KR20030050304A - Molding apparatus for semiconductor package - Google Patents

Molding apparatus for semiconductor package Download PDF

Info

Publication number
KR20030050304A
KR20030050304A KR1020010080717A KR20010080717A KR20030050304A KR 20030050304 A KR20030050304 A KR 20030050304A KR 1020010080717 A KR1020010080717 A KR 1020010080717A KR 20010080717 A KR20010080717 A KR 20010080717A KR 20030050304 A KR20030050304 A KR 20030050304A
Authority
KR
South Korea
Prior art keywords
semiconductor package
molding apparatus
ejectors
ejector
package
Prior art date
Application number
KR1020010080717A
Other languages
Korean (ko)
Inventor
이상국
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020010080717A priority Critical patent/KR20030050304A/en
Publication of KR20030050304A publication Critical patent/KR20030050304A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds

Abstract

PURPOSE: A molding apparatus for a semiconductor package is provided to prevent the transformation of the appearance of the semiconductor package and a warpage of the package by sequentially increasing a plurality of ejectors so that uniform force is applied to the lower surface of the package. CONSTITUTION: The molding apparatus(200) includes an upper molding die(201a) and a lower molding die(201b) that mold a package body(215) of the semiconductor package(210). A through hole(220) penetrates the lower molding die. The plurality of ejectors(230a,230b) ascend/descend from/to the bottom surface through the through hole. A control unit(240) controls an ascent or a descent of the ejector.

Description

반도체 패키지용 성형 장치{Molding apparatus for semiconductor package}Molding apparatus for semiconductor package

본 발명은 반도체 패키지용 성형 장치에 대한 것으로, 더욱 상세하게는 상이한 높이와 속도를 갖고 상승하는 이젝터(ejector)가 구비된 반도체 패키지용 성형 장치에 대한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding apparatus for a semiconductor package, and more particularly, to a molding apparatus for a semiconductor package having an ejector (ejector) rising at different heights and speeds.

반도체 패키지의 제조 공정은 패브리케이션(fabrication), 조립, 패키지 몸체 형성 공정 등으로 구성된다. 반도체 칩은 패브리케이션 공정을 통해 미세 회로가 형성되고, 조립 공정을 통해 리드 프레임, 와이어 등과 같은 전기적 연결 수단과 결합되어 외부 장치와의 전기적 연결이 가능해진다. 반도체 칩과 리드 프레임 및 와이어는, 에폭시 몰딩 수지(epoxy molding compound; EMC)와 같은 플라스틱 성형 수지로 구비된 패키지 몸체에 의해 봉지됨으로써, 물리적 충격, 습기, 오염 등의 외부 환경으로부터 보호되며, 동시에 각 구성 요소들의 결합 상태가 안정적으로 유지된다. 이와 같은 반도체 패키지의 패키지 몸체는 반도체 패키지용 성형 장치에 의해 형성될 수 있다.The manufacturing process of the semiconductor package is composed of fabrication, assembly, package body forming process and the like. In the semiconductor chip, a microcircuit is formed through a fabrication process, and the semiconductor chip is combined with an electrical connection means such as a lead frame or a wire through an assembly process to enable electrical connection with an external device. The semiconductor chip, lead frame and wire are encapsulated by a package body made of a plastic molding resin such as an epoxy molding compound (EMC), thereby protecting them from external environments such as physical shock, moisture, and contamination. The coupling state of the components is kept stable. The package body of such a semiconductor package may be formed by a molding apparatus for a semiconductor package.

이하, 도면을 참조하여 종래 기술에 따른 반도체 패키지용 성형 장치를 설명하겠다.Hereinafter, a molding apparatus for a semiconductor package according to the prior art will be described with reference to the drawings.

도 1은 종래 기술에 따른 반도체 패키지용 성형 장치의 단면도이다.1 is a cross-sectional view of a molding apparatus for a semiconductor package according to the prior art.

