KR20030010506A - High thermal emissive coated bodies for electronic equipment parts - Google Patents

Abstract

PURPOSE: A coating for electric devices with a good radiation property is provided to achieve a good self-cooling property capable of restricting an increase in the temperature of the coating when using the electric devices. CONSTITUTION: The coating for electric devices with a good radiation property is obtained by applying radiation pieces onto the surfaces of a substrate. By using a radiation assessment device, it is confirmed that a temperature difference is more than 2.6deg.C. The temperature difference is a value between a temperature measured when the coating is used as an object to be checked and a temperature measured when the substrate not coated with the coating is used as an object to be checked.

Description

High thermal emissive coated bodies for electronic equipment parts

TECHNICAL FIELD [0001] The present invention relates to an electronic device member coating body having excellent heat dissipation in a framework such as electronic, electrical, or optical equipment (hereinafter, sometimes referred to as an electronic device); And a coating material for an electronic device member having excellent self cooling property; and a coating material for an electronic device member having excellent conductivity; an electronic device part having excellent properties thereof; a paint composition useful for forming a coating material having excellent heat dissipation and conductivity. And a heat dissipation evaluation device for evaluating the heat dissipation of a test subject, and the coating material of the present invention relates to a coating agent thickness of a black additive such as carbon black. It has a good heat dissipation property, and it has excellent heat dissipation characteristics, and has an information recording field such as CD, LD, DVD, CD-ROM, CD-RAM, PDP, LCD, etc .; personal computer, car navigator ), Car AV (car AV) Suitable for electric, electronic, communication related fields such as projector, AV equipment such as TV, video, game machine etc .; copier equipment such as copy machine, printer; power box cover, control box cover, vending machine, etc. It can be used as a frame for various electronic device members such as a refrigerator, etc. The coating body of the present invention can also be used as a chromium-free coating body which does not contain any harmful hexavalent chromium. It is very useful in providing the chromium-free coating body which has the corrosion resistance and coating-film adhesiveness comparable to a processed steel plate, and also has the favorable workability.

Prior art

In recent years, due to high performance and miniaturization of electronic, electrical, and optical devices, problems such as increase in heat generation (high temperature) and high deterioration inside chassis of electronic devices, etc. have occurred (high deterioration inside electronic devices). ). The internal temperature of an electronic device may be a high temperature of about 40 to 70 ° C. and a maximum of 100 ° C. as an ambient temperature, but if this occurs, heat and high temperatures such as an IC, a CPU (semiconductor element), a disk, and a motor may be used. It is pointed out that it interferes with stable operation. In addition, there is a problem that the lifespan of electronic component parts decreases, such as breakdown of a semiconductor device when the temperature rises.

Thus, as a heat dissipation means for lowering (heat dissipation) the internal temperature of the electronic device, the sink is placed on a frame of the electronic device (frame body, frame, shield case, pack panel such as liquid crystal). It has been proposed to install heat-dissipating parts such as heat sinks, heat pipes, etc. However, in this method, at most, heat emitted from a heat source (heating element) inside an electronic device is diffused into the entire frame. It is possible to obtain only the effect of the degree, and in particular, when the volume of the frame is small, the heat dissipation effect as expected can be obtained, and the installation of this heat dissipation part takes time, and the installation place must be secured separately. Since it is inconvenient, such as high lifting, it is not suitable for application to electronic devices aiming at miniaturization and low cost.

Moreover, the method of using a metal plate (painting body) in the frame of an electronic device, making a hole in this metal plate, and providing a fan, and heat dissipating using convection is also proposed. However, since electronic devices are generally weak to water and dust, they are difficult to apply depending on their purpose. In addition to the above-mentioned heat sinks, the cost of parts, the effort for installation, and the securing of the installation location there is a problem.

Thus, while satisfying the inherent characteristics required for electronic devices (such as securing airtightness, miniaturization, and weight reduction associated with waterproofing and dustproofing), new devices capable of achieving a drop in the internal temperature of the electronic device (heat dissipation characteristics) can be achieved. There is a desire to provide a frame for an electronic device member.

On the other hand, in addition to the heat dissipation characteristics described above, the mold of the electronic device is also required to suppress the temperature rise of the mold itself. As a result, it is possible to prevent a risk such as burns caused by the consumer coming into contact with the frame during operation of the electronic device product, and to provide a safe product. In order to distinguish this "characteristic which suppresses the temperature rise of the frame of an electronic device" from the above-mentioned "heat dissipation property", it is especially called "self-cooling property" in this invention. In order to obtain a mold excellent in both of these characteristics, a method of installing heat-dissipating parts such as heat sinks or heat pipes described above, or a method of installing a fan by drilling a hole in a metal plate Etc.), the same problem can be seen. Thus, there is also a desire to provide a framework with both of these characteristics.

In addition, the mold of the electronic device is required to have excellent conductivity as well as the above-described characteristics. However, the conventionally used black coated steel sheet (steel plate coated with a black coating film) and the like have a problem that the thickness of the black coating film is so thick that the electrical resistance is high, so that the earth is not as good as expected to be applied to an electronic device.

On the substrate side, conventionally chromate treatment has been performed on the substrate from the viewpoint of corrosion resistance, coating film adhesion and the like, but the problem of environmental pollution is aggravated in that a large amount of harmful hexavalent chromium is used. Thus, in place of the harmful chromate treatment, a response to chromium-free non-chromate treatment has been requested. However, when the chromate treatment is not performed, it is known that the corrosion resistance, coating adhesion and workability are inferior. There is a desire to provide a frame for an electronic device member that also has excellent cooling property.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is a coating body used as a framework of an electronic device, and satisfies the inherent characteristics required for the electronic device member (securing airtightness, miniaturization and weight reduction with waterproofing and dustproofing, etc.). New coating body which can achieve the fall (heat dissipation characteristic) of the internal temperature of this electronic device; And the coating body for electronic device members excellent also in the characteristic (self-cooling property) which suppresses the temperature rise of this coating body itself; Moreover, the coating material for electronic device members excellent also in electroconductivity; And a chromium-free electronic device member having excellent corrosion resistance and coating film adhesion and good workability; Electronic device parts coated with a coating material having such excellent characteristics; Paint compositions useful for forming paints having excellent heat dissipation and conductivity; As a coating composition applied to the board | substrate which carried out the chromium-free base treatment, Paint composition excellent in heat dissipation, electroconductivity, corrosion resistance, coating adhesiveness, and workability; And a heat dissipation evaluation apparatus for evaluating heat dissipation of a subject.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram of an apparatus used for evaluating ΔT1 (heat dissipation) and ΔT2 (self cooling) in the coating body of the present invention.

2 is a graph showing a range of heat dissipation characteristics (a x b) in the first coating body according to the present invention.

3 is a graph showing a range in which both of self cooling and heat dissipation characteristics are excellent in the second coating body according to the present invention.

4 is a graph showing the relationship between ΔT1 and the product (a × b) of infrared ray emissivity on the surface and the back surface.

FIG. 5 is a graph showing the relationship between the P value [= (X-3) × (Y−0.5)] and the product (a × b) of the infrared emissivity on the surface and the back surface.

FIG. 6 is a graph showing a relationship between ΔT2 and a Q value (= 0.9a-b) in Example 5. FIG.

FIG. 7 is a graph showing a relationship between ΔT1 and an R value [= (a-0.05) × (b-0.05)] in Example 5. FIG.

8 is a schematic diagram of a heat radiation characteristic evaluation apparatus partially covered with a protective member.

9 is a schematic view of a heat dissipation characteristic evaluation apparatus in which a front surface is covered with a protective member.

It is a schematic explanatory drawing which shows the preferable position of the temperature measuring apparatus used for the apparatus of this invention.

FIG. 11 is a graph showing the relationship between the content (X) of the carbon black and the coating film thickness (Y) in Example 1. FIG.

12 is No. of Example 2; 1 is a graph showing the relationship between the wavelength of infrared rays and the emissivity.

13 is a view of No. 2 of Example 2; 2 is a graph showing the relationship between the wavelength of infrared rays and the emissivity.

14 is No. of Example 2; 3 is a graph showing the relationship between the wavelength of infrared rays and the emissivity.

15 is No. of Example 2; 4 is a graph showing the relationship between the wavelength of infrared rays and the emissivity.

Explanation of the sign

1 Test piece (Inspection) 2 Insulation material 3 Heating element 4 Protective member (cover) 5 Temperature measuring device

The coating material excellent in the heat dissipation property (henceforth a 1st coating material) in this invention which can solve the said subject is the paint body which coated the heat dissipation coating film which has heat dissipation on the front and back of a board | substrate, ie, the front and back surfaces of a board | substrate. It is a point which satisfy | fills the characteristic of following (I) or (II) as an index which shows the "heat dissipation property."

(I) The difference between T1 _A at the time of using the said coating body as a test material using the heat dissipation evaluation apparatus shown in FIG. 1 mentioned later, and the temperature T1 _B of the T1 position at the time of using the board | substrate which is not coated with a coating film as a test material. ΔT1 (= T1 _B -T1 _A ) is 2.6 ° C or higher.

(II) Integral emissivity of infrared rays (wavelength: 4.5-15.4 μm) when the coating body is heated to 100 ° C. satisfies the following (1), and as a recommended embodiment, a ≥ 0.65 and And / or the difference (AB) between the maximum value A and the minimum value B of the spectral emissivity in a wavelength range of b ≧ 0.65 and / or 4.5 to 15.4 μm is 0.35 or less.

a × b ≥0.42 ‥‥‥‥ (1)

a: Infrared integral emissivity of a coating body coated with a heat-dissipating film on its surface

b: Infrared integral emissivity of a coating body coated with a heat-dissipating film on the back surface

The specific structure for obtaining the coating material excellent in such a heat dissipation is the coating body in which the heat radiation coating film which has heat dissipation was coat | covered at the front and back of a board | substrate,

At least one surface of this heat-dissipation coating film contains a black additive, and also has a summary which satisfy | fills following formula (2).

(X-3) × (Y-0.5) ≥ 15 ‥‥‥‥ (2)

In formula, X is content (mass%) of the black additive contained in a heat-dissipation coating film,

Y means coating film thickness (micrometer), respectively.

Here, X (content of the black additive contained in a heat-resistant coating film) satisfy | fills 4 <= X <15 [Formula (3)]; Y (film thickness) satisfy | fills Y> 1 micrometer; And the average particle diameter of a black additive satisfy | fills 5-100 nm; The black additive is carbon black, which is useful for obtaining better heat dissipation.

In addition, a coating film (hereinafter also referred to as a second coating material) excellent in heat dissipation and self cooling properties according to the present invention which can solve the above problems is coated with a coating film on the front and back surfaces of the substrate, and at least the surface of the substrate. It is a coating body coated with a heat radiation coating film having heat dissipation in

As an index indicating "excellent self-cooling", the following (III) or (IV):

In this 2nd coating body, it has a summary that the following (V) is satisfy | filled as an index which shows "good heat radiation characteristic."

(III) The coating body temperature T2 _A when the said coating body was measured as a test material using the heat dissipation evaluation apparatus shown in FIG. 1, and the substrate temperature T2 _B when using the board | substrate which is not coat | covered as a test material. Difference ΔT2 (= T2 _B -T2 _A ) with 0.5 degreeC or more.

(IV) The integral emissivity of infrared rays (wavelength: 4.5-15.4 micrometers) when the said coating body is heated at 100 degreeC satisfy | fills following (4).

b ≤ 0.9 (a-0.05) ‥‥‥‥ (4)

(V) The integral emissivity of infrared rays (wavelength: 4.5-15.4 micrometers) when the said coating body is heated to 100 degreeC satisfy | fills following (5).

(a-0.05) × (b-0.05) ≥0.08 ‥‥‥‥ (5)

a: Infrared integral emissivity of a coating body coated with a heat-dissipating film on its surface

b: Infrared integral emissivity of a coating body coated with a heat-dissipating film on the back surface

The specific structure for obtaining the coating body excellent in such "heat dissipation property and self-cooling property" is the coating body which coat | covered the coating film on the front and back of the board | substrate, and the heat-dissipation coating film which has heat dissipation on at least the surface of a board | substrate,

This heat-dissipation coating film contains a black additive and has the point which satisfy | fills following formula (6).

(X-3) × (Y-0.5) ≥ 3 ‥‥‥‥ 6

In formula, X is content (mass%) of the black additive contained in a heat-dissipation coating film,

Y means coating film thickness (micrometer), respectively.

Here, X (content of the black additive contained in a heat-resistant coating film) satisfy | fills 4 <= X <15 [Formula (7)]; Y (film thickness) satisfy | fills Y> 1 micrometer; And the average particle diameter of a black additive satisfy | fills 5-100 nm; The black additive is carbon black, which is useful for obtaining better properties.

Furthermore, in addition to the above-mentioned characteristics, the "coating body excellent in heat dissipation (or self-cooling)" and electroconductivity (hereinafter sometimes referred to as "third-coating body") according to the present invention, which can solve the above problems, further has an electrical resistance of 100Ω. The present invention has the gist of satisfying the following, and specifically, a conductive filler (preferably Ni) is contained in the heat dissipation coating film.

In the coating film body (1st-3rd coating film body) of this invention mentioned above, if non-hydrophilic resin (preferably polyester-type resin) is used as resin which forms a heat-dissipating film, it is corrosion-resistant. It is a preferred embodiment because it is improved.

In addition, in the present invention, a coating of a clear coating film on the heat dissipation coating film is useful because it can improve scratch resistance and anti-fingerprint resistance.

