KR200376784Y1 - Solid-state semiconductor light emitting device - Google Patents

Abstract

The solid semiconductor light emitting device according to the present invention includes a heat sink block including a mount cup to install a chip, and fits a lead frame provided with a coupling base above the heat sink block. Then, the chip is connected to the lead frame with a wire, and a light emitting diode capable of emitting light is completed by sealing with a resin or silicone resin. The lead frame is installed so as to face two subleads having a round portion at an upper portion thereof, and a sublead having a through hole is provided between the two round portions, and a sublead having a through hole in the center and a sub portion having a round portion are provided. After connecting one of the leads, three subleads are inserted and molded into a resin material to form a joining base for fitting the heat sink block. From the above, the heat sink block can not only provide a good heat dissipation effect, but also each sub lead of this lead frame can also provide heat dissipation, and can also improve the stability of the coupling.

Description

Solid semiconductor light emitting device

The present invention not only has a good heat dissipation effect, but also relates to a solid semiconductor light emitting device having improved bonding stability, and is applicable to a light emitting diode or a similar structure.

In general, the luminous efficiency of a light emitting diode is inversely related to the interfacial temperature of the LED, and one of the most cautions in the LED package is that the temperature of the chip should be kept below the interfacial temperature. However, in the conventional LED, since the chip is mounted in a cup (for example, an optical cavity) in the lead and connected to another lead by a bonding wire, the packaged chip is subjected to thermal stress and is easily damaged and destroyed.

In view of the above-mentioned drawbacks of the prior art, US Patent No. 6274924 discloses a surface mount LED package structure. As shown in FIG. 1, the patent is formed around a heatsink block 10 with a reflector cup 14 (optionally available), an insert molded leadframe base 12, and a lead providing an electrical circuit. And a light emitting diode chip 16 by indirectly fixing the light emitting diode chip 16 on the heat sink block 10 by the heat conducting submount 18, and bonding the chip 16 and the submount with a bonding wire. 18, the optical lens 20 can be added and the preformed thermoplastic lens and the sealing material fixed by connecting to the lead on the lead frame base 12 which is electrically and thermally isolated from the heat sink block 10, Cover the LED with epoxy resin.

Although the structure described above can be electrically and thermally separated to prevent the chip from being affected by heat, the component is complicated. Therefore, the present invention concise the constituent members without being separated electrically and thermally, and in addition to heat dissipation using a heat sink block, the heat dissipation surface area is increased with a plurality of subleads of the lead frame, and a circuit board with a plurality of subleads. It is to provide a solid semiconductor light emitting device that can enhance the bond with.

The object of the present invention is to provide a solid semiconductor light-emitting device in which the component is concise and which is not electrically and thermally separated.

The object of the present invention is to provide a solid semiconductor light emitting device which increases the surface area of the heat dissipation and improves the bonding stability.

It is mainly provided with a heat sink block, a chip, a lead frame, and a resin material for sealing the three components. A mount cup is provided at a center position of the heat sink block to arrange chips, and the chip is a thermally conductive mount. May be combined with the heat sink block. The lead frame is installed so as to face two sub-leads having a round part at the top, and a sub-lead having a through hole in the center is installed between the two round parts again, and the sub-lead and round part having a through hole are provided in the center. One of the subleads is connected. In this case, the connection portion may be arbitrarily determined. Subsequently, the three subleads are integrally connected with the resin material, and the resin material is molded and made into a bonding base, and the mount cup of the heat sink block is inserted into the bonding base of the lead frame. Then, the chip is connected to the lead frame with a wire, and the resin is sealed with a resin or silicone resin to complete a light emitting diode capable of emitting light. By the above configuration, not only can the heat sink block provide a good heat dissipation effect, but also each sublead of this lead frame can increase the heat dissipation surface area and can also improve the stability of the coupling.

Hereinafter, the present application will be described in detail with reference to the accompanying drawings.

2 and 3, the present invention mainly includes a heat sink block 30, a lead frame 40, a chip 50, and a heat conductive mount 51, and the member is made of resin or silicone resin. Sealing (not shown) completes the light emitting diode. The heat sink block 30 is made of copper, silicon, aluminum, molybdenum, aluminum oxide, aluminum nitride, beryllium, or a mixture thereof and a thermally conductive material thereof, or a composite of copper-molybdenum and copper-tungsten. It can also manufacture. The heat sink block 30 is provided with a mount cup 31 protruding upward from the center of the heat sink block 30, and the mount cup 31 is disposed by coupling the heat conduction mount 51 (optionally provided) with the chip 50.

