KR200298851Y1 - Appratus for transporting semiconductor package having double head - Google Patents
Appratus for transporting semiconductor package having double head Download PDFInfo
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- KR200298851Y1 KR200298851Y1 KR2019970040078U KR19970040078U KR200298851Y1 KR 200298851 Y1 KR200298851 Y1 KR 200298851Y1 KR 2019970040078 U KR2019970040078 U KR 2019970040078U KR 19970040078 U KR19970040078 U KR 19970040078U KR 200298851 Y1 KR200298851 Y1 KR 200298851Y1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
1. 청구범위에 기재된 고안이 속한 기술분야1. TECHNICAL FIELD OF THE INVENTION
반도체 패키지 전달용 양방향 헤드 로봇Bidirectional Head Robot for Semiconductor Package Delivery
2. 고안이 해결하려고 하는 기술적 요지2. The technical gist of the invention
본 고안은 패키지를 두 개의 매거진으로부터 동시에 인출하고, 그들을 두 대의 컨베이어 밸트에 각각 장착할 수 있는 로봇을 구현하므로써, 작업공간을 효율적으로 활용할 수 있을 뿐만아니라 유지비용을 감소시켜 반도체 패키지의 제작원가를 최소화하는 반도체 패키지 전달용 양방향 헤드 로봇을 제공하는데 그 목적이 있다.The present invention implements a robot that can simultaneously take out packages from two magazines and mount them on two conveyor belts, which not only makes efficient use of the work space but also reduces maintenance costs, thereby reducing the cost of manufacturing semiconductor packages. It is an object of the present invention to provide a bidirectional head robot for minimizing semiconductor package delivery.
3. 고안의 해결 방법의 요지3. Summary of solution of design
본 고안은 매거진과 컨베이어 밸트 상으로 이동하는 아암; 상기 아암의 양측에 구비되며, 상하로 신장 및 수축하면서 매거진에 적재된 패키지를 흡착하고, 컨베이어 밸트상으로 상기 패키지를 안착시키는 제1 및 제2 착탈수단; 및 일측에 제1착탈수단이 연결되며, 전후 이동하는 슬라이드 부재와, 상기 슬라이드 부재를 안내하는 가이드 부재와, 상기 가이드 부재의 소정 위치에 장착되어 상기 제2헤드가 컨베이어 밸트 상에 위치되는 지를 감지하는 수단을 포함하며, 상기 제2착탈수단에 흡착된 패키지가 제2 컨베이어 밸트상에 위치되도록 위치를 보정하는 위치보정수단을 포함하는 반도체 패키지 전달용 양방향 헤드로봇을 제공한다.The present invention is an arm moving on the magazine and the conveyor belt; First and second detachable means provided on both sides of the arm, the first and second detachable means for absorbing the package loaded in the magazine while extending and contracting up and down, and seating the package onto a conveyor belt; And a first detachable means connected to one side, a slide member moving forward and backward, a guide member for guiding the slide member, and mounted at a predetermined position of the guide member to detect whether the second head is located on a conveyor belt. And means for correcting the position such that the package adsorbed on the second detachable means is positioned on the second conveyor belt.
4. 고안의 중요한 용도4. Important uses of the devise
본 고안은 반도체 패키지를 이동시키는데 소요되는 비용과 공간을 감소시켜제작원가를 감소시키는 것임.The present invention is to reduce the manufacturing cost by reducing the cost and space required to move the semiconductor package.
Description
본 고안은 반도체 패키지의 제조장비에서 로트공정을 수행하기 위한 위치로 패키지를 전달하기 위한 로봇에 관한 것으로, 특히 한 대의 로봇을 이용하여 두 대의 컨베이어 밸트에 각각 패키지를 전달할 수 있도록 하는 반도체 패키지 전달용 양방향 헤드 로봇에 관한 것이다.The present invention relates to a robot for delivering a package to a position for performing a lot process in a manufacturing apparatus of a semiconductor package, and in particular, for delivering a semiconductor package for delivering a package to two conveyor belts using one robot. Relates to a two-way head robot.
일반적으로, 반도체 패키지의 제조공정에서는, 패키지 상면에 제조사 및 품번 등을 마킹(marking)하는 로트공정을 수행하였다. 이때, 리드 프레임과 칩이 조립된 패키지를 로트공정 수행 장비로 이동시키기 위하여, 컨베이어 밸트 상에 패키지를 전달하는 로봇이 상기 패키지 제조장비에 구비된다.Generally, in the manufacturing process of a semiconductor package, the lot process which marks a manufacturer, an article number, etc. on the upper surface of the package was performed. At this time, in order to move the package assembled with the lead frame and the chip to the lot process performing equipment, the robot for delivering the package on the conveyor belt is provided in the package manufacturing equipment.
