CN103192463A - Transparent clamping type pre-alignment machine - Google Patents
Transparent clamping type pre-alignment machine Download PDFInfo
- Publication number
- CN103192463A CN103192463A CN2012100022961A CN201210002296A CN103192463A CN 103192463 A CN103192463 A CN 103192463A CN 2012100022961 A CN2012100022961 A CN 2012100022961A CN 201210002296 A CN201210002296 A CN 201210002296A CN 103192463 A CN103192463 A CN 103192463A
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- China
- Prior art keywords
- claw
- wafer
- clipping
- printing opacity
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A transparent clamping type pre-alignment machine comprises an engine base, a jack catch mounted on the engine base and a sensor for detecting a notch on a wafer, wherein the jack catch comprises at least two jack catch contact units, at least two jack catch arms and at least two connecting parts connected with the jack catch contact units and the jack catch arms; the jack catch contact units are used for clamping the wafer; the jack catch arms are used for supporting the wafer; the connecting parts are made of a transparent material; the sensor comprises a light transmitting terminal and a light receiving terminal; the light transmitting terminal is used for transmitting lights for detecting the notch of the wafer; the connecting parts are clamped between the light transmitting terminal and the light receiving terminal; and when the notch is positioned above the connecting parts, the sensor can detect out the position of the notch. Compared with the prior art, the transparent clamping type pre-alignment machine can avoid the problem that the wafer needs to be re-clamped, which is caused by the fact that the jack catch of the pre-alignment machine can shield the notch of the wafer and light of the sensor.
Description
Technical field
The present invention relates to a kind of prealignment machine of identifying notched wafer (side cut) and the center of circle, refer to the clipping prealignment machine of a kind of printing opacity especially.
Background technology
The clipping prealignment machine in existing edge (aligner) mostly is jack catchs type greatly, and common have two pawl formulas, three-pawl type and a four-jaw type.The sensor that is used for detecting notched wafer mostly is transmission sensors (for example LED or laser through mode sensor).When claw clamping wafer, the pawl arm of any one pawl all might shelter from notched wafer.Like this, when notched wafer rotates light position to sensor emission, can can't be identified because of blocking of claw pawl arm.Existing patent has been mentioned the method for avoiding the terminal osculating element of claw to block notched wafer mostly, for example the end of each pawl is arranged two osculating elements at least, and its spacing is greater than the notched wafer size, and do not mention claw pawl arm to the direct solution of blocking of sensor light.The solution that these patents are taked is that wafer is rotated a circle mostly, see sensor signal has no change or signal to change whether meet the requirements to judge whether notched wafer is blocked by claw pawl arm, if be blocked, then put down wafer, treat claw rotate to an angle after more again the clamping wafer continue to detect.Can make control program more complicated like this, and reduce the efficient of prealignment.
Summary of the invention
In view of above content, be necessary to provide a kind of printing opacity clipping prealignment machine, can avoid because prealignment machine claw blocks the problem of the wafer of clamping again of notched wafer and sensor light tape.
The clipping prealignment machine of a kind of printing opacity, the clipping prealignment machine of described printing opacity comprises a support, one is installed in the sensor that claw and on the described support detects the breach on the described wafer, described claw comprises at least two claw osculating elements, at least two claw arms and at least two connecting portions that are connected with described claw arm with described claw osculating element, the described wafer of described claw osculating element clamping, described claw arm supports described wafer, described connecting portion is that light transmissive material is made, described sensor comprises a light emission end and a light receiving terminal, and described light emission end emission light is to detect described gap position.
Relative prior art, in the preferred embodiments of the clipping prealignment machine of printing opacity of the present invention, light transmissive material adopts lucite, and adopt welding manner or be threaded etc. is connected with other parts; And sensor adopts emission light can see through the through mode laser sensor of described lucite, and can the faint variation of optical signal be compensated.Needn't worry that notched wafer and sensor emission light are sheltered from by claw pawl arm, also needn't do any adjustment and come clamping wafer again, simplify control program, and can effectively improve the efficient of prealignment.Can avoid because prealignment machine claw blocks the problem of the wafer of clamping again of notched wafer and sensor light tape.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of the clipping prealignment machine of printing opacity of the present invention preferred embodiments.
Fig. 2 is the stereogram of the claw among Fig. 1.
Fig. 3 is the enlarged drawing of the A among Fig. 1.
