KR200386730Y1 - Liquid suction and exhaust equipment use of pneumatic ejector - Google Patents
Liquid suction and exhaust equipment use of pneumatic ejector Download PDFInfo
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- KR200386730Y1 KR200386730Y1 KR20-2005-0008836U KR20050008836U KR200386730Y1 KR 200386730 Y1 KR200386730 Y1 KR 200386730Y1 KR 20050008836 U KR20050008836 U KR 20050008836U KR 200386730 Y1 KR200386730 Y1 KR 200386730Y1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/002—Manually-actuated controlling means, e.g. push buttons, levers or triggers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/40—Filters located upstream of the spraying outlets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
- B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
- B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
- B05B9/08—Apparatus to be carried on or by a person, e.g. of knapsack type
- B05B9/0805—Apparatus to be carried on or by a person, e.g. of knapsack type comprising a pressurised or compressible container for liquid or other fluent material
- B05B9/0811—Apparatus to be carried on or by a person, e.g. of knapsack type comprising a pressurised or compressible container for liquid or other fluent material comprising air supplying means actuated by the operator to pressurise or compress the container
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nozzles (AREA)
Abstract
본 고안은 반도체 제조공정을 통해 반도체 칩을 생산할때 사용되어지는 화학약품을 회수 처리하는 공압과 이젝터를 이용한 액체 흡,배기장치에 관한 것이다.The present invention relates to a liquid intake and exhaust device using a pneumatic and ejector to recover the chemicals used in the production of semiconductor chips through a semiconductor manufacturing process.
본 고안은 압축공기가 공급되는 건(20)의 분사구(22)가 공기도입체(30)의 커플러(31)와 연결되고, 분사구(22)를 통해 공급되는 압축공기가 이송되는 제1공기이송로(32)와 제2공기이송로(33)가 수평,수직하는 방향에서 연통 형성되어 있되, 상기 제1공기이송로(32)는 공기차단밸브(32a)에 의해 개폐 차단 됨과 동시에 말단부에 화학약품에 의한 2차오염을 방지할 수 있도록 유해가스를 정화시키는 탄소필터(34a)가 나사체결부(34)에 나사결합되는 필터커버(34b)를 매개로 설치되어 있고, 공기조절밸브(33a)를 포함하는 제2공기이송로(33)의 하부에는 용기체결부(35)에 체결된 용기(40)에 저장되는 화학약품의 수위와 음압에 의해 부상하면서 상기의 제2공기이송로(33)를 개폐시키는 부구(33c)가 공기이송홀(33b)을 가지는 하부에 설치되어 있으며, 용기(40)에 액체를 저장하거나 저장된 액체를 배출하는 흡,배기관(36)이 용기체결부(35)에 위치하도록 설치되어 있고, 상기 흡,배기관(36)과 연통하는 흡,배기노즐(37a)이 너트(37)에 의해 고정설치되어 있는 것을 특징으로 한다.The present invention is the first air transfer to which the injection port 22 of the gun 20 to which the compressed air is supplied is connected to the coupler 31 of the air introducer 30, the compressed air supplied through the injection port 22 is conveyed The furnace 32 and the second air transfer path 33 are formed in communication in the horizontal and vertical directions, but the first air transfer path 32 is opened and closed by an air shutoff valve 32a and chemically formed at the end thereof. A carbon filter 34a for purifying toxic gases to prevent secondary contamination by chemicals is provided via a filter cover 34b screwed to the screw fastening portion 34, and an air control valve 33a. In the lower portion of the second air transfer path 33 including a second air transfer path 33 while floating by the water level and sound pressure of the chemical stored in the container 40 fastened to the container fastening portion 35 The opening and closing hole (33c) is installed in the lower portion having the air transfer hole (33b), and stores the liquid in the container (40) An intake and exhaust pipe 36 for discharging the stored liquid is installed in the container fastening portion 35, and an intake and exhaust nozzle 37a communicating with the intake and exhaust pipe 36 is fixed by the nut 37. It is characterized by being installed.
