KR20030083226A - Wafer alignment apparatua for semiconductor manufacturing equipment - Google Patents
Wafer alignment apparatua for semiconductor manufacturing equipment Download PDFInfo
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- KR20030083226A KR20030083226A KR1020020021673A KR20020021673A KR20030083226A KR 20030083226 A KR20030083226 A KR 20030083226A KR 1020020021673 A KR1020020021673 A KR 1020020021673A KR 20020021673 A KR20020021673 A KR 20020021673A KR 20030083226 A KR20030083226 A KR 20030083226A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
본 발명은 반도체 웨이퍼 처리장치의 웨이퍼 얼라인먼트 장치에 관한 것으로서, 상기 반도체 웨이퍼 처리장치 내로 웨이퍼를 이송하는 반송암의 틀어짐 정도를 확인할 수 있는 장치를 구현하여 웨이퍼 얼라인먼트 정도를 향상시키는 반도체 제조 설비용 웨이퍼 얼라인먼트장치에 관한 것이다.The present invention relates to a wafer alignment apparatus for a semiconductor wafer processing apparatus, and implements a device capable of checking the degree of distortion of a carrier arm for transferring a wafer into the semiconductor wafer processing apparatus, thereby improving wafer alignment. Relates to a device.
반도체 제조 설비에 있어서, 에컨대 에칭장치, 플라즈마 CVD장치, 이온주입장치, 애싱장치, 리소그래피 장치 등에서는 웨이퍼를 진공중에 처리하는 것이 요구되며, 이때, 웨이퍼의 지지수단으로 웨이퍼스테이지가 사용되고 있다.In semiconductor manufacturing equipment, for example, an etching apparatus, a plasma CVD apparatus, an ion implantation apparatus, an ashing apparatus, a lithography apparatus, and the like are required to process a wafer in a vacuum, and at this time, a wafer stage is used as a means for supporting the wafer.
이러한 웨이퍼스테이지에 안착되는 웨이퍼는 반송암에 의해 이송되어져 로딩되는 일련의 작업 공정을 거치게 된다.The wafer seated on the wafer stage goes through a series of work processes that are transported and loaded by the transfer arm.
그러나, 종래에는 상기 반송암의 상태(예컨대, 휨, 스피드감소, 챔버내부의 진공상태 등)에 따라 수㎜에서 수십 ㎜까지 미스 얼라인먼트(Miss Alignment)가 발생하게 되어 상기 웨이퍼스테이지 상에 정확하게 안착되지 못하는 문제점이 발생하고 있으나, 그 미스 얼라인먼트 정도를 단순히 웨이퍼스테이지 상에 안착된 웨이퍼(WF)를 눈대중으로 확인한 후 상기 반송암의 틀어짐을 보정하는 형태로 실시하고 있다.However, in the related art, miss alignment occurs from several mm to several tens of mm depending on the state of the transfer arm (for example, warpage, speed reduction, vacuum in the chamber, etc.), and thus it is not accurately seated on the wafer stage. There is a problem that can not occur, but the misalignment degree is carried out in the form of simply checking the wafer WF seated on the wafer stage by eye mass and correcting the distortion of the carrier arm.
따라서, 종래에는 상기 반송암의 보정 시간이 오래 걸릴 뿐만 아니라 그 보정을 정확하게 실시하기 어렵다는 문제점이 있다.Therefore, conventionally, there is a problem that the correction of the carrier arm takes not only a long time, but also the correction is difficult to accurately perform.
본 발명은 상술한 문제점을 해결하기 위하여 안출 된 것으로서, 본 발명의 목적은 웨이퍼 스테이지 상에 안착되는 웨이퍼의 미스얼라인먼트정도를 측정하여상기 웨이퍼를 이송하는 반송암을 틀어짐 정도를 보다 정확하게 측정함과 아울러 신속하게 보정이 이루어지도록 하는 반도체 제조 설비용 웨이퍼 얼라인먼트 장치를 제공하는 데 있다.The present invention has been made to solve the above problems, an object of the present invention is to measure the degree of misalignment of the wafer seated on the wafer stage to more accurately measure the degree of twisting the carrier arm for transporting the wafer The present invention provides a wafer alignment apparatus for a semiconductor manufacturing facility that allows for quick calibration.
