KR200383153Y1 - Rinsing water supply apparatus of plating process - Google Patents
Rinsing water supply apparatus of plating process Download PDFInfo
- Publication number
- KR200383153Y1 KR200383153Y1 KR20-2005-0000351U KR20050000351U KR200383153Y1 KR 200383153 Y1 KR200383153 Y1 KR 200383153Y1 KR 20050000351 U KR20050000351 U KR 20050000351U KR 200383153 Y1 KR200383153 Y1 KR 200383153Y1
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- cleaning
- circuit board
- printed circuit
- cleaning liquid
- liquid supply
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
본 고안은 인쇄회로기판(PCB) 도금시 도금공정 전에 세정 및 린스 등과 같은 각종 화학 처리하는 도금 전처리 공정의 세정액 공급장치에 관한 것으로, 더욱 상세하게는 인쇄회로기판 세정시 세정액을 자유낙하 시키어 이 인쇄회로기판을 세정 및 린스 시키는 도금 전처리 공정의 세정액 공급장치에 관한 것이다.The present invention relates to a cleaning liquid supplying device of a plating pretreatment process that performs various chemical treatments such as cleaning and rinsing prior to the plating process when plating a printed circuit board (PCB). More specifically, the printing solution is freely dropped when cleaning a printed circuit board. A cleaning liquid supply apparatus for a plating pretreatment step of cleaning and rinsing a circuit board.
즉 이를 위해 본 고안은 도금공정 전 행거(1)의 클램퍼(2)에 물리어 세정 가이드(3)로 투입된 인쇄회로기판(100)을 세척 린스액 공급라인(5)을 통하여 공급되는 화학 처리액인 세정액(4)으로 세정하여 탈지시키는 세정액 공급장치에 있어서, 상기 세척 린스액 공급라인(5)을 통해 공급되는 세정액(4)은 중간에 압력흡수격판(6)이 설치된 오우버 플로우 통로(7)가 세정 가이드(3)의 상단에 설치된 워터가이드 나이프(9)와 연결되어 세정액(4)을 인쇄회로기판(100)의 상단부에서 자연낙하 방식으로 공급하여 이 인쇄회로기판(100)을 세척 및 린스하여 탈지시키도록 이루어진 구조로 되어 있다.In other words, the present invention for this purpose is a chemical treatment liquid supplied through the rinse liquid supply line (5) to the printed circuit board 100 introduced into the cleaning guide (3) by the clamper (2) of the hanger (1) before the plating process In the cleaning liquid supply apparatus for cleaning and degreasing with the phosphorus cleaning liquid (4), the cleaning liquid (4) supplied through the cleaning rinse liquid supply line (5) has an overflow passage (7) provided with a pressure absorbing plate (6) in the middle. ) Is connected to the water guide knife 9 installed at the upper end of the cleaning guide (3) to supply the cleaning liquid (4) from the upper end of the printed circuit board 100 in a natural drop method to clean the printed circuit board (100) and It has a structure that is rinsed and degreased.
Description
본 고안은 인쇄회로기판(PCB) 도금시 도금공정 전에 세정 및 린스 등과 같은 각종 화학 처리하는 도금 전처리 공정의 세정액 공급장치에 관한 것으로, 더욱 상세하게는 인쇄회로기판 세정시 세정액을 자유낙하 시키어 이 인쇄회로기판을 세정 및 린스 시키는 도금 전처리 공정의 세정액 공급장치에 관한 것이다.The present invention relates to a cleaning liquid supplying device of a plating pretreatment process that performs various chemical treatments such as cleaning and rinsing prior to the plating process when plating a printed circuit board (PCB). More specifically, the printing solution is freely dropped when cleaning a printed circuit board. A cleaning liquid supply apparatus for a plating pretreatment step of cleaning and rinsing a circuit board.