종래 기술에 따른 반도체 패키지용 성형 장치(100)는, 상부 금형(101a)과 하부 금형(101b)으로 구비되는 성형 금형을 포함하며, 상부 금형(101a)과 하부 금형(100b)은 포개어져 결합된다.The molding apparatus 100 for a semiconductor package according to the prior art includes a molding die provided with an upper mold 101a and a lower mold 101b, and the upper mold 101a and the lower mold 100b are stacked and coupled to each other. .

상부 금형(101a)과 하부 금형(101b) 내부에는 캐비티(103a, 103b)가 형성되어 반도체 패키지(110)의 패키지 몸체(115)의 형상을 결정한다. 특히 하부 금형(101b)에는 캐비티(103b)와 외부로 관통되는 관통홀(120)이 형성되며, 관통홀(120)에는 상승 또는 하강이 가능한 이젝터(130)가 구비된다.Cavities 103a and 103b are formed in the upper mold 101a and the lower mold 101b to determine the shape of the package body 115 of the semiconductor package 110. In particular, the lower mold 101b is formed with a cavity 103b and a through hole 120 that penetrates to the outside, and the through hole 120 is provided with an ejector 130 that can be raised or lowered.

반도체 패키지(110)는 상부 금형(101a)과 하부 금형(101b) 사이에 개재되고,상부, 하부 금형(101a, 101b)이 서로 포개짐으로써 고정된다. 결합된 상부 금형(101a)과 하부 금형(101b)에 주입된 성형 수지가 캐비티(103a, 103b)에 주입되어 경화되면, 캐비티(103a, 103b)의 형상과 동일한 패키지 몸체(140)가 형성된다. 경화가 완료되면, 이젝터(130)가 상승되고, 상승된 이젝터(130)는 패키지 몸체(115)의 하부를 밀어올림으로써 반도체 패키지(110)를 하부 금형(101b)으로부터 이형시킨다.The semiconductor package 110 is interposed between the upper mold 101a and the lower mold 101b, and the upper and lower molds 101a and 101b are fixed by being superimposed on each other. When the molding resin injected into the combined upper mold 101a and the lower mold 101b is injected into the cavities 103a and 103b and cured, a package body 140 having the same shape as the cavities 103a and 103b is formed. When curing is completed, the ejector 130 is raised, and the raised ejector 130 releases the semiconductor package 110 from the lower mold 101b by pushing up the lower portion of the package body 115.

그러나 종래 기술에 따른 반도체 패키지용 성형 장치(100)의 이젝터(130)는 반도체 패키지(110)의 하부면의 양끝을 밀어올림으로써 반도체 패키지(110)를 이형시키므로, 패키지 몸체(110) 하부면의 중앙 부분은 하부 금형(101b)간의 접착력이 증가될수록 이형이 어려워지는 문제가 발생한다. 더불어 반도체 패키지(110)가 경박 단소화에 따라 감소되는 기계적 신뢰도를 보완하기 위해 성형 수지에 경도를 증가시키는 성분을 추가함에 따라, 하부 금형(101b)과의 접착력 또한 증가되어 반도체 패키지(110)의 이형은 더욱 어려워진다.However, since the ejector 130 of the molding apparatus 100 for a semiconductor package according to the related art releases the semiconductor package 110 by pushing both ends of the bottom surface of the semiconductor package 110, the ejector 130 of the package body 110 may be removed. In the central part, as the adhesive force between the lower molds 101b increases, the problem of the release becomes more difficult. In addition, as the semiconductor package 110 adds a component that increases the hardness to the molding resin to compensate for the mechanical reliability that decreases as the thickness is reduced, the adhesive force with the lower mold 101b is also increased to increase the adhesion of the semiconductor package 110. Deformation becomes more difficult.

이와 같이 반도체 패키지의 이형이 어려워질수록 반도체 패키지 외관이 변형되는 문제가 발생될 뿐 아니라, 이형 시 발생되는 반도체 패키지의 휨 현상에 의해 내부에 구비된 반도체 칩에 크랙이 발생되는 등과 같은 손상 우려가 초래될 수 있다.As the mold release of the semiconductor package becomes more difficult, not only the appearance of the semiconductor package is deformed, but also the damage such as cracking in the semiconductor chip provided by the bending of the semiconductor package generated during the release may occur. May result.