상술한 목적을 달성하기 위하여 본 발명은 반송암에 의해 이송되어진 웨이퍼를 그 상면에 안착시켜 소정의 처리를 실시하도록 하는 웨이퍼스테이지와; 상기 웨이퍼스테이지의 상측에 설치되며 얼라인먼트눈금이 표시된 투명소재로 된 캘리브레이션플레이트과; 상기 캘리브레이션플레이트를 웨이퍼스테이지의 상측에 소정의 높이로 지지하는 복수의 지지수단과; 상기 지지수단에 의해 지지된 원판을 상기 웨이퍼스테이지에 센터를 맞추어 안착시키는 세팅수단을 포함한다.In order to achieve the above object, the present invention includes a wafer stage for mounting a wafer transported by a transfer arm on its upper surface to perform a predetermined process; A calibration plate mounted on the wafer stage and made of a transparent material on which alignment scales are displayed; A plurality of support means for supporting the calibration plate at a predetermined height above the wafer stage; And setting means for seating the disc supported by the support means on a center of the wafer stage.
상기 세팅수단은 상기 웨이퍼스테이지의 원동축을 매개로 상기 웨이퍼스테이지의 중앙부에 마련되는 조작부재와 연결되어 소정의 방향으로 회전하는 원동기어와; 상기 원동기어와 직교된 방향으로 기어 물림된 복수의 종동기어에 의해 회전됨과 아울러 상기 지지수단을 관통하도록 설치되는 복수의 종동축과; 상기 종동축의 일단과 나사 결합되어 상기 종동축의 회전운동에 따라 직선 이동하도록 설치됨과 아울러 그 일단에 상기 웨이퍼스테이지의 내주면 또는 외주면과 밀착되는 밀착판이 결합된 직선이동축을 포함한다.The setting means may include: a driving gear connected to an operation member provided at the center of the wafer stage via a driving shaft of the wafer stage and rotating in a predetermined direction; A plurality of driven shafts which are rotated by a plurality of driven gears which are geared in a direction orthogonal to the prime gear, and are installed to penetrate the support means; It is coupled to one end of the driven shaft and installed to move linearly in accordance with the rotational movement of the driven shaft, and includes a linear moving shaft coupled to the close contact plate in close contact with the inner circumferential surface or the outer circumferential surface of the wafer stage.
상기 얼라인먼트눈금은 소정의 간격을 두고 동심원으로 표시된 것이다.The alignment scale is indicated by concentric circles at predetermined intervals.
상기 캘리브레이션플레이트는 석영 또는 플라스틱으로 된 것이다.The calibration plate is made of quartz or plastic.
상기 지지수단은 그 높이조절이 가능하도록 구성되며 상기 지지수단은 연결부재에 의해 서로 연결된다.The support means is configured to be adjustable in height and the support means are connected to each other by a connecting member.
도 1은 본 발명의 일 실시 예에 의해 반송암틀어짐측정수단이 웨이퍼스테이지 상에 설치된 상태를 도시한 도면,1 is a view showing a state in which the carrier arm twist measuring means is installed on the wafer stage according to an embodiment of the present invention,
도 2는 상기 도 1의 A-A′를 따른 단면도이다.FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. 1.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>
1: 반송암3 : 웨이퍼스테이지1: carrier arm 3: wafer stage
100 : 반송암틀어짐측정수단110 : 지지수단100: conveying arm twist measuring means 110: support means
111 : 홀더113 : 지지축111 holder 113 support shaft
120 : 캘리브레이션플레이트121 : 눈금120: calibration plate 121: scale
150 : 세팅수단151 : 원동축150: setting means 151: circular shaft
152 : 조작부재153 : 원동기어152: operation member 153: prime move gear
155 : 종동기어156 : 종동축155: driven gear 156: driven shaft
157 : 밀착판158 : 직선이동축157: contact plate 158: linear movement axis
이하 첨부된 도면 도 1 및 도 2를 참조로 하여 본 발명의 일 실시 예에 의한 구성 및 작용에 대해서 좀더 자세히 설명한다.Hereinafter, with reference to the accompanying drawings, Figures 1 and 2 will be described in more detail with respect to the configuration and operation according to an embodiment of the present invention.
