KR200339876Y1 - Hologram film using insert inmold - Google Patents
Hologram film using insert inmold Download PDFInfo
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- KR200339876Y1 KR200339876Y1 KR20-2003-0031710U KR20030031710U KR200339876Y1 KR 200339876 Y1 KR200339876 Y1 KR 200339876Y1 KR 20030031710 U KR20030031710 U KR 20030031710U KR 200339876 Y1 KR200339876 Y1 KR 200339876Y1
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- South Korea
- Prior art keywords
- film
- hologram
- hologram film
- resin
- insert
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- 238000000034 method Methods 0.000 claims abstract description 25
- 238000004891 communication Methods 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 239000003086 colorant Substances 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- 238000010884 ion-beam technique Methods 0.000 claims description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000001746 injection moulding Methods 0.000 abstract description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000004381 surface treatment Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000002207 thermal evaporation Methods 0.000 description 2
- -1 acryl Chemical group 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/04—Processes or apparatus for producing holograms
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/26—Processes or apparatus specially adapted to produce multiple sub- holograms or to obtain images from them, e.g. multicolour technique
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
본 고안은 일반 가전 및 통신기기의 사출물이나 케이스 외장에 적용되는 홀로그램 필름에 관한 것으로 제품의 외장을 차별화하기 위해 주로 사용되고 있다. 현재 홀로그램 필름은 전문업체에서 생산하고 있으며, 외장후 가공업체에서 이러한 홀로그램 필름을 구입하여 주로 핫 스템핑(hot stamping) 방법을 사용하여 글자나 문양에 적용하고 있다. 현재 이 핫 스탭핑 방법은 해당 공정이 열에 의한 제약을 받음은 물론 제작과정에 있어서도 불량율이 20∼30%가 넘는 제한적 요소를 갖고 있다. 따라서 본 고안은 이러한 제한적 요인을 극복한 홀로그램 필름의 제작과 이를 이용한 인써트 인몰드(insert inmold)로 홀로그램 사출물을 개발하는 것이다.The present invention relates to a hologram film applied to an injection molding or a case exterior of general home appliances and communication devices, and is mainly used to differentiate the exterior of a product. Currently, holographic film is produced by a professional company, and after the exterior processing company, the holographic film is purchased and applied to a letter or a pattern mainly using a hot stamping method. At present, the hot stepping method is not only limited by heat, but also has a limited factor of more than 20-30% in the manufacturing process. Therefore, the present invention is to manufacture a hologram film that overcomes these limitations and to develop a hologram injection molding with insert inmold using the same.
Description
본 고안은 일반 가전 및 통신기기의 사출물이나 케이스 외장에 적용되는 홀로그램 필름에 관한 것으로, 더욱 상세하게는 내화학성 및 내열성을 향상시키고 핫 스템핑과 인써트 인몰드(Insert inmold) 사출도 가능한 인써트 인몰드용 홀로그램 필름에 관한 것이다.The present invention relates to a hologram film applied to an injection molding or a case exterior of general home appliances and communication devices, and more specifically, for an insert in mold which improves chemical resistance and heat resistance and also enables hot stamping and insert inmold injection. It relates to a hologram film.
도 1a 내지 도 1c는 일반적인 홀로그램 필름의 제조공정 순서도를 나타낸 것이다.Figures 1a to 1c shows a manufacturing process flow chart of a typical hologram film.
먼저, 도 1a와 같이 두께가 12∼125㎛ 정도인 패트(Pet) 필름이나 PC 또는 아크릴 등의 투명한 기판(11)에 500∼1000㎛ 두께의 아크릴계 수지(Resin, 12)를 도포한다.First, as shown in FIG. 1A, an acrylic resin (Resin) 12 having a thickness of 500 to 1000 μm is applied to a PET film having a thickness of about 12 to 125 μm or to a transparent substrate 11 such as PC or acrylic.
이어서, 도 1b와 같이 홀로그램의 효과를 위해서 형상이 새겨진 롤 브러쉬(roll brush)로 수지(12)층 표면을 형상화하는 각인 공정을 실시한다.Subsequently, a stamping step of shaping the surface of the resin 12 layer is performed with a roll brush engraved in shape for the effect of the hologram as shown in FIG. 1B.
마지막으로, 도 1c와 같이 투명한 기판(11) 필름 위에 각인되어 있는 투명한 수지(12)는 홀로그램 효과가 제대로 드러나지 않기 때문에 각인된 수지(12)의 표면을 열 증착방식으로 알루미늄 금속막(13)을 증착하여 완성한다.Lastly, since the transparent resin 12 imprinted on the transparent substrate 11 film as shown in FIG. 1C does not exhibit the hologram effect properly, the surface of the imprinted resin 12 may be thermally deposited on the aluminum metal film 13. Deposition is completed.