Description
본 고안은 반도체 제조공정을 통해 반도체 칩을 생산할때 사용되어지는 화학약품을 회수 처리하는 공압과 이젝터를 이용한 액체 흡,배기장치에 관한 것이다.The present invention relates to a liquid intake and exhaust device using a pneumatic and ejector to recover the chemicals used in the production of semiconductor chips through a semiconductor manufacturing process.
일반적으로 반도체 제조 과정에는 공정별로 많은 화학약품을 이용하여 반도체 칩(chip)을 만들게 된다.In general, semiconductor manufacturing processes use many chemicals to make semiconductor chips.
상기와 같이 화학약품을 사용하다 화학약품이 누설(leak)되거나 용기를 떨어 뜨렸을 시 각종 화학반응이 일어나면서 유독가스나 흄(fume)등이 발생하게 되고, 이로인한 직접적 재해 발생은 물론 청정도를 요구하는 클린 룸(clean room) 환경오염이 일어날 수 있다.When using chemicals as described above When chemicals leak or drop containers, various chemical reactions occur and toxic gases or fumes are generated, resulting in direct disasters as well as cleanliness. Clean room environmental pollution can occur.
이러한 문제를 해결하기 위하여는 누출된 화학약품을 적절하게 처리할 필요성이 있으나, 화학약품을 처리할 때에는 펌프를 이용하거나 흡착포를 이용하여 흡착처리하게 된다.In order to solve this problem, it is necessary to properly treat the leaked chemicals, but when treating chemicals, adsorption treatment is performed using a pump or an adsorption cloth.
상기의 화학약품 처리 방법중 펌프를 이용한 처리방법은 펌프의 구동부위가 있고, 전기를 쓰며, 모터나 팬등을 사용하게 되므로 부피가 크고, 적은량의 화학약품을 흡입 배출하지 못하는 단점을 가지고 있다.The treatment method using the pump of the chemical treatment method has a disadvantage that it is not possible to inhale and discharge a small amount of chemicals because the pump is driven, using electricity, and using a motor or a fan.
따라서 적은 량의 화학약품을 처리할 때에는 흡착포로 닦아 내거나 중화제로 먼저 중화처리한 후 닦아 낸다.Therefore, when treating a small amount of chemicals, either wipe with an absorbent cloth or neutralize with a neutralizer first, and then wipe off.
상기의 흡착포를 이용할 경우에는 흡착포로부터 발생되는 분진(파티클:Particle)이 FAB을 오염시키는 실정이나 화학약품으로부터의 오염과 재해가 더욱 크기 때문에 어쩔수 없이 사용되고 있는 실정이다.In the case of using the above-mentioned adsorption cloth, the dust (particles) generated from the adsorption cloth contaminates the FAB and is inevitably used because of the greater pollution and disasters from chemicals.
본 고안은 상기와 같은 제반 문제점을 해결하기 위하여 안출한 것으로, 반도체 칩 생산시 사용되어지는 화학약품을 손쉽게 회수할 수 있을 뿐만 아니라, 화학약품 회수시에 발생할 수 있는 2차오염을 방지할 수 있는 공압과 이젝터를 이용한 액체 흡,배기장치를 제공하는데 그 목적이 있다.The present invention has been devised to solve the above problems, and can easily recover the chemicals used in the production of semiconductor chips, and can prevent secondary pollution that may occur during chemical recovery. The purpose is to provide a liquid intake and exhaust device using pneumatic and ejector.
