KR200296515Y1 - The apparatus for thermal efficiency increase of thermocouple module - Google Patents
The apparatus for thermal efficiency increase of thermocouple module Download PDFInfo
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- KR200296515Y1 KR200296515Y1 KR2020020022007U KR20020022007U KR200296515Y1 KR 200296515 Y1 KR200296515 Y1 KR 200296515Y1 KR 2020020022007 U KR2020020022007 U KR 2020020022007U KR 20020022007 U KR20020022007 U KR 20020022007U KR 200296515 Y1 KR200296515 Y1 KR 200296515Y1
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- extender
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
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Abstract
본 고안은 상부에 휀이 형성된 상부히트싱크와, 상기 상부히트싱크 하부에 열전모듈이 내장된 열전모듈보호캡과, 상기 열전모듈보호캡하부에 형성된 엑스텐더와, 상기 엑스텐더하부에 휀이 형성된 하부히트싱크로 구성된 열전모듈의 열효율을 증대시키기 위한 장치에 관한 것이다.The present invention has an upper heatsink having a top portion formed therein, a thermoelectric module protection cap having a thermoelectric module built in the lower portion of the upper heatsink, an extender formed under the thermoelectric module protection cap, and a lower heat formed with the bottom portion of the extender. An apparatus for increasing the thermal efficiency of a thermoelectric module composed of a sink.
Description
본 고안은 열전모듈의 열효율을 증대시키기 위한 장치에 관한 것으로서, 직류전기를 통전하면 펠티어효과로 상하 양방향으로 온도가 분리되어 온도편차가 발생하는 것을 최소화하여 분리된 상하측 열을 적절하게 방열 또는 전열시키도록 열전모듈의 구조를 개선한 냉난방기에 사용되는 열전모듈의 열효율을 증대시키기 위한 장치에 관한 것이다.The present invention relates to a device for increasing the thermal efficiency of the thermoelectric module, and when the direct current is energized, the Peltier effect separates the temperature in both up and down directions, thereby minimizing the occurrence of temperature deviation, so that the upper and lower side heats are properly radiated or transferred. The present invention relates to an apparatus for increasing the thermal efficiency of a thermoelectric module used in an air conditioner for improving the structure of a thermoelectric module.
열전모듈은 펠티어효과를 이용하여 냉각이나 가열을 동시에 수행할 수 있는 열과 전기의 교환시스템으로 극전환을 통하여 간편하게 냉각과 가열을 전환할 수 있다.The thermoelectric module is a heat and electricity exchange system that can simultaneously perform cooling or heating using the Peltier effect, and can be easily switched between cooling and heating through pole switching.
이와같은 열전모듈은 부피가 작고, 빠르고 우수한 냉각효과를 얻을 수 있기 때문에 기존의 컴프레셔 냉각방식을 대체할 차세대 냉각방식으로 이용도가 넓어지고 있다. 특히, 전자소자와 같이 시스템의 안정을 요하나 가동공간이 협소한 경우, 소음방지를 요하는 경우, 온도의 제어가 쉽게 가능해야하는 경우에 사용되어 지고 있다.Such thermoelectric modules have a small volume, fast and excellent cooling effect, and thus are widely used as next generation cooling methods to replace conventional compressor cooling methods. In particular, when the system requires stability, such as electronic devices, but the operating space is small, noise prevention, it is used when the temperature control must be easily possible.
이와같은 열전모듈은 절연기판사이에 n형과 p형의 열전소자들을 배열시켜 형성한다. p형소자와 n형소자를 금속전극에 접합시키고, 상기 회로 p-n 쌍양분지단의 극을 각각 -,+로 되도록 직류전기를 흘리면 펠티어효과에 따라 p형 소자내의 정공은 -극으로, n형 소자내의 전자는 반대극으로 이끌리게된다. 이때 정공과 전자 모두 상부의 p-n접합부 전극으로부터 열을 갖고 하부 양분자단 전극으로 이동하기 때문에 상부의 접합부에서는 냉각되어 주위로부터 열을 흡수하고, 하부의 양분자단은 열을 방출한다. 전류의 흐름을 반대로 하면, 이와 반대의 효과가 일어난다. 따라서 열전모듈은 냉각용 또는 가열용으로 사용될수 있는 장치인 것이다.Such a thermoelectric module is formed by arranging n-type and p-type thermoelectric elements between insulating substrates. When the p-type device and the n-type device are bonded to a metal electrode, and a direct current is flowed so that the poles of the bipolar branch of the circuit become-and +, the holes in the p-type device are -poles according to the Peltier effect. The electrons inside are attracted to the opposite pole. At this time, since both the hole and the electron have heat from the upper p-n junction electrode and move to the lower quantum terminal electrode, the upper junction is cooled to absorb heat from the surroundings, and the lower quantum terminal emits heat. If you reverse the flow of current, the opposite effect occurs. Therefore, the thermoelectric module is a device that can be used for cooling or heating.