상기와 같이 제작된 홀로그램 필름(22)은 도 2에서와 같이, 일반 사출물(21)의 특정 부위(글자나 문양)에 배면 핫 스템핑 방법으로 붙여 그 효과를 내고 있다.The hologram film 22 manufactured as described above is attached to a specific part (letters or patterns) of the general injection-molded product 21 by a back hot stamping method to produce the effect.
그러나 이같이 제작된 종래의 홀로그램 필름(22)은 핫 스템핑 공정에서 20∼30%가 넘는 불량률을 감수하여야 하며 부착성, 내열성, 신뢰성 등에서 열악한 단점을 가지고 있다. 또한 마지막 금속막(13) 증착공정에서 열증착을 사용함으로 인해 수지와 알루미늄의 부착력이 떨어지며 알루미늄의 반사도도 낮아지게 된다. 또한 알루미늄이 갖고 있는 내약품성의 열화로 인한 단점이 지적된다.However, the conventional hologram film 22 manufactured as described above has a defect rate of more than 20 to 30% in a hot stamping process and has poor disadvantages in adhesion, heat resistance, reliability, and the like. In addition, due to the use of thermal evaporation in the final metal film 13 deposition process, the adhesion between the resin and the aluminum is reduced and the reflectivity of the aluminum is also lowered. In addition, the disadvantages due to the degradation of the chemical resistance of aluminum is pointed out.
따라서 이런 홀로그램 필름(22)은 인써트 인몰드에 적용하게 되면 280℃이상의 고온공정에서 다 녹아 없어지게 된다. 따라서 홀로그램이 갖고 있는 장점은 많으나 실제 활용영역을 확장시키는데 그 한계가 있다.Therefore, when the hologram film 22 is applied to the insert in-mold, it will melt away in a high temperature process of 280 ° C. or more. Therefore, there are many advantages of holograms, but there are limitations in extending the practical application area.
상기와 같은 문제점을 해결하기 위해 안출된 본 고안의 목적은 금속층과 수지의 부착력을 향상시킴은 물론 내화학성 및 내열성도 향상시켜 핫 스템핑 뿐만 아니라 인서트 인몰드 사출도 가능한 홀로그램 필름을 제공하는데 있다.An object of the present invention devised to solve the above problems is to provide a hologram film capable of improving the adhesion of the metal layer and the resin, as well as improving the chemical resistance and heat resistance, as well as hot stamping as well as insert in-mold injection.
도 1a 내지 도 1c는 일반적인 홀로그램 필름의 제조공정 순서도1a to 1c is a flow chart of the manufacturing process of a typical hologram film
도 2는 종래의 홀로그램 필름의 사출물 부착방법2 is a method of attaching the injection molding of the conventional hologram film
도 3a 내지 도 3d는 본 고안에 따른 홀로그램 필름 제조공정 순서도Figure 3a to 3d is a flow chart of the holographic film manufacturing process according to the present invention
도 4는 본 고안에 따른 홀로그램 인써트 인몰드 사출물 제조과정4 is a hologram insert in-mold injection molding manufacturing process according to the present invention
도 5는 본 고안에 따른 핸드폰 사출물5 is a mobile phone injection product according to the present invention
〈도면의 주요 부분에 대한 부호의 설명〉<Explanation of symbols for main parts of drawing>
31 : 기판 32 : 수지31 substrate 32 resin
34 : 금속막 41 : 홀로그램 필름34: metal film 41: hologram film
상기와 같은 목적을 달성하기 위한 본 고안의 홀로그램 필름은 투명기판에 수지를 도포하는 제1단계와, 상기 수지의 표면을 형상이 새겨진 롤 브러쉬로 각인하는 제2단계와, 상기 각인된 수지 표면을 처리하는 제3단계, 및 상기 표면처리된 수지 표면에 Ni 금속막을 증착하는 제4단계로 제조된 것을 특징으로 한다.The hologram film of the present invention for achieving the above object has a first step of applying a resin to a transparent substrate, a second step of stamping the surface of the resin with a roll brush engraved in shape, and the imprinted resin surface And a third step of treating, and a fourth step of depositing a Ni metal film on the surface-treated resin surface.
본 발명의 홀로그램 필름은 상기 제4단계 공정 이후에, 디자인에 사용될 부분을 에칭하는 제5단계와, 상기 에칭된 부분에 다른 문양 및 컬러가 필요시 프린터 인쇄하는 제6단계를 더 포함하여 제조된 것을 특징으로 한다.The hologram film of the present invention is manufactured by further comprising a fifth step of etching a portion to be used for design after the fourth step process, and a sixth step of printing a printer when other patterns and colors are required on the etched portion. It is characterized by.