상기 목적을 달성하기 위한 본 고안의 구성은, 압축공기발생부로부터 생성된 압축공기를 선택적으로 토출시키는 개폐핸들(21)을 가지고 있고, 공기도입체(30)의 커플러(coupler)(31)에 의해 연결되는 분사구(22)를 선단에 가지고 있는 건(20)과;The structure of the present invention for achieving the above object has an opening and closing handle 21 for selectively discharging the compressed air generated from the compressed air generating unit, the coupler (31) of the air introducing body (30) A gun (20) having a dispensing port (22) connected by the tip;
상기 건(20)의 분사구(22)가 체결되는 커플러(31)를 일측에 가지고 있고, 분사구(22)를 통해 공급되는 압축공기가 이송되는 제1공기이송로(32)와 제2공기이송로(33)가 수평,수직하는 방향에서 연통 형성되어 있되, 상기 제1공기이송로(32)는 공기차단밸브(32a)에 의해 개폐 차단 됨과 동시에 말단부에 화학약품에 의한 2차오염을 방지할 수 있도록 유해가스를 정화시키는 탄소필터(34a)가 나사체결부(34)에 나사결합되는 필터커버(34b)를 매개로 설치되어 있고, 공기조절밸브(33a)를 포함하는 제2공기이송로(33)의 하부에는 용기체결부(35)에 체결된 용기(40)에 저장되는 화학약품의 수위와 음압에 의해 부상하면서 상기의 제2공기이송로(33)를 개폐시키는 부구(33c)가 공기이송홀(33b)을 가지는 하부에 설치되어 있으며, 용기(40)에 액체를 저장하거나 저장된 액체를 배출하는 흡,배기관(36)이 용기체결부(35)에 위치하도록 설치되어 있고, 상기 흡,배기관(36)과 연통하는 흡,배기노즐(37a)이 너트(37)에 의해 고정설치되어 있는 것을 특징으로 한다.The first air transfer path 32 and the second air transfer path having a coupler 31 on one side to which the injection port 22 of the gun 20 is fastened, and to which compressed air supplied through the injection port 22 is transferred. (33) is formed in communication in the horizontal and vertical direction, the first air transfer path 32 is blocked by opening and closing by the air shut-off valve 32a and at the same time can prevent secondary pollution by chemicals at the end. Carbon filter 34a for purifying the noxious gas is installed through the filter cover 34b which is screwed to the screw fastening portion 34, and the second air transfer path 33 including the air control valve 33a. In the lower part of the), a float 33c for opening and closing the second air transfer path 33 while floating by the water level and the negative pressure of the chemical stored in the container 40 fastened to the container fastening part 35 is air transferred. It is installed in the lower part having the hole 33b, and stores the liquid in the container 40 or discharges the stored liquid. The intake and exhaust pipes 36 are provided to be located at the container fastening portion 35, and the intake and exhaust nozzles 37a communicating with the intake and exhaust pipes 36 are fixed by the nuts 37. It is done.
본 고안의 공압과 이젝터를 이용한 흡배기장치는, 공기도입체(30)와 에어건를 원터치 커플러에 의한 분리결합으로 에어건을 독립적으로 혹은 부품으로 사용될 수 있게 한 것을 특징으로 한다The intake and exhaust device using the pneumatic and ejector of the present invention is characterized in that the air gun body 30 and the air gun can be used independently or as a part by separate coupling by the one-touch coupler.
본 고안의 공압과 이젝터를 이용한 액체 흡,배기장치는, 나사체결부(34)에 탄소필터(24a)와 필터커버(34b)를 스프레이 노즐(50)로 교체 체결하여 스프레이건으로 사용할 수 있는 것을 특징으로 한다.The liquid intake and exhaust device using the pneumatic and ejector of the present invention, the carbon filter 24a and the filter cover 34b to the screw fastening portion 34 can be replaced by the spray nozzle 50 to be used as a spray gun. It is done.
본 고안의 공압과 이젝터를 이용한 액체 흡,배기장치는 공기도입체(30)의 탄소필터(34a) 장착부위에 에어노즐(60)을 장착하여 에어건으로 사용할 수 있는 것을 특징으로 한다.The liquid intake and exhaust device using the pneumatic and ejector of the present invention is characterized in that it can be used as an air gun by mounting the air nozzle 60 on the mounting portion of the carbon filter 34a of the air introducing body 30.
이하 본고안의 바람직한 실시예를 명세서에 첨부된 도면을 참조하여 보다 상세하게 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to the accompanying drawings.
