is provided with a plurality of lift pins composed of a connecting body, a magnetic weight and a connecting shaft,
리프트 핀의 접속체 상,하부에 접속스프링과 복원스프링이 설치됨을 특징으로 하는 반도체 제조장비용 정전척의 리프트 핀을 구비하므로서 달성된다.It is achieved by providing a lift pin of the electrostatic chuck for semiconductor manufacturing equipment, characterized in that the connecting spring and the restoring spring are installed on the upper and lower portions of the connecting body of the lift pin.
이때, 접속스프링은 리프트 핀의 상승작동시 웨이퍼와 선행되게 맞닿을 수 있도록 접속체의 최상측에 설치된다.At this time, the connecting spring is provided on the uppermost side of the connecting body so as to come into contact with the wafer in advance during the lift operation of the lift pin.
또한, 복원스프링은 상,하이동홀에 삽입되는 접속체의 하부에 위치하도록 끼워서 정전척의 하부면과 자중체의 사이에 개제되게 하며, 이러한 복원스프링은 적어도 상,하이동홀의 직경보다 큰 직경을 갖게 된다.In addition, the restoring spring is inserted so as to be positioned below the connecting body inserted into the upper and lower movable holes so as to be interposed between the lower surface of the electrostatic chuck and the magnetic weight, and the restoring spring has a diameter larger than the diameter of the upper and the lower movable holes. Will have
이에따라, 리프트 핀은 상승작동시 접속스프링이 웨이퍼와 직접 접하게되므로 웨이퍼에 충전된 전하를 원활히 제거할 수 있어, 웨이퍼가 정전척에 붙으려는힘을 완전제거하므로서 웨이퍼가 슬라이드되거나 파손되는 것을 방지할 수 있고, 또한 리프트 핀의 상승과 함께 압축되는 복원스프링의 반발력에 의해 핀이 원위치되므로 원활한 하강작동을 행할 수 있게 된다.As a result, the lift pin can directly remove the charges charged to the wafer because the contact spring is in direct contact with the wafer during the lift operation, thereby preventing the wafer from sliding or breaking by completely removing the force that the wafer is trying to attach to the electrostatic chuck. In addition, since the pin is repositioned by the repulsive force of the restoring spring compressed with the lift pin, it is possible to perform a smooth lowering operation.
이하, 본 발명의 바람직한 실시예를 첨부도면에 의거 상세히 설명하기로 한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명에 따른 반도체 제조장비용 정전척의 리프트 핀의 전체 구성을 나타낸 측면도 및 주요부를 발췌한 도면이고, 도 3은 본 발명에 따른 반도체 제조장비용 정전척의 리프트 핀의 작용상태도이다.2 is a view showing the side view and the main part of the overall configuration of the lift pin of the electrostatic chuck for semiconductor manufacturing equipment according to the present invention, Figure 3 is a functional state diagram of the lift pin of the electrostatic chuck for semiconductor manufacturing equipment according to the present invention.
이에 도시된 바와같이 본 발명의 리프트 핀(1)은 접속체(11)의 상,하부로 접속스프링(2)과 복원스프링(3)을 구비시킨 것에 특징적인 구성이 있다.As shown therein, the lift pin 1 of the present invention is characterized in that the connecting spring 2 and the restoring spring 3 are provided above and below the connecting body 11.
여기서, 본 발명의 리프트 핀(1)은 도 2에서와 같이 자중체(12)의 상부에 접속체(11)가 돌출되고 자중체(12)의 하부에는 실린더(도면에 미도시됨.)와 연결되는 연결축(13)이 형성되는 구조를 갖되,Here, the lift pin 1 of the present invention, as shown in FIG. 2, the connection body 11 protrudes on the upper portion of the magnetic body 12 and the cylinder (not shown in the drawing) and the lower portion of the magnetic body 12 and Has a structure in which the connecting shaft 13 is connected,
소정의 길이를 갖는 원통형 핀형태의 접속체(11)는 그 끝단을 단턱지게 형성한 설치부(111)를 구비하여 상기 설치부(111)에 접속스프링((2)통상의 코일스프링(COIL SPRING)을 적용함이 바람직함.)을 용접 등의 고정방법으로 고정하게 되며,The cylindrical pin-shaped connecting member 11 having a predetermined length has a mounting portion 111 formed at its end stepwise, and is connected to the mounting portion 111 by a connecting spring (2). It is preferable to apply)) by fixing method such as welding,
복원스프링((3)통상의 코일스프링(COIL SPRING)을 적용함이 바람직함.)은 정전척(4)에 형성되는 상,하이동홀(41)보다 큰 직경을 갖도록 하여, 접속체(11)의 하부에 끼운 상태에서 이 접속체(11)를 상,하이동홀(41)에 끼워 정전척(4)의 하부면과 자중체(12)의 상부면에 개재되도록 설치된다.Restoring spring ((3) It is preferable to apply a normal coil spring (coil spring)) is to have a larger diameter than the upper and lower moving holes 41 formed in the electrostatic chuck (4), the connection body 11 The connecting body 11 is inserted into the upper and lower moving holes 41 in a state of being inserted into the lower part of the upper and lower surfaces of the electrostatic chuck 4 and the upper surface of the magnetic body 12.