The main element symbol description
Bracketing 3
Light emission end 5
Light 6
Claw osculating element 8
Connecting portion 9
Wafer 12
The specific embodiment
See also Fig. 1-3, the clipping prealignment machine of printing opacity of the present invention preferred embodiments is used for the clamping crystal round fringes and identifies notched wafer (side cut) and the center of circle.The clipping prealignment machine of described printing opacity comprises that a support 1, is installed in claw 2, on the described support 1 and is located at bracketing 3 and a sensor 4 relative with described bracketing 3 on the described support 1.Described claw 2, described bracketing 3, described sensor 4 are located at the same one side of described support 1.
Please continue to consult Fig. 2, described support 1 is a cube.Described claw 2 is installed on the described support 1, and described claw 2 comprises at least two dried claw osculating elements 8, at least two connecting portions 9, at least two claw arms 10 and a claw rotating shaft 11.It is one hook-shaped that described claw osculating element 8 is, in order to clamping one wafer 12.Described connecting portion 9 is a small cubes shape, adopts light transmissive material to make, and connects described claw osculating element 8 and described claw arm 10.Described claw arm 10 is strip, and some claw arms 10 are connected in the described claw rotating shaft 11.Described claw rotating shaft 11 is cylindric, and described claw 2 is installed on the described support 1.Wherein, light transmissive material adopts lucite, and adopt welding manner or be threaded etc. is connected with described claw arm 10 with described claw osculating element 8.The plane at the bearing of trend of described claw rotating shaft 11 and described claw arm 10 places is perpendicular.In this preferred embodiment, described claw 2 has three claw arms 10.
See also Fig. 1, Fig. 3, described bracketing 3 contiguous described claws 2 arrange, in order to the described wafer 12 of bracketing.Described bracketing 3 is bending, has the connecting portion that is connected with described support 1 and in order to support the support portion of described wafer 12.Described sensor 4 is down L shaped shape, and described sensor 4 is installed in the next door of described claw 2, makes that described sensor 4 can detect the breach 13 on the described wafer 12 when the described wafer 12 of described claw 2 drives rotates.When described claw arm 10 just forwarded the position of described sensor 4 to, described claw osculating element 8 and described connecting portion 9 just were positioned at the below of described sensor 4.Described sensor 4 comprises a light emission end 5 and a light receiving terminal 7.Described light emission end 5 is located at the below, top of described sensor 4, and in order to launch light on described support 1, described light receiving terminal 7 is located on the described support 1 relative with described sensor 4 tops.Described light emission end 5 is to described light receiving terminal 7 emission light 6, because described connecting portion 9 is a small cubes shape, the employing light transmissive material is made, even described connecting portion 9 just is positioned at the below of described sensor 4, still can detect the breach 13 of described wafer 12.
On the bracketing 3, described claw 2 rose along described claw rotating shaft 11 as described in the wafer 12 of breach 13 was placed on as described in one wafer transfer device (as manipulator) will have, and described wafer 12 was held up make plane, described wafer 12 place be higher than described bracketing 3.The described wafer 12 of described claw 2 clampings also rotates a circle around described claw rotating shaft 11, by described sensor 4 (as the Nonopaque type sensor), detects breach 13 positions of described wafer 12.
Drive described wafer 12 rotations by described claw 2, make the breach 13 of described wafer 12 aim at preset direction, described claw 2 unclamps described wafer 12 and descends, and described wafer 12 is dropped on the described bracketing 3, by the wafer transfer device described wafer 12 is taken away.If a claw arm 10 of described claw 2 just is in breach 13 belows of described wafer 12, described claw 2 drives described wafer 12 rotations, when the breach 13 of described wafer 12 passes through the light 6 of described sensor 4 emissions, because the appropriate section on the described claw arm 10 is replaced by light transmissive material, and can not block described light 6.
In addition, enforcement of the present invention is not limited only to this example, also can described claw osculating element 8 and described claw arm 10 also be replaced to light transmissive material according to the different application situation.Light transmissive material can be selected lucite (PMMA, polymethyl methacrylate) for use, by related data as can be known, when the thickness of light transmissive material during at 6-15mm, its light transmittance can reach 90%-92%, and its intensity is higher, for the 7-18 of simple glass doubly, can satisfy the requirement of holding sheet.