본 고안에 따른 공압과 이젝터를 이용한 액체 흡,배기장치(10)를 이용할 때에는 압축공기발생부와 호스 연결된 건(20)과 공기도입체(30)를 연결한다.When using the liquid intake, exhaust device 10 using the pneumatic and ejector according to the present invention is connected to the compressed air generating unit and the hose 20 connected to the hose and the air introducer (30).
상기 건(20)과 공기도입체(30)를 연결할 때에는 건(20)의 분사구(22)를 공기도입체(30)의 커플러(31)에 꼽아 연결시킨다.When the gun 20 and the air introducer 30 are connected, the injection port 22 of the gun 20 is plugged into the coupler 31 of the air introducer 30.
상기와 같이 건(20)이 공기도입체(30)와 연결되어진 상태에서 사용목적에 따라 공기도입체(30)를 조정하게 된다.As described above, in the state where the gun 20 is connected to the air introducer 30, the air introducer 30 is adjusted according to the purpose of use.
도5는 화학약품(액체)이 용기(40)에 저장되는 상태를 보인 예시도로써, 건(20)의 개폐핸들(21)을 당기면 압축공기가 분사구(22)를 통해 공기도입체(30)로 공급된다.FIG. 5 is an exemplary view showing a state in which a chemical (liquid) is stored in the container 40. When the handle 20 of the gun 20 is pulled, compressed air is introduced through the injection hole 22. Is supplied.
상기 공기도입체(30)에 공급된 압축공기는 분사구(22)와 나란하고 공기차단밸브(32a)가 개방되어 있는 제1공기이송로(32)를 따라 빠른속도로 이송하게 된다.The compressed air supplied to the air introducing body 30 is transported at high speed along the first air transfer path 32 in which the air shutoff valve 32a is opened in parallel with the injection port 22.
상기와 같이 제1공기이송로(32)를 압축공기가 빠른속도로 이송할때 음압이 발생하게 되고, 상기와 같이 발생한 음압은 상기 제1공기이송로(32)와 연통된 제2공기이송로(33)를 통해 공기도입체(30)의 하부에 나사결합된 용기(40) 내부로 전달된다.As described above, a negative pressure is generated when the compressed air is conveyed at a high speed, and the negative pressure generated as described above is in communication with the first air path 32. Through the 33 is delivered into the container 40 screwed to the lower portion of the air introducer (30).
상기 용기(40) 내부로 전달된 음압은 용기(40)에 위치하도록 공기도입체(30)에 연결된 흡,배기관(36)에 전달되어 짐과 동시에 너트(37)에 의해 체결되어서 상기 흡,배기관(36)과 연통하도록 설치된 흡,배기노즐(37a)에 음압이 전달되어 화학약품이 흡,배기노즐(37a)을 통해 흡입되어 용기(40)에 저장되어지게 되는 것이다.The negative pressure transmitted into the container 40 is delivered to the intake and exhaust pipes 36 connected to the air introducing body 30 so as to be located in the container 40, and is fastened by the nut 37 to be connected to the intake and exhaust pipes. A negative pressure is transmitted to the intake and exhaust nozzles 37a installed to communicate with 36, so that chemicals are sucked through the intake and exhaust nozzles 37a and stored in the container 40.
상기와 같이 화학약품을 저장 회수할때 화학약품에서 발생하는 흄(fume)과 같은 유해가스가 제1공기이송로(32)와 나란하도록 설치된 탄소필터(34a)에 의해 필터링되어 화학약품에 의한 2차오염확산을 방지할 수 있는 것이다.As described above, when a chemical is stored and recovered, noxious gases such as fumes generated from chemicals are filtered by a carbon filter 34a installed to be parallel to the first air transfer path 32, thereby preventing the chemicals from being stored. It is possible to prevent the spread of secondary pollution.