본 발명의 목적은 반도체 패키지와 성형 금형 간의 이형이 용이한 반도체 패키지용 성형 장치를 제공하는데 있다.An object of the present invention is to provide a molding apparatus for a semiconductor package that is easy to release between the semiconductor package and the molding die.

도 1은 종래 기술에 따른 반도체 패키지용 성형 장치의 단면도,1 is a cross-sectional view of a molding apparatus for a semiconductor package according to the prior art,

도 2a는 본 발명에 따른 반도체 패키지용 성형 장치의 단면도,2A is a cross-sectional view of a molding apparatus for a semiconductor package according to the present invention;

도 2b는 본 발명에 따른 반도체 패키지용 성형 장치의 하부 금형의 상부도이다.2B is a top view of the lower mold of the molding apparatus for semiconductor package according to the present invention.

* 도면의 주요 부분에 대한 설명 *Description of the main parts of the drawing

100, 200 : 성형 장치101a, 201a : 상부 금형100, 200: molding apparatus 101a, 201a: upper mold

101b, 201b : 하부 금형110, 210 : 반도체 패키지101b and 201b: lower mold 110 and 210: semiconductor package

115, 215 : 패키지 몸체117, 217 : 리드 프레임115, 215: package body 117, 217: lead frame

120, 220 : 관통홀130, 230a, 230b, 230 : 이젝터120, 220: through hole 130, 230a, 230b, 230: ejector

240 : 제어 장치240: control unit

상기 목적을 달성하기 위하여, 본 발명에 따른 반도체 패키지의 패키지 몸체를 성형하는 상부 금형과 하부 금형을 포함하는 성형 장치에 있어서, 하부 금형을 관통하는 관통공;과 관통공을 통해 상기 바닥면 상으로 상승 또는 하강되는 복수개의 이젝터; 및 이젝터의 상승 또는 하강을 조절하는 제어 장치;를 포함하는 것을 특징으로 한다.In order to achieve the above object, a molding apparatus comprising an upper mold and a lower mold for molding the package body of the semiconductor package according to the present invention, a through hole penetrating the lower mold; and through the through hole on the bottom surface A plurality of ejectors that are raised or lowered; And a control device for adjusting the rising or falling of the ejector.

여기서, 이젝터들은 중심에서 외측으로 위치될수록 순차적으로 상승 높이가 낮아지는 것과, 외측부터 중심의 순서로 순차적으로 상승되도록 조절되는 것이 바람직하다. 더불어 복수개의 이젝터는 내부 직경이 상이한 링(ring) 형상이며, 내부 직경이 가장 큰 이젝터는 반도체 패키지의 하부면보다 작게 구비되는 것이 바람직하다.Here, the ejectors are preferably adjusted so that the elevation height is sequentially lowered from the center to the outside, and sequentially raised from the outside to the center. In addition, the plurality of ejectors may have a ring shape having different internal diameters, and the ejector having the largest internal diameter may be smaller than the lower surface of the semiconductor package.

이하, 첨부 도면을 참조하여 본 발명의 실시예를 보다 상세하게 설명하고자 한다.Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

도 2a는 본 발명에 따른 반도체 패키지용 성형 장치의 단면도, 도 2b는 본 발명에 따른 반도체 패키지용 성형 장치의 하부 금형의 상부도이다.2A is a cross-sectional view of a molding apparatus for a semiconductor package according to the present invention, and FIG. 2B is a top view of a lower mold of the molding apparatus for a semiconductor package according to the present invention.

본 발명에 따른 반도체 패키지용 성형 장치(200)는, 포개어져 결합되는 상부 금형(201a)과 하부 금형(201b)을 포함한다.The molding apparatus 200 for a semiconductor package according to the present invention includes an upper mold 201a and a lower mold 201b that are stacked and coupled to each other.