The coating body of this invention can be applied also to a chromium-free coating body. That is, the substrate is subjected to a chromium-free base treatment, and the heat dissipation coating film is a rust preventive agent. It is preferable to contain iii). Specifically, the forming component of the heat dissipation coating film is a polyester resin and a crosslinking agent (preferably an isocyanate resin and / or melamine resin, more preferably an epoxy-modified polyester resin and / or a phenol derivative). It is recommended to use both in combination), and accordingly, the area ratio of the abnormal part of the external part in the salt spray test corrosion resistance test (72 hours) specified in JIS-Z-2371 is excellent. : 10% or less], the film adhesion (the peeling state of the coating film after tempering the bend) and the workability (the number of cracks in the adhesion bending test specified in JIS K 5400: 5 or less) can be secured. In addition, when the coating film is coated on the coating film, it is possible to prevent the elution of the rust preventive agent. Therefore, the corrosion resistance is excellent. [Outer appearance in the salt spray test corrosion resistance test (120 hours) specified in JIS-Z-2371) Negative area ratio: 10% or less] can be obtained, which is very useful. In this case, when the coating film coated on the coating film is a clear coating film, the scratch resistance and the fingerprint resistance can also be increased.

And when electroconductive filler (preferably Ni) is added to the said coating film, the outstanding electroconductivity (electric resistance of 100 kPa or less) can be ensured. Further, when the conductive filler is added to the coating film, the corrosion resistance is lowered. However, by controlling the coating film thickness of at least the surface of the coating film coated on the front and back surfaces to 2 µm or more, good corrosion resistance can be maintained.

And the coating composition for electronic device members of this invention which can solve the said subject has the summary that it contains more than 3 mass% of black additives and 10-50 mass% of conductive fillers with respect to a coating film formation component. If the same coating composition is used, a coating film excellent in heat dissipation and conductivity can be formed. Here, the average particle size of the black additive is 5 to 100 nm; The black additive is carbon black; It is a preferable aspect that the said conductive filler is Ni.

In addition, in the present invention, as a coating composition applied to a substrate subjected to chromium-free base treatment, at least 35 parts by mass of a polyester resin having an epoxy-modified polyester resin and / or a phenol derivative introduced into the skeleton thereof, The coating composition for electronic device members containing 2-25 mass parts, 1-20 mass parts of crosslinking agents, 3 mass parts of black additives, and 10-50 mass parts of conductive fillers is also included in the scope of the present invention.

Here, it is preferable that the said crosslinking agent contains melamine type resin in the ratio of 5-80 mass parts with respect to 100 mass parts of isocyanate resins. In addition, the average particle diameter of the black additive is 5 to 100 nm, and the use of carbon black is recommended. In addition, use of Ni is preferable for the conductive filler. If a coating composition that satisfies such a composition is used, a chromium-free coating film excellent in heat dissipation, conductivity, corrosion resistance, coating adhesion and workability can be formed.

Furthermore, in the present invention, an electronic device component incorporating a heat dissipation body in a closed space, wherein all or part of its outer wall is formed of the coating member for electronic device member of the present invention (for example, CD, LD). Information recording fields such as DVDs, CD-ROMs, CD-RAMs, PDPs, LCDs, etc. Electrical, electronic and communication related fields such as personal computers, car navigators, and car AVs; AV equipment such as projectors, televisions, videos, game machines, copying apparatuses such as copiers, printers, power box covers such as air conditioner outdoor units, control box covers, vending machines, refrigerators, and the like, are also included within the scope of the present invention.

And in this invention, as a heat dissipation evaluation apparatus which evaluates the heat dissipation of a test plate,

All or part of the ceiling surface is composed of the above-described subjects, and a heat generating element is installed on the bottom of the upper body, which is composed of the heat insulating material on the side and the bottom, and a heat radiation device is installed on the center of the upper body. Evaluation apparatus is also included within the scope of the present invention. Here, the heat dissipation evaluation apparatus provided with the protection member which cuts off from the external air condition above the subject can prevent the factors (such as the wind from the air or the air conditioner) which may adversely affect the heat dissipation, It is very useful because the heat dissipation characteristics can be evaluated stably.

Embodiment of the invention

The coating body for electronic device members of this invention contains the following aspects (a)-(c).

(A) Coating material for electronic device member excellent in heat dissipation (first coating material)

(B) Coating material for electronic device member excellent in heat dissipation and self cooling (second coating

sieve)

(C) In the coatings of (A) and (B), the conductivity is further improved.

Paint body (third paint body)

First, the basic idea common to the above (a) to (c) will be described.

MEANS TO SOLVE THE PROBLEM The present inventors achieve the fall (heat dissipation characteristic) of the internal temperature of this electronic device, satisfying the inherent characteristics (securing airtightness, miniaturization, light weight, low cost, etc.) required for the electronic device. In order to provide a novel coating material for electronic device members, in particular, the present invention has been intensively focused on improving the heat dissipation of the coating material itself. As a result, it was found that the desired purpose is achieved by coating a predetermined coating film on the front and back surfaces of the substrate.

The mechanism is "absorption (radiation) of heat (radiation heat) emitted from a heat source (heating element) inside an electronic device, and radiate this heat from the heat radiation coating film on the surface, so-called" heat-penetrating method. It is the biggest feature that the design of 』was applied well to an electronic device member. The coating body which applied such an "heat-through method" to the electronic device member and absorbed and radiated the amount of heat emitted from the electronic device from the "surface of the board" to the "surface of the board" is a novel novel.

Next, before describing each coating body, the relationship between a 1st coating body (coating body excellent in heat dissipation property) and a 2nd coating body (coating body excellent in heat dissipation property and self-cooling property) is demonstrated.

Both the first coater and the second coater agree with each other in that the above-described "heat-through method" is applied to the electronic device member to improve heat dissipation. However, they differ in the ultimately oriented task (the main task), and the technical idea and composition for solving the task. That is, in the first coating body, the improvement of heat dissipation (decrease in the internal temperature of electronic equipment) is the biggest problem, and the idea that "the enemy of infrared radiation of surface and back surface is preferably as high as possible" is thought. The lower surface and the back surface are integrally constituting the heat dissipation coating film, and the configuration of the heat dissipation coating film is specified; In the second coating body, the above-mentioned "invention of the heat-transfer method" is used, while maintaining the heat dissipation characteristic to some extent, and the "temperature rise control of the coating itself" is the biggest problem, and the "infrared emissivity of the front and rear surfaces" The difference between the surface and the back surface of the surface and the back surface is determined separately by actively dissipating, and the infrared radiation rate of the back surface is lower than that of the surface and the infrared radiation rate of the surface is released as high as possible. In terms of control, the invention can be said to have different directing directions.

That is, the 1st coating body also includes the aspect with very good heat dissipation, and inferior self cooling. On the other hand, although the 2nd coating body is very excellent in self-cooling property, it also includes the aspect which is slightly lower compared with a 1st coating body regarding heat dissipation. In order to further ensure such a difference, the area | region (range | range which is excellent in the heat dissipation characteristic which satisfy | fills said Formula (1)) defined by the 1st coating body is shown in FIG. The area | region (the overlap part of the range which was excellent in the heat dissipation characteristic which satisfy | fills the said Formula (5), and the range which was excellent in self-cooling which satisfy | fills said Formula (4)) defined by the 2nd coating body is shown in FIG. 3, respectively. These field coatings also include overlapping parts (excellent heat dissipation characteristics due to the high infrared radiation on the front and back surfaces, and self cooling due to higher surface infrared emissivity than the rear surfaces). And self-cooling are both very good regions.

Hereinafter, the coating body which concerns on this invention is demonstrated.

(A) About the coating material (first coating material) for electronic device members excellent in heat dissipation

The first coating body is made based on the above-described basic idea, and is completed by revealing that a desired heat dissipation film is coated on the front and back surfaces of the substrate to achieve a desired purpose.

That is, the said 1st coating body is a coating body for an electronic device member, and is shown in the surface and back surface of the board | substrate (in this invention, the outside air side is called "surface" and this inside of this coating body is called "back surface" from this coating body.) An integral emissivity (hereinafter sometimes referred to simply as "infrared integral emissivity" or "infrared emissivity") in an arbitrary infrared wavelength range (wavelength: 4.5 to 15.4 µm) is coated with a heat dissipation coating film that satisfies a predetermined range. It has a technical idea to secure excellent heat dissipation by using a coating body.

For example, conventional coats include, for example, after coats to be coated after processing such as press work, and precoats to be coated before processing. As in the invention, there is no idea that "applied to the design of an electronic device member to improve heat dissipation by applying a heat penetrating method", so that the heat dissipation coating film having predetermined heat dissipation is not coated on the front and back surfaces of the substrate. In fact, these conventional coatings are coated on the exterior surface (surface) in terms of design, functionality (corrosion resistance, etc.), but their heat dissipation characteristics are low. On the other hand, the back surface (inner surface of the coating body) is actually painted only to ensure the minimum corrosion resistance even if it is unpainted or painted (therefore, the heat dissipation characteristics of the expectation cannot be obtained). Therefore, it is confirmed by the Example demonstrated later that such a single-sided coating body could not acquire the heat dissipation characteristic as much as expected.

Hereinafter, the said coating body is demonstrated concretely.

The first coating member is coated with a heat dissipation coating film having heat dissipation on the front and back surfaces of the substrate, and is an index indicating "excellent heat dissipation", and is represented by ΔT1 (difference in the internal temperature of the electronic device) shown below (I), or ( It satisfies "a x b" (the product of infrared ray emissivity on the front and back of a coating body) shown in II).

Among these, "a x b" defines the product of the emissivity of infrared rays emitted from the coating body, and is useful as an index indicating the heat dissipation effect of the coating body. On the other hand, ΔT1 defines the heat dissipation effect of the practical level that simulates the use of electronic device members, and the ambient temperature assumed for this purpose (ambient temperature varies depending on the type of electronic device, etc.), but is approximately 50 to 70 ° C., the highest. Since the heat dissipation characteristic can be evaluated in about 100 degreeC), it is the reason employ | adopted in this invention.

Thus, both are useful as indices of "heat dissipation" and have good correlation. For reference, a graph plotting the results (Tables 1 and 3) of the examples is shown in FIG. 4. In the drawings, Is the result of the coating material of which the composition of the heat-dissipation coating film of front and back surface differs; Shows the results of the coated bodies having the same composition of the heat dissipation coating film on the front and back surfaces (carbon black is used as the black additive).

According to the first coating material that satisfies such heat dissipation characteristics, the heat dissipation characteristics are excellent even when the heat generation amount in the chassis increases (high temperature) and deteriorates according to the high performance and miniaturization of the electronic device. The temperature inside the device can be lowered. Therefore, it is very useful, such as extending the life of electronic components, increasing power consumption, lowering noise, and increasing the degree of freedom in designing devices (high speed, high functionality, miniaturization, etc.).

Hereinafter, each characteristic is demonstrated.

(Ⅰ) △ T1 (= T1 _B -T1 _A ) ≥2.6 ℃

Here, T1 _A is the temperature of the T1 position at the time of using the said coating body as a test material using the heat dissipation evaluation apparatus shown in FIG. 1; Similarly, T1 _B means the temperature at the T1 position when the heat dissipation evaluation device of FIG. 1 is used and a substrate without a coating film is used as the test material.

In the present invention, ΔT1 is an index indicating how much the internal temperature of the electronic device can be reduced when using the coating body of the present invention, compared with the case of using a substrate (the original original without coating). In particular, the present invention's original heat dissipation evaluation device shown in Fig. 1 was used as the device for measuring ΔT1. The apparatus of FIG. 1 is very useful as an apparatus capable of evaluating the heat dissipation characteristics of an ambient temperature (an atmosphere temperature varies depending on the type of electronic device member, etc., but roughly 50 to 70 ° C., at most about 100 ° C.), which is assumed for use in electronic devices. Accordingly, it is possible to correctly evaluate the heat dissipation effect at the practical level simulating the use of electronic equipment. Conventionally, since there was no useful apparatus which can evaluate heat dissipation, the heat dissipation evaluation apparatus including the apparatus of FIG. 1 is also included in the scope of the present invention (to be described later).

1 is an apparatus of a rectangular parallelepiped whose inner space is 100 mm (length) x 130 mm (width) x 100 mm (height). In Fig. 1, 1 is a specimen (subject, measuring area is 100 × 130 mm), 2 is a heat insulating material, 3 is a heating element (lower area is 1300 mm 2, the longest straight line that can be drawn within the heating element area. Length (diagonal length in FIG. 1) is 164 mm], and 5 is a thermometer.

Among these, the silicon lava heater is used for the heat generating body 3, and the thing which adhered the aluminum plate (infrared emissivity 0.1 or less) on it is used. In addition, the thermocouple is fixed as the thermostat 5 at the T1 position (the central portion of the inner space (50 mm upward from the heating element 3)) in FIG. 1. In addition, the lower part of the thermocouple is covered for the purpose of eliminating the influence of heat radiation from the heating element. Insulation material 2 changes the atmosphere temperature in the box (it also affects heat dissipation) depending on the type and usage of the material. Therefore, a metal plate having an infrared emissivity of 0.03 to 0.06 (for example, an electrogalvanized steel sheet (JIS SECC, etc.)). By using the method described below, the installation method of the heat insulating material is adjusted so that the ambient temperature (absolute temperature) at the T1 position is in the range of about 73 to 74 ° C. In addition, the factors (for example, the fixing method of test materials) which affect heat dissipation are adjusted similarly so that the atmospheric temperature (absolute value temperature) of a T1 position may be in the range of about 73-74 degreeC.

Next, a method of evaluating heat dissipation characteristics using the apparatus will be described.

In the measurement, the measurement conditions are controlled at a temperature of 23 ° C. and a relative humidity of 60% for the purpose of eliminating errors in data due to outside conditions (wind and the like).

