KR200382481Y1 - Printed circuit borad - Google Patents

Abstract

The present invention relates to a printed circuit board, and more particularly, to a printed circuit board having conductive protrusions formed to easily solder the printed circuit board to other electronic components.

In a printed circuit board having conductive protrusions according to the present invention, a circuit is formed in which a circuit in which upper and lower surfaces are electrically connected to each other by copper electroless copper plating is formed on a copper foil laminated board having copper foil layers laminated on both sides of an insulating layer. One surface of the formed copper-clad laminate plate is characterized in that the conductive projection copper-plated by the electroplating method is formed on the soldering portion portion where the electronic component is soldered.

Description

Printed circuit borad with conductive protrusions {Printed circuit borad}

The present invention relates to a printed circuit board, and more particularly, to a printed circuit board having conductive protrusions formed to easily solder the printed circuit board to other electronic components.

Recently, the demand for printed circuit boards is continuously growing due to the development of electronic components, component embedded technologies, and thin and light electronic components. In addition, with the rapid development of semiconductor integrated circuit integration, the demand for printed circuit boards that allow easy embedding in more complex and narrow spaces is increasing with the development of surface mount technology for mounting small chips and their components.

In particular, in the case of a double-sided printed circuit board, with the development of digital cameras, mobile phones, liquid crystal display devices, PDPs, and the like, the use thereof is rapidly increasing, and the demand for technology development for manufacturing technology is increasing.

The production method of such a double-sided printed circuit board using a CNC drill or a laser drill to form a through hole or via hole in a copper-clad laminate laminated copper foil side on both sides of the epoxy resin which is an insulating layer, and then electroless plating and After the electroplating process, a plating layer was formed in the through hole and the copper foil layer to electrically connect the upper and lower surfaces, and a circuit pattern was formed through dry film laminating, exposure, development, and etching processes.

In order to solder to a double-sided printed circuit board produced in this way, a conventional solder screen is applied to a printed circuit board or film using a screen printing machine. The solder cream used at this time is a semi-solid alloy and is also referred to as solder paste.

First, a silk screen mask (metal mask) cut out of a printed area on a printed circuit board or film for applying solder cream is manufactured. After making the silk screen mask, attach it to the printed circuit board to be printed, apply solder cream with squeegee, and solder it on the surface such as various electronic components or SMD (Surface Mount Device) chips on the printed printed circuit board. The electronic components are mounted by soldering the components to align with the printed circuit board pads.

However, the printed circuit board printed by the conventional silk screen has a limitation in raising the coating film height of the solder cream, because the solder cream flows through fine silk between emulsions.

That is, as shown in FIG. 5, when the conventional printed circuit board on which the various elements 320 such as a capacitor are mounted is inserted into the microphone case 100, the circumference of the microphone case 100 and the printed circuit board 300 is rounded. The height of the curling 200 fixed to each other is formed higher than the soldering 310 formed on the printed circuit board.

Accordingly, when the printed circuit board 300 is connected to the printed circuit board of the mobile phone or the SMD chip, these mobile phone printed circuit boards or the soldering 310 of the printed circuit board formed below the height of the curling 200 are formed. Manual soldering of the SMD chips takes a lot of time and reduces productivity.

In particular, the height of the coating film of the solder cream of the screen mask to be soldered, that is, the height of the soldering 310 portion is lower than the curling height. Since solder cream is applied to the short, the defect rate of the product increases.

The present invention is designed to solve the above problems, and the predetermined area and height to easily solder the electronic components such as SMD-type chip or wire or microphone printed circuit board used in the mobile phone on the printed circuit board An object of the present invention is to provide a printed circuit board on which conductive protrusions having a soldering portion are provided.

Furthermore, an object of the present invention is to provide a printed circuit board having conductive protrusions which prevent oxidation of the surface of the copper-clad laminate of the printed circuit board and which can easily solder various electronic components or wires to the conductive protrusions.

A printed circuit board having conductive protrusions according to the present invention for achieving the above object has a circuit in which upper and lower surfaces are electrically connected to each other through an electroless copper plating on a copper foil laminate in which copper foil layers are laminated on both sides of an insulating layer. In the printed circuit board, the copper foil laminated plate on which the circuit is formed is characterized in that the conductive projections copper plated by the electroplating method is formed on the soldering portion to which the electronic component is soldered.

According to such a configuration, the printed circuit board on which the conductive protrusions according to the present invention are formed has conductive protrusions formed on the soldering portion connecting the substrate to other electronic components, thereby easily soldering the electronic components by hand. can do.

In particular, when the printed circuit board on which various elements are mounted is connected to other electronic components, the height of the soldering portion is formed higher than the height of curling, so that the soldering work can be automated, thereby improving productivity for the soldering work.