그러나 이러한 열전모듈의 냉각 또는 가열 대상체에 부착시켜 사용하거나, 냉각 또는 가열대상 공간상에 노출시켜사용시 히트싱크를 열전모듈의 반대편에 부착시켜 열교환을 시켜 사용하는데 접촉되는 방법과 열전모듈의 배치 및 구조에 따라 열효율의 많은 차이가 있어 이를 개량하고자 많은 연구가 있어 왔다.However, when the thermoelectric module is attached to the cooling or heating object of the thermoelectric module or is exposed to the cooling or heating object space, the heat sink is attached to the other side of the thermoelectric module to be used for heat exchange and the arrangement and structure of the thermoelectric module. There are many differences in thermal efficiency, and there have been many studies to improve it.
예를 들면 대한민국공개특허공보 공개번호 특2001-68353호에는 세라믹기판과 상기 세라믹기판위에 소정간격으로 형성된 하부구리전극과, 하부구리전극위에 형성되는 써모커플과, 써모커플위에 형성된 구리재질의 히트파이프로 구성되어 히트파이프가 써모커플의 전극기능과 방열기능을 동시에 수행할 수 있도록 형성된 열전냉각모듈이 기재되어 있으며,For example, Korean Patent Laid-Open Publication No. 2001-68353 discloses a ceramic substrate and a lower copper electrode formed on the ceramic substrate at predetermined intervals, a thermocouple formed on the lower copper electrode, and a copper heat pipe formed on the thermocouple. It is composed of a thermoelectric cooling module is formed so that the heat pipe can perform the electrode function and the heat radiation function of the thermocouple at the same time,
대한민국국제특허출원의 출원공개공보 공개번호 특1996-7006284호에는 제1전기 도전성패턴을 제1기판위에 놓고, 제2전기 도전성패턴을 제2기판위에 놓고, 제1열전재료 및 제2열전재료의 교차막대를 서로 평행하게 배열한 다음, 막대를 소자분리하여 제2기판을 소자위에 놓고 소자를 고정시켜 열전모듈을 제조하는 기술이 기재되어 있고,Korean Patent Laid-Open Publication No. 1996-7006284 discloses a first electrically conductive pattern on a first substrate, a second electrically conductive pattern on a second substrate, and a first thermoelectric material and a second thermoelectric material. A technique of manufacturing a thermoelectric module by arranging the cross bars in parallel with each other, then separating the rods and placing the second substrate on the elements and fixing the elements is described.
대한민국공개특허공보 공개번호 제2002-19786호에 온도센서가 일체형으로 부착된 열전모듈이 공개되어 있으나,Korean Patent Publication No. 2002-19786 discloses a thermoelectric module in which a temperature sensor is integrally attached,
상기와 같은 종래의 기술들은 열전모듈을 접촉시켜 열교환시 분리된 상하측열을 적절하게 방열 또는 전열시키지 못하여 열전모듈의 효능이 저해되는 문제점이있어 왔다.The prior art as described above has a problem that the efficacy of the thermoelectric module is hampered by contacting the thermoelectric module does not properly radiate or heat the upper and lower side heat separated during heat exchange.
상기와 같은 문제점을 해결하고자 본 고안은 열전모듈의 열효율을 증대시키기 위하여 열전모듈과 접촉되어 열전달되는 구조를 개량하여 부피를 최소화시킴과 동시에 열교환 효율의 증대 효과가 있는 냉난방기에 사용되는 열전모듈장치를 제공하는데 그 목적이 있는 것이다.In order to solve the above problems, the present invention improves the heat transfer efficiency of a thermoelectric module to improve the heat transfer structure in contact with the thermoelectric module to minimize the volume and at the same time increase the heat exchange efficiency of the thermoelectric module device used in the air conditioner The purpose is to provide.