상기와 같이 저장되어지는 화학약품이 용기(40)에 만수위로 저장되어지면, 제2공기이송로(33)상에 설치되어진 부구(33c)가 음압과 함께 저장되는 화학약품의 수위에 의해 상승하여 제2공기이송로(33)가 도6에서와 같이 차단되어지게 된다.When the chemicals stored as described above are stored at the full water level in the container 40, the floats 33c installed on the second air transfer path 33 are raised by the water level of the chemicals stored with the negative pressure. The second air transfer path 33 is blocked as shown in FIG.
상기와 같이 부구(33c)에 의해 제2공기이송로(33)가 차단되어짐으로써, 화학약품을 용기(40)에 저장할때 화학약품이 탄소필터(34a)쪽으로 배출되어지는 것을 근본적으로 막을 수 있는 것이다.As described above, since the second air transfer path 33 is blocked by the buckle 33c, when the chemical is stored in the container 40, it is possible to fundamentally prevent the chemical from being discharged toward the carbon filter 34a. will be.
도7은 용기(40)에 저장된 화학약품을 배출시키는 상태를 보인 예시도로써, 제1공기이송로상(32)에 설치된 공기차단밸브(32a)를 이용하여 상기의 제1공기이송로(32)를 차단시킨다.7 is an exemplary view showing a state of discharging the chemical stored in the container 40, the first air transfer path 32 by using the air shut-off valve (32a) installed on the first air transfer path (32) ).
제1공기이송로(32)가 공기차단밸브(32a)에 의해 차단되어진 상태에서 건(20)의 개폐핸들(21)을 작동시키면, 압축공기가 제2공기이송로(33)를 따라 이송한다.When operating the opening / closing handle 21 of the gun 20 in a state where the first air transfer path 32 is blocked by the air shutoff valve 32a, the compressed air is transferred along the second air transfer path 33. .
상기와 같이 제2공기이송로(33)를 따라 이송한 압축공기는 용기(40)내의 화학약품 표면에 골고루 압력이 작용하게 되며, 이 압력에 의해 화학약품(액체)이 흡,배기관(36)을 거쳐 상기 흡,배기노즐(37a)을 통해 분출되어지게 되는 것이다.Compressed air transported along the second air transfer path 33 as described above, the pressure is applied evenly to the surface of the chemical in the container 40, the chemical (liquid) by the pressure intake, exhaust pipe 36 It is to be ejected through the intake, exhaust nozzle (37a) through.
상기와 같이 흡,배기노즐(37a)을 통해 분출되는 액체는 분출압력이 너무 강할 경우, 외부로 비산 또는 튀어 오르는 화학약품에 의해 안전사고를 입을 수가 있다.As described above, when the ejection pressure is too strong, the liquid ejected through the intake and exhaust nozzles 37a may cause a safety accident due to splashing or splashing to the outside.
화학약품이 비산되거나 튀어 올라 발생하는 안전사고를 방지할 수 있도록 제2공기이송로(33)에 설치되어진 공기조절밸브(33a)를 도8에서와 같이 조정하여서 화학약품의 배출압력 및 속도를 조절할 수 있는 것이다.The air pressure control valve 33a installed in the second air transfer path 33 is adjusted as shown in FIG. 8 so as to prevent a safety accident caused by chemical splashing or splashing, thereby controlling the discharge pressure and speed of the chemical. It can be.
상기에서와 같이 본원고안은 반도체 제조공정을 통해 반도체 칩을 생산할때 사용되어지는 화학약품을 분출 또는 회수 처리할때 주로 사용하게 되나, 압축공기를 이용하여 생산라인에서 생산된 전자부품등에 묻은 먼지를 털어낼 수도 있다.As described above, the present application is mainly used when ejecting or recovering chemicals used in the production of semiconductor chips through a semiconductor manufacturing process, but using compressed air to remove dust from electronic components produced in the production line. You can also shake it off.
도9는 스프레이 노즐(50)을 탄소필터(34a) 및 탄소필터커버(34b)가 설치된 장착부위에 설치한 것이다.FIG. 9 shows that the spray nozzle 50 is installed on the mounting portion where the carbon filter 34a and the carbon filter cover 34b are installed.