In the preferred embodiments of the clipping prealignment machine of printing opacity of the present invention, described claw 2 drives described wafer 12 rotations, makes described sensor 4 detect the position at breach 13 places on the described wafer 12.In the middle of described connecting portion 9 was clipped in described light emission end 5, described light receiving terminal 7, when described breach 13 was positioned at described connecting portion 9 tops, because described connecting portion 9 is made by light transmissive material, described sensor 4 can detect the position at described breach 13 places.Can avoid because prealignment machine claw blocks the problem of the wafer of clamping again of notched wafer and sensor light tape.
In the preferred embodiments of the clipping prealignment machine of printing opacity of the present invention, light transmissive material adopts lucite, and adopt welding manner or be threaded etc. is connected with other parts; And sensor adopts emission light can see through the through mode laser sensor of described lucite, and can the faint variation of optical signal be compensated.Needn't worry that notched wafer and sensor emission light are sheltered from by claw pawl arm, also needn't do any adjustment and come clamping wafer again, simplify control program, and can effectively improve the efficient of prealignment.
Claims (10)
1. clipping prealignment machine of printing opacity, the clipping prealignment machine of described printing opacity comprises a support, one is installed in the sensor that claw and on the described support detects the breach on the described wafer, it is characterized in that: described claw comprises at least two claw osculating elements, at least two claw arms and at least two connecting portions that are connected with described claw arm with described claw osculating element, the described wafer of described claw osculating element clamping, described claw arm supports described wafer, described connecting portion is that light transmissive material is made, described sensor comprises a light emission end and a light receiving terminal, and described light emission end emission light is to detect described gap position.
2. the clipping prealignment machine of printing opacity as claimed in claim 1, it is characterized in that: described light transmissive material is pmma material.
3. the clipping prealignment machine of printing opacity as claimed in claim 2 is characterized in that: described sensor is one can see through the through mode laser sensor of lucite, and can the faint variation of optical signal be compensated.
4. the clipping prealignment machine of printing opacity as claimed in claim 1 is characterized in that: described connecting portion is with welding manner or be threaded and be connected with described claw osculating element, described claw arm.
5. the clipping prealignment machine of printing opacity as claimed in claim 1, it is characterized in that: described claw osculating element is made by light transmissive material.
6. the clipping prealignment machine of printing opacity as claimed in claim 1, it is characterized in that: described claw arm is made by light transmissive material.
7. the clipping prealignment machine of printing opacity as claimed in claim 1, it is characterized in that: the clipping prealignment machine of described printing opacity also comprises one in order to support the bracketing of described wafer, described claw drives described wafer rotation, make the notch alignment preset direction of described wafer, described claw unclamps described wafer and descends, and described wafer is dropped on the described bracketing.
8. the clipping prealignment machine of printing opacity as claimed in claim 7, it is characterized in that: described claw also comprises a claw rotating shaft, described claw rotating shaft is connected with described claw arm, and described claw is installed on the described support, described claw rises along described claw rotating shaft, described wafer held up make plane, described wafer place be higher than described bracketing, the described wafer of described claw clamping also rotates a circle around described claw rotating shaft, is detected the breach position of described wafer by described sensor.
9. the clipping prealignment machine of printing opacity as claimed in claim 1 is characterized in that: described claw osculating element is one hook-shaped, in order to the described wafer of clamping.