First, each specimen 1 is installed, the power is turned on, and the hot plate 3 is heated to 140 ° C. After confirming that the temperature of the hot plate is 140 ° C stably and the temperature at the T1 position is 60 ° C or more, the test material is removed once. At the time when the temperature in the box dropped to 50 ° C, the test material was again installed and the temperature in the box 90 minutes after the installation was measured. And the difference (ΔT1) between the temperature at the time of using the said test material and the temperature at the time of using the unpainted disc which does not apply | coat is computed.

In addition, (DELTA) T1 was measured 5 times for each test material, and the average value of three points | pieces except an upper limit and a lower limit among them was set as (DELTA) T1 in this invention.

ΔT1 calculated in this manner means that the heat dissipation characteristics are excellent as large. Preferred procedures are at least 2.7 ° C, at least 3.0 ° C, at least 3.3 ° C, at least 3.5 ° C, at least 3.7 ° C, and at least 4.0 ° C.

The index (target level) of the heat dissipation characteristic varies depending on the type of electronic device, etc., but according to the present invention, as described later, the predetermined black heat dissipation can be easily controlled by appropriately controlling the black additive included in the heat dissipation coating film in relation to the coating film thickness. You can adjust the characteristics.

(II) Formula (1); a × b ≥0.42

In the formula, a and b are the infrared integrated emissivity (a) of the surface in the integral emissivity of infrared rays (wavelength: 4.5 to 15.4 μm) when the coating body coated with the heat-dissipating coating film on the front and back surfaces of the substrate is heated to 100 ° C. Infrared integrated emissivity (b) on the back means respectively. An infrared integrated emissivity can be measured by the method of mentioning later, and the infrared integrated emissivity of a surface or a back surface can be measured separately, respectively.

Said "infrared integral emissivity" means, in other words, easy to emit (easy to absorb) infrared rays (heat energy). Therefore, the higher the infrared emissivity, the greater the amount of heat energy emitted (absorbed). For example, when 100% of the thermal energy given to an object (in the present invention, a paint body) is emitted, this infrared integrated emissivity is 1.

In addition, in this invention, although the infrared integrated emissivity at the time of heating at 100 degreeC is determined, this is the coating material of this invention differs depending on an electric equipment use (member etc.), but the normal atmospheric temperature is about 50-70 degreeC, the maximum about 100 degreeC. Considering the application to), in order to match the temperature of this practical level, the heating temperature is set to 100 ℃. However, even when heated to 200 ℃, the infrared integrated emissivity hardly changed, and the infrared integrated emissivity when heated to 200 ℃ was almost 0.02 higher than that of 100 ℃. (And, in Examples described later, infrared emissivity when heated to 100 ° C. and 200 ° C. are written together).

In this invention, the measuring method of infrared integrated emissivity is as follows.

Apparatus: JIR-05500 Fourier Transform Infrared Spectrophotometer and Radiation

Fixed unit `` IRR-200 ''

Measurement Wavelength Range: 4.5 ~ 15.4㎛

Measurement temperature: Set the sample's heating temperature to 100 ℃.

Total number of times: 200 times

Resolution: 16 cm ^-1

Using this apparatus, the spectral radiant intensity (actual value) of the sample in the infrared wavelength range (4.5-15.4 micrometers) was measured. In addition, since the actual measured value of the sample was measured as the added / added value of the background radiation intensity and the device irritation, the integral emissivity was determined by using an emissivity measurement program (emissivity measurement program manufactured by Nippon Electronics Co., Ltd.) for the purpose of correcting them. Calculated. The calculation method is as follows.

[1]

In the formula,

ε (λ): Spectral emissivity of the sample at wavelength λ (%)

E (T): integral emissivity of the sample at temperature T (° C) (%)

M (λ, T): The spectral radiant intensity of the sample at wavelength λ and temperature T (° C)

Chi)

A (λ): device irrigation

K _FB (λ): Fixed background at wavelength λ (no change with sample)

Is the spectral radiant intensity of the background

K _TB (λ, T _TB ): Spectroradiation of Trump Blackbody at Wavelength λ, Temperature T _TB (° C)

burglar

K _B (λ, T): The spectral radiant intensity of the black body at the wavelength λ and the temperature T (° C) (blank

Calculated from the theoretical formula of

λ ₁ , λ ₂ : Range of wavelengths to integrate

Means each.

Here, A (λ: device irrigation) and K _FB (λ: fixed background spectral radiant intensity) are measured values of spectral radiant intensities of two black body furnaces (80 ° C and 160 ° C) and this temperature range. It is computed by the following formula based on the spectral radiant intensity (calculated value from the theoretical formula of blank) of the black body in.

[Number 2]

In formula, M ₁₆₀ degreeC ((lambda), 160 degreeC): spectral emission to black body of 160 degreeC in wavelength (lambda)

Strength (actual value)

M ₈₀ ° C (λ, 80 ° C): Spectroradiation into a black body at 80 ° C at wavelength λ

Strength (actual value)

M ₁₆₀ ° C (λ, 160 ° C): Spectroradiation to a black body at 160 ° C at wavelength λ

Strength (calculated from the theoretical formula of the blank)

M ₈₀ ° C (λ, 80 ° C): Spectroradiation into a black body at 80 ° C at wavelength λ

Strength (calculated from the theoretical formula of the blank)

Means each.

In the calculation of the integral emissivity E (T = 100 ° C.), K _TB (λ, T _TB ) is taken into account because a water-cooled Trump black body is placed around the sample in the measurement. By the installation of the Trump blackbody, the fluctuating background radiation (means background radiation that varies with the sample. Since the radiation from the surroundings of the sample is reflected on the sample surface, the actual value of the spectral radiant intensity of the sample is added to this background radiation. It is possible to control the spectral radiation intensity of the low). The Trump black body uses a pseudo black body with an emissivity of 0.96, and the K _TB [(λ, T _TB ): spectral radiant intensity of the Trump black body at a wavelength λ and a temperature T _TB (° C.)] is as follows. Calculate as

K _TB (λ, T _TB ) = 0.96 × K _B (λ, T _TB )

In the formula, K _B (λ, T _TB ) means the spectral radiant intensity of the black body at the wavelength λ and the temperature T _TB (° C.).

The 1st coating body which concerns on this invention is the integral emissivity (the said E (T = 100 degreeC)) of the infrared rays (4.5-15.4 micrometers) measured in this way, and the infrared integral emissivity of the coating body by which the heat-dissipation coating was coat | covered on the surface ( The product (a x b) of the infrared integrated emissivity (b) of a) and the back surface coated with a heat-dissipating coating film satisfy | fills 0.42 or more (Equation (1)). As described above, the numerical value (a product of infrared integrated emissivity emitted from the coating body) calculated as "a x b" is useful as an index indicating the heat dissipation effect of the coating body itself. On the contrary, the average level of the heat dissipation characteristics of the first coating body was set to "a x b ≥ 0.42" in order to exhibit an average high radiation characteristic. The numerical value of "a x b" (maximum 1) is The larger (closer to 1), the better the heat dissipation characteristics, and the preferred order is 0.49 or more, 0.56 or more, 0.61 or more, 0.64 or more, 0.72 or more.

Further, in the first coating body, as long as the above-described target level of heat dissipation characteristics is satisfied, the relationship between the infrared radiation rate of the front surface and the infrared radiation rate of the back surface is not particularly limited, and the aspects and both sides of which the infrared radiation rates of the surface and the back surface are different are different. Both of embodiments having the same degree of emissivity. On the other hand, in the 2nd coating body which concerns on this invention, improvement of self-cooling property is mainly aimed at in addition to heat dissipation, and both differ from the point which limits only the coating body with a high infrared emissivity on the surface compared with the back surface. [We describe in term of (b) to be].

Specifically, as long as the heat dissipation characteristic of the formula (1) "a x b> 0.42" is satisfied, the surface / rear surface can determine any infrared ray emissivity. However, since the maximum value of infrared ray emissivity is 1, in order to satisfy said formula (1), the infrared ray emissivity of at least one surface is 0.42 or more; In order to satisfy axb≥0.56, the infrared emission factor of at least one side is 0.56 or more; In order to satisfy axb? 0.62, it is necessary to set the infrared emissivity of at least one side to 0.64 or more.

Here, it is more preferable that the larger the infrared ray emissivity of one side is, and it is preferable that the infrared ray emissivity of at least one side satisfies 0.65 or more. More preferable order is 0.7 or more, 0.75 or more, 0.8 or more. It is more preferable that the coating body of both surfaces is 0.65 or more.

In the said 1st coating body, it is preferable that the difference (A-B) between the maximum value A and the minimum value B of the spectral emissivity in the arbitrary wavelength range of the said infrared ray (wavelength 4.5-15.4 micrometers) is 0.35 or less. This "A-B" shows the "change range of the emissivity" in the said infrared wavelength range, and "A-B <= 0.35" shows the stable and high radiation characteristic also in any of the said infrared wavelength ranges. Therefore, it is expected that the use of the above-mentioned requirements will be extended to use for electronic device members, for example, to be used for applications such as electronic devices equipped with various components having different wavelengths of emitted infrared rays. Specifically, any emissivity measured as described above is measured, and the difference (A-B) between the maximum value A and the minimum value B of the spectral emissivity in this wavelength range is calculated as the "change rate of emissivity". The smaller the numerical value of "A-B" is, the more stable heat dissipation characteristics can be obtained, more preferably 0.3 or less, and very preferably 0.25 or less.

Next, the specific structure for obtaining the said 1st coating body is demonstrated.

The coating body is a coating body having a heat radiation coating film having heat dissipation on the front and back surfaces of the substrate, but the content X of the black additive included in at least one side of the heat dissipation coating film (% by mass, hereinafter, unless otherwise specified, "%" is " Mass% &quot;) can be appropriately controlled in relation to the coating film thickness Y (µm), so that heat dissipation characteristics as expected can be obtained. Specifically, said X and Y satisfy following formula (2), Among these, Preferably, following formula (3), Y preferably satisfies Y> 1 micrometer.

① Formula (2): (X-3) × (Y-0.5) ≥ 15

Hereinafter, the calculated value of the left side [(X-3) x (Y-0.5)] may be represented by P value.

Equation (2) below is a content requirement for obtaining the above-mentioned heat radiation characteristic [indicator indicated by [Delta] T1 or (a × b)], and the content X (%) of the black additive contained in at least one side of the heat radiation coating film and the film thickness Y. (Μm) is defined. The above formula means that in order to secure the "heat dissipation characteristics" defined by the first coating body, it is necessary to appropriately control black additives such as carbon black in relation to the film thickness, and "when the coating film is thin, The content of the black pigment per unit thickness should be increased (that is, the black pigment content per unit thickness is large), but if the coating film thickness is thick, the content of the black pigment is at least good (that is, the black pigment content per unit thickness is reduced) ''. Is to formulate the view.

Here, the P value [= (X-3) × (Y−0.5)] and the heat dissipation characteristic generally show a good correlation. Fig. 5 is a graph of the relationship between the P value and the heat dissipation characteristic (a × b) based on the results (Tables 4 and 5) of the examples to be described later, but the target level of the heat dissipation characteristics held by the first coating body is shown. In order to ensure (a × b ≥ 0.42, ΔT1 ≥ 2.6 ° C), it is necessary to make the P value 15 or more. According to the present invention, when an index of heat radiation characteristics is determined, a P value corresponding to the heat radiation characteristics is calculated, and the heat radiation characteristics as expected are easily secured simply by appropriately adjusting the ranges of X and Y so as to obtain the P values. There is a merit to do.

In addition, in order to obtain more excellent heat radiation characteristics, the said P value is so preferable that it is preferable, and as a preferable order, it is 7 or more, 11 or more, 15 or more, 30 or more.

However, even if the P value is excessively large, the heat dissipation characteristic is saturated, and the amount of the black additive to be used is not only increased, but also economically wasteful, and the coating body of the present invention is used as a framework of the electronic device, and workability and conductivity are also required. In consideration of the above, it is recommended to control the upper limit of the P value to 240, 200, 150, 100 in the preferred order.

② Equation (3): 4% ≤ X <15%

In addition, in this invention, it is recommended to make content X of a black additive more than 3%, and to be 4% or more. Here, the assumption of "X> 3%" is because (X-3), which is the coefficient on the left side of the equation, must be positive (> 0) in order to satisfy the above expression (2).

In addition, the lower limit of X is determined in order to obtain excellent heat dissipation characteristics and to ensure the characteristics (paintability, appearance, etc.) of the coating itself, and at 3% or less, the characteristics as expected cannot be obtained. Preferable lower limits are 5%, 7%, 8% and 10%. On the other hand, the upper limit of X is not particularly controlled in relation to the heat dissipation characteristics. However, when the upper limit is 15% or more, paintability is poor and coating stains occur, resulting in poor appearance. Therefore, the upper limit with consideration of coating property etc. is in order of less than 15%, 13%, and 11% in order.

③ Y〉 1㎛

Furthermore, in the present invention, with respect to the coating film thickness Y of the heat dissipation coating film, it is recommended that the thickness of the thermal radiation coating film be more than 0.5 µm and more than 1 µm. It is assumed here that "Y> 0.5 µm" because it is necessary that (Y-0.5), which is the coefficient on the left side of the equation, to be positive (> 0) in order to satisfy the above expression (4).

The lower limit of the above Y is specifically determined to obtain heat dissipation characteristics, and when Y is 0.5 µm or less, even if a large amount of black additive is added, the heat dissipation effect as expected cannot be obtained. Preferable minimum is 3 micrometers, 5 micrometers, 7 micrometers, and 10 micrometers in order.

The upper limit of the Y is not particularly limited in relation to the heat dissipation characteristics, but the coating body of the present invention is intended to be applied to electronic device components, and improvement of workability is also required in relation to this use; In particular, in consideration of the occurrence of cracks or peeling of the coating film during bending, it is recommended to control the thickness to 50 µm or less (more preferred order is 45 µm or less, 40 µm or less, 35 µm or less, 30 µm or less).