상기 도면에 도시된 바와 같이 그 상면에 반송암(1)에 의해 이송되어지는 웨이퍼(미도시)가 안착되는 웨이퍼스테이지(3)가 있다.As shown in the figure, there is a wafer stage 3 on which a wafer (not shown) to be transported by the transfer arm 1 is seated.
본 발명은 상기 웨이퍼가 보다 정확한 위치에 안착되도록 하기 위한 것으로서, 상기 반송암(1)의 틀어짐 정도를 보다 쉽고 정확하게 측정하기 위한 수단으로 반송암틀어짐측정수단(100)을 제공한다.The present invention is to allow the wafer to be seated in a more accurate position, to provide a carrier arm distortion measuring means 100 as a means for measuring the degree of distortion of the carrier arm 1 more easily and accurately.
상기 반송암틀어짐측정수단(100)은 도시된 바와 같이 복수의 지지수단(110)을 매개로 상기 웨이퍼스테이지(3)의 상측에 설치되는 캘리브레이션플레이트(120 : CALIBRATION PLATE)와, 상기 지지수단(110)에 의해 지지된 캘리브레이션플레이트(120)를 상기 웨이퍼스테이지(3)의 센터와 맞추어 안착시키는 세팅수단(150)으로 구성된다.The carrier arm twist measuring means 100 is a calibration plate 120 which is installed on the upper side of the wafer stage 3 via a plurality of support means 110 as shown, and the support means 110 It is composed of the setting means 150 for seating the calibration plate 120, which is supported by a) in accordance with the center of the wafer stage (3).
상기 캘리브레이션플레이트(120)는 투명재질 예컨대 석영 또는 투명 플라스틱으로 제조된 원형의 판으로 구성되며, 그 표면에는 소정의 간격 예컨대, 1㎜간격으로 새겨진 동심원의 눈금(121)이 표시되며, 상기 지지수단(110)을 관통시키도록 다수의 관통홀(123)이 형성된다.The calibration plate 120 is composed of a circular plate made of a transparent material such as quartz or transparent plastic, the surface of which is displayed a scale 121 of concentric circles engraved at predetermined intervals, for example, 1 mm intervals, the support means A plurality of through holes 123 are formed to penetrate the 110.
상기 지지수단(110)은 상기 웨이퍼스테이지(3) 상면에 안착되는 홀더(111)와, 상기 홀더(111)의 내부에 상하로 구동 가능하게 설치됨과 아울러 상기 캘리브레이션플레이트(120)와 결합되는 지지축(113)으로 구성되어 그 높이조절이 가능하도록 구성된다.The support means 110 is a holder 111 which is seated on the upper surface of the wafer stage (3), the support shaft which is installed to be driven up and down in the holder 111 and coupled to the calibration plate 120 It is composed of 113 is configured to enable the height adjustment.
이때, 상기 지지축(113)의 구동은 에어실린더와 같이 유압을 이용하여 상하로 구동시키거나 또는 기타 구동모터 및 연결브라켓을 이용하여 상하로 구동되도록 재현할 수 있다.At this time, the driving of the support shaft 113 can be reproduced to be driven up and down using hydraulic pressure, such as an air cylinder, or up and down using other drive motors and connecting brackets.
또는 상기 지지축(113) 및 홀더(111)를 나사 결합시키는 것에 의해 조정이 가능하도록 할 수도 있을 것이다.Alternatively, it may be possible to adjust by screwing the support shaft 113 and the holder 111.
상기 지지축(113)의 사이는 연결부재(116)가 연결되어 일체로 연결되도록 구성된다.Between the support shaft 113 is configured such that the connection member 116 is connected and integrally connected.
상기 세팅수단(150)은 원동축(151)을 매개로 상기 웨이퍼스테이지(3)의 중앙부에 마련되는 조작부재(152)와 연결되어 소정의 방향으로 회전하는 원동기어(153)와, 상기 원동기어(153)와 직교된 방향으로 기어 물림된 복수의 종동기어(155)에 의해 회전됨과 아울러 상기 지지수단(110)의 홀더(111)를 관통하도록 설치되는 복수의 종동축(156)과, 상기 종동축(156)의 일단과 나사 결합되어 상기 종동축(156)의 회전운동에 따라 직선 이동하도록 설치됨과 아울러 그 일단에 상기 웨이퍼스테이지(3)의 내주면 또는 외주면과 밀착되는 밀착판(157)이 결합된 직선 이동축(158)으로 구성된다.The setting means 150 is connected to the operation member 152 provided in the center portion of the wafer stage 3 via the driving shaft 151 to rotate in a predetermined direction and the driving gear 153, the driving gear A plurality of driven shafts 156 rotated by a plurality of driven gears 155 geared in a direction orthogonal to 153 and penetrating the holders 111 of the support means 110, and the longitudinal It is screwed with one end of the coaxial 156 is installed to move linearly in accordance with the rotational movement of the driven shaft 156 and the close contact plate 157 is in close contact with the inner circumferential surface or outer peripheral surface of the wafer stage (3) It consists of the linear movement shaft 158.