도1은 본 고안의 열전모듈장치 상세도1 is a detailed view of the thermoelectric module device of the present invention
도2는 본 고안의 열전모듈장치 분해 조립상세도Figure 2 is an exploded assembly detail of the thermoelectric module device of the present invention
도3은 본 고안의 상부 히트싱트 상세도Figure 3 is a detailed view of the upper heat sink of the present invention
도4는 본 고안의 열전모듈보호캡 상세도Figure 4 is a detailed view of the thermoelectric module protective cap of the present invention
도5는 본 고안의 엑스텐더상세도5 is a detail of the extender of the present invention
도6은 본 고안의 내부공기순환용 하부 히트싱크상세도Figure 6 is a detailed view of the lower heat sink for internal air circulation of the present invention
도7은 본 고안의 원형 엑스텐더 평면 및 측면 상세도Figure 7 is a planar and side detailed view of the circular extender of the present invention
도8은 본 고안의 사각엑스텐더 평면 및 측면상세도Figure 8 is a planar and side detail of the rectangular extender of the present invention
도9는 본 고안의 사이클론형상의 홈에 관한 다양한 형태에 관한 상세도9 is a detailed view of various forms of the cyclone groove of the present invention;
<도면의 부호 설명><Description of the symbols in the drawing>
상부히트싱크(1), 방출용휀(2), 히트싱크상부보호캡(3), 볼트(4), 볼트통공 (5), 열전모듈보호캡(6), 엑스텐더(7), 열전모듈접촉부(8), 하부히트싱크(9), 내부순환용휀(10), 열전모듈(20)Upper heat sink (1), discharge cap (2), heat sink upper protective cap (3), bolt (4), bolt hole (5), thermoelectric module protective cap (6), extender (7), thermoelectric module contact ( 8), lower heat sink (9), internal circulation fan (10), thermoelectric module (20)
상기와 같은 목적을 달성하고자, 본 고안은 상부에 휀이 형성된 상부히트싱크와, 상기 상부히트싱크 하부에 열전모듈이 내장된 열전모듈보호캡과, 상기 열전모듈보호캡하부에 형성된 엑스텐더와, 상기 엑스텐더하부에 휀이 형성된 하부히트싱크로 구성된 열전모듈의 열효율을 증대시키기 위한 장치에 관한 것이다.In order to achieve the above object, the present invention is an upper heat sink is formed in the upper heat sink, the thermoelectric module protective cap is built in the thermoelectric module lower portion of the upper heat sink, the extender formed under the thermoelectric module protective cap, and The present invention relates to an apparatus for increasing the thermal efficiency of a thermoelectric module composed of a lower heat sink having a fin formed under the extender.
종래에는 엑스텐더(냉각전열판)와 연결조립하기 위하여 히트싱크(방열판)날개를 제거하여 왔으나, 본 고안에서는 도3과 같이, 히트싱크(방열판)날개를 제거하지 않은채 그대로 두고 지정된 위치에 가공과 테이핑하여 열전모듈에 가까운 상부히트싱크(방열판)을 그대로 두어 단위면적당 방열량을 증대시켜 발열효율을 증대시켰으며, 각부품을 조립하는 볼트는 종래에는 쇠로된 스크류볼트로 상하부 연결시켜 볼트재질이 열을 전도하여 장치내의 열전도의 효율을 감소시켰으나, 본 고안에서 사용되는 볼트는 열전도성이 낮은 플라스틱소재의 스크류볼트로 볼트자체로 인한열손실을 감소시켰다.Conventionally, the heat sink (heat sink) blade has been removed to connect and assemble with the extender (cooling plate), but in the present invention, as shown in FIG. 3, the heat sink (heat sink) blade is left as it is without processing and taping at a designated position. The upper heatsink (heat sink) close to the thermoelectric module is kept intact to increase the heat dissipation per unit area, thereby increasing heat generation efficiency. Bolts for assembling each component are connected to the upper and lower parts by screw bolts made of iron. However, the efficiency of the thermal conductivity in the device was reduced, but the bolt used in the present invention is a screw bolt of a low thermal conductivity plastic material to reduce the heat loss due to the bolt itself.