In addition, in order to have good workability and to ensure excellent conductivity, it is recommended to control the Y to 12 m or less (preferably in the order of 11 m or less, more preferably 10 m or less).

In the above formula (2), X (content of the black additive) and Y (film thickness) have been described.

In addition, the black additive used in the present invention is not particularly limited as long as it can impart black, and examples thereof include carbon black. Other examples include Fe, Co, Ni, Cu, Mn, Mo, Ag, Sn, and the like. Oxides, emulsions, carbides, and fine black metal powders can be used. Most preferred is carbon black.

Here, the addition amount X of carbon black in a coating film can be measured by the following method.

First, a solvent is added to a subject (analytical sample) and warmed, and the organic substance in a subject is decomposed. The kind of solvent to be used also varies depending on the type of base resin, and an appropriate solvent may be used depending on the solubility of each resin. For example, when a polyester resin or a urethane resin is used as the base resin, sodium hydroxide is used. The subject is added to a container (such as a nasal flask) to which a ethanol solution is added, and the container is heated with a water pass at 70 ° C to decompose the organic matter in the subject.

Subsequently, this organic substance is hung by a glass filter (pore diameter 0.2 micrometer), the carbon in the obtained residue is quantified by a combustion infrared absorption method, and the carbon black concentration in a coating film is computed.

It is preferable to control the average particle diameter of the said black additive to 5-100 nm. If the average particle diameter of the said additive is less than 5 nm, the heat dissipation characteristic as much as expected cannot be acquired, In addition, paint stability will be bad and coating appearance will fall. On the other hand, when the average particle diameter exceeds 100 nm, not only the heat dissipation characteristic is reduced, but also the appearance after coating is uneven. Preferably it is 10 nm or more and 90 nm or less; More preferably, they are 15 nm or more and 80 nm or less. In addition to the heat dissipation characteristics, the overall average particle size of the black additive is recommended to be about 20 to 40 nm, considering overall coating stability and post-coating appearance uniformity.

In addition, the kind of resin (base resin for forming a heat-resistant coating film) added to the coating film is not particularly limited in terms of heat dissipation characteristics, and acrylic resins, urethane resins, polyolefin resins, polyester resins, fluorine resins and silicone resins are not particularly limited. And these mixed or modified resin etc. can be used suitably. However, since the coating body of the present invention is used as a framework of an electronic device, considering that the improvement of workability is required in addition to heat dissipation, the base resin has a non-hydrophilic resin (specifically, the contact angle with water is 30 ° or more (more preferably, Is 50 ° or more, more preferably 70 ° or more). Resin that satisfies such non-hydrophilic characteristics may change depending on the number of mixing, the degree of modification, etc., for example, polyester resin, polyolefin resin, fluorine resin, silicone resin and mixed or modified resin thereof. It is preferable to use, for example, thermosetting polyester-based resin such as polyester-based resin or modified polyester-based resin (epoxy-modified polyester-based resin, polyester-based resin in which phenol derivative is introduced into skeleton) Resins or unsaturated polyester-based resins) is recommended.

In addition to the black additives such as carbon black, pigments such as rust preventive pigments and silica may be added to the coating film within a range that does not impair the effect of the present invention. Alternatively, additives having heat dissipation other than black additives (for example, at least one of TiO ₂ , ceramics, iron oxide, aluminum oxide, barium lactate, silicon oxide, and the like) may also impair the effect of the present invention. It can be added in a range not exceeding.

In addition, a crosslinking agent may be added to the coating film. As a crosslinking agent used for this invention, a melamine type compound, an isocyanate type compound, etc. are mentioned, for example, It is recommended to add these in 1 or 2 types on 0.5 to 10 weight% of range.

Thus, although the coating body of this invention was coated with the heat-dissipation coating film containing black pigments, such as carbon black, the coating steel plate which added black pigments, such as carbon black, to the resin coating film conventionally is disclosed.

For example, Japanese Patent Application Laid-Open No. 3-120378 discloses a method for producing a far-infrared radiation plate (a ceramic layer having far-infrared characteristics formed on a substrate) used for a hot air balloon member. Black pigments such as carbon black may be added, whereby far-infrared radiation characteristics are exhibited; The compounding quantity is 0.1-10 weight part per 100 weight part of resin, and the resin film thickness is 0.1-5 micrometers normally. "

However, in the far-infrared radiation plate described in the above publication, only a ceramic layer is formed on one side of the substrate, and since the coating film is not formed on the front and back surfaces of the substrate as in the paint plate of the present invention, heat dissipation as expected cannot be obtained. .

From the beginning, since they differ in their application (use), the technical idea underlying the problem solving means is different and the configuration requirements are different. That is, the far-infrared radiation plate of the above publication is used in the field of a hot air balloon (typically a stove, etc.) requiring heat dissipation characteristics under a very high temperature of about 200 to 300 ° C. Is not intended for application to the electronic device member which is usually about 40 to 70 ° C at the ambient temperature and even at most 100 ° C. Therefore, in the above publication, the only idea is to increase the emissivity (radiation) of far-infrared radiation emitted from a hot air balloon such as a stove. Therefore, only carbon black is added. In order to reduce the amount of heat emitted from the electronic device in the so-called &quot; heat penetration method &quot;

In fact, since only one side of the radiating plate is coated, the change in integral emissivity and emissivity was examined under the conditions described in the present invention, and it was confirmed by experiment that excellent heat dissipation characteristics could not be obtained as in the present invention. No. 19 in Table 5).

In the above publication, the black film is formed by blackening the Zn-Ni alloy plated steel sheet as a base, and the black resin film is coated on the upper layer to exhibit far-infrared radiation characteristics in the high temperature region. When applied to an electronic device member (which is used at a much lower temperature region than that of a far infrared ray radiating plate) which is the object of the present invention as it is, various unreasonable states arise because the required characteristics are different depending on the use. In other words, (1) more severe bending processability is required in electronic device members than in hot air balloon applications, so cracks occur in the alloy plating layer, and black resin film or plating residue is peeled and dropped from the cracks. ; (2) If such peeling or dropping occurs inside the alloy plating layer, the peeled film or plating dregs may adhere to and accumulate on the parts of the electronic device, causing the electronic device to break down.

Therefore, I think that this invention and the said radiation plate are another invention.

In the above, the heat radiation coating film containing a black additive was demonstrated. In the first coating body, at least one surface of the heat dissipation coating film coated on the front and back surfaces of the substrate mainly contains a black additive, but the other heat dissipation coating film is not limited to this, and exhibits heat dissipation characteristics as expected in the present invention. A heat dissipation coating film may be formed by adding an additive having a heat dissipation other than a black additive (also referred to as "other heat dissipating additives") to satisfy. Of course, the coating body which has the black additive containing heat-dissipation coating film which satisfy | fills the said relationship on both the front and back surfaces is especially preferable aspect.

Here, Examples of the "other additives heat dissipation", there may be mentioned at least one kind of TiO _2, ceramic, iron oxide, aluminum oxide, barium sulfate, silicon oxide, etc. on one or two or more kinds. The coating film thickness of the heat-dissipating film mainly containing such "other heat-dissipating additives" can be set to a suitable film thickness so that the heat dissipation characteristics as expected can be obtained depending on the type and application of the "other heat-dissipating additive" to be used. It is preferable to set it as about 30 micrometers.

Specifically, in the case of the TiO ₂ -containing coating film, when the coating film containing about 40 to 60% of TiO ₂ is formed in the coating film, about 25 to 30 μm, an infrared emissivity of about 0.8 can be obtained. In addition, when an black additive such as carbon black is added to the coating film, the infrared emissivity is further increased. In addition, when it is desired to apply a metallic-like appearance, Al flakes and the like are added in an amount of about 5 to 30%, and the thickness of the coating is about 5 to 30 µm. Can be obtained.

(B) About coating material (second coating material) for electronic device member having excellent emissivity and self cooling

The said 2nd coating body is a coating body which coat | covers the coating film on the front and back surface of a board | substrate, and the heat-dissipating coating film which has a heat dissipation coating | coating on the at least surface of a board | substrate, and (DELTA) T2 shown below as an index which shows "excellent self-cooling property". (Degree of inhibiting the temperature rise of the coating itself) or formula (4) [b ≦ 0.9 (a-0.05)] shown in the following (IV); In addition, the index (5) [(a-0.05) × (b-0.05)? 0.08] shown in the following (V) is satisfied as an index indicating "excellent heat dissipation" in the second coating body.

First, the index of self cooling is demonstrated.

Equation (4) is defined as an index indicating the heat radiation effect of increasing the infrared radiation rate of the surface compared to the infrared radiation rate of the back surface and moving the heat absorbed by the coating material to the outside air, while ΔT2 is used as an electronic device member. The heat dissipation effect of the simulated practical level coated body is determined.

Thus, both are useful as indices for "self cooling" and have good correlation. For reference, a graph plotting the results of Examples described later is shown in FIG. 6. The vertical axis | shaft of FIG. 6 is the calculated value (henceforth represented by a Q value) of the left side (0.9a-b) among the formulas (0.9a-b≥0.05) which transformed the said Formula (4).

According to the second coating body that satisfies such self cooling, the temperature rise of the coating body itself can be suppressed. Therefore, when the coating body is used as a frame of the electronic device, the operator touches it when the electronic device is operating. Even if it feels "not hot," it can provide a safe electronic device from the handling side. In addition, since the coating material has good heat dissipation, the electronic device member having both of these characteristics is very useful in that it brings about expansion of new applications.

Hereinafter, each characteristic of (III)-(V) is demonstrated.

(Ⅲ) △ T2 (= T2 _B -T2 _A ) ≥0.5 ℃

Here, T2 _A is the coating material temperature at the time of measuring the coating material of this invention as a test material using the heat dissipation evaluation apparatus shown in FIG. 1 mentioned above; T2 _B similarly means the substrate temperature at the time of using the heat dissipation evaluation apparatus of FIG. 1, and using the board | substrate with which the coating film was not coat | covered as a test material. In addition, (DELTA) T1 was measured similarly to the previous description. And the difference (ΔT2) between the temperature at the time of using a test material and the temperature at the time of using the unpainted disc which did not coat is computed.

In addition, (DELTA) T2 was measured 5 times in each test material, and the average value of the data of three points except an upper limit and a lower limit among them was set as (DELTA) T2 in this invention.

[Delta] T2 is an indicator of how much the temperature rise of the coating body itself can be suppressed when the electronic device is operated when the coating body of the present invention is used, compared with the case where the substrate (the original plate without the coating film) is used. Cooling property), and in the present invention, the heat dissipation evaluation device of the present invention, as shown in Fig. 1, was used as the device for measuring ΔT2.

In order to obtain the excellent self-cooling property, it is preferable that DELTA T2 is larger. As preferable order of (DELTA) T2, they are 1.0 degreeC or more, 1.5 degreeC or more, 2.0 degreeC or more, and 2.5 degreeC or more.

(IV) Formula (4): b ≤ 0.9 (a-0.05)

In the formula, the meanings of a and b and the measuring method of the infrared integrated emissivity are as described in the above (II).

As mentioned above, said Formula (4) is also useful as an index of "self cooling" which suppresses the temperature rise of the coating body itself. The above formula is based on the technical idea of "to suppress the temperature rise of the coating body by performing the coating film which made the infrared radiation rate of the surface (outer air side) of the board | substrate high compared with the back surface (inside of electronic equipment) of a board | substrate" The relational expression of the infrared emissivity of the surface and the back surface which can ensure cooling property ((DELTA) T2> 0.5 degreeC) is specified.

When using a coating body as a frame of an electronic device, when the infrared emissivity of the inner surface (back surface) of a frame is raised, the amount of infrared absorption emitted from the heat source in an electronic device will increase, and the temperature of a coating body itself will rise. On the other hand, when the emissivity of the outer surface (surface) of a frame is raised, the amount of infrared rays emitted to the outside air from a coating body will increase, and the temperature of a coating body will also fall. According to the present invention, the above formula is determined by performing various experiments. According to the present invention, the amount of heat radiated from the surface side of the substrate becomes larger than the amount of heat absorbed (radiated) on the back surface side of the substrate. The temperature rise of the sieve itself can be suppressed with high efficiency.

Thus, the coating body which forms the coating film which differs in the heat dissipation characteristic on the surface and back surface of a board | substrate, and maintains the level of heat dissipation characteristic to some extent, and suppresses the temperature rise of a coating body is thought to be a novel thing conventionally unknown.

Therefore, in the second coating body, the greater the difference between the infrared emissivity of a and b, the better self cooling can be obtained. Specifically, the larger the Q value (= 0.9a-b) is, the more preferable, and the preferred order is 0.13 or more, 0.24 or more, 0.35 or more, and 0.47 or more.

(V) Formula (5): (a-0.05) × (b-0.05) ≥ 0.08

Equation (5) specifies the index of the heat dissipation characteristic in the second coating body by the product of the infrared integrated emissivity on the front and back surfaces, and the calculated value of the left side [(a-0.05) × (b-0.05)]. The larger (hereinafter, may be represented by R value), the better the heat radiation characteristic (ΔT1). The lower limit is preferably 0.35 (about 2.6 deg. C at ΔT1) and 0.52 (about 3.5 deg. C at ΔT1) in order.

The above equation (5) has a good correlation with the above-described ΔT1 ("differential difference in internal temperature of the electronic device" described by the first coating body). FIG. 7 is a graph plotting the result of the example described later. Indicated.

The level of the heat dissipation characteristic (ΔT ≧ 1.5 ° C. in terms of DELTA T1) in the second coating body is wider than the level (ΔT ≧ 2.6 ° C.) of the first coating body. This is a major problem in the second coating body to improve self-cooling, and as long as this problem is achieved, the level of heat dissipation characteristics may be slightly lower than that of the first coating body. It is decided.

Next, the specific structure for obtaining the said 2nd coating body is demonstrated.