10. the clipping prealignment machine of printing opacity as claimed in claim 1, it is characterized in that: described claw comprises three claw osculating elements, three claw arms and three connecting portions that are connected with described claw arm with described claw osculating element.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100022961A CN103192463A (en) | 2012-01-05 | 2012-01-05 | Transparent clamping type pre-alignment machine |
| PCT/CN2012/078863 WO2013102351A1 (en) | 2012-01-05 | 2012-07-19 | Transparent and clamped pre-alignment machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100022961A CN103192463A (en) | 2012-01-05 | 2012-01-05 | Transparent clamping type pre-alignment machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103192463A true CN103192463A (en) | 2013-07-10 |
Family
ID=48715368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100022961A Pending CN103192463A (en) | 2012-01-05 | 2012-01-05 | Transparent clamping type pre-alignment machine |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103192463A (en) |
| WO (1) | WO2013102351A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106574900A (en) * | 2014-07-29 | 2017-04-19 | Lg矽得荣株式会社 | Defect measuring device for wafers |
| CN112051708A (en) * | 2020-09-15 | 2020-12-08 | 青岛天仁微纳科技有限责任公司 | Centering feeding device and nano-imprinting equipment |
| CN112635350A (en) * | 2019-09-24 | 2021-04-09 | 沈阳新松机器人自动化股份有限公司 | Clamping type wafer calibration device and calibration method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000164675A (en) * | 1998-11-25 | 2000-06-16 | Mecs Corp | Notch matching machine |
| JP2003163258A (en) * | 2001-09-14 | 2003-06-06 | Assist Japan Kk | Aligner device of wafer |
| KR20030083226A (en) * | 2002-04-19 | 2003-10-30 | 삼성전자주식회사 | Wafer alignment apparatua for semiconductor manufacturing equipment |
| CN1499602A (en) * | 2002-10-24 | 2004-05-26 | �յÿ���ʽ���� | Collimator |
| JP2006222190A (en) * | 2005-02-09 | 2006-08-24 | Yaskawa Electric Corp | Wafer aligner |
| CN101479829A (en) * | 2005-07-11 | 2009-07-08 | 布鲁克斯自动化公司 | High speed substrate aligner apparatus |
| CN101777509A (en) * | 2009-01-08 | 2010-07-14 | 日东电工株式会社 | Alignment apparatus for semiconductor wafer |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3245833B2 (en) * | 1999-07-08 | 2002-01-15 | 日本エー・エス・エム株式会社 | Semiconductor substrate aligner apparatus and method |
| DE29921553U1 (en) * | 1999-12-07 | 2000-03-30 | Krassow, Heiko, Dr.-Ing., 85055 Ingolstadt | Apparatus for applying plastic structures to semiconductor wafers |
| JP2004363218A (en) * | 2003-06-03 | 2004-12-24 | Yaskawa Electric Corp | Pre-aligner equipment |
| JP2005101040A (en) * | 2003-09-22 | 2005-04-14 | Jel:Kk | Aligner apparatus |
| US7891936B2 (en) * | 2005-03-30 | 2011-02-22 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
| CN101493657B (en) * | 2009-02-27 | 2011-03-30 | 上海微电子装备有限公司 | Mask plate positioning device |
-
2012
- 2012-01-05 CN CN2012100022961A patent/CN103192463A/en active Pending
- 2012-07-19 WO PCT/CN2012/078863 patent/WO2013102351A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000164675A (en) * | 1998-11-25 | 2000-06-16 | Mecs Corp | Notch matching machine |
| JP2003163258A (en) * | 2001-09-14 | 2003-06-06 | Assist Japan Kk | Aligner device of wafer |
| KR20030083226A (en) * | 2002-04-19 | 2003-10-30 | 삼성전자주식회사 | Wafer alignment apparatua for semiconductor manufacturing equipment |
| CN1499602A (en) * | 2002-10-24 | 2004-05-26 | �յÿ���ʽ���� | Collimator |
| JP2006222190A (en) * | 2005-02-09 | 2006-08-24 | Yaskawa Electric Corp | Wafer aligner |
| CN101479829A (en) * | 2005-07-11 | 2009-07-08 | 布鲁克斯自动化公司 | High speed substrate aligner apparatus |
| CN101777509A (en) * | 2009-01-08 | 2010-07-14 | 日东电工株式会社 | Alignment apparatus for semiconductor wafer |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106574900A (en) * | 2014-07-29 | 2017-04-19 | Lg矽得荣株式会社 | Defect measuring device for wafers |
| US10255669B2 (en) | 2014-07-29 | 2019-04-09 | Sk Siltron Co., Ltd. | Defect measuring device for wafers |
| CN106574900B (en) * | 2014-07-29 | 2019-07-09 | 爱思开矽得荣株式会社 | The defectoscopy device of chip |
| CN112635350A (en) * | 2019-09-24 | 2021-04-09 | 沈阳新松机器人自动化股份有限公司 | Clamping type wafer calibration device and calibration method |
| CN112635350B (en) * | 2019-09-24 | 2024-05-24 | 沈阳新松半导体设备有限公司 | Clamping type wafer calibration device and calibration method |
| CN112051708A (en) * | 2020-09-15 | 2020-12-08 | 青岛天仁微纳科技有限责任公司 | Centering feeding device and nano-imprinting equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013102351A1 (en) | 2013-07-11 |
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Application publication date: 20130710 |