In addition, since the conductive protrusions formed on the soldering portion are formed to protrude vertically, the solder cream can be prevented from spreading to other portions in addition to the corresponding portions during soldering operations, thereby reducing the occurrence of short circuits due to soldering. It can reduce the occurrence.

That is, by forming a soldering area and a step corresponding to the area and height of the conductive protrusion on the printed circuit board, it is possible to prevent the solder cream soldered to the conductive protrusion during soldering to spread to other parts.

The present invention will become more apparent through the following preferred embodiments with reference to the accompanying drawings. Hereinafter will be described in detail to enable those skilled in the art to easily understand and reproduce through these embodiments.

First, before describing the printed circuit board on which the conductive protrusions according to the present invention are formed, the printed circuit board to be described below will be described by exemplifying a SMD (Surface Mount Device) form in which various electronic components constituting the microphone of the mobile phone are mounted. However, the printed circuit board on which the conductive protrusions according to the present invention are formed is not necessarily limited thereto.

1 is a cross-sectional view of a printed circuit board according to the present invention, Figure 2 is a cross-sectional view showing a mounting state of the printed circuit board according to the present invention.

As shown in FIG. 1, a printed circuit board having conductive protrusions according to the present invention (hereinafter referred to as a “printed circuit board” for convenience) is electroless on a copper foil laminated board in which copper foil layers 2 are laminated on both sides of the insulating layer 1. A circuit pattern is formed in which upper and lower surfaces are electrically connected by thawing plating. On the upper surface of the printed circuit board, a circuit pattern formed on both sides and a soldering portion 3 on which the various electronic components are mounted by soldering are formed.

That is, in the printed circuit board according to the present invention, an electroless copper plated copper foil layer 2 is formed around the upper surface, and the copper foil layer and the outside are integrally connected to the inner circumference of the copper foil layer 2, and the electronic component is A plurality of soldering parts 31 to be soldered and fixed are formed, but the soldering parts 31 are formed to be spaced apart from each other. At the inner center of the copper foil layer 2, a circular soldering portion 32 is formed on which the other end is soldered and fixed.

And the upper surface of the soldering portion (3) has a conductive projection (4) connecting the printed circuit board according to the present invention to the above-mentioned other electronic components through the soldering is formed.

That is, the conductive protrusions 4 formed on the upper surface of the soldering portion, which is a feature of the present invention, are copper plated to a thickness of 100 to 170 μm by electroplating, and protrude vertically to the upper surface of each soldering portion formed on the upper surface of the printed circuit board. It is formed to have a certain width.

As described above, since the conductive protrusion is formed to be relatively higher than the surface of the printed circuit board, the soldering operation of connecting the printed circuit board to other electronic components can be easily performed.

In other words, in the case of SMD-type printed circuit boards that are currently used in microphones of mobile phones, the thickness of soldering portions of printed circuit boards to be soldered with other electronic components is about 30 μm.

Accordingly, when mounting and fixing the printed circuit board to the microphone case of the mobile phone, the soldering part formed on the upper surface is formed to be lower than the height of curling of the printed circuit board and the microphone case, so that various electronic components are manually processed by the soldering part of the printed circuit board. It must be soldered. Therefore, not only does the soldering work take a lot of time, but also the solder cream spreads and comes into contact with the microphone case part, causing a short.

However, in the case of the printed circuit board according to the present invention, the thickness of the soldering portion is formed to be 100 to 170 μm higher than the surface of the printed circuit board through the conductive protrusions, so that the printed circuit board and other electronic components, such as SMD type chips, are formed. However, soldering can be performed more easily when soldering with a flexible printed circuit board.

That is, as shown in FIG. 2, when the printed circuit board according to the present invention, in which various elements 320 are mounted, is mounted on the microphone case 100, the conductive protrusions 4 of the printed circuit board are higher than the height of the curling 200. Protruding from the height of the higher, it is possible to automatically proceed the soldering operation for connecting the printed circuit board to the other electronic components can improve the productivity.

In addition, since the conductive protrusions 4 formed on the upper surface of the soldering portion have an area necessary for soldering and are formed to protrude vertically, the solder cream applied to the upper surface of the conductive protrusions 4 can be prevented from being connected to other parts while being spread. It is possible to reduce the defective rate caused by the short that was a problem in the conventional printed circuit board.

Meanwhile, according to an additional embodiment of the present invention, the metal layer 5 is further plated on the surface of the copper foil layer 2 of the printed circuit board on which the conductive protrusions 4 are formed.

The metal layer 5 serves to prevent the copper foil formed on the surface of the printed circuit board from being oxidized by the atmosphere. That is, the metal layer is plated on the copper foil on the surface of the printed circuit board, thereby preventing the atmosphere from contacting the copper foil, thereby preventing the formation of an oxide film on the copper foil surface.

The metal layer 5 having such a role is formed by an electroless plating method, and the metal layer may be formed using either gold, tin, or tin alloy.