The said coating body is coat | covered with the coating film in the front and back of the board | substrate, and the heat-dissipating coating film which has a heat dissipation is coat | covered at least the surface of a board | substrate. In order to ensure the self cooling as much as expected, it is necessary to satisfy the above formula (4) by increasing the infrared radiation rate of the surface relative to the back surface, and the heat dissipation characteristic must satisfy the above formula (5). Thus, since the level of the heat dissipation characteristic calculated | required by the surface and the back surface in a 2nd coating body differs, it demonstrates divisionally below.

First, in the coating body of the said 2nd formula, "the surface heat-dissipation coating film" includes the aspect of the following (i) and (ii).

(Iii) An aspect in which a black additive is mainly added and the black additive (X) contained in the heat dissipation coating film is controlled in relation to the coating film thickness (Y).

In the case where a black additive is added to the surface coating film and the heat dissipation characteristic is increased, X and Y may be appropriately controlled so that the addition amount (X) and the coating film thickness (Y) of the black additive satisfy the following formula (6). Specifically, it is as follows (4)-(6).

④ Formula (6): (X-3) × (Y-0.5) ≥ 3

Equation (6) defines the relationship between X and Y for realizing the target level of heat dissipation (ΔT ≥1.5 ° C) in the second coating body, wherein P value [= (X-3) × (Y − 0.5)], the better the heat dissipation characteristic is obtained. Preferred order is 7 or more, 11 or more, 15 or more, 30 or more, 50 or more.

However, even if the P value is excessively large, the heat dissipation characteristics are saturated, and the amount of the black additives to be used is not only increased, but also economically wasteful, and the coating body of the present invention is used as a framework for electronic devices, and workability and conductivity are also required. In other words, it is recommended to control the upper limit of the P value to 240, 200, 150, 100 in the preferred order.

In addition, the minimum of said Formula (6) is small compared with the minimum of Formula (2) prescribed | regulated by the 1st coating body. This is because the heat dissipation characteristic level of the second coating body may include a slightly lower mode than the first coating body, and thus the allowable range is wide.

⑤ Equation (7): 4% ≤X 〈15%

The content X of the black additive is assumed to be more than 3%, and it is recommended to be 4% or more. The premise of "X> 3%" is that in order to satisfy the above formula (6), (X-3), which is the coefficient on the left side of this formula, must be positive (> 0). to be.

In addition, the lower limit of X is determined in order to obtain excellent heat dissipation characteristics and to ensure the characteristics (paintability, appearance, etc.) of the coating itself, and at 3% or less, the characteristics as expected cannot be obtained. Preferable lower limits are 5%, 7%, 8% and 10%. On the other hand, the upper limit of X is not particularly limited in relation to the heat dissipation characteristics, but when it is 15% or more, paintability is poor and coating stains are generated, resulting in poor appearance. Therefore, the upper limit with consideration of coating property etc. is less than 15%, 13%, and 11% in order.

⑥ Y〉 1㎛

The coating film thickness Y of the heat dissipation coating film is assumed to be more than 0.5 µm, and more than 1 µm is recommended. It is assumed here that "Y> 0.5 µm" because in order to satisfy the above formula (6), it is necessary that (Y-0.5), which is the coefficient on the left side of the formula, to be positive (> 0). .

The lower limit of the above Y is specifically determined to obtain heat dissipation characteristics, and when Y is 0.5 µm or less, even if a large amount of black additive is added, the heat dissipation effect as expected cannot be obtained. Preferable minimum is 3 micrometers, 5 micrometers, 7 micrometers, and 10 micrometers in order.

The upper limit of the above Y is not particularly limited in relation to the heat dissipation characteristics, but the present invention is intended to be applied to an electronic device component, and in view of improving the workability, it is also required in view of the use thereof; In particular, in consideration of the occurrence of cracks or peeling of the coating film during bending, it is recommended to control the film to 50 µm or less (more preferred order is 45 µm or less, 40 µm or less, 35 µm or less, 30 µm or less).

In addition, in order to have good workability and to ensure excellent conductivity, it is recommended to control the Y to 12 m or less (preferably in the order of 11 m or less, more preferably 10 m or less).

(Ii) Embodiment which mainly adds other additives other than black additive

In the case where an additive other than a black additive is used in order to enhance the heat dissipation characteristics of the surface coating film, examples of the other additive include TiO ₂ , ceramics, iron oxide, aluminum oxide, barium lactate, and silicon oxide. These can be used on one or two species. Moreover, you may add black additives, such as carbon black. The coating film thickness of the heat dissipation coating film can be appropriately determined according to the type of additive to be used so as to obtain the heat dissipation characteristics as expected, and it is recommended to be about 5 to 30 μm.

Specifically, in the case of the TiO ₂ -containing coating film, it is recommended to add approximately 50 to 70% of titanium oxide in the coating film and to set the coating film thickness to about 25 to 30 µm. In addition, when it is desired to apply a metallic-like appearance, Al flakes and the like are added in an amount of about 5 to 30%, and the coating thickness is preferably about 5 to 30 µm.

Next, the "coating film of the back surface" is demonstrated in the 2nd coating body which concerns on this invention. The above-mentioned "backside coating film" needs to be a heat dissipation coating film in order to ensure excellent self-cooling property, but a "backside coating film" should always be a heat dissipation coating film as long as the characteristics as expected in the second coating body can be obtained. There is no need. That is, the second coating body does not include the "single-coated steel sheet" which is not coated on the back surface of the substrate (infrared emissivity of the original film without coating is about 0.04, so that the magnetic cooling as expected cannot be obtained). Arbitrary coating films can be employ | adopted as long as Formula (4) is satisfied.

Specifically, other additives other than the above black additives and black additives may be used alone or in combination, and the addition amount and the coating film thickness may be appropriately adjusted in accordance with the emissivity of the surface coating film to form the coating film on the back surface. In addition, when forming a coating film of the back surface using a black additive, even if the relationship of said X and Y does not necessarily satisfy Formula (6) mentioned above, even if it is a coating film which hardly has heat dissipation (The above P value is less than 0). Appropriate control of the infrared emissivity of the surface coating film ensures self-cooling as expected (see Nos. 1 and 11 in Table 6).

Or the coating film which controlled the coating film thickness to a predetermined range (about 2.5 micrometers or more) without adding the said additive can also be employ | adopted (refer No. 3 and 7 of Table 6). This is because some degree of heat dissipation characteristics can be obtained only by the resin contained in the coating film.

Specifically, for example, when non-hydrophilic polyester-based resin is used as the coating film forming resin, the coating film thickness may be adjusted to approximately 2.5 µm or more.

In the above, the basic structure was demonstrated about the black additive / other additive which forms the coating film of the surface and the back surface in the 2nd coating body which concerns on this invention. In addition, in the said coating film, the kind and average particle diameter of the black additive to be used; Types of additives other than black additives; The kind of resin, additive, etc. which are added to a coating film are as having demonstrated with the 2nd coating body mentioned above.

(C) An electronic device having high conductivity in the coatings of (a) and (b). About member coating body (third coating body)

The third coating body according to the present invention is also excellent in conductivity, and has an electrical resistance of 100? Or less as its index. Preferably it is 10 or less.

Here, the measuring method of electrical resistance is as follows.

Mitsubishi Chemical Corporation "Loresta EP" and the probe used Mitsubishi Chemical Corporation 2 probe (MCP-TP01) as a conductivity measuring device. In the measurement, two sheets of copper plates each having a thickness of 0.8 mm and a size of 20 mm were placed between the probe and the measurement sample so that the copper plates did not come into contact with each other, and the resistance (Ω) of the specimen was measured.

Thus, in order to obtain the coating material excellent in electroconductivity, it is necessary to contain 10-50% of conductive fillers in the coating film of a surface and / or a back surface. In addition, in the coating body of the present invention, both the first coating body and the second coating body are coated with the coating film on the front and back surfaces of the substrate. When the conductive filler is added to both the front and back surfaces, very excellent conductivity can be obtained. Therefore, you may add a conductive filler only to one surface, and can secure predetermined electroconductivity by this.

Here, as an electrically conductive filler used for this invention, Metals, such as Ag, Zn, Fe, Ni, Cu, etc .; And metal compounds such as FeP. Especially preferred is Ni. Moreover, the shape is not specifically limited, In order to acquire the outstanding electroconductivity, it is recommended to use a flaky thing.

In addition, content of the said conductive filler contains all the components which form a coating film containing a coating film forming component (base resin, such as polyester resin, etc., also a crosslinking agent added as needed, or a black additive, an electroconductive filler, and the additive added as needed. 10 to 50% with respect to 100% (solid content conversion). If it is less than 10%, the effect as expected cannot be achieved. Preferably it is 15% or more, More preferably, it is 20% or more, More preferably, it is 35% or less. On the other hand, when content of an electroconductive filler exceeds 50%, workability will fall. In particular, when applied to the site where high bending workability is required, such as painted metal sheet, it is recommended to be 45% or less. More preferably, it is 40% or less, More preferably, it is 35% or less.

In the above, the coating film which characterizes the coating body of this invention was explained in full detail. As mentioned above, the important point of this invention is what specifies the structure of a coating film, and it does not specifically limit about board | substrates other than a coating film. Accordingly, as the substrate used in the present invention, the metal sheet, specifically, a cold rolled steel sheet, a hot rolled steel sheet, an electrogalvanized steel sheet (EG), a hot dip galvanized steel sheet (GI), an alloyed hot dip galvanized steel sheet (GA), 5 Steel plates such as% Al-Zn plated steel sheets, 55% Al-Zn plated steel sheets, various plated steel sheets such as Al, stainless steel sheets, and known metal plates can be used. ② Substrates other than metal plates, specifically, wire rods. , Bar material, pipe material, ceramic material, and the like. Among them, preferred are metal materials such as metal substrates having excellent thermal conductivity and ceramics.

In addition, the metal sheet of ① may be subjected to surface treatment such as chromate treatment or phosphate treatment for the purpose of improving the corrosion resistance, adhesion of the coating film, etc., or may use a non-chromate-treated metal plate in consideration of environmental pollution. Any of these aspects is included within the scope of the present invention.

Here, the structure of the coating body of this invention using the non-chromate-treated metal plate is demonstrated.

First, the substrate is subjected to chromium-free base treatment, and the heat dissipation coating film (at least the surface) needs to contain a rust preventive agent. In general, non-chromate treatment is known to reduce corrosion resistance, and the use of a rust preventive agent is indispensable for the purpose of improving corrosion resistance.

Here, the "substrate processing of chromium free" is not particularly limited, and any known substrate processing commonly used may be performed. Specifically, it is recommended to carry out the base treatment such as phosphate, silica, titanium, zirconium or the like alone or in combination.

In addition, as the rust inhibitor, a silica compound, a phosphate compound, a phosphite compound, a polyphosphate compound, a sulfur organic compound, a benzotriazole, a tannic acid compound, a molputinate compound, a tungstate compound, a vanadium compound, and a silane A coupling agent etc. can be mentioned, These can be used individually or in combination. Particularly preferred is a combination of a silica compound (e.g., calcium ion exchange silica, etc.), a phosphate compound, a phosphite compound, a polyphosphate compound (e.g., triborate phosphate, etc.), and a silica compound. ; (Phosphate-based compound, phosphite-based compound or polyphosphate-based compound) is preferably used in a mass ratio in the range of 0.5 to 9.5: 9.5 to 0.5 (more preferably 1: 9 to 9: 1). By controlling within this range, both corrosion resistance and workability as expected can be secured.

In addition, these rust inhibitors may be used for the above base treatment.

Although corrosion resistance is ensured with the use of said rust inhibitor, it is also known that workability will fall with addition of a rust inhibitor. Therefore, in the present invention, a combination of a resin and a crosslinking agent is particularly noted as a forming component of the heat dissipation coating film, and a polyester resin and a crosslinking agent (preferably an isocyanate resin and an epoxy modified polyester resin and / or a phenol derivative) are introduced. / Or melamine-based resin, more preferably both combination) is recommended to be used in combination.

Among these, polyester-based resins (such as polyester-based resins in which bisphenol A is introduced into the skeleton) in which epoxy-modified polyester-based resins and phenol derivatives are introduced into the skeleton are more resistant to corrosion and coating adhesion than polyester-based resins. This is excellent.

On the other hand, the isocyanate-based crosslinking agent has an effect of improving workability (meaning an appearance improvement after processing, and is evaluated by the number of cracks in the adhesion bending test in the later-described examples), thereby ensuring excellent workability even if an antirust agent is added. It becomes possible.

In addition, the inventors have found that the melamine-based crosslinking agent has excellent corrosion resistance. Therefore, in this invention, very good corrosion resistance can be obtained by using together with the above-mentioned rust inhibitor.

Although the said isocyanate type crosslinking agent and the melamine type crosslinking agent may be used independently in this invention, when using both together, workability and corrosion resistance can be improved further. Specifically, it is recommended to contain melamine resin in the ratio of 5-80 mass parts with respect to 100 mass parts of isocyanate resins. If the melamine resin is less than 5 parts by mass, the corrosion resistance as expected cannot be obtained. If the melamine resin is more than 80 parts by mass, the effect of the addition of the isocyanate resin is not exhibited satisfactorily. Can't get it. More preferably, they are 10 mass parts or more and 40 mass parts or less with respect to 100 mass parts of isocyanate resins, More preferably, they are 15 mass parts or more and 30 mass parts or less.

In addition, the ratio of resin, rust preventive agent, crosslinking agent, black additive, and conductive filler which comprise the above-mentioned coating film forming component is demonstrated in the "paint composition" mentioned later.