상기 스프레이 노즐(50)을 체결한 상태에서 도장 도료를 스프레이할 때에는 제1공기이송로(32)에 설치된 공기차단밸브(32a)를 오픈상태로 조정하고, 제2공기이송로(33)에 설치된 공기조절밸브(33a)도 오픈상태로 조절하며, 부구(33c)를 분리하고 그 자리에 흡,배기관(흡,배기관을 탈부착하는 기술은 통상적으로 이루어지는 기술로써 도면에 구체적으로 표시하지 않았음)을 연결한 후 건(20)의 개폐핸들(21)을 당긴다.When spraying the coating material while the spray nozzle 50 is engaged, the air shutoff valve 32a installed in the first air transfer path 32 is adjusted to an open state and installed in the second air transfer path 33. The air control valve 33a is also adjusted to the open state, and the suction port 33c is removed and the intake and exhaust pipes (the technology of attaching and detaching the intake and exhaust pipes in place are conventional techniques and are not specifically shown in the drawings). After connecting, pull the opening and closing handle 21 of the gun (20).
개폐핸들(21)을 당기면 압축공기가 제1공기이송로(32)를 따라 빠르게 이송하며 이때 음압이 발생되고, 이 음압이 제2공기이송로(33)와 연결된 흡,배기관에 전달된 음압에 흡입된 도료를 분사되는 공기압으로 밀어 내어 스프레이 노즐(50)을 통해 분사시키게 되는 것이다.Pulling the opening / closing handle 21 causes the compressed air to be quickly transferred along the first air path 32, and at this time, a negative pressure is generated. The sucked paint is pushed through the sprayed air pressure to be sprayed through the spray nozzle 50.
도10은 압축공기를 사용하는 상태를 예시한 실시예로써, 공기도입체(30)의 나사체결부(34)에 필터커버(34b)를 매개로 설치되어진 탄소필터(34a)를 분리해낸 다음 에어노즐(60)을 장착한다.10 is a view illustrating an example of using compressed air, and after removing the carbon filter 34a installed through the filter cover 34b on the screw fastening portion 34 of the air introducing body 30, air is removed. The nozzle 60 is mounted.
상기와 같이 에어노즐(60)을 장착한 상태에서 압축공기를 에어노즐을 통해 분출시켜 공기를 이용한 부품세척등을 할 수 있는 것이다.As described above, the compressed air is ejected through the air nozzle in the state where the air nozzle 60 is mounted, and the parts can be cleaned using the air.
상기된 바와 같이 본 고안은, As described above, the present invention,
첫째, 건(20)을 통해 분출되는 공기압을 이용하여 반도체 제조공정을 통해 반도체 칩을 생산할때 사용되어지는 화학약품(액체)의 회수가 용이할 뿐만 아니라, 화학약품 회수에 따른 안전사고를 예방할 수 있는 효과를 가지고 있고;First, not only the recovery of chemicals (liquids) used in the production of semiconductor chips through the semiconductor manufacturing process using the air pressure blown out through the gun 20 can be prevented, but also the safety accidents caused by the recovery of chemicals can be prevented. Has an effect;
둘째, 반도체 제조공정에서 에어건, 스프레이건, 화학약품 흡,배기장치등을 각각 비취해야 했던 문제점을 본원 고안의 공압과 이젝터를 이용한 액체 흡,배기장치에 의해 해결 함으로써, 장비구입에 따른 설비비를 절감할 수 있는 매우 유용한 고안인 것이다.Second, by solving the problem of having to jade air gun, spray gun, chemical intake, exhaust device, etc. in the semiconductor manufacturing process by the liquid intake and exhaust device using pneumatic and ejector of the present invention, equipment cost according to equipment purchase is reduced It is a very useful design to do.
도1은 본 고안의 실시예를 예시한 측면 구성도.Figure 1 is a side configuration diagram illustrating an embodiment of the present invention.
도2는 본 고안의 요부를 발췌한 분리 사시도.Figure 2 is an exploded perspective view of the main portion of the present invention.