공지된 바와 같이 인쇄회로기판과 같은 도금 기판을 전기 도금할 때 이 도금할 기판을 클램퍼에 물려 이동하면서 전처리 공정과 도금공정 및 후처리 공정을 차례로 거치게 되면 도금이 완료된다.As is well known, when electroplating a plated substrate such as a printed circuit board, the substrate to be plated is subjected to a pretreatment process, a plating process, and a post-treatment process while the substrate to be plated is moved by a clamper.
여기서, 전처리 공정은 도금공정에서 도금이 이루어지는 인쇄회로기판의 분진, 이물질 제거 내지는 도금편차 및 균일성에 악영향을 끼치는 것들을 세척하기 위해 이 인쇄회로기판 도금공정 전에 수행하는 세정 및 린스와 같은 화학처리 공정이다.Here, the pretreatment process is a chemical treatment process such as cleaning and rinsing performed before the plating process of the printed circuit board in order to clean the dust, debris from the printed circuit board which is plated in the plating process, or those which adversely affect the plating deviation and uniformity. .
종래 이와 같은 인쇄회로기판의 전처리는 주로 화학 처리액인 세정액에 도금할 인쇄회로기판을 담가 끄집어내거나 세정액을 노즐을 통해 인쇄회로기판에 분사하여 세정시킴으로서 탈지효과를 얻을 수 있었다.Conventionally, such a pretreatment of a printed circuit board can obtain a degreasing effect by immersing a printed circuit board to be plated in a cleaning solution, which is a chemical treatment solution, or by spraying the cleaning solution onto the printed circuit board through a nozzle.
그러나 종래 상기와 같은 세정방식은 세정액이 과다하게 사용되는 단점과 많은 세정액 사용으로 장비의 레이아웃이 크게 점유되는 문제점이 있었다.However, the conventional cleaning method as described above has a problem in that the layout of the equipment is largely occupied by the disadvantage of excessive use of the cleaning solution and the use of many cleaning solutions.
이에 본 고안은 종래 상기와 같은 문제점을 해결하기 위해 안출된 것으로, 각종 화학 처리액인 세정액을 이용하여 인쇄회로기판을 세정할 때 세정액을 폭포수와 같은 자연낙하 방식을 이용하여 인쇄회로기판을 세정 및 세척함에 따라 충분한 탈지효과를 얻을 수 있으면서 세정액의 절감도 이루어지는 도금 전처리 공정의 세정액 공급장치를 제공함에 그 목적이 있다. Accordingly, the present invention has been made to solve the above problems, and when cleaning the printed circuit board using a cleaning liquid which is various chemical treatment liquids, the cleaning liquid is washed and printed using a natural dropping method such as a waterfall. It is an object of the present invention to provide a cleaning liquid supplying device of a plating pretreatment process in which a sufficient degreasing effect can be obtained by washing, and the cleaning liquid is also reduced.
상기와 같은 목적을 달성하기 위한 본 고안은 행거의 클램퍼에 물리어 세정가이드로 투입된 인쇄회로기판을 세척 린스액 공급라인을 통하여 공급되는 화학 처리액인 세척 린스액으로 세정하여 탈지시키는 세정액 공급장치에 있어서, 상기 세정액 공급라인을 통해 공급되는 세정액은 중간에 압력흡수 격판이 설치된 오우버 플로우 통로를 갖춘 세정액 공급부로 공급되고, 이 세정액 공급부의 오우버 플로우 통로가 세정 가이드의 상단에 설치된 워터가이드 나이프와 연결되어 세정액을 인쇄회로기판의 상단부에서 자연낙하 방식으로 공급하여 세척 및 린스 시키도록 이루어져 있다.The present invention for achieving the above object is a cleaning liquid supply apparatus for cleaning and degreasing the printed circuit board, which is introduced into the cleaning guide by the clamper of the hanger with a cleaning rinse liquid which is a chemical treatment liquid supplied through the cleaning rinse liquid supply line. The cleaning liquid supplied through the cleaning liquid supply line is supplied to a cleaning liquid supply unit having an overflow passage having a pressure absorbing diaphragm interposed therebetween, and the overflow passage of the cleaning liquid supply unit is provided with a water guide knife installed at an upper end of the cleaning guide. It is connected to the cleaning solution is supplied from the upper end of the printed circuit board in a natural drop method to wash and rinse.
