KR200389204Y1 - High intensity LED lamp assembly having effective heat racliation system - Google Patents
High intensity LED lamp assembly having effective heat racliation system Download PDFInfo
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- KR200389204Y1 KR200389204Y1 KR20-2005-0009434U KR20050009434U KR200389204Y1 KR 200389204 Y1 KR200389204 Y1 KR 200389204Y1 KR 20050009434 U KR20050009434 U KR 20050009434U KR 200389204 Y1 KR200389204 Y1 KR 200389204Y1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/54—Cooling arrangements using thermoelectric means, e.g. Peltier elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/30—Ventilation or drainage of lighting devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/08—Lighting devices intended for fixed installation with a standard
- F21S8/085—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
- F21S8/086—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light with lighting device attached sideways of the standard, e.g. for roads and highways
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/15—Thermal insulation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/03—Gas-tight or water-tight arrangements with provision for venting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/72—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps in street lighting
Abstract
본 고안은 고광도의 엘이디(LED)를 이용한 램프 조립체에 관한 것으로, 특히 복수개의 엘이디가 부착된 기판의 전,후측에 투명의 커버렌즈와 알루미늄의 방열체를 결합하여 형성하되, 그 기판의 배면에는 열전모듈과 열전도체를 형성하여 방열체의 내측면과 면접되게 하고, 그 방열체의 외측면에는 중앙의 방열팬을 중심으로 방사상으로 방열핀을 형성하며, 그 방열핀의 상측에는 별도의 커버를 결합하여 완성함으로서,The present invention relates to a lamp assembly using a high-intensity LED (LED), in particular formed by combining a transparent cover lens and a radiator of aluminum on the front and rear sides of the substrate with a plurality of LEDs, the back of the substrate The thermoelectric module and the thermal conductor are formed to be interviewed with the inner surface of the heat sink, and the outer surface of the heat sink is radially formed around the center of the heat radiating fan, and a separate cover is coupled to the upper side of the heat sink. By completing
고광도 엘이디로부터 발생하는 고온의 열이 상기 열전모듈 및 열전도체를 통해 알루미늄의 방열체로 신속하게 전도되게 하고, 전도된 열은 방열체 자체의 방열은 물론 상기 열전도체에 의해 집중된 고열을 방열팬과 방열핀을 통해 외부로 방출하여 매우 효과적인 방열작용이 이루어지게 함으로서, 고광도의 엘이디를 사용함에 있어 효과적인 방열에 의한 효율적인 설계 및 구조의 선택이 가능한 것이며, 다양한 분야에 모두 안정적으로 적용할 수 있는 특징을 갖는 효율적인 방열구조를 갖는 고광도 엘이디 램프 조립체에 대한 것이다.The high temperature heat generated from the high brightness LED is quickly conducted to the heat radiator of aluminum through the thermoelectric module and the heat conductor, and the conducted heat radiates high heat concentrated by the heat conductor as well as the heat radiating fan and the heat radiating fins. By dissipating to the outside through a very effective heat dissipation effect, it is possible to select an efficient design and structure by effective heat dissipation in the use of high-intensity LED, and has the characteristics that can be applied stably in various fields A high brightness LED lamp assembly having a heat dissipation structure.
Description
본 고안은 고광도의 엘이디(LED)를 이용한 램프 조립체에 관한 것으로, 특히 고열이 발생하는 엘이디의 열기를 신속하게 방출하여 자동차용 헤드램프나 리어 콤비네이션 램프 및 가로등, 각종 조명등으로 사용할 수 있게 한 효율적인 방열구조를 갖는 고광도 엘이디 램프 조립체에 대한 것이다.The present invention relates to a lamp assembly using a high-intensity LED (LED), and in particular, the heat dissipation of the LED that emits high heat quickly can be used for automotive head lamps, rear combination lamps, street lights, various lights, etc. For a high brightness LED lamp assembly having a structure.
일반적으로 자동차의 헤드램프나 리어 콤비네이션 램프 및 가로등을 포함한 각종 조명등은 일반적인 벌브(Bulb)를 광원으로 사용하고 있다.In general, various lightings including headlamps, rear combination lamps, and street lamps of automobiles use a general bulb as a light source.