상부 금형(201a)과 하부 금형(201b) 내부에는 반도체 패키지(210)의 패키지 몸체(215)와 같은 형상으로 캐비티(203a, 203b)가 형성된다. 특히 하부 금형(201b)에는 캐비티(203b)와 외부로 관통되는 관통홀(220)이 형성되며, 관통홀(220)에는상승 또는 하강이 가능한 이젝터(230)가 구비된다.The cavity 203a, 203b is formed in the upper mold 201a and the lower mold 201b in the same shape as the package body 215 of the semiconductor package 210. In particular, the lower mold 201b is provided with a cavity 203b and a through hole 220 that penetrates to the outside, and the through hole 220 is provided with an ejector 230 capable of raising or lowering.

이젝터(230)들은 상이한 상승 높이와 속도를 갖고 상승된다. 예를 들어, 이젝터(230)들 중 중심에 위치된 이젝터(230a)에서 외측에 위치된 이젝터(230b)로 갈수록 상승 높이가 순차적으로 낮아지고, 외측에 위치된 이젝터(230b)가 가장 먼저 상승되도록 구비된다. 이와 같은 이젝터(230)들의 높이 및 속도는 제어 장치(240)에 의해 조절 및 판단되며, 유압식 구동에 의해 높낮이가 조절되는 것이 바람직하다.Ejectors 230 are raised with different elevation heights and speeds. For example, as the ascending height is sequentially lowered from the ejector 230a positioned at the center of the ejector 230 to the ejector 230b located at the outside, the ejector 230b located at the outside is raised first. It is provided. The height and speed of the ejectors 230 are adjusted and determined by the control device 240, it is preferable that the height is adjusted by the hydraulic drive.

복수개의 이젝터(230)는 패키지 몸체(215)의 하부면의 형상과 대응되는 현상을 갖고 분포된다. 예를 들어, 패키지 몸체(215)의 하부면이 사각형이라면, 이젝터(230)는 사각 링 형상으로 구비되며, 그 내부 직경은 반도체 패키지(210)의 하부면보다 작게 구비되는 것이 바람직하다. 더불어 복수개의 이젝터(230)는 패키지 몸체(215)의 하부면 전면보다 좁고 고르게 대응되어 분포되는 것이 유리하다.The plurality of ejectors 230 are distributed with a phenomenon corresponding to the shape of the lower surface of the package body 215. For example, if the lower surface of the package body 215 is a square, the ejector 230 is provided in a rectangular ring shape, the inner diameter is preferably provided smaller than the lower surface of the semiconductor package 210. In addition, the plurality of ejectors 230 is advantageously distributed correspondingly narrower than the front surface of the lower surface of the package body 215.

본 발명에 따른 반도체 패키지용 성형 장치(200)의 동작을 설명하면 다음과 같다.The operation of the molding apparatus for semiconductor package 200 according to the present invention is as follows.

먼저, 리드 프레임(217)은 결합되는 상부 금형(201a)과 하부 금형(201b) 사이에 맞물려짐으로써 고정된다.First, the lead frame 217 is fixed by being engaged between the upper mold 201a and the lower mold 201b to be joined.

이어, 결합된 상부 금형(201a)과 하부 금형(201b)에 주입된 성형 수지가 캐비티(203a, 203b)에 주입되어 경화되면, 캐비티(203a, 203b)의 형상과 동일한 패키지 몸체(240)가 형성된다. 이때, 이젝터(230)는 하부 금형(201b)의 캐비티(203b)와 높이가 같은 상태로 조절된다.Subsequently, when the molded resin injected into the combined upper mold 201a and the lower mold 201b is injected into the cavities 203a and 203b and cured, a package body 240 having the same shape as the cavities 203a and 203b is formed. do. At this time, the ejector 230 is adjusted to the same height as the cavity 203b of the lower mold 201b.