이때, 접속체(11)의 설치부(111)는 도 2에서 확대도시한 바와같이 접속스프링(2)이 외경으로 삽입될 수 있는 직경을 갖되, 이러한 설치부(111)에 삽입고정되는 접속스프링(2)은 적어도 자체길이의 1/2정도가 설치부(111)에 삽입고정되게하여 접속스프링(2)이 좌,우로 유동되거나, 휘는 것을 방지하게 된다.At this time, the mounting portion 111 of the connecting body 11 has a diameter that the connecting spring 2 can be inserted into the outer diameter, as shown in enlarged in Figure 2, the connection spring is inserted and fixed to the mounting portion 111 (2) at least about half of its own length is fixed to the installation portion 111 to prevent the connection spring 2 to flow left or right, or to bend.
또한, 복원스프링(3)의 상,하부가 맞닿게 되는 정전척(4)의 하부면과 자중체(12)의 상부면에는 복원스프링(3)을 안정되게 고정하기 위한 고정홈 또는 고정돌기(도면에 미도시됨.)를 형성함이 바람직하다.In addition, a fixing groove or a fixing protrusion for stably fixing the restoring spring 3 on the lower face of the electrostatic chuck 4 and the upper face of the restoring body 12 to which the upper and lower parts of the restoring spring 3 come into contact with each other. Not shown in the drawing).
이에, 상기와 같은 구성을 갖는 본 발명에 따른 리프트 핀(1)의 작용상태에 대하여 살펴보면;Thus, look at the operation state of the lift pin (1) according to the present invention having the configuration as described above;
이는 도 3에서와 같이 실린더(도면에 미도시됨.)에 의해 각 리프트 핀(1)의 연결축(13)을 밀어올리는 형태로 상승시키게 되면,When it is raised in the form of pushing up the connecting shaft 13 of each lift pin 1 by a cylinder (not shown in FIG. 3), as shown in FIG.
각 리프트 핀(1)의 접속체(11) 상단부 설치부(111)에 일단이 고정설치된 접속스프링(2)은 접속체(11)가 웨이퍼(5)에 닿기 이전에 접속스프링(2)의 상단이 먼저 웨이퍼(5)에 닿게 되어 웨이퍼(5)에 충전된 전하를 완전 방전시키게 되므로, 웨이퍼(5)는 정전척(4)과 붙으려는 힘이 완전소멸됨에 따라 웨이퍼(5)의 반발력이 상쇄된 상태에서 접속핀(11)에 의해 웨이퍼(5)를 상승시키게 되므로서 챔버내에서 웨이퍼(5)가 슬라이드되는 현상을 방지하게 된다.The connecting spring 2 having one end fixed to the connecting portion 11 upper end mounting portion 111 of each lift pin 1 has an upper end of the connecting spring 2 before the connecting body 11 touches the wafer 5. Since the first contact with the wafer 5 completely discharges the charge charged in the wafer 5, the repulsive force of the wafer 5 cancels out as the force to bond with the electrostatic chuck 4 is completely extinguished. In this state, the wafer 5 is raised by the connecting pin 11, thereby preventing the wafer 5 from sliding in the chamber.