그러나, 상기한 바와 같은 벌브는 사용수명이 짧고 내충격성이 떨어지므로, 근자에 들어서는 사용수명이 크게 연장되면서도 내충격성이 뛰어난 고광도의 엘이디를 광원으로 사용하는 추세에 있다.However, bulbs as described above have a short service life and low impact resistance, and thus, there is a tendency to use high brightness LEDs having excellent impact resistance as light sources while greatly extending the service life in the near field.
특히, 상기한 바와 같은 고광도의 엘이디는 주지한 바와 같이 자동차의 헤드램프나 리어 콤비네이션 램프 및 가로등을 포함한 각종 조명등의 광원으로 사용될 수 있는 것으로서, 그 적용범위가 매우 광범위하다 할 수 있는 것이다.In particular, the high-intensity LED as described above can be used as a light source for a variety of lights, including headlamps, rear combination lamps and streetlights of automobiles, and the scope of application thereof can be very broad.
상기한 바와 같은 고광도의 엘이디는 점등시 매우 높은 열이 발생하므로, 고열의 발열온도에 의해 이를 적용 및 설계하는데 많은 어려움이 있는 것이다.Since the LED of high brightness as described above generates very high heat when turned on, there are many difficulties in applying and designing it by the exothermic temperature of high heat.
따라서, 종래에는 도 1의 도시와 같이 다수개의 엘이디(100)(100')가 부착된 기판(101)의 배면에 위치하는 본체(102)를 금속재로 형성하거나, 그 본체에 복수개의 방열 및 대기순환공(103)(103')을 형성하여 자연 방열에 의해 엘이디로부터 발생하는 열을 방열시키고 있는 것이다.Therefore, in the related art, as shown in FIG. 1, the body 102 positioned on the back surface of the substrate 101 on which the plurality of LEDs 100, 100 ′ is attached is formed of a metal material, or a plurality of heat radiating and air atmospheres are formed on the body. The circulation holes 103 and 103 'are formed to dissipate heat generated from the LED by natural heat dissipation.
그러나, 상기한 바와 같은 자연 방열에 의한 엘이디 램프 조립체는 그 방열량에 한계가 있고, 방열되는 열량보다 엘이디에서 발생하는 열량이 더 높아 그 램프 조립체가 지속적으로 가온되는 형태를 갖고 있으므로, 제품 설계시 고가의 난연, 불연재질의 선택은 물론 고온에서도 열변형이나 수축 등이 발생하지 않는 수지 또는 금속재를 사용하여야 하는 비경제적인 문제점이 있는 것이며,However, the LED lamp assembly by the natural heat dissipation as described above is limited in its heat dissipation amount, and the heat generated from the LED is higher than the heat dissipation heat, so that the lamp assembly is constantly warmed, it is expensive to design the product In addition to the selection of flame retardant, non-flammable materials, there is an uneconomical problem of using a resin or metal material that does not cause heat deformation or shrinkage even at high temperatures.
특히, 엘이디 및 각종 전기접속기구 등은 고온으로부터 취약성능을 갖고 있으므로 이들의 사용수명을 단축시키는 원인이 되고 있는 것이다.In particular, LEDs and various electrical connection devices have weaknesses at high temperatures, which causes shortening of their service life.