Accordingly, when soldering to connect other electronic components to the printed circuit board, the solder cream is firmly adhered to the upper surface of each soldering portion where the metal layer is plated, thereby improving the soldering of the printed circuit board and the other electronic components.

Hereinafter, a method of manufacturing a printed circuit board according to the present invention with the above structure will be described with reference to FIGS. 3 and 4A to 4K.

First, FIG. 3 is an overall process diagram for explaining a process of manufacturing a printed circuit board according to the present invention, and FIGS. 4A to 4K are cross-sectional views illustrating a process of manufacturing a printed circuit board according to the present invention.

As shown in the figure, first, a circuit is formed on a copper clad laminate in which copper foil layers 2 are laminated on both sides of insulating layer 1, and electroless copper plating is performed.

In the case of forming the circuit as described above, the printed circuit board according to the present invention has a circular soldering portion 32 and a circumference thereof to form conductive protrusions on the upper surface of the circular soldering portion 32 formed at the center through electroplating. A guide line 21 for electrically connecting any one of the soldering portions 31 formed therein is formed.

Since the process of forming the circuit as described above is performed through a commonly used method, a detailed description thereof will be omitted.

As described above, electroless copper plating is performed to form a circuit, and then a soldering part 3 connected to other electronic components through soldering is formed (S10). That is, by drying the dry film 10 on both sides of the insulating layer 1 and peeling only the dry film 10 laminated at the position where the soldering part 3 is to be formed by exposure and development, as shown in FIG. 4A. Soldering portion (3) is formed on the upper surface.

And in order to prevent the formation of the conductive projections in addition to the soldering portion peeled dry film to form the conductive projections, a characteristic aspect of the present invention is laminated to the dry film (S20). That is, as shown in FIG. 4B, the dry film 10 is laminated on the entire upper surface of the printed circuit board on which the soldering part 3 is formed (S21).

At this time, the laminated dry film 10 is preferably progressed to a thickness of 100 ~ 170㎛. This is because the conductive protrusions, which will be described later, are limited in height by the thickness of the laminated dry film.

After laminating the dry film 10 to the entire upper surface as described above, as shown in FIG. 4C, the dry film 10 laminated at the position where the conductive protrusions are to be formed is exposed and developed using the mask 20, and is unnecessary. The part is removed with a weak alkaline solution (S22).

Accordingly, as shown in FIG. 4D, only the portion A to which the conductive protrusion is to be formed is exposed to the outside, and the upper surface of the other portion is covered by the dry film 10.

Then, copper plating is performed on the upper surface of the soldering portion 3 exposed to the outside by electroplating to form conductive protrusions 4 having a thickness of 100 to 170 μm, and are laminated between the formed conductive protrusions 4. The dry film 10 is removed using a peeling liquid (S30).

At this time, since the circular soldering part 32 formed at the center is electrically connected to any one of the soldering parts 31 formed at the outer circumference through the induction line 21, the induction line during electroplating ( Electric current is also supplied to the circular soldering portion 32 through the 21, and the conductive protrusions 4 are copper plated on the upper surface of the soldering portion 32.

Therefore, as shown in FIG. 4E, the conductive protrusions 4 having a thickness of 100 to 170 μm are formed on the upper surface of each soldering portion, so that solder cream may be easily applied during the soldering operation for connecting the printed circuit board to other electronic components. Can be.

Meanwhile, as described above, the conductive protrusions 4 are formed on each of the soldering parts 3, and then the connection sites connecting the conductive protrusions formed at the outer circumference and the conductive protrusions formed at the center are etched (S40).

That is, as illustrated in FIG. 4F, the dry film 30 is laminated on the entire upper surface of the printed circuit board on which the conductive protrusions 4 are formed (S41). Then, as shown in FIG. 4G, the dry film 30 is exposed and developed by using the mask 40 to expose the portion of the gland 21 to the outside (S42). .

Accordingly, as shown in FIG. 4H, only the portion of the gland 21 is exposed to the outside, and the upper surface of the other portion is covered by the dry film 30.

Next, the copper-plated indwelling part is etched using the ferric chloride, which is an alkaline etching solution, in the part of the intact gland 21 exposed to the outside (S43).

Accordingly, as shown in FIG. 4I, the lead wire 21 connecting the soldering portion 31 formed at the outer circumference and the circular soldering portion 32 formed at the center thereof and the copper foil layer which is the conductive protrusion copper plated on the upper surface thereof ( 2) is removed through the etching process, the soldering portion 31 formed around the circumference and the circular soldering portion 32 formed in the center is electrically insulated to form a printed circuit board of the SMD type.