또한, 리프트 핀(1)의 상승작용에 의해 정전척(4)의 하부면과 자중체(12)의 상부면 사이에서 복원스프링(3)이 압축되므로 리프트 핀(1)의 하강작동시에는 자중체(12)의 자체무게와 함께 복원스프링(3)의 반발력으로 리프트 핀(1)이 원위치됨에 따라 기존과 같이 자체무게에만 의존함에 따른 걸림현상 등을 방지하게 된다.In addition, since the restoring spring 3 is compressed between the lower surface of the electrostatic chuck 4 and the upper surface of the magnetic weight 12 due to the synergism of the lift pin 1, the self-weight during the lowering operation of the lift pin 1. As the lift pin 1 is returned to its original position due to the repulsive force of the restoring spring 3 together with the weight of the sieve 12, it is possible to prevent a jamming phenomenon such as depending on its own weight.
이와같은 본 발명은 공정챔버내부에 다수의 리프트 핀(1)이 설치되는 정전척(4)이 구비되며, 이러한 리프트 핀(1)은 웨이퍼(5)에 충전된 전하를 방출함과 동시에 자체무게에 의해 하강작동을 행하도록 구성되는 반도체 제조장비에 적용할 수 있는 것이다.The present invention is provided with an electrostatic chuck (4) in which a plurality of lift pins (1) are installed in the process chamber, which lifts the charge charged on the wafer (5) and at the same time weighs itself. It can be applied to the semiconductor manufacturing equipment configured to perform the descent operation by.
이상과 같이, 본 발명에 따른 반도체 제조장비용 정전척의 리프트 핀은 접속체의 상,하부로 접속스프링과 복원스프링을 설치하여, 리프트 핀의 상승시 접속스프링을 선행되게 웨이퍼와 접속시킴에 따라 각 접속체가 웨이퍼에 닿기 이전에 웨이퍼에 충전된 전하를 완전 방전시킬 수 있어, 웨이퍼의 반발력 제거에 따른 웨이퍼의 챔버내 슬라이드현상을 방지할 수 있는 효과가 있으며,As described above, the lift pins of the electrostatic chuck for semiconductor manufacturing equipment according to the present invention are provided with connecting springs and restoring springs on the upper and lower portions of the connecting bodies, and the connecting springs are connected to the wafer in advance when the lift pins are raised. Since the sieve can completely discharge the charge charged in the wafer before it reaches the wafer, there is an effect that can prevent the sliding phenomenon in the chamber of the wafer due to the removal of the repulsive force of the wafer,
또한, 각 리프트 핀의 상승작동시 수평상태 및 마모상태에 따른 웨이퍼에 닫는 시간적인 차이를 극복할 수 있게 된다.In addition, it is possible to overcome the time difference of closing the wafer according to the horizontal state and the wear state during the lift operation of each lift pin.
한편, 리프트 핀의 하강시 복원스프링의 탄성복원력에 의해 상,하이동홀에 접속체가 걸림되는 것을 방지할 수 있으므로 원활한 승,하강 작동을 통해 웨이퍼를 분리할 수 있어, 장비 에러발생의 최소화에 따른 생산성의 향상효과를 갖게 된다.On the other hand, it is possible to prevent the connecting body from being caught in the upper and lower movement holes by the elastic restoring force of the restoring spring when the lift pin is lowered, so that the wafer can be separated by smooth lifting and lowering operations, resulting in minimization of equipment error. Productivity will be improved.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020045410A KR20040012053A (en) | 2002-07-31 | 2002-07-31 | Lift pin for manufacturing semiconductor device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020045410A KR20040012053A (en) | 2002-07-31 | 2002-07-31 | Lift pin for manufacturing semiconductor device |
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| Publication Number | Publication Date |
|---|---|
| KR20040012053A true KR20040012053A (en) | 2004-02-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020020045410A KR20040012053A (en) | 2002-07-31 | 2002-07-31 | Lift pin for manufacturing semiconductor device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100734671B1 (en) * | 2005-12-28 | 2007-07-02 | 동부일렉트로닉스 주식회사 | Electro static chuck apparatus for manufacturing semiconductor device |
| KR101135355B1 (en) * | 2008-12-12 | 2012-04-16 | 엘아이지에이디피 주식회사 | Substrate lifting apparatus |
-
2002
- 2002-07-31 KR KR1020020045410A patent/KR20040012053A/en not_active Application Discontinuation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100734671B1 (en) * | 2005-12-28 | 2007-07-02 | 동부일렉트로닉스 주식회사 | Electro static chuck apparatus for manufacturing semiconductor device |
| KR101135355B1 (en) * | 2008-12-12 | 2012-04-16 | 엘아이지에이디피 주식회사 | Substrate lifting apparatus |
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