본 고안은 전기한 바와 같은 문제점을 제거코자 안출된 것으로서, 복수개의 엘이디가 부착된 기판의 전,후측에 투명의 커버렌즈와 알루미늄의 방열체를 결합하여 형성하되, 그 기판의 배면에는 열전모듈과 열전도체를 형성하여 방열체의 내측면과 면접되게 하고, 그 방열체의 외측면에는 중앙의 방열팬을 중심으로 방사상으로 방열핀을 형성하며, 그 방열핀의 상측에는 별도의 커버를 결합하여 완성함으로서,The present invention was conceived to eliminate the problems described above, and is formed by combining a transparent cover lens and a radiator of aluminum on the front and rear sides of a plurality of LED-attached substrates. By forming a thermal conductor to be interviewed with the inner surface of the heat sink, the outer surface of the heat sink to form a heat radiation fin radially around the center of the heat dissipation fan, by combining a separate cover on the upper side of the heat sink fin,
고광도 엘이디로부터 발생하는 고열이 상기 열전모듈 및 열전도체를 통해 알루미늄의 방열체로 신속하게 전도되게 하고, 전도된 열은 방열체 자체의 방열은 물론 상기 열전도체에 의해 집중된 고열을 방열팬과 방열핀을 통해 외부로 방출하여 매우 효과적인 방열작용이 이루어지게 함으로서, 고광도의 엘이디를 사용함에 있어 효과적인 방열에 의한 효율적인 설계 및 구조의 선택이 가능한 것이며, 다양한 분야에 모두 안정적으로 적용할 수 있는 특징을 갖는 효율적인 방열구조를 갖는 고광도 엘이디 램프 조립체를 제공함에 본 고안의 목적이 있는 것이다.The high heat generated from the high brightness LED is quickly conducted to the heat radiator of aluminum through the thermoelectric module and the heat conductor, and the conducted heat is not only the heat dissipation of the heat sink itself but also the high heat concentrated by the heat conductor through the heat dissipation fan and the heat sink fins. Efficient heat dissipation by emitting to the outside makes it possible to select efficient design and structure by effective heat dissipation in using high brightness LED, and efficient heat dissipation structure that can be applied to various fields stably. It is an object of the present invention to provide a high brightness LED lamp assembly having a.
이하, 본 고안의 바람직한 실시예를 설명한다.Hereinafter, preferred embodiments of the present invention will be described.
도 2는 본 고안에 의한 엘이디 램프 조립체의 분리사시도이고, 도 3은 본 고안에 의한 엘이디 램프 조립체의 전체단면도이다.Figure 2 is an exploded perspective view of the LED lamp assembly according to the present invention, Figure 3 is an overall cross-sectional view of the LED lamp assembly according to the present invention.
투명의 커버렌즈(10)와 알루미늄재로 된 방열체(20)를 결합하여 그 내측공간(1)을 형성하고, 그 내측공간(1)에는 복수개의 고광도 엘이디(2)(2')가 커버렌즈(10)를 향하여 부착되어진 알루미늄 기판(3)을 내장하되,The inner cover 1 is formed by combining the transparent cover lens 10 and the heat sink 20 made of aluminum, and the inner space 1 is covered with a plurality of high brightness LEDs 2 and 2 '. Built-in aluminum substrate (3) attached toward the lens 10,
알루미늄 기판(3)의 배면 중앙에는 열전모듈(4)을 면접촉되게 부착하고, 그 열전모듈(4)의 일측에는 금속재의 열전도체(5)를 부착하여 그 열전도체(5)의 일면이 상기 방열체(20)의 저면에 면접촉되게 하며,The thermoelectric module 4 is attached to the center of the rear surface of the aluminum substrate 3 so as to be in surface contact, and one side of the thermoelectric module 4 is attached with a thermal conductor 5 made of metal, and one surface of the thermal conductor 5 is In surface contact with the bottom of the heat sink 20,
상기 알루미늄 기판(3)의 배면과 방열체(20) 내측의 공간부에는 단열재(6)(6')를 충전하여 되며,The back surface of the aluminum substrate 3 and the space portion inside the heat sink 20 are filled with the heat insulating material 6, 6 ′,
상기 방열체(20)의 외측 중앙에는 요홈부(21)를 형성하고, 그 요홈부(21)에는 방열팬(30)을 장착하며, 상기 요홈부(21)를 기준으로 방열체(20)의 외측면에는 복수개의 방열핀(22)(22')이 요홈상으로 형성된 방열부(23)(23')를 사방으로 형성하고, 상기 방열팬(30)과 방열부(23)(23')의 일부를 커버링하는 별도의 덮개(40)를 상기 방열체(20)의 중앙에 결합하여 구성된 것이다.A groove 21 is formed in the outer center of the heat sink 20, and a heat radiating fan 30 is mounted on the groove 21, and the heat sink 20 is disposed on the groove 21. On the outer side, a plurality of heat dissipation fins 22, 22 'are formed in four directions to form a heat dissipation part 23, 23' formed in a groove shape, and A separate cover 40 covering a part is configured by coupling to the center of the heat sink 20.
