KR20030012384A - Structure for short prevention of pattern of circuit board - Google Patents

Structure for short prevention of pattern of circuit board Download PDF

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Publication number
KR20030012384A
KR20030012384A KR1020010046386A KR20010046386A KR20030012384A KR 20030012384 A KR20030012384 A KR 20030012384A KR 1020010046386 A KR1020010046386 A KR 1020010046386A KR 20010046386 A KR20010046386 A KR 20010046386A KR 20030012384 A KR20030012384 A KR 20030012384A
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KR
South Korea
Prior art keywords
pattern
circuit board
balance coil
film
terminal pins
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KR1020010046386A
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Korean (ko)
Inventor
윤복수
Original Assignee
파츠닉(주)
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Application filed by 파츠닉(주) filed Critical 파츠닉(주)
Priority to KR1020010046386A priority Critical patent/KR20030012384A/en
Publication of KR20030012384A publication Critical patent/KR20030012384A/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching

Abstract

PURPOSE: A structure for preventing a short circuit of a circuit board pattern is provided to prevent a short circuit phenomenon of patterns by intensifying adhesive strength between a circuit board and the circuit board pattern. CONSTITUTION: A balance coil is used for correcting mis-landing of a deflection yoke. The balance coil is formed on a back face of a circuit board(100) and located on a front face of the circuit board(100). A pattern(140) is formed on a back face of the circuit board(100). The pattern(140) is used for connecting a plurality of terminal pins with various electronic components. The terminal pins are used for connecting and fixing the balance coil and other coils. A lug combination portion(150) has a rear projection portion of the terminal pins. A pattern film portion(160) is formed by uncovering a film of the pattern(140).

Description

회로기판 패턴의 단락방지구조{STRUCTURE FOR SHORT PREVENTION OF PATTERN OF CIRCUIT BOARD}Short circuit prevention structure of circuit board pattern {STRUCTURE FOR SHORT PREVENTION OF PATTERN OF CIRCUIT BOARD}

본 발명은 회로기판 패턴의 단락방지구조에 관한 것으로, 더욱 상세하게는 편향요크의 미스랜딩을 보정하기 위한 밸런스코일 등을 장착하는 회로기판과 그에 형성되는 패턴간의 접착력을 강화시켜 고온의 납땜시 발생하는 패턴의 단락현상을 방지할 수 있도록 한 회로기판 패턴의 단락방지구조에 관한 것이다.The present invention relates to a short circuit prevention structure of a circuit board pattern. More particularly, the present invention relates to a circuit board having a balance coil for correcting mis-landing of a deflection yoke and an adhesive force between a pattern formed on the circuit board. It relates to a short circuit prevention structure of the circuit board pattern to prevent the short circuit phenomenon of the pattern.

일반적으로 편향요크는 음극선관의 전자총에서 발사되는 전자빔을 편향시키는 것으로, 상기 편향요크에 의해 편향된 전자빔은 섀도우마스크에 형성된 관통공을 통과해서 패널(panel)의 내주에 장착된 형광면 각각의 스트라이프(stripe)에 봉착하여 발광함으로써 텔레비전의 스크린에 정상적인 화상을 구현하게 된다.In general, a deflection yoke deflects an electron beam emitted from an electron gun of a cathode ray tube, and an electron beam deflected by the deflection yoke passes through a through hole formed in a shadow mask, and strips of each fluorescent surface mounted on an inner circumference of a panel. ) To emit light, thereby realizing a normal image on the screen of the television.

이때, 상기 패널의 스트라이프의 내주에 전자빔이 정밀도 있게 봉착되는 것을 랜딩이라 하며 상기 전자빔이 스트라이프의 외주로 벗어나는 것을 미스랜딩이라 하는데, 상기 미스랜딩이 발생하게 되면 스크린의 화상이 명확하게 되지 않으므로 화질열화의 원인을 제공하게 된다.At this time, the landing of the electron beam on the inner circumference of the stripe of the panel with precision is called landing, and the departure of the electron beam on the outer circumference of the stripe is called mislanding. To provide a cause.

이러한 미스랜딩을 보정하기 위한 수단으로 밸런스코일이 사용되는데, 상기 밸런스코일은 도 1에 나타낸 바와 같이, 회로기판(100)에 장착되는 구조로 고정된다.A balance coil is used as a means for correcting such mis landing, and the balance coil is fixed to a structure mounted on the circuit board 100 as shown in FIG. 1.