이하, 본 고안의 바람직한 실시예를 예시도면을 참조로 상세히 설명한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 고안이 적용된 인쇄회로기판(100)의 전처리 설비를 도시한 정면도이고, 도 2는 도 1의 I-I선 단면도이며, 도 3은 도 2의 부분 확대도 이다.1 is a front view illustrating a pretreatment facility of a printed circuit board 100 to which the present invention is applied, FIG. 2 is a cross-sectional view taken along line II of FIG. 1, and FIG. 3 is a partially enlarged view of FIG. 2.
본 고안은 도면에 도시된 바와 같이 도금공정 전 행거(1)의 클램퍼(2)에 물리어 세정 가이드(3)로 투입된 인쇄회로기판(100)을 세척 린스액 공급라인(5)을 통하여 공급되는 화학 처리액인 세정액(4)으로 세정하여 탈지시키는 세정액 공급장치에 있어서, 상기 세척 린스액 공급라인(5)을 통해 공급되는 세정액(4)은 중간에 압력흡수격판(6)이 설치된 오우버 플로우 통로(7)가 세정 가이드(3)의 상단에 설치된 워터가이드 나이프(9)와 연결되어 세정액(4)을 인쇄회로기판(100)의 상단부에서 자연낙하 방식으로 공급하여 이 인쇄회로기판(100)을 세척 및 린스하여 탈지시키도록 이루어져있다.The present invention is supplied through the cleaning rinse liquid supply line (5) to the printed circuit board 100 introduced into the cleaning guide (3) by biting the clamper (2) of the hanger (1) before the plating process as shown in the figure In the cleaning liquid supply apparatus for cleaning and degreasing with the cleaning liquid (4) that is a chemical treatment liquid, the cleaning liquid (4) supplied through the cleaning rinse liquid supply line (5) is an overflow with pressure absorbing plate (6) installed in the middle The passage 7 is connected to the water guide knife 9 installed at the upper end of the cleaning guide 3 so as to supply the cleaning liquid 4 from the upper end of the printed circuit board 100 in a natural dropping manner, thereby supplying the printed circuit board 100. To degrease by washing and rinsing.
여기서, 상기 세척 린스액 공급라인(5)은 여과필터(10)를 거친 세정액(4)을 펌프(11)를 통하여 세정액 공급부(8)로 공급시키되, 공급되는 세정액(4)의 압력이 이 세정액 공급부(8)의 압력흡수격판(6)에 의하여 완화되도록 되어 있으며, 이 세정액 공급부(8)의 한쪽에는 공급되는 세정액(4)을 한쪽방향으로만 흐르도록 오우버 플로우 통로(7)가 형성되어 있어서 세정액(4)을 유도 안내하도록 되어 있다.Here, the washing rinse liquid supply line 5 supplies the washing liquid 4 that has passed through the filtration filter 10 to the washing liquid supply unit 8 through the pump 11, and the pressure of the washing liquid 4 supplied is the washing liquid. The pressure absorbing plate 6 of the supply unit 8 is relaxed, and on one side of the cleaning liquid supply unit 8, an overflow passage 7 is formed so as to flow the cleaning liquid 4 supplied in only one direction. In this case, the cleaning liquid 4 is guided.
또한 상기 오우버 플로우 통로(7)에는 세정 가이드(3)의 상단에 설치된 워터가이드 나이프(9)가 연결됨에 따라 세정액(4)을 클램퍼(2)에 물린 인쇄회로기판(100)의 상단부에서 한쪽으로 편중시키지 않고 고르게 안내 공급시키도록 되어 있다.In addition, as the water guide knife 9 installed at the upper end of the cleaning guide 3 is connected to the overflow passage 7, one side of the upper portion of the printed circuit board 100 with the cleaning liquid 4 bitten by the clamper 2. It guides and distributes evenly without biasing.