특히, 상기한 방열부(23)(23')의 방열핀(22)(22')은 그 중앙으로부터 외측으로 점차 하향의 경사상으로 형성하여 빗물의 유입을 방지할 수 있도록 설계하고,In particular, the heat dissipation fins 22 and 22 'of the heat dissipation unit 23 and 23' are designed to be gradually inclined downward from the center to the outside to prevent the inflow of rain water.
상기 요홈부(21)로부터 외측으로 횡상으로 관통된 배수공(24)을 형성하여, 요홈부(21)로 유입된 빗물이 용이하게 배수되도록 설계할 수도 있는 것이다.By forming a drain hole 24 horizontally penetrated outward from the groove portion 21, the rainwater introduced into the groove portion 21 may be designed to be easily drained.
도면 중 미설명 부호 50은 내부렌즈이다.Reference numeral 50 in the drawings is an internal lens.
이상과 같은 구성을 갖는 본 고안 고광도 엘이디 램프 조립체의 작용을 첨부도면에 의해 보다 상세히 설명하면 다음과 같다.Referring to the operation of the high-intensity LED lamp assembly of the present invention having the configuration as described above in more detail by the accompanying drawings as follows.
본 고안에 따른 엘이디 램프 조립체는 투명의 커버렌즈(10)와 알루미늄재로 된 방열체(20)의 내측에 다수개의 고광도 엘이디(2)(2')가 부착되어진 알루미늄 기판(3)이 내장되는 것으로서,LED lamp assembly according to the present invention is a transparent cover lens 10 and the aluminum substrate (3) having a plurality of high brightness LEDs (2) (2 ') attached to the inside of the heat sink 20 made of aluminum material is embedded As,
상기한 고광도 엘이디(2)(2')의 발광방향은 커버렌즈(10)를 향하도록 부착되어지고, 그 각각의 고광도 엘이디(2)(2')에는 빛의 직선성 및 확장성을 증대시키는 별도의 내부렌즈(50)가 각각 결합되어 있는 것이다.The light emitting direction of the high brightness LEDs 2 and 2 'is attached to the cover lens 10, and each of the high brightness LEDs 2 and 2' increases linearity and expandability of light. Separate inner lenses 50 are respectively coupled.
특히, 상기한 고광도 엘이디(2)(2')가 부착되어지는 알루미늄 기판(3)은 상기 엘이디(2)(2')로부터 발생하는 고온의 열을 신속하게 흡수하여 전달하는 역할을 하는 것으로서, 알루미늄 기판(3)으로부터 흡수된 열은 그 알루미늄 기판(3)의 배면에 위치하는 열전모듈(4;TE Module)에 의해 고온의 열을 집중적으로 흡수하게 된다.In particular, the aluminum substrate 3 to which the high brightness LEDs 2 and 2 'are attached serves to quickly absorb and transfer the high temperature heat generated from the LEDs 2 and 2'. The heat absorbed from the aluminum substrate 3 is concentrated by the thermoelectric module 4 (TE Module) located on the back surface of the aluminum substrate 3 to absorb the high temperature heat.
이렇게 흡수된 열은 열전모듈(4)의 이면에 위치하는 알루미늄으로 된 열전도체(5)를 통해 다시 전달되어, 전체가 알루미늄으로 된 방열체(20)의 내측면을 통해 그 전체로 열을 확산시키게 되는 것이다.The heat absorbed in this way is transferred back through the heat conductor 5 made of aluminum located on the rear surface of the thermoelectric module 4, and the heat is diffused through the inner surface of the heat sink 20 made of aluminum in its entirety. It is to be made.