상기 종래의 패키지 전달용 로봇은, 도1에 도시된 바와 같이, 본체(1)와, 상기 본체(1) 상에 그의 길이방향으로 이동가능하도록 장착되어 평행한 두 컨베이어 밸트(4,4a) 및 다수의 패키지가 적재된 매거진(5) 상에서 이동하되, 확장 및 수축이 가능하도록 형성된 아암(2)과, 상기 아암(2)의 일단부 저면에 장착되어 매거진에 적재된 패키지를 진공으로 흡착하도록 형성된 착탈기(3)로 구성되어 있다.The conventional package delivery robot is, as shown in Figure 1, the main body 1, and the two conveyor belts (4, 4a) parallel to and mounted to be movable in the longitudinal direction on the main body (1) and A plurality of packages are moved on the loaded magazines 5, and the arms 2 are formed to expand and contract, and are mounted to the bottom of one end of the arms 2 so as to suck the packages loaded in the magazines by vacuum. It is comprised by the attachment / detachment machine 3.
이와 같은 종래 기술에 따른 반도체 패키지 전달용 로봇은 각 컨베이어 밸트마다 하나씩 구비되며, 그의 작용을 살펴보면 다음과 같다.Such a semiconductor package delivery robot according to the prior art is provided with one for each conveyor belt, looking at the operation thereof as follows.
상기 아암(2)이 그의 길이방향으로 신장되어 상기 착탈기(3)를 매거지(5)으로부터 패키지를 흡착할 수 있는 위치까지 이동시키게 되면, 상기 착탈기(3)가 매거진(5)으로부터 하나의 패키지를 흡착한다. 이어, 아암(2)이 수축되어 컨베이어 밸트의 중앙부분으로 이동한다. 다음으로, 상기 착탈기(3)에 흡착되어 있는 패키지를 안전하게 이탈시킬 수 있는 위치까지 신장시키면, 상기 착탈기(3)의 진공력을 제거하여 컨베이어 밸트의 상면에 패키지를 전달한다.When the arm 2 extends in its longitudinal direction and moves the detacher 3 from the magazine 5 to a position where the package can be adsorbed, the detacher 3 is removed from the magazine 5. To adsorb the package. The arm 2 then contracts and moves to the center portion of the conveyor belt. Next, when the package adsorbed on the detacher 3 is extended to a position where it can be safely detached, the vacuum force of the detacher 3 is removed to transfer the package to the upper surface of the conveyor belt.
그러나, 상기한 바와 같은 종래 기술에는, 각 매거진당 하나의 로봇이 할당되어 각각의 컨베이어 밸트에 패키지를 전달하고 있기 때문에, 상기 로봇의 유지보수 비용이 증가하고 설치공간이 증가할 뿐만아니라, 로봇의 구입단가가 상승되는 문제점이 있었다.However, in the prior art as described above, since one robot is allocated to each magazine to deliver a package to each conveyor belt, the maintenance cost of the robot is increased and the installation space is increased. There was a problem that the purchase price is increased.
따라서, 본 고안은 상기한 문제점을 해결하기 위하여 안출된 것으로서, 패키지를 두 개의 매거진으로부터 동시에 인출하고, 그들을 두 대의 컨베이어 밸트에 각각 안착시킬 수 있는 로봇을 구현하므로써, 작업공간을 효율적으로 활용할 수 있을 뿐만아니라 유지비용을 감소시켜 반도체 패키지의 제작원가를 최소화하는 반도체 패키지 전달용 양방향 헤드 로봇을 제공하는데 그 목적이 있다.Therefore, the present invention was devised to solve the above problems, and by realizing a robot that can simultaneously take out packages from two magazines and seat them on two conveyor belts, it is possible to utilize the work space efficiently. In addition, the object of the present invention is to provide a bidirectional head robot for semiconductor package delivery that minimizes manufacturing costs of semiconductor packages by reducing maintenance costs.
도1은 종래 기술에 따른 패키지 전달용 로봇의 구성을 나타낸 개략도.1 is a schematic view showing the configuration of a package delivery robot according to the prior art.
도2는 본 고안에 따른 패키지 전달용 양방향 헤드 로봇의 일실시예 구성을 나타낸 사시도.Figure 2 is a perspective view showing an embodiment configuration of a bidirectional head robot for package delivery according to the present invention.
도3은 본 고안에 따른 패키지 전달용 양방향 헤드 로봇의 개략적인 작용 상태도.Figure 3 is a schematic operation state of the bidirectional head robot for package delivery according to the present invention.