종래에는 엑스텐더(냉각전열판)과 히트싱크(방열판)의대류복사열로 인한 열효율의 하락현상과, 조립시 스크류 조립강도 편차로 인한 열전모듈의 파손이 많았으나, 본 고안에서는 도4와 같이, 열전모듈보호캡을 설치하여 상기 열전모듈 내부 홈에 열전모듈을 삽입시켜 조립작업시 열전모듈의 파손을 방지하고 상하 열복사대류를 차단하여 열효율을 증대시키고, 조립시 용이하고 안전하게 작업할 수 있도록 하였으며, 히트싱크와 엑스텐더의 목부위까지 플라스틱재질의 보호캡에 날개를 붙여 보온효과와 충격시 충격을 완화시켜 열전모듈을 보호하였고,Conventionally, the thermal efficiency of the extruder (cooling plate) and heat sink (heat sink) due to the convective radiation of the thermal degradation, and the assembly of the thermoelectric module due to the variation in screw assembly strength during assembly, but the present invention, as shown in Figure 4, the thermoelectric module By installing a protective cap to insert the thermoelectric module into the inner groove of the thermoelectric module to prevent damage of the thermoelectric module during assembly work, and to block the heat radiation convection up and down to increase the thermal efficiency, and to be able to work easily and safely during the assembly, heat sink Wings are attached to the protective cap made of plastic material to the neck of the and the extender to protect the thermoelectric module by alleviating the thermal effect and impact in shock.
본 고안의 액스텐더(냉각전열판)는 도7 및 도8과 같이, 사각구조와 원형형상인 두가지로 제작하여 사각구조는 상판히크싱크와 연결조립을 용이하게 하기 위함이며, 원형형상은 가공비가 절감되고 표면적이 적어 열손실이 적고 몸체와 접촉면적이 넓어 열전도성이 좋아 필요에 따라 사각형상 또는 원형형상을 선택하여 사용하게 하였으며, 상기 엑스텐더의 상부는 도8과 같이, 열전모듈접촉부분에 원형이며 싸이클론형상의 홈을 형성시켜 열전모듈에서 발생하는 열을 효율적으로 전도성을 높혔고, 그 형상은 필요에 따라 도9와 같이 다양하게 개량할 수 있는 것이다.7 and 8, the actuator of the present invention is manufactured in two types, a rectangular structure and a circular shape, so that the rectangular structure is easy to assemble and connect the top plate sink, and the circular shape reduces the processing cost. It has a small surface area, low heat loss and a large contact area with the body, so that it has good thermal conductivity. A rectangular or circular shape can be selected and used as needed. The upper part of the extender is circular in the thermoelectric module contact part as shown in FIG. By forming a cyclone-shaped groove, the heat generated from the thermoelectric module is efficiently increased, and the shape thereof can be variously improved as shown in FIG.
종래에는 엑스텐더를 몸체에 연결하여 전도에 의한 냉각방식으로 부위별 온도편차가 크나 본 고안에서는 도6과 같이, 휀을 장착하여 하부히트싱크를 엑스텐더에 열결하여 열 전도와 공기순환방식을 병용하여 온도편차를 없애고 열효율을 증대시켰다.Conventionally, the temperature difference for each part is large by cooling by conduction by connecting the extender to the body, but in the present invention, as shown in FIG. 6, by attaching a fan, the lower heatsink is thermally connected to the extender to use both heat conduction and air circulation. Elimination of deviations and increased thermal efficiency.
이하 도면을 참고하여 상세히 설명하면 다음과 같다.When described in detail with reference to the drawings as follows.