상기 회로기판(100)은 편향요크의 미스랜딩을 보정하는 밸런스코일(110)과,상기 밸런스코일(110) 및 기타 코일(미 도시됨) 등을 다수회 권회하여 연결 고정하기 위한 다수의 단자핀(120)과, 각종 전자부품(130)으로 이루어진다.The circuit board 100 includes a balance coil 110 for correcting mis-landing of the deflection yoke, and a plurality of terminal pins for winding and fixing the balance coil 110 and other coils (not shown). 120 and various electronic components 130.

여기서, 상기 회로기판(100)에 장착된 밸런스코일(110)과 단자핀(120) 및 각종 전자부품(130)은 도 2에 나타낸 바와 같이, 상기 회로기판(100)의 배면에 형성된 패턴(140)에 의해 상호 유기적인 연결구조를 갖게 되는데, 상기 단자핀(120)의 돌출 형성된 러그(lug)결합부(150)와 접촉되는 패턴(140)은 상기 러그결합부(150) 둘레를 따라 정원형으로 패턴(140)의 피막을 벗겨낸 후 납땜을 수행하여 상호 연결시키는 구조형태를 갖는다.Here, the balance coil 110, the terminal pin 120, and the various electronic components 130 mounted on the circuit board 100 may have patterns 140 formed on the rear surface of the circuit board 100. By having a mutual organic connection structure), the pattern 140 is in contact with the protruding lug coupling portion 150 of the terminal pin 120 is a garden type along the circumference of the lug coupling portion 150 As a result, the film of the pattern 140 is peeled off and then soldered to each other to form a structure.

그런데, 이러한 종래기술에 따른 회로기판의 패턴 연결구조는 러그결합부의 디핑(dipping)되는 부분과 회로기판에 납땜되는 부분간 접착부위가 작아 고온 납땜이 불가능하고 그에 따른 작업시간이 증가되며 고온 납땜을 시행하더라도 회로기판과 패턴간 접착력이 약하므로 러그결합부위의 패턴이 회로기판에서 단락되는 현상이 발생되는 문제점이 있었다.By the way, the pattern connection structure of the circuit board according to the prior art is a high temperature soldering is impossible due to the small adhesion portion between the dipping portion of the lug coupling portion and the portion soldered to the circuit board, and thus increase the working time and increase the high temperature soldering. Even if it is implemented, the adhesive force between the circuit board and the pattern is weak, so that the pattern of the lug coupling part is short-circuited in the circuit board.

본 발명은 상기와 같은 문제점을 해결하기 위하여 제안된 것으로서, 그 목적으로 하는 바는 단자핀의 러그결합부에 연결되는 회로기판상의 패턴에 있어 상기 러그결합부위에 형성된 패턴의 피막을 그 패턴의 진행방향으로 길게 벗겨냄으로써 회로기판과 그에 형성되는 패턴간의 접착력을 강화시켜 고온 납땜을 가능하게 하고 고온 납땜시 회로기판에서 패턴이 단락되는 것을 방지할 수 있도록 하는데 있다.The present invention has been proposed to solve the above problems, the object of which is to move the pattern of the pattern formed on the lug coupling portion in the pattern on the circuit board connected to the lug coupling portion of the terminal pin The long peeling in the direction to enhance the adhesive force between the circuit board and the pattern formed thereon to enable high temperature soldering and to prevent the pattern from shorting in the circuit board during high temperature soldering.

도 1은 종래 기술에 따른 편향요크의 회로기판을 나타내는 정면도.1 is a front view showing a circuit board of a deflection yoke according to the prior art.

도 2는 종래 기술에 따른 편향요크의 회로기판을 나타내는 배면도.Figure 2 is a rear view showing a circuit board of the deflection yoke according to the prior art.

