KR20030008644A - Shipping boat of semiconductor package - Google Patents

Shipping boat of semiconductor package Download PDF

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Publication number
KR20030008644A
KR20030008644A KR1020010043480A KR20010043480A KR20030008644A KR 20030008644 A KR20030008644 A KR 20030008644A KR 1020010043480 A KR1020010043480 A KR 1020010043480A KR 20010043480 A KR20010043480 A KR 20010043480A KR 20030008644 A KR20030008644 A KR 20030008644A
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South Korea
Prior art keywords
semiconductor package
loader
size
insertion holes
regulators
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KR1020010043480A
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Korean (ko)
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유정길
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주식회사 하이닉스반도체
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Priority to KR1020010043480A priority Critical patent/KR20030008644A/en
Publication of KR20030008644A publication Critical patent/KR20030008644A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE: A transferring apparatus of a semiconductor package is provided to reduce a fabricating cost by using a plurality of handlers changed according to various sizes of semiconductor packages without an additional transferring device. CONSTITUTION: A loader portion(102) has a plurality of ball insertion holes(104). The ball insertion holes(104) has a predetermined structure for receiving a ball grid array type semiconductor package. The ball insertion holes(104) are arranged according to the same interval. The first and the second handler(110,120) are located on an upper face of the loader portion(102). The first handler(110) is shifted to a left or a right direction according to a size of a horizontal axis of the received semiconductor package. The second handler(120) is shifted to an upper or a lower direction according to a size of a vertical axis of the received semiconductor package. The first and the second handler(110,120) are fixed by a support portion(130).

Description

반도체 패키지의 이송 장치{SHIPPING BOAT OF SEMICONDUCTOR PACKAGE}SHIPPING BOAT OF SEMICONDUCTOR PACKAGE

본 발명은 반도체 패키지의 이송 장치에 관한 것으로, 좀 더 구체적으로 테스트용 핸들러에 구비되는 반도체 패키지 이송 장치에 관한 것이다.The present invention relates to a semiconductor package transfer apparatus, and more particularly, to a semiconductor package transfer apparatus provided in a test handler.

반도체 패키지의 제조 과정에서 조립 공정을 거쳐 제조된 반도체 패키지는 최종적으로 테스트 공정을 거치게 된다. 테스트 공정에서 사용되는 테스트용 핸들러는 복수 개의 반도체 패키지들을 이송 장치를 이용하여 테스트용 핸들러 내부로이송시킨다. 이 때, 반도체 패키지들은 이송 장치에 형성된 패키지 수납홈에 삽입되는데, 각각의 수납홈에는 패키지를 지지하도록 기구적인 메커니즘을 갖는다. 이러한 테스트용 핸들러의 이송 장치는 반도체 패키지의 형상 및 종류에 따라 적절한 형태의 수납홈을 구비해야 한다.The semiconductor package manufactured through the assembly process in the manufacturing process of the semiconductor package is finally subjected to a test process. The test handler used in the test process transfers the plurality of semiconductor packages into the test handler using a transfer device. At this time, the semiconductor packages are inserted into the package receiving groove formed in the transfer apparatus, each of the receiving groove has a mechanical mechanism to support the package. The transfer device of the test handler should be provided with a receiving groove of a suitable shape according to the shape and type of the semiconductor package.

상기한 바와 같은 일반적인 테스트 핸들러는, 이송 장치에 수납되는 반도체 패키지들의 종류 및 크기에 따라 별도의 수납홈을 갖는 이송 장치를 구비해야 하며, 이로 인하여 반도체 제조 비용이 상승하게 된다.The general test handler as described above should include a transfer device having a separate accommodation groove according to the type and size of the semiconductor packages accommodated in the transfer device, thereby increasing the semiconductor manufacturing cost.

도 1을 참조하면, 종래 기술에 따른 테스트용 핸들러의 이송 장치(2)는 이송할 반도체 패키지의 종류 및 크기에 따라 복수 개의 수납홈(10)을 구비한다. 예컨대, 도면에 도시된 바와 같이, μBGA(micro Ball Grid Array) 타입의 반도체 패키지를 수납하기 위한 각각의 수납홈(10)은 다수의 볼들이 삽입되는 볼 삽입구(12)들을 구비한다. 이 때, μBGA 타입의 반도체 패키지는 볼들 간 행과 열의 간격 즉, 피치(pitch : Pr, Pc)가 동일한 구조의 패키지이다.Referring to FIG. 1, the transfer apparatus 2 of the test handler according to the related art includes a plurality of receiving grooves 10 according to the type and size of a semiconductor package to be transferred. For example, as shown in the drawing, each receiving groove 10 for accommodating a micro ball grid array (μBGA) type semiconductor package includes ball insertion holes 12 into which a plurality of balls are inserted. At this time, the microBGA type semiconductor package is a package having a structure in which the pitch between rows and columns, that is, pitches Pr and Pc, is the same.