상기 종동축(156)의 일단 내부에는 너트부(156a)가 형성되고, 상기 직선이동축(158)의 일단에는 상기 너트부(156a)와 나사 결합되는 볼트부(158a)가 형성된다.A nut part 156a is formed at one end of the driven shaft 156, and a bolt part 158a is screwed to the nut part 156a at one end of the linear moving shaft 158.
도면에서 미설명부호(114,115)는 상기 지지축(113)에 캘리브레이션플레이트(120)를 고정시키는 너트부재를 나타낸다.In the drawings, reference numerals 114 and 115 denote nut members for fixing the calibration plate 120 to the support shaft 113.
다음은 상술한 바와 같이 구성에 의해 반송암(1)의 틀어짐을 측정하는 동작원리에 대해서 설명한다.Next, the operation principle of measuring the twist of the carrier arm 1 by the configuration as described above will be described.
먼저, 캘리브레이션플레이트(120)를 지지하는 지지수단(110)을 웨이퍼스테이지(3)의 상면에 안착시켜 캘리브레이션플레이트(120)를 웨이퍼스테지(3)의 상면으로부터 소정거리 유지하도록 한다.First, the support means 110 for supporting the calibration plate 120 is seated on the top surface of the wafer stage 3 to maintain the calibration plate 120 a predetermined distance from the top surface of the wafer stage 3.
그와 같은 상태에서 캘리브레이션플레이트(120)를 웨이퍼스테이지(3)의 센터에 맞추어 고정시킨다.In such a state, the calibration plate 120 is fixed to the center of the wafer stage 3.
그 고정작업은 조작부재(152)를 소정의 방향으로 회전시킴에 따라 상기 조작부재(152)와 연결된 원동축(151)이 소정의 방향으로 회전하여 원동기어(153)가 회전하고, 상기 원동기어(153)와 기어 결합된 다수의 종동기어(155)가 소정의 방향으로 동시에 회전을 하게 된다.As the fixing operation rotates the operation member 152 in a predetermined direction, the driving shaft 151 connected to the operation member 152 rotates in a predetermined direction, so that the driving gear 153 rotates, and the driving gear is rotated. A plurality of driven gears 155 gear-coupled with 153 rotates simultaneously in a predetermined direction.
그러면, 상기 종동축(156)에 나사 결합된 복수의 직선이동축(158)이 직선이동을 하게 되어 복수의 밀착판(157)의 위치를 일괄 조절하게 된다.Then, the plurality of linear moving shafts 158 screwed to the driven shaft 156 is linearly moved to collectively adjust the positions of the plurality of contact plates 157.
이때, 상기 밀착판(157)의 이동방향은 상기 조작부재(152)의 회전방향에 의해 결정되게 됨은 물론이다.At this time, the movement direction of the contact plate 157 is of course determined by the rotation direction of the operation member 152.
상술한 바와 같은 원리에 의해 밀착판(157)의 위치를 조절하여 웨이퍼스테이지(3)상에 캘리브레이션플레이트(120)를 적정의 위치로 세팅시킨 다음에는 반송암(1)을 상기 캘리브레이션플레이트(120)의 하부로 삽입시킨다.According to the principle described above, after adjusting the position of the adhesion plate 157 to set the calibration plate 120 on the wafer stage 3 to an appropriate position, the carrier arm 1 is mounted on the calibration plate 120. Insert it to the bottom of.