이어, 경화가 완료되면, 이젝터(230)들은 외측에 위치된 이젝터(230b)로부터 중심에 위치된 이젝터(230a)의 순서로 상승되고, 패키지 몸체(215) 하부 외측으로부터 중심으로 밀어올림으로써 하부 금형(201b)에서 이형시킨다.Then, when curing is completed, the ejectors 230 are raised in the order of the ejector 230a located at the center from the ejector 230b located at the outer side, and the lower mold is pushed out from the outer side of the lower part of the package body 215. Release at 201b.

한편, 본 명세서와 도면에 개시된 본 발명의 실시예들은 이해를 돕기 위해 특정 예를 제시한 것에 지나지 않으며, 본 발명의 범위를 한정하고자 하는 것은 아니다. 본 발명의 실시예에 따른 이젝터의 형상은 사각형의 링 형상으로 예를 들어 설명하였으나, 반도체 패키지의 패키지 몸체 형상에 따라 원, 타원 등의 링 형상 또는 링 형상이 아닌 패키지 몸체에 손상을 주지 않는 다른 형상으로 구비되어도 무방하다.On the other hand, the embodiments of the present invention disclosed in the specification and drawings are merely presented specific examples to aid understanding and are not intended to limit the scope of the present invention. The shape of the ejector according to the embodiment of the present invention has been described as an example of a rectangular ring shape, but according to the shape of the package body of the semiconductor package, other shapes that do not damage the package body other than the ring shape such as a circle, an ellipse or the like. It may be provided in a shape.

여기에 개시된 실시예들 이외에도 본 발명의 기술적 사상에 바탕을 둔 다른 변형예들이 실시 가능하다는 것은, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 자명한 것이다.In addition to the embodiments disclosed herein, it is apparent to those skilled in the art that other modifications based on the technical idea of the present invention may be implemented.

따라서, 본 발명의 구조를 따르면 복수개의 이젝터가 순차적으로 상승하여 반도체 패키지 하부면에 고르게 힘을 가함으로써 반도체 패키지와 성형 금형 간의 이형이 용이하도록 한다. 따라서 불균일한 힘의 분포에 의해 발생되는 반도체 패키지 외관의 변형 및 반도체 패키지의 휨 발생 현상이 감소될 수 있다.Therefore, according to the structure of the present invention, a plurality of ejectors are sequentially raised to apply a force evenly to the lower surface of the semiconductor package to facilitate the release between the semiconductor package and the molding die. Therefore, the deformation of the appearance of the semiconductor package caused by the uneven distribution of forces and the occurrence of warpage of the semiconductor package can be reduced.

Claims (4)

반도체 패키지의 패키지 몸체를 성형하는 상부 금형과 하부 금형을 포함하는 성형 장치에 있어서,In the molding apparatus comprising an upper mold and a lower mold for molding the package body of the semiconductor package, 상기 하부 금형을 관통하는 관통공;과A through hole penetrating the lower mold; and 상기 관통공을 통해 상기 바닥면 상으로 상승 또는 하강되는 복수개의 이젝터; 및A plurality of ejectors raised or lowered onto the bottom surface through the through holes; And 상기 이젝터의 상승 또는 하강을 조절하는 제어 장치;를 포함하는 것을 특징으로 하는 반도체 패키지용 성형 장치.Molding apparatus for a semiconductor package comprising a; control device for adjusting the rise or fall of the ejector. 제 1항에 있어서, 상기 이젝터들은 중심에서 외측으로 위치될수록 상승 높이가 순차적으로 낮아지도록 조절되는 것을 특징으로 하는 반도체 패키지용 성형 장치.The molding apparatus as claimed in claim 1, wherein the ejectors are adjusted to be sequentially lowered as the ejectors are positioned from the center to the outside. 제 1항에 있어서, 상기 이젝터들은 외측부터 중심의 순서로 순차적으로 상승되도록 조절되는 것을 특징으로 하는 반도체 패키지용 성형 장치.The molding apparatus of claim 1, wherein the ejectors are adjusted to be sequentially raised in the order from the outside to the center. 제 1항에 있어서, 복수개의 상기 이젝터는 내부 직경이 상이한 링(ring) 형상이며, 내부 직경이 가장 큰 상기 이젝터는 상기 반도체 패키지의 하부면보다 작게 구비되는 것을 특징으로 하는 반도체 패키지의 성형 장치.2. The apparatus of claim 1, wherein the ejectors have a ring shape having a different internal diameter, and the ejector having the largest internal diameter is smaller than a lower surface of the semiconductor package.
KR1020010080717A 2001-12-18 2001-12-18 Molding apparatus for semiconductor package KR20030050304A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020010080717A KR20030050304A (en) 2001-12-18 2001-12-18 Molding apparatus for semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020010080717A KR20030050304A (en) 2001-12-18 2001-12-18 Molding apparatus for semiconductor package