도 3은 본 발명에 따른 회로기판 패턴의 단락방지구조를 설명하기 위한 편향요크 회로기판을 나타내는 배면도.3 is a rear view showing a deflection yoke circuit board for explaining a short circuit prevention structure of a circuit board pattern according to the present invention;

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

100: 회로기판 110: 밸런스코일100: circuit board 110: balance coil

120: 단자핀 130: 전자부품120: terminal pin 130: electronic components

140: 패턴 150: 러그결합부140: pattern 150: lug coupling portion

160: 패턴피막부160: pattern coating

상기와 같은 목적을 달성하기 위한 본 발명은 회로기판의 배면에 패턴이 형성되며 단자핀의 러그결합부와 납땜을 통하여 상호 유기적인 결합을 갖는 회로기판의 패턴 구조에 있어서,The present invention for achieving the above object is a pattern formed on the back surface of the circuit board and the pattern structure of the circuit board having a mutual organic coupling through the lug coupling portion and soldering of the terminal pin,

상기 러그결합부와 결합되는 패턴중 러그결합부의 주변에 형성된 패턴의 피막을 길게 벗겨내어 패턴피막부를 형성하되 패턴이 진행되는 방향으로 피막을 벗겨내도록 하는 것을 그 기술적 구성상의 특징으로 한다.The technical composition is characterized in that the film of the pattern formed around the lug coupling portion of the pattern to be combined with the lug coupling portion to peel off the coating in the direction in which the pattern proceeds by forming a pattern coating portion.

이하, 본 발명에 따른 바람직한 실시예를 도면을 참조하면서 상세히 설명하면 다음과 같다.Hereinafter, a preferred embodiment according to the present invention will be described in detail with reference to the drawings.

도 3은 본 발명에 따른 회로기판 패턴의 단락방지구조를 설명하기 위한 편향요크 회로기판을 나타내는 배면도이고, 종래와 동일 작용을 하는 동일 구성에 대해서는 동일 명칭 및 동일 부호를 병기 사용하기로 한다.Figure 3 is a rear view showing a deflection yoke circuit board for explaining the short circuit protection structure of the circuit board pattern according to the present invention, the same name and the same reference numerals will be used together for the same configuration having the same function as the conventional.

본 발명에 따른 회로기판 패턴의 단락방지구조의 구성을 설명하기에 앞서 본 발명에 이용되는 회로기판을 설명하면 도 1에 나타낸 바와 같이, 편향요크의 미스랜딩을 보정하는 밸런스코일(110)과, 상기 밸런스코일(110) 및 기타 코일(미 도시됨) 등을 다수회 권회하여 연결 고정하기 위한 다수의 단자핀(120)과, 각종 전자부품(130)으로 이루어진다.Before explaining the configuration of the short circuit prevention structure of the circuit board pattern according to the present invention, the circuit board used in the present invention will be described. As shown in Fig. 1, a balance coil 110 for correcting mis-landing of the deflection yoke, A plurality of terminal pins 120 and various electronic components 130 for fixing the balance coil 110 and other coils (not shown) and the like by winding a plurality of times.

한편, 도 3에 나타낸 바와 같이, 본 발명에 따른 회로기판 패턴의 단락방지구조는 회로기판(100)의 배면에 형성되어 회로기판(100)의 정면에 장착되는 밸런스코일(110), 단자핀(120) 및 각종 전자부품(130) 등의 각 구성요소를 상호 유기적으로 연결시키는 패턴(140)과, 상기 회로기판(100)의 배면에 형성되며 상기 회로기판(100)의 정면으로 삽입된 단자핀(120)의 후면 돌출부를 갖는 러그결합부(150)와, 상기 러그결합부(150)의 주변에 형성된 패턴(140)의 피막을 길게 벗겨내되 패턴(140)이 진행되는 방향으로 피막을 벗겨낸 패턴피막부(160)로 이루어진다.On the other hand, as shown in Figure 3, the short circuit protection structure of the circuit board pattern according to the present invention is formed on the back of the circuit board 100, the balance coil 110, the terminal pin (mounted on the front of the circuit board 100) 120 and a pattern 140 for organically connecting each component such as various electronic components 130 and terminal pins formed on the rear surface of the circuit board 100 and inserted into the front surface of the circuit board 100. The lug coupling part 150 having the rear protrusion of the 120 and the film of the pattern 140 formed around the lug coupling part 150 are peeled off for a long time, but the film is peeled off in the direction in which the pattern 140 proceeds. The pattern coating part 160 is formed.

이때, 상기 러그결합부(150)는 단자핀(120)의 안정된 고정 및 상기 패턴(140)과의 유기적인 결합을 위해 납땜된다.In this case, the lug coupling part 150 is soldered for stable fixing of the terminal pin 120 and organic coupling with the pattern 140.