The coating body which satisfies such a structure is excellent in corrosion resistance, coating film adhesiveness, and workability. Specifically, the corrosion resistance in the salt spray test (72 hours) specified in JIS-Z-2371 (corrosion resistance, coating swelling, rust) ), Etc.) satisfies 10% or less (more preferably 5% or less). The above characteristics are applied to the coating film (preferably a clear coating film) for the purpose of appropriately controlling the kind of the crosslinking agent to be used (for example, adding a predetermined amount of melamine-based crosslinking agent useful for improving corrosion resistance alone) or suppressing elution of the rust preventive agent. By adopting a structure such as a two-layer coating film, which has been subjected to a double layer coating, it is further increased. As a result, even a more severe test [a salt spray test corrosion resistance test specified in JIS-Z-2371 (120 hours)] has an area ratio of 10% or more. The following (more preferably 5% or less) is satisfied.

Moreover, the said coating body is also excellent in coating film adhesiveness and workability. Here, "film adhesion" and "processability" have common properties in that they are "excellent in appearance after processing," but in the present invention, in particular, in the "adhesive bending test" specified in JIS K 5400 for "processability", Number of cracks in the adhesion bending test of the present invention, the number of cracks in the close bending test is 5 or less, more preferably 2 or less, and most preferably 0). "Film adhesion" is evaluated as "film adhesion of the processed part".

In addition, when it is desired to secure the conductivity as well as the above characteristics (corrosion resistance, coating adhesion and workability), an electrically conductive filler may be added to the coating film, whereby the electrical resistance can be controlled to 100 kPa or less. Preferable embodiments of the conductive filler to be used are as described above. In addition, when the conductive filler is added to the coating film, the corrosion resistance decreases. By controlling the coating thickness of the coating film to 2 µm or more, both corrosion resistance and conductivity can be ensured even in the chromium-free coating body. More preferably, it is 3 micrometers or more, More preferably, it is 5 micrometers or more. On the other hand, it is recommended to control the upper limit to 12 micrometers or less (more preferably 10 micrometers or less) as mentioned above.

In the above, the coating body of this invention using the non-chromate-treated metal plate was demonstrated.

Although the coating body of this invention demonstrated so far is a single-layer coating structure in which the coating film was given to the board | substrate, this invention also includes the aspect of the multilayer coating structure which coat | covered 1 type or 2 or more types on it again. In particular, in the present invention, it is recommended to have a two-layer coating structure in which a black coating film is applied to the black coating film by paying attention to the provision of scratch resistance and anti-fingerprint resistance. Since the black coating is painted in a dark black color, it has a disadvantage that the fingerprint is more noticeable when handled by hand, and the appearance quality is deteriorated. In addition, even if a black film has a flaw, there is an advantage that the flaw is not noticeable by applying a clear film.

Herein, in order to improve the scratch resistance and fingerprint resistance while maintaining the characteristics (heat dissipation characteristics / self-cooling characteristics) as expected, it is important to control the coating thickness of the cree coating film. The preferable range of coating film thickness changes.

That is, in the case of the coating material which does not add a conductive filler to the coating film, in order to maintain the excellent heat dissipation characteristic / self-cooling property and to improve the flaw resistance and fingerprint resistance, it is recommended to control the coating film thickness of the cree coating film to 0.1-10 micrometer. do. If it is less than 0.1 µm, the effect of improving the scratch resistance and fingerprint resistance cannot be obtained. More preferably, it is 0.2 micrometer or more, More preferably, it is 0.3 micrometer or more. However, even if the coating film thickness is made larger than 10 mu m, the improvement effect such as scratch resistance is saturated, so only the coating cost increases and there is no economical effect. Therefore, the upper limit is preferably 10 mu m. More preferably, it is 8 micrometers or less, More preferably, it is 7 micrometers or less.

On the other hand, in the case of a coating body in which a conductive filler is added to the coating film, it is necessary to improve the scratch resistance and the fingerprint resistance while maintaining good heat dissipation characteristics / self cooling performance, and for that purpose, the coating film thickness of the clear coating film is 0.1. Control at ˜3.0 μm is recommended. If it is less than 0.1 µm, the effect of improving the scratch resistance and fingerprint resistance cannot be obtained. More preferably, it is 0.2 micrometer or more, More preferably, it is 0.3 micrometer or more. However, when the coating film thickness is too thick, since it adversely affects electroconductivity, it is preferable to make the upper limit into 3.0 micrometers. More preferably, it is 2.0 micrometers or less, More preferably, it is 1.5 micrometers or less.

As described above, by using a two-layer coating structure in which a clear coating film is coated on the coating film, the scratch resistance can be significantly improved as compared with the single-layer coating structure that becomes the coating film alone, and anti-fingerprint that could not be achieved in this single layer coating structure. Formation of a clear coating film is very effective in that the improvement can also be obtained.

Here, it does not specifically limit as resin which comprises the said clear film, All resin which can form a transparent film is contained. Specific examples thereof include acrylic resins, urethane resins, polyolefin resins, polyester resins, fluorine resins, resins such as silicone resins, mixtures of these resins, and modified resins. Moreover, you may add additives, such as a crosslinking agent, a wax, and a chlorine agent, in the range which does not impair the effect | action of this invention in a clear film. This is because the lubricity and the strength of the coating film can be easily adjusted, and as a result, the scratch resistance can be further increased. The additive used in the present invention is not limited as long as it is commonly used in coating films and capable of effectively exhibiting the above-mentioned functions, and examples thereof include crosslinking agents such as melamine crosslinking agents and block isocyanate crosslinking agents.

In addition, although the coating body of this invention includes the thing of the multiple film structure to which the coating film was performed instead of the clear coating film as mentioned above, in this case, pigments, such as a coloring pigment, etc. can be added to resin and additive which comprise the above-mentioned clear coating film again. have.

In addition, in this invention, the coating composition containing more than 3 mass parts of black additives and 10-50 mass parts of conductive fillers with respect to a coating film formation component is also included in the scope of the present invention. Here, the requirements of the black additive (preferably carbon black, the average particle diameter should be controlled to 5 to 100 nm, and the relationship between the content and the film thickness are recommended to satisfy the above-described relationship) and the conductive filler The requirement (preferably Ni) is as described above. When the coating composition of the present invention is used, a coating film excellent in heat dissipation and conductivity can be formed, and therefore, it can be suitably used as a coating material for obtaining a coating material for an electronic device member.

Further, as a coating composition applied to a substrate subjected to chromium-free base treatment, 35 parts by mass or more (preferably 40 parts by mass or more) of a polyester resin obtained by introducing an epoxy-modified polyester resin and / or a phenol derivative into a skeleton , More preferably 45 parts by mass or more), 2 to 25 parts by mass (preferably 3 parts by mass or more and 20 parts by mass or less; more preferably 4 parts by mass or more and 15 parts by mass or less) and a crosslinking agent. -20 parts by mass (preferably 2 parts by mass or more, 18 parts by mass or less; more preferably 3 parts by mass or more, 15 parts by mass or less), more than 3 parts by mass of the black additive and 10 to 50 parts by mass of the conductive filler Paint compositions to be included are also included within the scope of the present invention. Among these, the preferable requirements for the crosslinking agent (preferably containing 5 to 80 parts by mass of the melamine crosslinking agent relative to 100 parts by mass of the isocyanate crosslinking agent), the preferable requirements for the black additive and the preferred requirements for the conductive filler are described above. It is as it is. When the coating composition of the present invention is used, a chromium-free coating film excellent in heat dissipation, conductivity, corrosion resistance, coating adhesion, and workability can be formed. It is available.

Next, the method of manufacturing the coating body of this invention is demonstrated. The coating body of this invention can be manufactured by apply | coating the coating material containing the said component to the surface of a board | substrate by a well-known coating method, and drying it. Although the coating method is not specifically limited, For example, the roll coating method is applied to the surface of the elongate metal strip which cleaned the surface and performed the pre-painting process (for example, phosphate treatment, chromate treatment, etc.) as needed. The coating method is applied using the spray method, the catheter coating method, etc., and the method of drying through a hot air drying furnace is mentioned. Considering the uniformity of film thickness, processing cost, coating efficiency and the like as a whole, the roll coater method is preferable in practical use.

On the other hand, when a resin coated metal sheet is used as the substrate, a phosphate treatment or chromate treatment may be performed as a pre-painting treatment for the purpose of improving adhesion to the resin film or corrosion resistance. However, for the chromate treated material, it is preferable to suppress the amount of Cr deposited during the chromate treatment to 35 mg / m 2 or less from the viewpoint of chromium elution during use of the resin coating agent. This is because chromium elution in the underlying chromate treatment layer can be suppressed within this range. In addition, in the conventional chromate treatment material, the water-adhesive resistance of the top coat coating tends to decrease in the wet environment with the elution of hexavalent chromium, if necessary, but the elution is suppressed in the metal plate. The watertightness of the top coat is not deteriorated.

Alternatively, if the above-described base treatment of chromium-free is carried out by a roll coater method, a spray method, an immersion treatment method, or the like, a non-chromate type coating body can be obtained.

On the other hand, the present invention is an electronic device component incorporating a heating element in a closed space, and the electronic device component also includes an electronic device component in which all or part of its outer wall is made of the coating material for the electronic device member. Examples of the electronic device parts include information recording products such as CD, LD, DVD, CD-ROM, CD-RAM, PDP and LCD; Electrical, electronic and telecommunication related products such as personal computers, car navigators and car AVs; AV equipment such as a projector, a television, a video, and a game machine; Copying equipment such as copying machines and printers; Power box cover, control box cover, vending machine, refrigerator, etc.

Moreover, in this invention, it is a heat dissipation evaluation apparatus which evaluates the heat dissipation of a test plate, The whole or part of a ceiling surface is comprised by the said subject, The side surface and the bottom face are provided with the heat generating body in the bottom surface of the upper body which consists of heat insulating materials, Moreover, the heat dissipation evaluation apparatus which provided the temperature measuring apparatus in the substantially center part in an upper body is also included in the scope of this invention. 1 mentioned above is a representative example. Moreover, in order to avoid the influence of the wind etc. which originate in external air, an air conditioner, etc., and to obtain stable data, it is a preferable aspect to provide the protection member which isolate | blocks from an external air condition above the said test board.

Representative examples of such a device are shown in FIGS. 8 and 9. 8 is a schematic view of a heat dissipation evaluation apparatus in which an upper part of the upper body is partially covered with a protective member; 9 shows schematic diagrams of a heat dissipation evaluation apparatus in which the upper body front surface is covered with a protective member. According to FIG. 9, since the influence by external air can be completely interrupted, it is useful. Of course, these devices are only representative examples and are not limited to these devices.

In the figure, reference numeral 1 denotes a subject (a sample for which heat dissipation is to be evaluated), 2 denotes a heat insulating material, 3 denotes a heating element, 4 denotes a protective member (cover), and 5 denotes a temperature measuring device. The heat dissipation evaluation device of the present invention has a box-shaped structure, the side and bottom are composed of a heat insulating material 2, the heating element 3 is attached to the bottom of the upper body, the temperature measuring device 5 is attached to the center of the upper body, the outside of the apparatus Covered with protective member 4. In addition, in the case where the external air condition is measured to be constant, the protective member is not required to be installed, and FIG. 1 shows the aspect thereof. The protective member is not particularly limited as long as it can block the outside air, for example, plastics, wood, metal materials and the like can also be used.

The temperature measuring device 5 is a device capable of measuring the ambient temperature inside the device. In order to accurately measure the temperature, it is recommended to properly control the position thereof. Specifically, in the heating element 3 provided on the bottom surface, the longest straight line (mm) is L; The bottom area (mm 2) of the heating element 3 is S; Height (mm) from the heating element 3 to the thermostat 5 is H _T ; When referred to the height (㎜) of the heating element 3 in the blood to the specimens 1 H, are the L / H = 0.7~2.8: S / H 2 = 0.25~4; It is recommended to control to satisfy the relationship H _T / H = 0.3 to 0.7. It is because the precision of data falls if it falls outside these ranges. For reference, Fig. 10 shows the relationship with L, S, H _T and H.

EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, the following Example does not restrict this invention. In addition, all the changes performed within the range which does not deviate from the meaning of this invention are contained in this invention.

Example

Examples 1 to 4 below evaluate various characteristics with respect to heat dissipation characteristics of the first and third coating bodies according to the present invention. Among these, Examples 1-3 were applied to the coating body which apply | coated the same amount of paint to the front and back of a board | substrate, and formed the heat-dissipation coating film of the same thickness, and Example 4 is the coating material which is added to the front and back of a board | substrate. It is carried out for the coating body which formed the heat-dissipation coating film which has different emissivity on the front and back surface by changing the kind, quantity, etc.

Example 1: Evaluation of heat dissipation in the first coating body (without addition of the conductive filler)

In the present Example, the heat dissipation property of the 1st coating body which concerns on this invention was evaluated.

First, an electrogalvanized steel sheet (plate thickness of 0.6 mm) was used as a master plate, and a coating material (polyester resin was used as a base resin) in which the same amount of carbon black (average particle size 25 nm) shown in Table 1 was added to the front and back surfaces thereof. And a melamine resin is used as the crosslinking agent, followed by baking and drying. Each test material of 120-150 mm was produced. And for comparison, the unpainted disc which did not apply the coating was similarly treated.

The specimens thus obtained were obtained by using the apparatus of FIG. 1 by using the apparatus described above with respect to the integral emissivity of the infrared rays (wavelength: 4.5 to 15.4 µm) and ΔT1 [No. The difference between the temperature at the time of using each test material of 1-32 and the temperature at the time of using the test material (unpainted disc) of a comparative example was measured. In addition, an infrared emissivity describes the data at the time of heating at 100 degreeC, and the data at the time of heating at 200 degreeC.

In addition, although larger (DELTA) T1 was larger, it showed the more excellent heat dissipation characteristic, but it evaluated relative to the following reference | standard. And in the 1st coating body which concerns on this invention, it is The coating body of is evaluated as "showing excellent heat dissipation property in this coating body."