이때, 상기한 열전도체(5)와 방열체(20)가 서로 맞닿는 부분에는 상대적으로 더욱 고온의 열이 발생하게 되는데, 이러한 고온의 열은 방열체(20)의 중앙에 위치한 요홈부(21) 내측의 방열팬(30)에 의해 강제 송풍시켜 방열시키는 것으로서,At this time, a portion of the heat conductor 5 and the heat dissipator 20 which are in contact with each other will generate a relatively high temperature heat, this high temperature heat is formed in the recess 21 located in the center of the heat dissipator 20 It is forced to blow by the heat radiation fan 30 on the inside to radiate heat,
상기한 방열팬(30)이 작동함에 따라 그 집중 고온부에서 발생하는 열기를 외기로 토출시키게 되는 것이다.As the heat radiating fan 30 operates, the heat generated from the concentrated high temperature part is discharged to the outside air.
이때, 상기한 방열팬(30)이 위치한 방열체(20)의 외표면에는 도 4 및 도 5의 도시와 같이 요홈조로 된 사방의 방열부(23)(23')가 형성되어 있는데, 상기한 방열부(23)(23')는 복수개의 방열핀(22)(22')으로 이루어져 있고, 그 방열핀(22)(22')은 외부로 노출되지 않도록 경사상의 요홈조 형태로 구성된다.At this time, the outer surface of the heat sink 20 in which the heat dissipation fan 30 is located, as shown in FIGS. 4 and 5, the heat dissipation parts 23 and 23 ′ formed of grooves are formed on four sides. The heat dissipation portions 23 and 23 'are composed of a plurality of heat dissipation fins 22 and 22', and the heat dissipation fins 22 and 22 'are configured in the form of an inclined groove to prevent exposure to the outside.
또한, 상기한 방열팬(30)과 그 방열부(23)(23')의 일부를 상측으로부터 커버링하기 위한 별도의 덮개(40)가 그 방열체(20)에 결합되는데, 상기한 덮개(40)에 의해 방열팬(30)으로부터 토출되는 고온의 열기는 상기한 방열부(23)(23')를 통해서만 배출되는 것이므로, 토출되는 고온의 열기는 상기 방열부(23)(23')의 방열핀(22)(22')에 열접촉하면서 그 방열면적이 크게 확대되므로 더욱 신속한 방열이 이루어지는 것이다.In addition, a separate cover 40 for covering a part of the heat dissipation fan 30 and the heat dissipation part 23, 23 ′ from the upper side is coupled to the heat dissipation body 20. Since the hot heat discharged from the heat dissipation fan 30 is discharged only through the heat dissipation part 23 (23 '), the hot heat discharged is the heat dissipation fin of the heat dissipation part 23 (23'). Since the heat dissipation area is greatly enlarged while in thermal contact with (22) and 22 ', heat dissipation is more rapid.
또한, 상기한 방열체(20)는 알루미늄으로 제작되므로 열전도성이 매우 뛰어나 그 내측의 열기를 흡수하여 외기로 방열하게 되는데, 상기한 방열체(20) 자체의 열기가 다시 내측의 엘이디(2)(2') 및 기판(3)에 영향을 끼칠 수도 있는 것으로서,In addition, since the heat sink 20 is made of aluminum, it is very excellent in thermal conductivity and absorbs heat from the inside to radiate heat to the outside, and the heat of the heat sink 20 itself is again the inner LED 2. And may affect the 2 'and the substrate 3,
이를 방지하기 위해 상기한 기판(3)의 배면과 방열체(20)의 내측 사이에는 별도의 단열재(6)(6')를 충전하여 상기 열체(20)로부터의 방출열이 다시 역전도되는 것을 방지하므로, 상기한 고광도 엘이디(2)(2')로부터 발생하는 고온의 열은 온전하게 모두 외부로 방열되는 것이다.In order to prevent this, a separate heat insulating material 6, 6 ′ is charged between the rear surface of the substrate 3 and the inside of the heat sink 20 so that the heat of emission from the heat body 20 is reversed again. Therefore, the high temperature heat generated from the high brightness LEDs 2 and 2 'is completely radiated to the outside.