본 발명의 홀로그램 필름은 상기 제6단계 공정 이후에, 인써트 인몰드 사출하는 제7단계를 더 포함하여 휴대폰이나 전자통신제품에 부착하는 것을 특징으로 한다.The hologram film of the present invention may further include a seventh step of insert-in-mold injection after the sixth step process, and attach it to a mobile phone or an electronic communication product.
본 고안의 상기 표면처리는 홀로그램 층의 표면 활성화, 표면 개질 및 표면 세정을 하는데 특징이 있다.The surface treatment of the present invention is characterized by surface activation, surface modification and surface cleaning of the hologram layer.
본 고안의 상기 홀로그램 필름을 디자인이 상품성을 좌지우지하는 여러 전자통신제품의 사출물 제작에 활용하는데 특징이 있다.The hologram film of the present invention is characterized in that the design is utilized in the production of injection molding of various electronic communication products that control the commerciality.
이하, 첨부된 도면을 참조하여 본 고안을 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
도 3a 내지 도 3d는 본 고안의 흘로그램 필름 제조공정 순서를 나타낸 것이다.Figure 3a to 3d shows a flow chart manufacturing process sequence of the present invention.
먼저, 도 3a와 같이 12∼125㎛ 정도의 두께를 갖는 패트(pet) 필름이나 PC 또는 아크릴 등의 투명 기판(31)에 아크릴계 수지(32)를 200∼1500㎛ 정도 두께로 도포한 후, 도 3b와 같이 홀로그램의 효과를 위해 형상이 새겨진 롤 브러쉬(roll brush)로 수지(32) 표면을 각인한다.First, as shown in FIG. 3A, the acrylic resin 32 is applied to the PET film having a thickness of about 12 to 125 μm, a transparent substrate 31 such as a PC, or an acryl, and has a thickness of about 200 to 1500 μm. The surface of the resin 32 is imprinted with a roll brush engraved for the effect of the hologram as shown in 3b.
이어서, 도 3c와 같이 각인된 수지(32) 표면과 금속막의 부착력을 향상시키기 위해 표면처리(33)를 실시한다.Subsequently, the surface treatment 33 is performed to improve the adhesion between the surface of the resin 32 imprinted with the metal film as shown in FIG. 3C.
마지막으로, 도 3d와 같이 각인된 수지(32) 표면에 스퍼터링 방식으로 Ni 금속막(34)을 증착한다.Finally, the Ni metal film 34 is deposited on the surface of the engraved resin 32 as shown in FIG. 3D by sputtering.
본 고안이 종래의 구조와 크게 다른 점은 홀로그램 각인 형성후에 표면처리(33)를 통해 홀로그램 층의 표면 활성화, 표면 개질 및 표면 이물질제거를 위한 세정을 실시하는 것이다. 이로써 금속막(34)과 수지(32)의 부착력을 향상시킴은 물론 내화학성 및 내열성도 향상시켜 핫 스템핑 뿐만 아니라 인써트 인몰드 사출도 가능하도록 하는 것이다.The present invention is significantly different from the conventional structure after the holographic stamping is formed to perform cleaning for surface activation, surface modification and surface foreign matter removal of the hologram layer through the surface treatment 33. This improves the adhesion between the metal film 34 and the resin 32, as well as chemical and heat resistance, thereby enabling not only hot stamping but also insert in-mold injection.
이때 표면처리(33) 공정은 진공도가 3.5mtorr인 진공 챔버내에서 아르곤(Ar) 가스를 400sccm 투입하여 500W의 전력으로 90초간 이온빔 샤워를 조사하여 실시한다.At this time, the surface treatment (33) process is carried out by irradiating an ion beam shower for 90 seconds at a power of 500W by putting 400sccm of argon (Ar) gas in a vacuum chamber having a vacuum degree of 3.5mtorr.
이와 같이 홀로그램 수지층의 표면처리(33)를 완성한 후 동일 진공챔버내에서 연속하여 금속막(34)을 열증착이 아닌 스퍼터링 방법으로 증착한다. 이때 사용되는 금속막(34)은 니켈로 내열성 및 내화학성을 강화하기 위함이며, 공정조건은상기 표면 처리시와 같은 작업진공도에서 DC 마그네트론 케소드(cathod) 5.3Kw로 150초간 증착하여 800Å 두께로 형성한다. 금속막(34)은 Cr 또는 Al을 사용할 수도 있다.After the surface treatment 33 of the hologram resin layer is completed as described above, the metal film 34 is continuously deposited in the same vacuum chamber by the sputtering method rather than thermal deposition. At this time, the metal film 34 used is nickel to enhance the heat resistance and chemical resistance, and the process conditions are 800 Å thick by depositing for 150 seconds with 5.3Kw of DC magnetron cathode (cathod) at the working vacuum degree as the surface treatment. Form. The metal film 34 may use Cr or Al.