그러나 상기 이송 장치(2)는 반도체 패키지의 크기가 동일한 경우에만 사용 가능하며, 크기가 변경됨에 따라 이송 장치의 수납홈을 반도채 패키지의 크기에 맞춰서 별도로 제작해야만 한다.However, the transfer device 2 may be used only when the size of the semiconductor package is the same. As the size is changed, the transfer device 2 must be manufactured separately according to the size of the half-vessel package.

본 발명의 목적은 상술한 문제점을 해결하기 위한 것으로, 반도체 패키지의 크기에 대응하여 수납 가능한 반도체 패키지의 이송 장치를 제공하는데 있다.SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problem, and to provide a transfer apparatus of a semiconductor package that can be accommodated corresponding to the size of the semiconductor package.

도 1은 종래 기술의 테스트용 핸들러에 구비되는 이송 장치의 구조를 도시한 도면; 그리고1 is a view showing the structure of a transfer device provided in the test handler of the prior art; And

도 2는 본 발명의 실시예에 따른 반도체 패키지 이송 장치를 도시한 도면이다.2 is a view showing a semiconductor package transfer device according to an embodiment of the present invention.

* 도면의 주요 부분에 대한 부호 설명 *Explanation of symbols on the main parts of the drawings

100 : 이송 장치102 : 로더부100: conveying device 102: loader

104 : 볼 삽입구110 : 제 1 조정기104: ball insertion port 110: the first adjuster

120 : 제 2 조정기130 : 지지부120: second regulator 130: support portion

상술한 목적을 달성하기 위한 본 발명의 특징은 볼 그리드 어레이 타입 반도체 패키지의 이송 장치에 있어서, 상기 반도체 패키지를 수납하기 위한 다수의 볼 삽입구들을 구비하는 로더부와, 상기 로더부의 상면에 구비되고, 상기 수납되는 반도체 패키지의 크기에 대응하여 상 하 좌 우로 이동하는 복수 개의 조정기 및 상기 로더부의 가장 자리를 둘러싸고 결합되며, 상기 조정기들을 상기 로더부 상면에서 이동하도록 하는 지지부를 포함한다.A feature of the present invention for achieving the above object is a ball grid array type semiconductor package transfer device, comprising: a loader having a plurality of ball insertion holes for accommodating the semiconductor package, and is provided on the upper surface of the loader, And a plurality of regulators moving up, down, left, and right in correspondence with the size of the semiconductor package to be accommodated, and surrounding the edges of the loader unit, and a support unit for moving the regulators from the upper surface of the loader unit.

바람직하게는 상기 볼 삽입구들은 상기 로더부 상면에 동일한 패턴으로 구비되어, 피치가 동일한 반도체 패키지의 볼들을 삽입하도록 한다.Preferably, the ball insertion holes are provided in the same pattern on the upper surface of the loader to insert balls of the semiconductor package having the same pitch.

그리고 상기 조정기들은 상기 수납된 반도체 패키지의 가로축 크기에 대응해서 좌우로 이동하는 복수개의 제 1 조정기 및 상기 수납된 반도체 패키지의 세로축 크기에 대응하여 상하로 이동하는 복수 개의 제 2 조정기를 포함하며, 상기 복수 개의 제 1 조정기는 가로 방향으로, 상기 제 2 조정기는 세로 방향으로 평행하게 이동된다. 또한 상기 조정기들은 상기 수납된 반도체 패키지의 크기에 맞게 이동한 후, 각각 상기 지지부에 고정되도록 나사 형태로 구비된다.The regulators include a plurality of first regulators moving left and right corresponding to the horizontal axis size of the accommodated semiconductor package and a plurality of second regulators moving up and down corresponding to the vertical axis size of the accommodated semiconductor package. The plurality of first regulators are moved in the horizontal direction, and the second regulators are moved in parallel in the longitudinal direction. In addition, the adjusters are moved in accordance with the size of the accommodated semiconductor package, and each is provided in the form of a screw to be fixed to the support.