도1은 본 고안의 열전모듈장치 상세도, 도2는 본 고안의 열전모듈장치 분해 조립상세도, 도3은 본 고안의 상부 히트싱크 상세도, 도4는 본 고안의 열전모듈보호캡 상세도, 도5는 본 고안의 엑스텐더상세도, 도6은 본 고안의 내부공기순환용 하부 히트싱크상세도, 도7은 본 고안의 원형 엑스텐더 평면 및 측면 상세도, 도8은 본 고안의 사각엑스텐더 평면 및 측면상세도, 도9는 본 고안의 사이클론형상의 홈에 관한 다양한 형태에 관한 상세도를 도시한 것이며, 상부히트싱크(1), 방출용휀(2), 히트싱크상부보호캡(3), 볼트(4), 볼트통공(5), 열전모듈보호캡(6), 엑스텐더(7), 열전모듈접촉부(8), 하부히트싱크(9), 내부순환용휀(10), 열전모듈 (20)를 나타낸 것임을 알 수 있다.1 is a detailed view of the thermoelectric module device of the present invention, Figure 2 is an exploded assembly detail of the thermoelectric module device of the present invention, Figure 3 is a detailed view of the upper heat sink of the present invention, Figure 4 is a detailed view of the thermoelectric module protection cap of the present invention 5 is a detail of the extender of the present invention, FIG. 6 is a bottom heat sink detail for internal air circulation of the present invention, FIG. 7 is a circular extender plane and a detailed side view of the present invention, and FIG. 8 is a square extender plane of the present invention. 9 is a detailed view of various forms of the cyclone-shaped groove of the present invention, the upper heat sink 1, the discharge fan 2, the heat sink upper protective cap 3, Bolt (4), bolt hole (5), thermoelectric module protective cap (6), extender (7), thermoelectric module contact (8), lower heat sink (9), internal circulation fan (10), thermoelectric module (20) It can be seen that it represents.
구조를 살펴보면 도1 및 도2에 도시된 바와 같이, 상부에 형성된 상부히트싱크(1)와, 상기 상부히트싱크(1)의 중앙상부에 안치되는 방출용휀(2)과, 상기 히트싱크(1)의 테두리부에 형성되어 주위로 방출되는 열을 방지하는 히트싱크상부보호캡(3)과, 상기 상부히트싱크(1)의 하부에 볼트(4)로 연결되기 위한 다수의 볼트통공(5)가 테두리에 다수 구비되어 있으며 중앙부에 열전모듈(20)을 내장하는 열전모듈홈과, 하부에 요홈이 형성된 열전모듈보호캡(6)과, 상기 열전모듈보호캡(6) 및 열전모듈(20)의 하부에 설치되어 있으며, 상기 열전모듈보호캡(6)과 볼트(4)로 연결되어 있고, 상부 중앙이 상기 열전모듈(20)의 하부와 밀착되는 열전모듈접촉부 (8)가 형성된 엑스텐더(7)와,Looking at the structure, as shown in Figure 1 and 2, the upper heat sink (1) formed in the upper portion, the discharge fin (2) is placed in the upper center of the upper heat sink (1), and the heat sink (1) Heat sink upper protective cap (3) formed on the edge portion of the) to prevent heat emitted to the surroundings, and a plurality of bolt through holes (5) for connecting to the lower portion of the upper heat sink (1) with a bolt (4) The thermoelectric module groove is provided with a plurality of edges in the center and the thermoelectric module 20 is built in the center, the thermoelectric module protective cap (6) formed with a recess in the lower portion, the thermoelectric module protective cap (6) and the thermoelectric module (20) Is installed in the lower portion of the extender 7 is connected to the thermoelectric module protective cap 6 and the bolt (4), the thermoelectric module contact portion 8 is formed in the upper center is in close contact with the lower portion of the thermoelectric module 20 )Wow,
상기 엑스텐더(7)의 하부에 설치되어 있고 엑스텐더(7)와 볼트(4)로 연결되어 있으며, 하부중앙부에 내부순환용휀(10)이 형성된 하부히트싱크(9)로 구성된 열전모듈의 열효율을 증대시키기 위한 장치인 것이다.It is installed at the lower part of the extender (7) and connected to the extender (7) and the bolt (4), the heat efficiency of the thermoelectric module consisting of a lower heat sink (9) having an inner circulation fan (10) formed in the lower center portion to increase the efficiency It is a device for making it.