Publications (1)

Publication Number Publication Date
KR20030050304A true KR20030050304A (en) 2003-06-25

Family

ID=29576049

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010080717A KR20030050304A (en) 2001-12-18 2001-12-18 Molding apparatus for semiconductor package

Country Status (1)

Country Link
KR (1) KR20030050304A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100719938B1 (en) * 2006-06-07 2007-05-18 윤점채 A reverse warpage method and the apparatus in molded semiconductor strips
KR102087318B1 (en) * 2019-03-29 2020-04-23 박오희 Semi-conductor molding forming manufacturing method and device thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100719938B1 (en) * 2006-06-07 2007-05-18 윤점채 A reverse warpage method and the apparatus in molded semiconductor strips
KR102087318B1 (en) * 2019-03-29 2020-04-23 박오희 Semi-conductor molding forming manufacturing method and device thereof
WO2020204266A1 (en) * 2019-03-29 2020-10-08 박오희 Method for molding semiconductor package, and apparatus therefor

Similar Documents

Publication Publication Date Title
US20060055080A1 (en) Semiconductor package having flash-free contacts and techniques for manufacturing the same
EP0124244B1 (en) Transfer moulding method and apparatus
JPH0845972A (en) Production of semiconductor device
KR100929054B1 (en) Method of Resin Encapsulation, Apparatus for Resin Encapsulation, Method of Manufacturing Semiconductor Device, Semiconductor Device and Resin Material
US6208020B1 (en) Leadframe for use in manufacturing a resin-molded semiconductor device
US20050110168A1 (en) Low coefficient of thermal expansion (CTE) semiconductor packaging materials
KR20190017683A (en) Resin molding device and method for preparing resin molding product
KR20190017684A (en) Resin molding product transportation device, resin molding device and method for preparing resin molding product
CN108568929B (en) Resin molding apparatus, resin molding method, and method for manufacturing resin molded article
KR20030050304A (en) Molding apparatus for semiconductor package
KR200489288Y1 (en) Lead frame device and lead frame device assembly including the same
US6645792B2 (en) Lead frame and method for fabricating resin-encapsulated semiconductor device
JP7018377B2 (en) Molding mold, resin molding equipment, manufacturing method of resin molded products
TWI648140B (en) Mould, moulding press and method for encapsulating electronic components mounted on a carrier using micro-pillars
JP3784597B2 (en) Sealing resin and resin-sealed semiconductor device
US5672550A (en) Method of encapsulating semiconductor devices using a lead frame with resin tablets arranged on lead frame
US20050266602A1 (en) Encapsulated chip and method of fabrication thereof
JP2011040625A (en) Method of manufacturing semiconductor device
JP2008140807A (en) Resin sealed semiconductor device
JP2730873B2 (en) Method for manufacturing semiconductor device
KR20100052182A (en) Retractor pin device for semiconductor package mold
KR20000001008A (en) Plastic package mold device having built-in semiconductor chip and its molding method
KR101303796B1 (en) Molding apparatus for manufacturing semi-conductor package
KR20000002701A (en) Molding device
KR100788113B1 (en) Mold structure for manufacturing semiconductor device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application