도 4는 본 고안에서 제작된 홀로그램 필름을 사용하여 인서트 인몰드 사출물의 제작공정을 나타낸 것이고, 도 5는 휴대폰 사출품을 나타낸 것이다.Figure 4 shows the manufacturing process of the insert in-mold injection molding using the hologram film produced in the present invention, Figure 5 shows a mobile phone injection.
먼저, 홀로그램 효과를 내는 부분을 얻기 위한 공정으로 본 고안에서 제작된 홀로그램 필름(41)을 디자인에 사용될 부분을 베다 인쇄하여 마스킹을 하고 나머지 부분을 에칭공정(41)을 실시한다. 이때 에칭공정(41)은 2단계로 실시하는데 1단계는 금속막인 니켈을 염화제이철을 사용하여 에칭하고, 2단계에서는 가성소다를 사용하여 수지를 에칭한다.First, the hologram film 41 produced in the present invention is cut and printed by masking the part to be used for the design, and the remaining part is subjected to the etching step 41 as a process for obtaining a part that produces the hologram effect. At this time, the etching step 41 is performed in two steps. In the first step, nickel, a metal film, is etched using ferric chloride, and in the second step, the resin is etched using caustic soda.
이어서, 필요에 따라 홀로그램이 에칭된 부분에 다른 문양이 필요로 하거나 아니면 다른 컬러가 필요시 프린터 인쇄공정(42)을 실시한 후, 인써트 인몰드 사출공정(43)을 통해 도 5와 같이 휴대폰이나 전자통신제품에 부착한다. 이러한 공정으로 원하는 홀로그램 사출물을 얻게 되는 것이다.Subsequently, if a different pattern is needed or a different color is required on the portion where the hologram is etched, if necessary, the printer printing process 42 is performed, and then through the insert in-mold injection process 43, a mobile phone or an electronic device as shown in FIG. Attach to communication products. This process yields the desired hologram injection.
종전의 홀로그램 필름은 인써트 인몰드 사출공정(43) 온도인 280∼290℃에서 견딜 수 없으나 본 고안의 홀로그램 필름으로는 가능하다.Conventional hologram film can not withstand the temperature of the insert in-mold injection process (43) 280 ~ 290 ℃, it is possible with the hologram film of the present invention.
상기와 같은 본 고안의 홀로그램 필름은 금속층과 수지의 부착력을 향상시킴은 물론 내화학성 및 내열성도 향상시켜 핫 스템핑 뿐만 아니라 인서트 인몰드 사출도 가능한 장점이 있다. 본 고안은 부품소재에 많이 뒤쳐진 국내의 실정을 감안할 때 더욱 의미가 있으며 또한 고안 제품의 적용이 상품이 가치를 높이는 외장에 채용된다는 점에서 기대된다. 특히 휴대폰이나 가전제품 등의 디자인 주기가 짧은 경우에 있어 인써트 인몰드 사출이나 CNC 가공 등 다양한 공정으로 제작이 가능함으로 시장에서 경쟁력을 가일층 가져오리라 판단된다.The hologram film of the present invention as described above has the advantage of improving the adhesion of the metal layer and the resin, as well as improving the chemical resistance and heat resistance, as well as hot stamping and insert in-mold injection. The present invention is more meaningful considering the domestic situation that lags behind parts and materials, and it is expected that the application of the designed product is adopted in the exterior of which the product adds value. In particular, if the design cycle of mobile phones or home appliances is short, it can be manufactured by various processes such as insert in-mold injection or CNC machining.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2003-0031710U KR200339876Y1 (en) | 2003-10-08 | 2003-10-08 | Hologram film using insert inmold |
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| Application Number | Priority Date | Filing Date | Title |
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| KR20-2003-0031710U KR200339876Y1 (en) | 2003-10-08 | 2003-10-08 | Hologram film using insert inmold |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020030068962A Division KR20050032958A (en) | 2003-10-02 | 2003-10-02 | Hologram film using insert inmold and method for manufacturing thereof |
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| KR200339876Y1 true KR200339876Y1 (en) | 2004-01-28 |
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| KR20-2003-0031710U KR200339876Y1 (en) | 2003-10-08 | 2003-10-08 | Hologram film using insert inmold |
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