이때, 상기 캘리브레이션플레이트(120)는 투명재질로 제작됨과 아울러 그 상면에 눈금(121)이 표시되어 상기 반송암(1)의 위치를 작업자가 눈으로 쉽게 확인하여 그 틀어짐 정도를 쉽게 확인할 수 있다.In this case, the calibration plate 120 is made of a transparent material, and the scale 121 is displayed on the upper surface thereof, so that the operator can easily check the position of the carrier arm 1 by visually confirming the amount of distortion.
상술한 바와 같이 본 발명은 웨이퍼가 안착되는 웨이퍼스테이지상에 웨이퍼의 틀어짐 정도를 측정하는 반송암틀어짐측정수단을 설치하여 웨이퍼의 틀어짐을 눈대중이 아닌 정확한 수치로 측정 가능하게 하여 보정을 보다 정확하게 함과 아울러 보정 작업을 보다 신속하게 행할 수 있는 이점을 갖는다.As described above, the present invention provides a carrier arm distortion measuring means for measuring the degree of warpage of the wafer on the wafer stage on which the wafer is seated so that the warpage of the wafer can be measured with an accurate value instead of the eye mass. In addition, there is an advantage that the correction operation can be performed more quickly.
이와 같이, 본 발명의 상세한 설명에서는 구체적인 실시 예에 관해 설명하였으나, 본 발명의 범주에서 벗어나지 않는 한도 내에서 여러 가지 변형이 가능함은 물론이다. 그러므로, 본 발명의 범위는 설명된 실시 예에 국한되어 정해져서는 안되며 후술하는 특허청구범위 뿐만 아니라 이 특허청구범위와 균등한 것들에 의해 정해져야 한다.As described above, in the detailed description of the present invention, specific embodiments have been described. However, various modifications may be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the claims below and equivalents thereof.
Claims (6)
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020020021673A KR20030083226A (en) | 2002-04-19 | 2002-04-19 | Wafer alignment apparatua for semiconductor manufacturing equipment |
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| KR1020020021673A KR20030083226A (en) | 2002-04-19 | 2002-04-19 | Wafer alignment apparatua for semiconductor manufacturing equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101225263B1 (en) * | 2011-06-28 | 2013-01-22 | 현대제철 주식회사 | Guide device for centering filament of electron probe micro analyzer and the apparatus having the same |
| CN103192463A (en) * | 2012-01-05 | 2013-07-10 | 沈阳新松机器人自动化股份有限公司 | Transparent clamping type pre-alignment machine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990076333A (en) * | 1998-03-31 | 1999-10-15 | 윤종용 | Horizontal measuring device of semiconductor inspection equipment |
| US6138494A (en) * | 1999-07-02 | 2000-10-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Robot calibration tool and method |
| US6237393B1 (en) * | 1999-07-30 | 2001-05-29 | International Business Machines Corporation | Wafer center alignment device and method of wafer alignment |
| KR20010087405A (en) * | 1999-10-29 | 2001-09-15 | 조셉 제이. 스위니 | Device for testing wafer-transporting robot |
| KR20020025786A (en) * | 2000-09-29 | 2002-04-04 | 나까무라 쇼오 | Calibration Device for Semiconductor Testing Apparatus, Calibration Method and Semiconductor Testing Apparatus |
-
2002
- 2002-04-19 KR KR1020020021673A patent/KR20030083226A/en not_active Application Discontinuation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990076333A (en) * | 1998-03-31 | 1999-10-15 | 윤종용 | Horizontal measuring device of semiconductor inspection equipment |
| US6138494A (en) * | 1999-07-02 | 2000-10-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Robot calibration tool and method |
| US6237393B1 (en) * | 1999-07-30 | 2001-05-29 | International Business Machines Corporation | Wafer center alignment device and method of wafer alignment |
| KR20010087405A (en) * | 1999-10-29 | 2001-09-15 | 조셉 제이. 스위니 | Device for testing wafer-transporting robot |
| KR20020025786A (en) * | 2000-09-29 | 2002-04-04 | 나까무라 쇼오 | Calibration Device for Semiconductor Testing Apparatus, Calibration Method and Semiconductor Testing Apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101225263B1 (en) * | 2011-06-28 | 2013-01-22 | 현대제철 주식회사 | Guide device for centering filament of electron probe micro analyzer and the apparatus having the same |
| CN103192463A (en) * | 2012-01-05 | 2013-07-10 | 沈阳新松机器人自动化股份有限公司 | Transparent clamping type pre-alignment machine |
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