*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
8 : 제1컨베이어 밸트 7 : 제2컨베이어 밸트8: 1st conveyor belt 7: 2nd conveyor belt
9 : 매거진 10 : 본체9: magazine 10: body
20 : 아암 31 : 제1헤드20: arm 31: first head
32 : 제2헤드 41 : 제1착탈기32: second head 41: the first detachable
42 : 제2착탈기 50 : 위치보정기42: second detachable device 50: position corrector
51 : 슬라이드 부재 52 : 가이드 부재51: slide member 52: guide member
53 : 위치감지센서53: position sensor
상기 목적을 달성하기 위하여 본 고안은, 매거진과 컨베이어 밸트상으로 이동하는 아암; 상기 아암의 양측에 구비되며, 상하로 신장 및 수축하면서 매거진에 적재된 패키지를 흡착하고, 컨베이어 밸트상으로 상기 패키지를 안착시키는 제1 및 제2 착탈수단; 및 일측에 제1착탈수단이 연결되며, 전후 이동하는 슬라이드 부재와, 상기 슬라이드 부재를 안내하는 가이드 부재와, 상기 가이드 부재의 소정 위치에 장착되어 상기 제2헤드가 컨베이어 밸트 상에 위치되는 지를 감지하는 수단을 포함하며, 상기 제2착탈수단에 흡착된 패키지가 제2 컨베이어 밸트상에 위치되도록위치를 보정하는 위치보정수단을 포함하는 반도체 패키지 전달용 양방향 헤드로봇을 제공하다.The present invention to achieve the above object, the arm moving on the magazine and the conveyor belt; First and second detachable means provided on both sides of the arm, the first and second detachable means for absorbing the package loaded in the magazine while extending and contracting up and down, and seating the package onto a conveyor belt; And a first detachable means connected to one side, a slide member moving forward and backward, a guide member for guiding the slide member, and mounted at a predetermined position of the guide member to detect whether the second head is located on a conveyor belt. And means for correcting the position such that the package adsorbed on the second detachable means is positioned on the second conveyor belt.
이하, 첨부된 도2 및 도3을 참조하여 본 고안에 따른 반도체 패키지의 마킹장치용 양방향 헤드 로봇의 실시예를 상세히 설명하면 다음과 같다.Hereinafter, an embodiment of a bidirectional head robot for a marking device for a semiconductor package according to the present invention will be described in detail with reference to FIGS. 2 and 3.
본 고안에 따른 반도체 패키지 전달용 양방향 헤드 로봇은, 도2에 도시된 바와 같이, 그 일단부가 지면에 고정되고 그 타단부는 제1 및 제2컨베이어 밸트(8,7)의 상측에 위치된 "ㄱ"자 형상의 본체(10)와, 상기 본체(10)와 길이방향을 따라 전후로 이동가능하게 장착되는 아암(20)과, 상기 아암(20)의 양단부에 고정되어 공기를 흡입 및 흡출할 수 있도록 형성된 제1 및 제2헤드(31,32)와, 상기 각 헤드(31,32)의 작용에 의해 변화되는 압력차를 이용하여 반도체 패키지를 흡착 또는 이탈시킬 수 있도록 구비된 제1 및 제2착탈기(41, 42)와, 상기 제2헤드(32)와 제2착탈기(42)의 사이에 장착되며 상기 제2착탈기(42)에 흡착되어 있는 반도체 패키지의 이탈위치로 그를 이동시키는 위치보정기(50)를 포함한다.In the bidirectional head robot for semiconductor package delivery according to the present invention, as shown in Fig. 2, one end thereof is fixed to the ground, and the other end thereof is located above the first and second conveyor belts 8 and 7. A-shaped main body 10, the arm 20 is mounted to be movable back and forth along the main body 10 and the longitudinal direction, and fixed to both ends of the arm 20 can suck and suck air The first and second heads 31 and 32 formed so that the first and second heads 31 and 32 and the pressure difference changed by the action of the heads 31 and 32 are adapted to adsorb or detach the semiconductor package. It is mounted between the detachers 41 and 42 and the second head 32 and the second detacher 42, and moves them to the detachment position of the semiconductor package adsorbed by the second detacher 42. And a position corrector 50.
여기서, 상기 제1착탈기(41) 및 위치보정기(50)는 제1 및 제2헤드(31, 32)에 연결된 상태로 상 하 방향으로 이동되는 것이 가능하도록 구비된다.Here, the first detacher 41 and the position corrector 50 are provided to be movable in the vertical direction while being connected to the first and second heads 31 and 32.