◎: 3.5 ≤ △ T1

: 2.7 ≤ △ T1 <3.5

: 1.5 ≤ △ T1 <2.7

△: 1.0 ≤ △ T1 <1.5

×: ΔT1 <1.0

The obtained result is written together in Table 1, and the graph shows the relationship between the addition amount (X) of carbon black and coating film thickness (Y) in FIG. In the drawings, ◎, , , Δ, and × mean the above evaluation criteria.

Table 1

In Table 1, all of the coatings (No. 1 to 2) that do not satisfy the requirements of the present invention are inferior in heat dissipation characteristics, while all of the coatings (No. 3 to 23) that satisfy the requirements of the present invention have heat dissipation characteristics. great.

In addition, although not shown in the table, when the content of carbon black is 18% over X and the preferred range (15%) of the present invention, the coating film thickness Y is thickened to 1, 10, 18 μm, and the above formula (2) Although it controlled in [= (X-3) x (Y-0.5) ≥ 15] within the range of, it was confirmed that the application stain was distinct and difficult to apply uniformly.

Example 2 Evaluation of Heat Dissipation and Conductivity in Third Coating Body (Oil Added in Conductive Filler)

In Example 1, No. 2 in Table 2 was used in the same manner as in Example 1, except that paint a (the composition of the resin was the same as in Example 1) consisting of the following composition instead of the coating in Table 1 was used. 1 to 2 specimens (120 × 150 mm) were produced.

Paint a (with conductive filler)

65% of the resin of Example 1

As a black additive, 10% carbon black with an average particle diameter of 25 nm

As a conductive filler, flaky (1 micrometer in thickness, 25% of Ni of 15-20 micrometers in size)

Thus, the integrated emissivity of infrared rays (wavelength 4.5-15.4 micrometers), the change range of emissivity, (DELTA) T1, and electrical resistance (electroconductivity) were measured by the method mentioned above about each specimen.

In addition, as a conventional steel sheet, a blackened coating film is formed on the front and back surfaces of a Zn-Ni alloy plated steel sheet, and a coated steel sheet (No. 3 in Table 2) coated with a clear coating film only on the surface thereof is used. Various properties were evaluated in the same manner. This steel sheet is obtained by electroplating plating in the formation of a blackening treatment film.

And various characteristics were evaluated similarly also about the unpainted original board which has not been coated for comparison (No. 4 of Table 2).

These results are shown in Table 2. Moreover, No. of Table 2 is shown in FIGS. 13-16. In 1, 2, 3 and 4, the relationship between the wavelength of infrared light and the infrared emissivity is shown graphically.

TABLE 2

The coating bodies (No. 1-2) which satisfy | fill the requirements of this invention in Table 2 and the said figure satisfy | fill the requirements of this invention for all of infrared ray emissivity, the change range of emissivity, and (DELTA) T1, and are excellent in the heat radiation characteristic.

In comparison, No. 3 is an example of using a conventional black steel sheet (blacked without using black additives such as carbon black), but since it does not use a black additive and does not contain a conductive filler, the heat dissipation characteristics as expected And conductivity cannot be obtained.

Moreover, the product of the infrared ray emissivity of the unpainted disc (No. 4) was 0.0016, and the heat dissipation characteristic was not seen at all.

Example 3: Evaluation of heat dissipation, conductivity, anti-fingerprint and scratch resistance in the first / third coating body

In the present embodiment, the experiment was conducted to confirm the effect of improving the fingerprint resistance and scratch resistance by the formation of the clear film and the improvement of the conductivity by the addition of the conductive filler.

Specifically, carbon black having a variety of average particle diameters shown in Table 3 as the undercoat on the front and back surface of the electrogalvanized steel sheet (plate thickness 0.6 mm) and 0 to 0 After coating with the same amount of paint (polyester resin as base resin and melamine resin as crosslinking agent) to which 40% of flaky Ni (thickness 1 µm, width 15-20 µm) was added, the material was baked and Dry to No. Each test material (120 * 150mm) of 1-11 was produced (without a clear coating film).

Then, in order to confirm the action of improving the scratch resistance and fingerprint resistance according to the formation of the cree coat film, the coating material was applied, and then the polyester resin of the cree was applied, followed by baking and drying. Each test material of 120-150 mm of 12-22 was produced (with a clear coating film). Among these, No. 12-14 is the example which did not add Ni which is an electrically conductive filler.

In each test material obtained in this way, while evaluating heat dissipation and electroconductivity by the method similar to Example 1, anti-fingerprint and flaw resistance were evaluated by the following method. In addition, electroconductivity was evaluated relative to the following criteria.

◎: Excellent resistance 10Ω or less

Good resistance 10 to 100 kΩ

×: bad resistance over 100Ω

[Scratch resistance]

Using a cylindrical press having a diameter of 110 mm and a punch diameter of about 50 mm, each test piece was subjected to a press test, and the scratches of the sliding part were visually observed and evaluated according to the following criteria. In addition, the punch diameter was adjusted so that the clearance of the metal mold might be +40 µm, and the press condition was a speed of 40 rpm and a punch R0.5 mm.

◎: Good (no change in appearance)

: Slightly traced

×: traces are distinct

[Fingerprint resistance]

Fingers were placed on the surface of each specimen for 1 second to visually assess traces of fingerprints. Evaluation criteria are as follows.

◎: No trace of fingerprint

: Slight fingerprints

×: traces of fingerprints are distinct

The obtained results are written together in Table 3. In addition, in the table, "-" means that each characteristic was not evaluated because no conductive filler was added and no crimp film was formed.

TABLE 3

From Table 3, it can consider as follows.

First of all, No. 1 to 2 are examples in which the average particle diameter of the black additive (carbon black) is changed without adding the conductive filler (Ni), but since the average particle diameter is controlled in the preferred range (5 to 100 nm) of the present invention, all Good heat dissipation characteristics are obtained.

In addition, No. Although 3-11 are examples which contain carbon black and Ni in a coating film, Among these, No. Since 3 to 10 satisfy the requirements of the present invention, both heat dissipation characteristics and conductivity are excellent. And No. The conductivity of 10 is slightly lower than the other examples (Nos. 3 to 9) because the thickness of the coating film increases, which may be considered to increase the electrical resistance of the coating film.

In comparison, No. 11, since the coating film thickness of the black coating film was beyond the preferable upper limit (12 micrometers or less), electroconductivity fell.

In addition, No. 12-22 is an example which coats a clear film with a black coating film.

Among these, No. 12-18 and 21-22 are excellent in both rubbing resistance and flaw resistance because the coating film thickness of a clear coating film satisfy | fills the preferable range of this invention. However, No. 12-14 does not contain a conductive filler, or No. Since the addition amount of 21 is less than the preferable minimum of this invention, No. 21 containing a conductive filler is included. Compared with 15-21 and 23, electroconductivity is falling. In addition, No. 22 is an example with many addition amounts of an electrically conductive filler, and although electroconductivity is very favorable, it has confirmed that workability falls (not shown in the table).

In comparison, No. 19, since the film thickness of the clear film exceeds the preferable upper limit of this invention, electroconductivity is interrupted. And no. As for 20, the coating film thickness of a creeper film fell beyond the preferable minimum of this invention, and the fingerprint resistance and the scratch resistance fell.

Example 4 Evaluation of Heat Dissipation and Conductivity in First / Third Paints

In Example 1, the heat dissipation characteristics and conductivity of the specimens in which the type and the additive and the emissivity of the front and back surfaces were variously changed in Example 1 were measured in the same manner as in Example 1.

Specifically, the specimens (No. 1-30) which consist of the composition of Table 4 and Table 5 were used. Among these, No. 19 used a blackened Zn-Ni alloy plated steel sheet as a raw plate; No. of Table 5 26 used Al plate 1050 as the disc; No. of Table 5 27 used a Cu plate as a disc; The other specimens were electro galvanized steel sheets as the original plates. In addition, the board thickness of the original plate was all 0.6 mm.

The base resin was used in the same manner as in Example 1, the polyester resin was used, the melamine resin was used as the crosslinking agent, and the test materials of Tables 4 and 5 were baked and dried in the same manner as in Example 1 (120 x 150 mm). ) Was produced.

The obtained results are written together in Table 4 and Table 5.

Table 4

Table 5

In Tables 4 and 5, all of the coating bodies (Nos. 1 to 15 in Table 4 and Nos. 23 to 28 in Table 5) satisfying the requirements of the present invention have good heat dissipation characteristics, and the product of the emissivity (in the table It is understood that the heat dissipation characteristics are excellent as large as a × b). Moreover, the coating body (No. 2, 4, 6-7, 10, 13 of Table 4; No. 16-18, 24-26 of Table 5) which added Ni in the coating film is also excellent in electroconductivity.

Among these, No. 23 to 26 are examples of forming a heat dissipation coating film by adding carbon black to the back surface and an additive other than carbon black to the surface (No. 23 is an example in which only titanium oxide is added; No. 24 is titanium oxide and iron oxide). Example of mixed addition; No. 25 is a mixture of carbon black and acryl beads; No. 26 is an example in which only Al flake is added), and satisfies the requirements of the present invention, thus exhibiting excellent heat dissipation characteristics. .

On the other hand, all the coating bodies (No. 16-22, 29-30 of Table 5) which do not satisfy the requirements of this invention are inferior in heat dissipation characteristic. In particular, No. 18 to 20 and 29 are examples in which only one surface is painted, but heat dissipation characteristics as expected cannot be obtained.

The following Example 5 evaluated various characteristics centering on the heat dissipation property and the self-cooling property about the 2nd / 3rd coating body which concerns on this invention.

Example 5 Evaluation of Heat Dissipation and Conductivity in Second / Third Paints

In the present Example, in Example 1, the heat dissipation characteristic and electroconductivity in each specimen which changed the kind of additive, the emissivity of the front and back surfaces were measured similarly to Example 1, and the self-cooling property was evaluated by the method mentioned above.

Specifically, the specimens (No. 1-19) which consist of the composition of Table 6 were used. Among these, No. 17 used the blackened Zn-Ni alloy-plated steel sheet as a disc (0.6 mm), and the electroplated steel plate (0.6 mm as a disc) was used as the other plate. The base resin was prepared by using the same polyester resin as in Example 1, melamine resin as the crosslinking agent, and baking and drying in the same manner as in Example 1 to prepare each specimen (120 x 150 mm).

In addition, (DELTA) T1 which shows the heat radiation characteristic was evaluated relative to the following reference | standard. In the second coating body according to the present invention, And The coating body of is evaluated as "showing favorable heat dissipation property in this coating body."

◎: 3.5 ≤ △ T1

: 2.7 ≤ △ T1 <3.5

: 1.5 ≤ △ T1 <2.7

△: 1.0 ≤ △ T1 <1.5

×: ΔT1 <1.0

Moreover, (DELTA) T2 which shows self-cooling property was evaluated relative to the following reference | standard. The larger ΔT2 is, the better the heat dissipation characteristics are. In addition, in the 2nd coating body which concerns on this invention, (double-circle) and Is evaluated as "exhibiting excellent self-cooling".

◎: 1.5≤ △ T2

: 1.5 ≤ △ T2 <1.5

×: ΔT2 <0.5

The results obtained are shown in Tables 6 and 7.

Table 6

TABLE 7

In the above table, all of the coated bodies (Nos. 1 to 12) that satisfy the requirements of the present invention have excellent self-cooling properties while maintaining good heat dissipation characteristics. In particular, in the equation (4), which is an index of self-cooling, the Q value (= 0.9a-b) is much higher than 0.045. 1 to 8 exhibit very good self cooling, and it is understood that the higher the Q value, the better the self cooling.

Moreover, the coating body (No. 1-5, 7-9, 11-12) which added Ni to the coating film is also excellent in electroconductivity.

Among these, No. 3 and 7 cover a carbon black-containing coating film on the surface and only a coating film on the back surface (no participant); No. 6 / No. 12 is an example in which the carbon black-containing coating film is coated on the surface / rear surface and the titanium oxide-containing coating film is coated on the back / surface; No. 10 is an example in which a metallic-like appearance coating film is coated on both front and back surfaces; No. 11 is an example in which the Al flake-containing coating film is coated on the surface and the carbon black-containing coating film is coated on the back surface, but all of them satisfy the requirements of the present invention, and thus have excellent self-cooling properties and good heat dissipation.

In addition, No. 1 and No. 11 is an example in which carbon black is added to the coating film on the back side, but the self-cooling property is also dissipated because it satisfies the indexes (formulas (4) and (5)) defined by the second coating film even when the above formula (6) is not satisfied. The characteristics are also good.

On the other hand, all the coating bodies (No. 13-19) which do not satisfy the requirements of this invention are inferior in self-cooling property.

For example, No. 13 is a single-sided coating that is not coated on one side, and heat dissipation characteristics as a base cannot be obtained. Similarly Since the composition of the surface (carbon black containing coating film) does not satisfy said Formula (6), 14 does not satisfy | fill Formula (5) which becomes an index of a heat radiating characteristic, and the heat radiating characteristic of expectation is not acquired. No. Since the coating film thickness is thin without adding any participant to the 15 degree front and back surface, the heat dissipation characteristic as expected cannot be obtained.

On the other hand, No. 16 is an example in which the emissivity of the front and back surfaces is similar, and self cooling cannot be achieved as expected. No. 17 is a conventional example in which the front and back surfaces are blackened in the same manner, and since the emissivity of the front and back surfaces is about the same, magnetic cooling as expected cannot be obtained. No. 18 is an example in which the emissivity of the back surface is larger than the surface, and the self cooling property is falling.

The following Example 6 examines the chromium-free coating body which concerns on this invention centering on corrosion resistance, coating film adhesiveness, workability, and electroconductivity.