따라서, 도 6의 도시와 같이 고광도 엘이디(2)(2')로부터 발생하는 열기는 일차적으로 알루미늄 기판(3)을 통해 흡수되고, 그 알루미늄 기판(3)의 열은 열전모듈(4)을 통해 집중적으로 흡수되어 열전도체(5)를 매개로 하여 알루미늄의 방열체(20)로 확산 전도되는 것이다.Therefore, as shown in FIG. 6, heat generated from the high brightness LEDs 2 and 2 ′ is primarily absorbed through the aluminum substrate 3, and heat of the aluminum substrate 3 is transferred through the thermoelectric module 4. It is absorbed intensively and is diffused and conducted to the radiator 20 of aluminum through the heat conductor 5.
이렇게 전도된 열은 방열체(20) 자체의 방열작용 및 그 중앙의 방열팬(30) 및 방열부(23)(23')에 의해 강제적인 방열이 이루어지므로 더욱 신속한 방열효과를 얻게 되는 것이다.The conducted heat is forced to dissipate by the heat dissipation action of the heat sink 20 itself and the heat radiating fan 30 and the heat dissipation unit 23 (23 ') in the center is to obtain a more rapid heat dissipation effect.
또한, 상기한 방열부(23)(23')에 형성된 방열핀(22)(22')은 그 중앙으로부터 외측으로 점차 경사상으로 형성함으로서, 그 엘이디 램프 조립체가 외부로 노출되어 있을 경우 빗물이 유입되는 것을 어느 정도 방지할 수 있도록 구성되어 지며,In addition, the heat radiation fins 22 and 22 'formed on the heat dissipation portions 23 and 23' are formed to be inclined gradually from the center to the outside, so that rainwater flows when the LED lamp assembly is exposed to the outside. It is configured to prevent to some extent,
상기한 방열체(20)의 요홈부(21)로 빗물이 유입되는 경우를 대비하여, 그 요홈부(21)로부터 외측으로 관통되는 별도의 배수공(24)을 더 형성하여 보다 안정적인 사용을 가능케 하는 것이다.In case rainwater flows into the recess 21 of the radiator 20, a separate drain hole 24 penetrates outward from the recess 21 to allow a more stable use. will be.
따라서, 상기한 바와 같은 방열작용에 의해 그 설계의 용이성 및 적용분야 및 적용형태를 다양하게 변경할 수 있으므로, 자동차의 헤드 램프 및 리어 콤비네이션 램프, 가로등, 각종 조명등의 광원으로 사용할 수 있게 되는 것이다.Therefore, the ease of design, application field, and application form can be variously changed by the heat dissipation as described above, so that the light source can be used as a light source for a head lamp, a rear combination lamp, a street lamp, and various lights of an automobile.
이상과 같은 본 고안 효율적인 방열구조를 갖는 고광도 엘이디 램프 조립체는, 고광도 엘이디로부터 발생하는 고열이 상기 열전모듈 및 열전도체를 통해 알루미늄의 방열체로 신속하게 전도되게 하고, 전도된 열은 방열체 자체의 방열은 물론 상기 열전도체로부터 집중된 고열을 방열팬과 방열핀을 통해 외부로 방출하여 매우 효과적인 방열작용이 이루어지게 함으로서, 고광도의 엘이디를 사용함에 있어 효과적인 방열에 의한 효율적인 설계 및 구조의 선택이 가능한 것이며, 다양한 분야에 모두 안정적으로 적용할 수 있는 효과가 있는 것이다.The high brightness LED lamp assembly having an efficient heat dissipation structure as described above, the high heat generated from the high brightness LED is quickly conducted to the heat radiator of aluminum through the thermoelectric module and the heat conductor, the conducted heat is radiated heat of the heat sink itself Of course, by dissipating high heat concentrated from the heat conductor to the outside through the heat dissipation fan and the heat dissipation fin to make a very effective heat dissipation action, it is possible to select an efficient design and structure by effective heat dissipation in the use of high brightness LED, There is an effect that can be applied to all sectors stably.