또한, 상기 위치보정기(50)는 외부에서 제공되는 구동력에 의해 전 후 이동하는 슬라이드 부재(51)와, 상기 슬라이드 부재(51)의 이동을 안내하는 가이드부재(52)와, 상기 제2착탈기(42)가 제2컨베이어 밸트(7) 상의 중앙부분에 위치되는 것을 감지하는 위치감지센서(53)로 구성된다.In addition, the position corrector 50 is a slide member 51 to move back and forth by a driving force provided from the outside, a guide member 52 for guiding the movement of the slide member 51, and the second detachable It is composed of a position sensor 53 for detecting that the 42 is located in the center portion on the second conveyor belt (7).
이와 같은, 본 고안에 따른 반도체 패키지 전달용 양방향 헤드 로봇의 작용을 살펴보면 다음과 같다.As described above, the operation of the bidirectional head robot for semiconductor package delivery according to the present invention is as follows.
외부전원을 인가하여 로봇을 초기화시키면, 즉 헤드(31,32)가 신장하여 상기 제1 및 제2착탈기(41,42)를 각 매거진(9)의 상면에 밀착시키게 되면, 상기 제1 및 제2헤드(31, 32)가 공기를 흡입하여 각 착탈기(41, 42)에 패키지를 흡착한 다음, 수축된다.When the robot is initialized by applying an external power source, that is, when the heads 31 and 32 are extended and the first and second detachers 41 and 42 are brought into close contact with the upper surfaces of the magazines 9, the first and second The second heads 31 and 32 suck air and suck the package to each of the detachers 41 and 42, and then contract.
이어, 아암(20)이 작동하여 제1 및 제2착탈기(41, 42)를 컨베이어 밸트 상의 패키지가 안착될 위치로 이동시킨다. 이때, 상기 제1헤드(31)가 신장하여 제1착탈기(41)에 흡착되어 있는 패키지를 제1컨베이어 밸트(8)의 상면에 안착시킨다. 또한, 상기 제2착탈기(42)는 위치보정기(50)의 구동에 따라 이동되어 패키지를 제2컨베이어 밸트(7)의 상면 중앙에 안착되도록 한다.The arm 20 then operates to move the first and second desorbers 41, 42 to the position where the package on the conveyor belt will rest. At this time, the first head 31 is extended and seated on the upper surface of the first conveyor belt 8, the package adsorbed on the first detacher 41. In addition, the second detacher 42 is moved according to the driving of the position corrector 50 so that the package is seated at the center of the upper surface of the second conveyor belt 7.
본 발명의 반도체 패키지 전달용 양방향 헤드 로봇은, 제1 및 제2컨베이어 밸트로 반도체 패키지를 전달할 뿐만아니라, 그로부터 반도체 패키지를 흡착하여 다른 장치로 이동시키는 것이 가능하다.The bidirectional head robot for semiconductor package delivery of the present invention can not only deliver the semiconductor package to the first and second conveyor belts, but also absorb the semiconductor package therefrom and move it to another device.
이상에서 설명한 본 고안은 전술한 실시예 및 도면에 의해 한정되는 것은 아니고, 본 고안의 기술적 사상을 벗어나지 않는 범위내에서 여러 가지 치환, 변형 및 변경이 가능함은 본 고안이 속하는 기술 분야에서 통상의 지식을 가진 자에게 있어 명백할 것이다.The present invention described above is not limited to the above-described embodiments and drawings, and various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be apparent to those who have
상기한 바와 같은 본 고안에 따른 반도체 패키지 전달용 양방향 헤드 로봇은, 한 대의 로봇으로 종래의 한 방향 헤드 로봇 두 대가 하는 역할을 하므로, 그의 유지비용이 감소되고, 그의 설치를 위해 필요한 공간이 줄어드는 효과가 있다.As described above, the bidirectional head robot for semiconductor package delivery according to the present invention has a role of two conventional one-way head robots as one robot, so that the maintenance cost thereof is reduced and the space required for its installation is reduced. There is.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970040078U KR200298851Y1 (en) | 1997-12-23 | 1997-12-23 | Appratus for transporting semiconductor package having double head |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970040078U KR200298851Y1 (en) | 1997-12-23 | 1997-12-23 | Appratus for transporting semiconductor package having double head |
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| Publication Number | Publication Date |
|---|---|
| KR19990027485U KR19990027485U (en) | 1999-07-15 |
| KR200298851Y1 true KR200298851Y1 (en) | 2003-04-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR2019970040078U KR200298851Y1 (en) | 1997-12-23 | 1997-12-23 | Appratus for transporting semiconductor package having double head |
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| Country | Link |
|---|---|
| KR (1) | KR200298851Y1 (en) |
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1997
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| KR19990027485U (en) | 1999-07-15 |
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