따라서 본 발명에 의하면, 테스트용 핸들러의 이송 장치는 수납되는 볼 그리드 어레이 타입 반도체 패키지의 크기에 맞도록 제 1 및 제 2 조정기들을 상하 좌우로 이동하여 반도체 패키지가 로더부에서 이탈되지 않도록 한다.Therefore, according to the present invention, the transfer device of the test handler moves the first and second regulators up and down and left and right to fit the size of the ball grid array type semiconductor package to be stored so that the semiconductor package is not separated from the loader.

이하 본 발명의 실시예를 첨부된 도면에 의거하여 상세히 설명한다.DETAILED DESCRIPTION Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명의 실시예에 따른 테스트용 핸들러 장치의 이송 장치를 도시한 도면이다.2 is a view showing a transfer device of the test handler device according to an embodiment of the present invention.

도면을 참조하면, 상기 이송 장치(100)는 신규한 로더부(102)와 조정기(110, 120) 및 지지부(130)를 포함한다. 상기 로더부(102)는 상면에 균일한 패턴으로 다수의 볼 삽입구(104)들을 포함한다. 상기 볼 삽입구(104)들은 볼 그리드 어레이 타입의 반도체 패키지를 수납하기에 적합한 구조를 가지며, 동일한 간격으로 구비된다. 이 때, 상기 수납되는 반도체 패키지는 행열 간의 피치(pitch : Pr, Pc)가 동일하고, 크기가 다른 반도체 패키지이다.Referring to the drawings, the transfer device 100 includes a novel loader portion 102, regulators 110 and 120, and a support 130. The loader portion 102 includes a plurality of ball insertion holes 104 in a uniform pattern on the upper surface. The ball insertion holes 104 have a structure suitable for accommodating a ball grid array type semiconductor package and are provided at equal intervals. In this case, the accommodated semiconductor package is a semiconductor package having the same pitch (Pr, Pc, Pc) and different sizes.

상기 조정기(100, 120)는 상기 로더부(102) 상면에 구비되며, 상기 수납되는 반도체 패키지의 크기에 대응하여 상 하 좌 우로 이동되도록 구비한다. 상기 조정기(110, 120)들은 상기 수납된 반도체 패키지의 가로축 크기에 대응해서 좌우로 이동하는 복수 개의 제 1 조정기(110)와, 상기 수납된 반도체 패키지의 세로축 크기에 대응하여 상하로 이동하는 복수 개의 제 2 조정기(120)를 포함한다. 그리고 상기 복수 개의 제 1 조정기(110)는 가로 방향으로, 상기 제 2 조정기(120)는 세로 방향으로 평행하게 이동된다. 또한 상기 조정기들(110, 120)은 상기 수납된 반도체 패키지의 크기에 맞게 이동한 후, 각각 상기 지지부(130)에 고정되도록 나사 형태로 구비된다.The regulators 100 and 120 are provided on an upper surface of the loader unit 102 and move up, down, left, and right in correspondence with the size of the semiconductor package to be accommodated. The regulators 110 and 120 may include a plurality of first adjusters 110 moving left and right corresponding to the horizontal axis size of the accommodated semiconductor package, and a plurality of movers up and down corresponding to the vertical axis size of the accommodated semiconductor package. And a second adjuster 120. The plurality of first regulators 110 are moved in the horizontal direction, and the second regulators 120 are moved in parallel in the longitudinal direction. In addition, the adjusters 110 and 120 are moved in accordance with the size of the accommodated semiconductor package, and are provided in the form of a screw to be fixed to the support 130, respectively.

그리고 상기 지지부(130)는 상기 로더부(102)의 가장 자리를 둘러싸고 박스 형태로 결합되며, 상기 조정기들(110, 120)을 상기 로더부(102) 상면에서 이동하도록 하는 기구적인 메커니즘을 갖는다.And the support 130 is coupled in the form of a box surrounding the edge of the loader 102, and has a mechanical mechanism to move the adjusters (110, 120) on the upper surface of the loader (102).

상술한 바와 같이, 본 발명의 이송 장치는 크기가 서로 다른 반도체 패키지를 수납하여 이송이 가능하다. 물론 이 실시예에서는 동일한 피치를 갖는 반도체패키지에 한정하여 설명하였지만, 본 발명의 기술적 사상이 변경되지 않는 범위에서 다양한 실시예가 가능한 것은 자명하다.As described above, the transfer apparatus of the present invention can accommodate and transfer semiconductor packages having different sizes. Of course, this embodiment is limited to the semiconductor package having the same pitch, but it is obvious that various embodiments are possible within a range that does not change the technical spirit of the present invention.