도3은 본 고안의 요부를 단면한 부분 단면도.Figure 3 is a partial cross-sectional view of the main part of the present invention.
도4는 본 고안의 요부를 단면한 확대 단면도.Figure 4 is an enlarged cross-sectional view of the main part of the present invention.
도5는 본고안의 실시예로서 용기에 액체가 저장되는 상태의 예를 보인 예시도.5 is an exemplary view showing an example in which a liquid is stored in a container as an embodiment of the present invention.
도6는 본 고안의 실시예로써, 용기에 저장된 액체의 만수위와 음압에 의해 부구가 상승하여 제2공기이송로가 차단된 상태의 예시도.Figure 6 is an embodiment of the present invention, an exemplary view of a state in which the second air transport path is blocked by the float rises by the full water level and the negative pressure of the liquid stored in the container.
도7은 본 고안의 실시예로써, 용기에 저장된 액체를 흡,배기노즐을 통해 분사하는 상태를 보인 예시도.Figure 7 is an embodiment of the present invention, an exemplary view showing a state of spraying the liquid stored in the container through the intake, exhaust nozzle.
도8은 본 고안의 실시예로써, 제2공기이송로의 공기조절밸브를 조절한 상태를 보인 예시도.8 is an exemplary view showing a state in which the air control valve of the second air transfer path is adjusted as an embodiment of the present invention.
도9는 본 고안의 장치를 스프레이 건으로 사용하는 상태를 보인 예시도.Figure 9 is an illustration showing a state using the device of the present invention as a spray gun.
도10은 본 고안의 장치를 에어건으로 사용하는 상태를 보인 예시도.10 is an exemplary view showing a state using the device of the present invention as an air gun.
※도면의 주요 부분에 대한 부호의 설명※※ Explanation of code for main part of drawing ※
20 : 건 21 : 개폐핸들20: Case 21: Opening and closing handle
22 : 분사구 30 : 공기도입체 22: injection hole 30: air inlet
31 : 커플러 32 : 제1공기이송로31: Coupler 32: First air transfer path
32a : 공기차단밸브 33 제2공기이송로32a: Air shutoff valve 33 Second air transfer path
33a : 공기조절밸브 33b : 공기이송홀33a: air control valve 33b: air transfer hole
33c : 부구 34 : 나사체결부33c: Sphere 34: Screw connection part
34a : 탄소필터 34b : 필터커버34a: carbon filter 34b: filter cover
35 : 용기체결부 36 : 흡,배기관35: container fastening part 36: intake, exhaust pipe
37 : 너트 37a : 흡,배기노즐37: nut 37a: intake and exhaust nozzle
50 : 스프레이노즐 60 : 에어노즐 50: spray nozzle 60: air nozzle
Claims (3)
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KR20-2005-0008836U KR200386730Y1 (en) | 2005-03-31 | 2005-03-31 | Liquid suction and exhaust equipment use of pneumatic ejector |
Applications Claiming Priority (1)
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KR20-2005-0008836U KR200386730Y1 (en) | 2005-03-31 | 2005-03-31 | Liquid suction and exhaust equipment use of pneumatic ejector |
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KR1020050064720A Division KR100639151B1 (en) | 2005-07-18 | 2005-07-18 | Liquid suction and exhaust equipment use of pneumatic ejector |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101005323B1 (en) * | 2008-08-29 | 2011-01-05 | 한양이엔지 주식회사 | A Recovery Device of Chemical Agents |
CN112263282A (en) * | 2020-10-09 | 2021-01-26 | 厦门志煊生物科技有限公司 | Eye drops collector |
-
2005
- 2005-03-31 KR KR20-2005-0008836U patent/KR200386730Y1/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101005323B1 (en) * | 2008-08-29 | 2011-01-05 | 한양이엔지 주식회사 | A Recovery Device of Chemical Agents |
CN112263282A (en) * | 2020-10-09 | 2021-01-26 | 厦门志煊生物科技有限公司 | Eye drops collector |
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