도 1은 일반적인 엘이디 램프 조립체의 전체단면도1 is a cross-sectional view of a typical LED lamp assembly
도 2는 본 고안에 의한 엘이디 램프 조립체의 분리사시도2 is an exploded perspective view of the LED lamp assembly according to the present invention
도 3은 본 고안에 의한 엘이디 램프 조립체의 전체단면도Figure 3 is an overall cross-sectional view of the LED lamp assembly according to the present invention
도 4는 본 고안에 의한 엘이디 램프 조립체의 요부확대 사시도Figure 4 is an enlarged perspective view of the main part of the LED lamp assembly according to the present invention
도 5는 본 고안에 의한 엘이디 램프 조립체의 방열커버 평면도5 is a plan view of the heat radiation cover of the LED lamp assembly according to the present invention
도 6은 본 고안에 의한 엘이디 램프 조립체의 방열작용 상세도Figure 6 is a heat radiation action detail of the LED lamp assembly according to the present invention
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on main parts of drawing
1 : 내측공간 2,2' : 고광도 엘이디1: inner space 2,2 ': high brightness LED
3 : 알루미늄 기판 4 : 열전모듈3: aluminum substrate 4: thermoelectric module
5 : 열전도체 6,6' : 단열재5: thermal conductor 6,6 ': insulation
10 : 커버렌즈10: cover lens
20 : 방열체 21 : 요홈부20: heat sink 21: groove portion
22,22' : 방열핀 23,23' : 방열부22,22 ': Heat sink fin 23,23': Heat sink
24 : 배수공24: drain hole
30 : 방열팬30: heat dissipation fan
40 : 덮개40: cover
50 : 내부렌즈50: internal lens
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Cited By (9)
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KR20090001140A (en) * | 2007-06-29 | 2009-01-08 | 화우테크놀러지 주식회사 | Heat release led lighting fitting without fan |
KR100883346B1 (en) | 2008-08-08 | 2009-02-12 | 김현민 | Pannel type led illumination device |
KR200448023Y1 (en) | 2009-08-24 | 2010-03-10 | 주식회사 로드스타 | Heat sink structure |
KR100948955B1 (en) | 2009-08-31 | 2010-03-19 | 박창수 | Lighting device |
KR100955869B1 (en) | 2009-10-21 | 2010-05-04 | 한국에너컴주식회사 | Led lamp |
KR101078810B1 (en) | 2008-11-22 | 2011-11-04 | 신동현 | LED headlights with radiators and cooling system for the vehicles |
KR101087663B1 (en) * | 2010-02-16 | 2011-11-30 | 한국건설기술연구원 | Lighting Apparatus |
KR101093073B1 (en) * | 2009-12-28 | 2011-12-13 | 주식회사 케이디파워 | LED illumination Lamp |
KR20200040381A (en) * | 2018-10-10 | 2020-04-20 | (주)와이드윙스 | Lamp apparatus for plant |
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Publication number | Priority date | Publication date | Assignee | Title |
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KR20090001140A (en) * | 2007-06-29 | 2009-01-08 | 화우테크놀러지 주식회사 | Heat release led lighting fitting without fan |
KR100883346B1 (en) | 2008-08-08 | 2009-02-12 | 김현민 | Pannel type led illumination device |
KR101078810B1 (en) | 2008-11-22 | 2011-11-04 | 신동현 | LED headlights with radiators and cooling system for the vehicles |
KR200448023Y1 (en) | 2009-08-24 | 2010-03-10 | 주식회사 로드스타 | Heat sink structure |
KR100948955B1 (en) | 2009-08-31 | 2010-03-19 | 박창수 | Lighting device |
KR100955869B1 (en) | 2009-10-21 | 2010-05-04 | 한국에너컴주식회사 | Led lamp |
KR101093073B1 (en) * | 2009-12-28 | 2011-12-13 | 주식회사 케이디파워 | LED illumination Lamp |
KR101087663B1 (en) * | 2010-02-16 | 2011-11-30 | 한국건설기술연구원 | Lighting Apparatus |
KR20200040381A (en) * | 2018-10-10 | 2020-04-20 | (주)와이드윙스 | Lamp apparatus for plant |
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