상술한 바와 같이, 본 발명은 이송 장치에 반도체 패키지를 수납하기 위한 다수의 볼 삽입구들을 구비하고, 수납된 반도체 패키지의 크기에 대응하여 상하 좌우로 이동하여 반도체 패키지를 이탈되지 않도록 하는 조정기를 구비함으로써, 반도체 패키지의 크기 변경에 따른 이송 장치를 별도로 제작할 필요가 없으며 이로 인하여 제작 비용이 절감되는 효과를 얻을 수 있다.As described above, the present invention is provided with a plurality of ball insertion holes for accommodating the semiconductor package in the transfer device, and by having an adjuster to move up and down and left and right corresponding to the size of the semiconductor package accommodated so as not to leave the semiconductor package As a result, there is no need to separately manufacture the transfer device according to the size change of the semiconductor package, thereby reducing the manufacturing cost.

Claims (4)

볼 그리드 어레이 타입 반도체 패키지의 이송 장치에 있어서:In the transfer device of the ball grid array type semiconductor package: 상기 반도체 패키지를 수납하기 위한 다수의 볼 삽입구들을 구비하는 로더부와;A loader having a plurality of ball insertion holes for accommodating the semiconductor package; 상기 로더부의 상면에 구비되고, 상기 수납되는 반도체 패키지의 크기에 대응하여 상 하 좌 우로 이동하는 복수 개의 조정기 및;A plurality of regulators provided on an upper surface of the loader and moving up, down, left, and right in accordance with the size of the semiconductor package; 상기 로더부의 가장 자리를 둘러싸고 상기 로더부에 결합되며, 상기 조정기들을 상기 로더부 상면에서 이동하도록 하는 지지부를 포함하는 것을 특징으로 하는 반도체 패키지의 이송 장치.And a support part surrounding the edge of the loader part and coupled to the loader part to move the adjusters on the upper surface of the loader part. 제 1 항에 있어서,The method of claim 1, 상기 볼 삽입구들은 상기 로더부 상면에 동일한 패턴으로 구비되어, 피치가 동일한 반도체 패키지의 볼들을 삽입하도록 구비되는 것을 특징으로 하는 반도체 패키지의 이송 장치.The ball insertion holes are provided in the same pattern on the upper surface of the loader, it is provided to insert the balls of the semiconductor package with the same pitch, characterized in that the transfer device of the semiconductor package. 제 1 항에 있어서,The method of claim 1, 상기 조정기들은;The regulators; 상기 수납된 반도체 패키지의 가로축 크기에 대응해서 좌우로 이동하는 복수개의 제 1 조정기 및,A plurality of first regulators moving left and right corresponding to the horizontal axis size of the semiconductor package; 상기 수납된 반도체 패키지의 세로축 크기에 대응하여 상하로 이동하는 복수 개의 제 2 조정기를 포함하는 것을 특징으로 하는 반도체 패키지의 이송 장치.And a plurality of second adjusters moving up and down corresponding to the vertical axis size of the accommodated semiconductor package. 제 1 항 또는 제 3 항에 있어서,The method according to claim 1 or 3, 상기 조정기들은 상기 수납된 반도체 패키지의 크기에 맞게 이동한 후, 각각 상기 지지부에 고정되도록 나사 형태로 구비되는 것을 특징으로 하는 반도체 패키지의 이송 장치.The adjusters are moved in accordance with the size of the accommodated semiconductor package, each of the semiconductor device transfer device, characterized in that provided in the form of a screw to be fixed to the support.
KR1020010043480A 2001-07-19 2001-07-19 Shipping boat of semiconductor package KR20030008644A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100792485B1 (en) * 2006-07-01 2008-01-10 (주)테크윙 Pick-and-place apparatus
KR101110666B1 (en) * 2004-09-17 2012-03-13 한미반도체 주식회사 Vision equipment for a semiconductor package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101110666B1 (en) * 2004-09-17 2012-03-13 한미반도체 주식회사 Vision equipment for a semiconductor package
KR100792485B1 (en) * 2006-07-01 2008-01-10 (주)테크윙 Pick-and-place apparatus
WO2008004778A1 (en) * 2006-07-01 2008-01-10 Techwing., Co. Ltd Pick-and-place apparatus
US8141922B2 (en) 2006-07-01 2012-03-27 TechWing Co., Ltd Pick-and-place apparatus

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