따라서 세척 린스액 공급라인(5)을 통하여 공급되는 세정액(4)은 세정액 공급부(8)의 오우버 플로우 통로(7)와 워터가이드 나이프(9)를 통하여 클램퍼(2)에 물린 인쇄회로기판(100)의 상단부로 공급되어 폭포수처럼 자연 낙하하면서 이 인쇄회로기판(100)을 세척 린스하여 탈지시키고, 상기 인쇄회로기판(100)을 세척 린스한 세정액(4)은 다시 여과필터(10)를 거쳐 펌프(11)에 의해 세척 린스액 공급라인(5)으로 재 공급되는 폐쇄 순환되어 진다.Therefore, the cleaning liquid 4 supplied through the cleaning rinse liquid supply line 5 is a printed circuit board bitten by the clamper 2 through the overflow passage 7 and the water guide knife 9 of the cleaning liquid supply unit 8 ( It is supplied to the upper end of the 100 and the natural fall like a waterfall, washing and rinsing the printed circuit board 100 by degreasing, the cleaning liquid (4) to wash and rinse the printed circuit board 100 is again passed through the filtration filter (10) Closed circulation is supplied back to the washing rinse liquid supply line (5) by the pump (11).
상기와 같이 본 고안에 따른 도금 전처리 공정의 세정액 공급장치는 세척 및 린스액 뿐만 아니라 기타 각종 화학 처리액을 공급하는 세정액 공급장치에 적용되어 도금할 인쇄회로기판을 깨끗하게 적은 양으로 세척 및 린스하여 탈지시키면서 장비의 전체 레이아웃도 보다 콤팩트하게 제작 공급할 수 있는 잇점을 갖는다.As described above, the cleaning solution supply device of the plating pretreatment process according to the present invention is applied to the cleaning solution supply device for supplying not only the cleaning and rinsing liquid but also various other chemical treatment liquids, and cleans and rinses the printed circuit board to be plated with a small amount. At the same time, the overall layout of the equipment has the advantage of being able to manufacture and supply more compactly.
도 1은 본 고안이 적용된 도금장치의 전처리부 정면도,1 is a front view of the pretreatment unit of the plating apparatus to which the present invention is applied,
도 2는 도 1의 I-I선 단면도,2 is a cross-sectional view taken along line II of FIG. 1;
도 3은 도 2의 부분 확대도 이다.3 is a partially enlarged view of FIG. 2.
-도면의 주요부분에 대한 부호의 설명-Explanation of symbols on the main parts of the drawing
1: 행거, 2: 클램퍼,1: hanger, 2: clamper,
3: 세정 가이드, 4: 세정액,3: cleaning guide, 4: cleaning liquid,
5: 세척 린스액 공급라인, 6: 압력흡수격판,5: washing rinse liquid supply line, 6: pressure absorption plate,
7: 오우버 플로우(Over flow)통로, 8: 세정액 공급부,7: over flow passage, 8: cleaning liquid supply,
9: 워터가이드 나이프(Water guide knife), 10: 여과필터,9: Water guide knife, 10: Filtration filter,
11: 펌프, 100: 인쇄회로기판.11: pump, 100: printed circuit board.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2005-0000351U KR200383153Y1 (en) | 2005-01-06 | 2005-01-06 | Rinsing water supply apparatus of plating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2005-0000351U KR200383153Y1 (en) | 2005-01-06 | 2005-01-06 | Rinsing water supply apparatus of plating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR200383153Y1 true KR200383153Y1 (en) | 2005-05-03 |
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ID=43684694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR20-2005-0000351U KR200383153Y1 (en) | 2005-01-06 | 2005-01-06 | Rinsing water supply apparatus of plating process |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200383153Y1 (en) |
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2005
- 2005-01-06 KR KR20-2005-0000351U patent/KR200383153Y1/en not_active IP Right Cessation
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