Example 6 Evaluation of Corrosion Resistance, Coating Adhesion, Processability and Conductivity in Chrome-Free Painted Body

In the present Example, the various characteristics mentioned above were evaluated using the coating body which apply | coated the same amount of paint to the front and back of the board | substrate with which the chromium-free base treatment was performed, and gave the heat-dissipation coating film of the same thickness.

Specifically, chromium-free by electropainted steel sheet (plate thickness 0.8 mm, one side Zn adhesion amount 20 g / m 2) was used as a base plate and manufactured by Japan Paint Co., Ltd., "Saf Coating EC 2000 (Si adhesion amount 50 mg / m 2)." Base treatment was performed. Carbon black (10%) and the paint ingredients shown in Table 8 as base coats, crosslinking agents and rust preventive agents (using a mixture of tripolyphosphate and calcium ion exchange silica in a mass ratio of 8: 2) on the front and back surfaces thereof, Then, if necessary, after coating Ni (thickness 1 μm, width 15 to 20 μm) in the same amount to form a heat dissipation coating film, the specimens of No. 23 in Table 8 (120 × 150 mm) were baked and dried. ) (Without clear coating film) and coating the coating material at the same time, and then applying the CREE polyester resin, followed by baking and drying to prepare each test material of Nos. 1 to 22 in Table 8 (120 x 150 mm). In this case, the coating film thickness of the heat dissipation coating film is 8 µm, and the coating film thickness of the clear coating film is 1 µm, and No. 21 is an example in which Ni, which is a conductive filler, is not added. .

Thus, each test material obtained was evaluated for heat dissipation and conductivity in the same manner as in Example 1, and also for rubbing resistance and scratch resistance in the same manner as in Example 3. Corrosion resistance, coating film adhesion, and workability were evaluated according to the following criteria.

[Corrosion resistance]

Using each specimen, the salt spray test specified in JIS-Z-2371 is carried out for 72 hours or 120 hours, and the area ratio of the appearance abnormality (rusting and swelling) generated in the coating film of the flat portion at each elapsed time is measured. The area ratio of 10% or less of the apparent abnormality part measured in this way is called "example of this invention."

[Processability (Number of Cracks)]

The specimens were cut to 50 × 50 mm, subjected to close bending (0T bending) test in the bending bending test specified in JIS K 5400, and the cracks of the bends were observed by videoscope photograph (magnification 25 times). Measure the number. In detail, the number of cracks of 0.1 mm or more of long diameter existing in a 3 mm width visual field is measured, and the average value of the number of cracks in total 10 visual fields is evaluated as "the number of cracks." The "crack number" measured in this way is evaluated as "inventive example" of 5 or less.

[Processability (film adhesion)]

After performing the close bending test, the bent part is tempered, and the coating film adhesion is evaluated according to the following criteria according to the degree of peeling of the coating film after peeling the tape. The part to be evaluated is 40 mm wide except 5 mm at both ends of the sample.

: No peeling off

(Triangle | delta): There exists peeling at night (No more than 3 peelings of a coating film in an evaluation part)

X: peeling exists (4 or more peelings of a coating film in an evaluation part)

The obtained result was written together in Table 8.

Table 8

By the said table, it can consider as follows. In addition, each of the specimens had good heat dissipation characteristics, and No. It is confirmed that 1 to 22 have excellent anti-fingerprint and scratch resistance (not shown in the table).

First, all the coating bodies (No. 2-5, 7-14, 16-17, 21-23) which satisfy | fill the requirements of this invention are excellent in corrosion resistance, coating-film adhesiveness, and workability. In particular, it can be seen that the coating material in which the melamine-based crosslinking agent and the isocyanate-based crosslinking agent are used in a predetermined ratio in the coating body is significantly superior to the coating bodies (Nos. 8 and 9) used alone. Moreover, the coating body (The said coating body except No. 23) which carried out the clear coating film on the heat-dissipation coating film has very excellent corrosion resistance. And no. 8 is an example in which the melamine crosslinking agent is used alone (addition amount 5.5 mass%) and the Cree coating is applied. The area ratio of the abnormal part is less than 1%] by experiments (not shown in the table).

And the coating body to which the electroconductive filler Ni was added (the said coating body except No. 21) is also favorable in a coatability.

On the other hand, the coating bodies (No. 1, 6, 15, 18-20) which do not satisfy the requirements of the present invention have the following irrationality.

First of all, No. 1 is an example which does not use a rust preventive agent, and corrosion resistance is inferior.

No. 6 is an example with little amount of resin, and coating-film adhesiveness and workability fall.

No. 15, 18, and 19 are examples in which the content of melamine-based crosslinking agent is high relative to the isocyanate-based crosslinking agent (that is, the content of isocyanate-based crosslinking agent is low), all of which have a large number of cracks and poor workability. In particular, the No. 19 cannot fully acquire the workability improvement effect by addition of an isocyanate type crosslinking agent, the number of cracks becomes very large, and coating film adhesiveness also falls.

No. 20 is an example of using a polyester-based resin, and the corrosion resistance and the coating film adhesion decrease.

Since the coating body of this invention is comprised as mentioned above, while satisfy | filling the conventional characteristic calculated | required by the electronic device member (securing airtightness, size reduction, and weight reduction accompanying waterproofing and dustproof, etc.), A novel coating material for electronic device members that can also have a decrease in internal temperature (heat dissipation characteristics); In addition, it is possible to provide a coating for an electronic device member having excellent characteristics (self-cooling property) of suppressing a temperature rise of the coating body for the electronic device member itself. The coating body of the present invention is particularly used in the field of information recording such as CD, LD, DVD, CD-ROM, CD-RAM, PDP, LCD, etc .; AV devices such as projectors, TVs, videos, game machines, etc., such as electric, electronic, and communication related fields such as personal computers, car navigators, and car AVs; Copying equipment such as copying machines and printers; It can be used for various electronic devices such as power box covers, control box covers, vending machines, refrigerators such as air conditioners and outdoor units.

Claims (42)

A coating body coated with a heat radiation coating film having heat dissipation on the front and back surfaces of the substrate, Using the heat dissipation evaluation apparatus shown in FIG. 1, The temperature T1 _A at the T1 position when the coating material is used as the test material, The temperature difference ΔT1 (= T1 _B -T1 _A ) with the temperature T1 _B at the T1 position when using a substrate not coated with a coating film as a test material is 2.6 ° C. or more, the coating material for an electronic device member having excellent heat dissipation characteristics (電子 機器)部 材 用 塗裝 體) A coating body coated with a heat radiation coating film having heat dissipation on the front and back surfaces of the substrate, Integral emissivity of infrared rays (wavelength: 4.5-15.4 µm) when the coating body is heated to 100 ° C satisfies the following formula (1) a × b ≥0.42 ‥‥‥‥ (1) Where a is the infrared integrated emissivity of the coating material on which the heat-resistant coating is coated b: Infrared integral emissivity of a coating body coated with a heat-dissipating film on the back surface The coating according to claim 2, which satisfies a ≥ 0.65 and / or b ≥ 0.65 Where a is the infrared integrated emissivity of the coating material on which the heat-resistant coating is coated b: Infrared integral emissivity of a coating body coated with a heat-dissipating film on the back surface The coating body according to claim 2, wherein the difference (A-B) between the maximum value A and the minimum value B of the spectral emissivity in the wavelength range of 4.5 to 15.4 µm in the coating body is 0.35 or less. A coating body coated with a heat radiation coating film having heat dissipation on the front and back surfaces of the substrate, At least one surface of this heat radiation coating film contains a black additive, and satisfy | fills following formula (2), The coating body excellent in heat dissipation characteristics characterized by the above-mentioned. (X-3) × (Y-0.5) ≥ 15 ‥‥‥‥ (2) In formula, X is content (mass%) of the black additive contained in a heat-dissipation coating film, Y means coating film thickness (micrometer), respectively. The coating body of Claim 5 which satisfy | fills following formula (3). 4 ≤X 〈15 ‥‥‥‥ (3) In formula, X means content (mass%) of the black additive contained in a heat radiation coating film. The coating body according to claim 5, wherein the coating film thickness Y satisfies the coating film thickness Y &gt; The coating body according to claim 5, wherein the average particle diameter of the black additive is 5 to 100 nm. The coating body according to claim 5, wherein the black additive is carbon black. As a coating body which coat | covers the coating film on the front and back of a board | substrate, and the heat-dissipation coating film which has heat dissipation on at least the surface of a board | substrate, Using the heat dissipation evaluation apparatus shown in FIG. 1, Coating body temperature T2 _A when the said coating body was measured as a test material, Coating material with excellent heat dissipation and self-cooling property in which the substrate temperature difference ΔT2 (= T2 _B -T2 _A ) from the substrate temperature T2 _B when the substrate without the coating film is used as the test material is 0.5 ° C or higher. As a coating body which coat | covers the coating film on the front and back of a board | substrate, and the heat-dissipation coating film which has heat dissipation on at least the surface of a board | substrate, Integral emissivity of infrared rays (wavelength: 4.5-15.4 μm) when the coating body is heated to 100 ° C. satisfies the following formulas (4) and (5). Paint b ≤ 0.9 (a-0.05) ‥‥‥‥ (4) (a-0.05) × (b-0.05) ≥0.08 ‥‥‥‥ (5) a: Infrared integral emissivity of a coating body coated with a heat-dissipating film on its surface b: Infrared integral emissivity of a coating body coated with a heat-dissipating film on the back surface As a coating body which coat | covers the coating film on the front and back of a board | substrate, and the heat-dissipation coating film which has heat dissipation on at least the surface of a board | substrate, The heat dissipation coating film contains a black additive, and A coating material excellent in heat dissipation and self cooling, characterized by satisfying the following formula (6) (X-3) × (Y-0.5) ≥ 3 ‥‥‥‥ 6 In formula, X is content (mass%) of the black additive contained in a heat-dissipation coating film, Y means coating film thickness (micrometer), respectively. The coating body according to claim 12, which further satisfies the following formula (7). 4 ≤X 〈15 ‥‥‥‥ (7) In formula, X means content (mass%) of the black additive contained in a heat radiation coating film. 13. The coating body according to claim 12, which further satisfies the coating film thickness Y &gt; The coating body according to claim 12, wherein the average particle diameter of the black additive is 5 to 100 nm. 13. The coating body according to claim 12, wherein the black additive is carbon black. The coating body according to any one of claims 1 to 16, wherein the resin forming the heat dissipation coating film is a non-hydrophilic resin. 18. The coating body according to claim 17, wherein the non-hydrophilic resin is a polyester resin. The coating body excellent in electroconductivity in any one of Claims 1-16 whose electric resistance satisfy | fills 100 kPa or less. The coating material according to any one of claims 1 to 16, wherein the heat dissipation coating film contains a conductive filler. 21. The coating as claimed in claim 20, wherein the conductive filler is Ni. 17. The coating body according to any one of claims 1 to 16, wherein the heat dissipation coating film is coated with a clear coating film, whereby the scratch resistance and rubbing resistance are increased. 17. The substrate according to any one of claims 1 to 16, wherein the substrate is subjected to chromium free undertreatment, and the heat dissipation film is a rust preventive agent. I) a paint containing The coating material according to claim 23, wherein the heat dissipation coating film contains a conductive filler, and the thickness of the heat dissipation coating film is 2 µm or more. The coating material of Claim 23 which satisfy | fills 5 or less crack numbers in the close bending test prescribed | regulated to JISK5400. The coating body according to claim 23, wherein the area ratio of the external part abnormality in the salt spray test corrosion resistance test (72 hours) specified in JIS-Z-2371 satisfies 10% or less. The coating according to claim 23, wherein the area ratio of the external part abnormality in the salt spray test corrosion resistance test (120 hours) specified in JIS-Z-2371 as a coating body coated with the heat dissipation film again is satisfied. sieve The coating body according to claim 23, wherein the electrical resistance satisfies 100 kΩ or less. Paint composition for electronic device member containing more than 3 mass% of black additive and 10-50 mass% of conductive fillers with respect to a coating film formation component. 30. The composition of claim 29, wherein the average particle diameter of the black additive is 5-100 nm. 30. The composition of claim 29, wherein the black additive is carbon black The composition of claim 29, wherein the conductive filler is Ni. The composition as described in any one of Claims 29-32 which forms the coating film excellent in heat dissipation and electroconductivity. A paint composition applied to a substrate subjected to chromium-free base treatment, 35 parts by mass or more of an epoxy-modified polyester resin and / or a polyester resin having a phenol derivative introduced into the skeleton, 2 to 25 parts by mass of a rust preventive body, 1 to 20 parts by mass of a crosslinking agent, and 3 parts by mass of a black additive. And 10 to 50 parts by mass of a conductive filler. The composition according to claim 34, wherein the crosslinking agent contains a melamine resin in a proportion of 5 to 80 parts by mass with respect to 100 parts by mass of the isocyanate resin. The composition of claim 34, wherein the average particle diameter of the black additive is 5 to 100 nm. 35. The composition of claim 34, wherein the black additive is carbon black 35. The composition of claim 34, wherein the conductive filler is Ni. 35. The composition according to claim 34, which forms a chromium-free coating film excellent in heat dissipation, conductivity, corrosion resistance, coating film adhesion, and workability. As an electronic device component incorporating a heating element in a closed space, This electronic device component is an electronic device component characterized in that all or part of its outer wall is composed of the coating material for an electronic device member according to any one of claims 1 to 16. A heat dissipation evaluation device for evaluating heat dissipation of a test plate, All or part of a ceiling surface is comprised of the said subject, and a heat generating body is provided in the bottom face of the upper body which the side and the bottom surface consist of a heat insulating material, and A heat dissipation evaluation device characterized in that a thermostat is installed at approximately the center of the upper body. 42. The heat dissipation evaluation device according to claim 41, wherein a protection member is provided on the test plate to block the external air condition.