따라서, 회로기판(100)의 패턴(140)상에 존재하는 러그결합부(150)의 주변 패턴(140)피막을 그 패턴(140)의 진행방향으로 길게 벗겨냄으로써 정원형으로 벗겨낸 패턴피막에 비해 회로기판(100)과 패턴(140)간의 접착부위가 넓어져 접착력이 강화되고 그에 따라 고온 납땜이 가능하게 됨은 물론 작업시간이 짧아지며 고온 납땜시 회로기판에서 패턴이 단락되는 현상을 방지할 수 있게 된다.Therefore, by peeling the film of the peripheral pattern 140 of the lug coupler 150 existing on the pattern 140 of the circuit board 100 in the direction in which the pattern 140 travels, the pattern film is stripped in a garden shape. In comparison, the adhesive area between the circuit board 100 and the pattern 140 is widened to enhance adhesion, thereby enabling high temperature soldering, shortening working time, and preventing short circuits in the circuit board during high temperature soldering. Will be.

이상에서 살펴본 바와 같이 본 발명에 따른 회로기판 패턴의 단락방지구조에 의하면, 단자핀의 러그결합부에 연결되는 회로기판상의 패턴에 있어 상기 러그결합부위에 형성된 패턴의 피막을 그 패턴의 진행방향으로 길게 벗겨냄으로써 회로기판과 그에 형성되는 패턴간의 접착력이 강화되고 그에 따라 고온 납땜이 가능하게 됨은 물론 고온 납땜시 회로기판에서 패턴이 단락되는 현상을 방지할 수 있으며 결국제품에 대한 신뢰성을 확보할 수 있게 되는 탁월한 효과가 있다.As described above, according to the short circuit prevention structure of the circuit board pattern according to the present invention, in the pattern on the circuit board connected to the lug coupling portion of the terminal pin, the film of the pattern formed on the lug coupling portion in the direction of the pattern By long peeling, the adhesive force between the circuit board and the pattern formed thereon is strengthened, so that high temperature soldering is possible and the pattern short circuit in the circuit board can be prevented during high temperature soldering, thus ensuring the reliability of the product. Being an excellent effect.

Claims (1)

회로기판(100)의 배면에 패턴(140)이 형성되며 단자핀(120)의 러그결합부(150)와 납땜을 통하여 상호 유기적인 결합을 갖는 회로기판의 패턴 구조에 있어서,In the pattern structure of the circuit board is formed on the back surface of the circuit board 100 and having a mutual organic coupling through the lug coupling portion 150 of the terminal pin 120 and soldering, 상기 러그결합부(150)와 결합되는 패턴(140)중 러그결합부(150)의 주변에 형성된 패턴(140)의 피막을 길게 벗겨내어 패턴피막부(160)를 형성하되 패턴(140)이 진행되는 방향으로 피막을 벗겨내도록 하는 것을 특징으로 하는 회로기판 패턴의 단락방지구조.Of the pattern 140 coupled to the lug coupling part 150, the film of the pattern 140 formed around the lug coupling part 150 is peeled off to form the pattern coating part 160, but the pattern 140 proceeds. A short circuit prevention structure of a circuit board pattern, characterized in that the film is peeled off in the direction of the direction.
KR1020010046386A 2001-07-31 2001-07-31 Structure for short prevention of pattern of circuit board KR20030012384A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01164086A (en) * 1987-12-21 1989-06-28 Toshiba Corp Printed-circuit board
JPH0521944A (en) * 1991-07-12 1993-01-29 Canon Inc Printed-wiring board
JPH05226820A (en) * 1992-02-18 1993-09-03 Ibiden Co Ltd Printed wiring board
JPH08186360A (en) * 1994-12-28 1996-07-16 Matsushita Electric Ind Co Ltd Printed wiring board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01164086A (en) * 1987-12-21 1989-06-28 Toshiba Corp Printed-circuit board
JPH0521944A (en) * 1991-07-12 1993-01-29 Canon Inc Printed-wiring board
JPH05226820A (en) * 1992-02-18 1993-09-03 Ibiden Co Ltd Printed wiring board
JPH08186360A (en) * 1994-12-28 1996-07-16 Matsushita Electric Ind Co Ltd Printed wiring board

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