The lead frame 40 is made by arranging the first surveill 41, the second surveill 43, and the third surveill 45 in a state where the lead frame 40 is assembled to a joining base 47 molded of a resin material. . As shown in FIG. 6, the structures of the first surveill 41 and the second surveill 43 are the same and include two pins. The upper part is provided with round parts 42 and 44 connecting the two pins, and are provided so as to face the round parts 42 and 44 of the first surveill 41 and the second surveill 43. The central through hole 46 of the third surveil 45 is arranged between the round portions 42 and 44, and is arranged in the mold, and the third surveil 45 and the first surveill 41 or the second surveil are arranged. The lead 43 (either one) is connected. At this time, the connection portion can be arbitrarily determined. When a plurality of protrusions are formed on the mold to form a resin material, the lead frame 40 having the joining base 47 is completed, and the joining base 47 has subleads 41, 43, and 45. ) Is provided with a plurality of holes exposed.

As shown in Figs. 4 and 5, when the heat sink block 30 is charged from the bottom up, the mount cup 31 is passed through the through hole 46 of the third surveill 45. The chip 50 installed in the mount cup 31 is connected to the first surveill 41 and the second surveill 43 or the third surveil 45 through holes formed in the coupling base 47 by wires. Then, the heat sink block 30, the lead frame 40, the chip 50, and the wire are sealed together (not shown) with a resin or silicone resin to complete the manufacture of the light emitting diode. When this is coupled to the circuit board 60, not only the first subsurface 41 and the second subsurface 43 are coupled to both sides, but also the stability of the coupling is achieved by the third subsurface 45 on both front and rear sides thereof. Strengthen. When the third substrate 45 is coupled to the circuit board 60, the third substrate 45 may be directly welded through the circuit board 60 or welded to the surface of the circuit board 60. In addition, the end portion may be bent after passing through the circuit board 60. 7, 8 and 9 illustrate this.

When the solid semiconductor light emitting device of the present invention is used with electricity, heat generated from the chip 50 and the wire is released through the heat conduction mount 51 and the heat sink block 30, as shown in FIG. Likewise, by providing the projections 32 forming a multi-concentric circle at the bottom of the heat sink block 30, it is possible to increase the step design of the surface temperature. Further, as shown in FIG. 10, when the radial projection 32 is provided at the bottom of the heat sink block 30 from the center of the circle to the outside, the projection 32 increases the surface temperature step. Through the results, it was found that the heat dissipation effect was also very good.

The device of the present invention has the following practical advantages.

First, it is possible to achieve a function which effectively reduces the constituent members and also has a good heat dissipation effect and similarly does not affect the chip under the electric and thermal non-separation situation.

Secondly, with a plurality of subleads of the leadframe, not only the coupling is more robust, but also the heat dissipation surface area is further increased.

Third, the third surviv in the lead frame can be cut out according to the needs of the user.

1 is an exploded view of a three-dimensional component of a conventional light emitting diode.

2 is a three-dimensional exploded view of an embodiment according to the present invention.

3 is a top view combining the heat sink block and the lead frame according to the present invention.

4 is a cross-sectional view taken along the line A-A of FIG.

5 is a cross-sectional view taken along line B-B of FIG. 3.

6 is a cross-sectional view taken along the line C-C of FIG.

7 is a diagram illustrating an application example in which the embodiment according to the present invention is coupled to a circuit board.

8 is a diagram illustrating another application example in which the embodiment of the present invention is coupled to a circuit board.

9 is a diagram showing another application example in which the embodiment according to the present invention is coupled to a circuit board.

10 is a bottom view of an embodiment according to the present invention.

11 is a bottom view showing another application example of the embodiment according to the present invention.

<Brief description of the main references in the drawings>

10.Heat sink block 12.Lead frame base 14.Reflector cup

16.LED chip 18.Submount 20.Optical lens

30.Heat sink block 31.Mount cup 32.Protrusion

40..Lead frame 41..1st surv. 42.Round part

43. Second Surveillance 44. Round Part 45. Third Surveillance

46..through 47..combined base 50..chip

51..Heat conduction mount 60..Circuit board

Claims (6)

In the solid semiconductor light emitting device, It is equipped with a heat sink block, and provided with a mount cup protruding from the center to install the chip, The lead frame is provided so as to face two sub-leads with round parts on the upper side, and the sub-leads with through holes are provided between the two round parts, and the sub-leads with the through holes and the round parts are provided. After connecting one of the subleads, insert molding three subleads with a resin material to form a joining base that can be joined through the mount cup of the heat sink block. By connecting the chip with a wire and a lead frame, and coated with a resin or silicone resin, a solid semiconductor light emitting device having a good heat dissipation effect and a solid semiconductor light emitting device capable of improving the stability of the bonding is completed. device. The method of claim 1, And a plurality of holes in which three subleads are exposed on a coupling base of the lead frame. The method of claim 1, Solid semiconductor light emitting device, characterized in that the projection is provided on the bottom surface of the heat sink block. The method of claim 3, wherein Solid projection light emitting device, characterized in that the projection is provided to form a radial. The method of claim 3, wherein The projection portion is a solid semiconductor light emitting device, characterized in that formed to form a plurality of concentric circles. The method of claim 1, And one of the sublead provided with the through hole and the sublead provided with the round part may be connected at an arbitrary site.