도3은 본 고안의 히트싱크를 도시한 것으로, 상부히트싱크(6)의 상부 테두리에 형성되어 있으며 볼트(4)에 의해 상부히트싱크(6)에 의해 연결된 히트싱크상부보호캡(3)과, 상기 히트싱크(6)의 중앙부, 즉 히트싱크상부호호캡(3)의 중앙부에 상부에 형성된 방출용휀(2)과 하부에는 열전모듈보호캡(6)과 볼트(4)로 연결되도록 구성되어 있으며,3 shows the heat sink of the present invention, which is formed at the upper edge of the upper heat sink 6 and is connected to the heat sink upper protective cap 3 by the upper heat sink 6 by a bolt 4. In the center of the heat sink 6, that is, the heat dissipation cap (2) formed in the upper portion and the central portion of the heat sink upper code cap (3) and the lower portion is configured to be connected to the thermoelectric module protective cap (6) and bolt (4) And
도4는 열전모듈 및 열전모듈보호캡을 상세히 도시한 것으로서, 상기 상부히트싱크(1)의 하부에 볼트(4)로 연결되기 위한 다수의 볼트통공(5)가 테두리에 다수 구비되어 있으며 중앙부에 열전모듈(20)을 내장하는 열전모듈홈과, 하부에 요홈이 형성된 열전모듈보호캡(6)과, 하부에 엑스텐더(7)와 볼트로 연결되는 구조이고,Figure 4 shows the thermoelectric module and the thermoelectric module protection cap in detail, a plurality of bolt through holes (5) to be connected to the lower portion of the upper heat sink (1) with a bolt (4) is provided in the rim A thermoelectric module groove in which the thermoelectric module 20 is embedded, a thermoelectric module protection cap 6 having a recess in the lower portion thereof, and a structure in which the extender 7 and the bolt are connected to the lower portion thereof,
도5는 엑스텐더를 나타낸 것으로서, 상기 열전모듈보호캡(6)의 하부에 형성된 요홈에 삽입되도록 돌기형상으로 구성된 상부와, 상기 상부의 하측에 설치되어 있으며, 상부보다 넓게 외측으로 경사지게 형성된 하부로 구성되어 있으며, 상기 열전모듈보호캡(6)과 볼트(4)로 연결되어 있고, 상부 중앙이 상기 열전모듈(20)의 하부와 밀착되는 열전모듈접촉부(8)가 형성된 구조이며,5 shows an extender, the upper part having a protrusion shape to be inserted into a recess formed in the lower portion of the thermoelectric module protection cap 6 and the lower part which is installed below the upper part and is inclined outwardly wider than the upper part. Is connected to the thermoelectric module protective cap 6 and the bolt (4), the upper center is a structure in which the thermoelectric module contact portion 8 is in close contact with the lower portion of the thermoelectric module 20,
상기 엑스텐더는 도7 및 도8과 같이 원형 또는 사각형상이며, 중앙부에 형성된 열전모듈접촉부(8)에는 엑스텐더 평면 및 측면 상세도로 나타낸 것이며, 열전모듈접촉부(8)은 원형이며 싸이클론형상의 홈이 형성되어 있는 구조인 것이다.7 and 8, the extender has a circular or quadrangular shape, and the thermoelectric module contact portion 8 formed at the center portion is shown in the plane and side details of the extender, and the thermoelectric module contact portion 8 is circular and has a cyclone groove. It is a structure that is formed.
도6은 하부히트싱크(9)를 나타낸 것으로서, 상기 엑스텐더(7)와 볼트(4)로 엑스텐더(7)의 하부에 연결되어 있으며, 하부중앙부에 내부순환용휀(10)이 형성된 하부히트싱크(9)로 구성된 열전모듈의 열효율을 증대시키기 위한 장치인 것이다.6 shows the lower heat sink 9, which is connected to the lower part of the extender 7 by the extender 7 and the bolt 4, and has a lower heat sink 10 having an inner circulation fan 10 formed at the lower center thereof. It is a device for increasing the thermal efficiency of the thermoelectric module composed of 9).
도9는 본 고안의 열전모듈접촉부(8)에 형성된 사이클론형상의 홈의 다양한 형태에 관한 또 다른 예를 상세히 나타낸 도면인 것이다.9 is a view showing in detail another example of various forms of the cyclone-shaped groove formed in the thermoelectric module contact portion 8 of the present invention.
상기와 같은 본 고안은 부피를 최소화하여 공간차지를 적게하였으며, 열전모듈과 접촉되는 부분의 구조를 개량하여 열효율을 높혔으며, 조립식으로 되어 누구나 쉽게 조립 및 해체할 수 있으며, 각 부품을 대량생산하여 원가를 저렴하게하는 경제적인 장점이 있는 것이다.The present invention as described above has minimized the volume of the space to reduce the space, improved the structure of the part in contact with the thermoelectric module to increase the thermal efficiency, it can be easily assembled and disassembled by anyone as a prefabricated, mass production of each part There is an economic advantage to lower the cost.
Claims (4)
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