Then, the dry film 30 stacked between the conductive protrusions 4 and the dry film 10 stacked on the lower surface of the printed circuit board are removed using a peeling solution (S50). Accordingly, as shown in FIG. 4J, the dry film 30 stacked between the conductive protrusions 4 and the dry film 10 stacked on the bottom surface of the printed circuit board are removed and the copper foil layer including the circuit ( 2) is exposed to the outside.

The etching process of the conductive protrusions is necessary when the conductive protrusions are connected to one end of the electronic component in the form of SMD, that is, the center, but is not necessarily required when manufacturing a printed circuit board other than the SMD type.

For example, when the terminal positions of the circuit pattern on which the electronic component is mounted are formed to be symmetrically on the outermost side, soldering portions are present on the opposite side of the terminal positions, so that the conductive protrusions are formed only on the upper surface of the soldering portions. It may be formed to protrude through the electroplating method.

When the conductive protrusion is formed on the circuit pattern without the etching process as described above, the peeling of the dry film laminated on the lower surface of the printed circuit board is performed in the above-described conductive protrusion step (S30). That is, when the dry film laminated between the conductive protrusions is removed, the dry film laminated on the lower surface of the printed circuit board is removed together using a peeling solution, thereby manufacturing a printed circuit board having the conductive protrusions according to the present invention. .

Meanwhile, a method of manufacturing a printed circuit board having conductive protrusions according to the present invention includes a metal plating step of plating the metal layer 5 on the surface of the printed circuit board manufactured through the above method, that is, the surface of the copper foil layer 2 ( It is preferable to further include S60).

 That is, as shown in FIG. 4K, the metal layer 5 is formed on the upper surface of the copper foil layer 2 exposed to the outside by performing an electroless plating method on the surface of the printed circuit board from which the dry film is removed, thereby providing a printed circuit board. It serves to prevent the copper foil layer 2 formed on the surface of the oxidized by the atmosphere.

That is, gold, tin, or tin alloy is plated on the copper foil of the printed circuit board surface, thereby preventing the air from contacting the copper foil, thereby preventing the formation of an oxide film on the copper foil surface.

Accordingly, when soldering for mounting electronic components on a printed circuit board, the solder cream is firmly adhered to the upper surface of each soldering portion where the metal layer is plated, thereby improving soldering with the electronic components connected to the printed circuit board. have.

As described in detail above, the printed circuit board on which the conductive protrusions according to the present invention are formed has conductive protrusions connected to other electronic components on the soldering portion formed on the upper surface of the printed circuit board, so that the soldering of the electronic components by hand is performed. Soldering can be performed more easily.

In particular, when the printed circuit board on which various elements are mounted is connected to other electronic components, the height of the soldering portion is formed higher than the height of curling, so that the soldering work can be automated, thereby improving productivity for the soldering work.

In addition, since the conductive protrusions are formed to protrude vertically, the solder cream can be prevented from spreading to other parts in addition to the corresponding parts during the soldering operation, thereby reducing the occurrence of short circuits due to the soldering, thereby reducing the occurrence of defects on the product. have.

In addition, since metal layers are further plated on both surfaces of the printed circuit board, copper foils formed on both surfaces of the printed circuit board can be prevented from being oxidized by the air, thereby improving soldering of the printed circuit board and other electronic components. .

Although the present invention has been described with reference to the accompanying drawings, it will be apparent to those skilled in the art that many different and obvious modifications are possible without departing from the scope of the present invention from this description. Therefore, the scope of the present invention should be interpreted by the utility model registration claims described to include many such variations.

1 is an enlarged cross-sectional view of a printed circuit board according to the present invention.

2 is a cross-sectional view showing a mounting state of a printed circuit board according to the present invention.

3 is an overall process diagram for explaining a process of manufacturing a printed circuit board according to the present invention.

4A to 4K are cross-sectional views illustrating a manufacturing process of a printed circuit board according to the present invention.

5 is a cross-sectional view showing a mounting state of a conventional printed circuit board.

<Explanation of symbols for the main parts of the drawings>

1: insulation layer

2: copper foil layer

3: soldering part

4: conductive projection

5: metal layer

10, 30: dry film

20, 40: mask

Claims (4)

In a printed circuit board having a circuit in which the upper and lower surfaces are electrically connected to each other by an electroless copper plating on a copper foil laminated plate in which copper foil layers are laminated on both sides of an insulating layer, A printed circuit board having conductive protrusions formed on one surface of the copper-clad laminate in which the circuit is formed is formed on the soldering portion to which the electronic component is soldered by the electroplating method. The method of claim 1, The conductive projection is a printed circuit board having a conductive projection, characterized in that formed in a thickness of 100 ~ 170㎛. The method according to claim 1 or 2, The surface of the copper-clad laminated board of the printed circuit board including the conductive protrusions prevent the oxidation of the copper foil and a metal layer is further plated to improve the soldering. The method of claim 3, wherein The metal layer is a printed circuit board having a conductive projection, characterized in that any one of gold, tin or tin alloy.