KR200277175Y1 - Ejection device for pick and place system for semiconductor equipment - Google Patents

Abstract

The present invention is to facilitate the coupling by simplifying the structure of the ejection device provided in the pick-and-place system that is completed in the manufacturing process of the CABGA semiconductor package, and picked up individually separated packages in the sawing process to be stored in the tray An ejection apparatus of a pick-and-place system for semiconductor equipment.

Description

Ejection device for pick and place system for semiconductor equipment

The present invention relates to an ejection apparatus of a pick-and-place system for semiconductor equipment, and more particularly, a pick-up which is completed in a manufacturing process of a CABGA semiconductor package, and picks up a package separated in a sawing process and is stored in a tray. It is to simplify the structure of the ejection device provided in the place system to facilitate the coupling.

Recently, electronic devices and home appliances have also been miniaturized due to the rapid high integration and miniaturization of semiconductor chips. As a result, semiconductor packages have been reduced in size and size as well as semiconductor packages. Chip Scale Package (CSP) has been developed to enable high integration and high performance.

A typical small package of such a CSP is a CABGA (Chip Array Ball Grid Array) semiconductor package. The CABGA semiconductor package is a multi-row matrix type printed circuit board. The printed circuit board is molded at once so that each unit is simultaneously wrapped in a state where each unit is arranged in a mattress shape, and then singulated in a sawing process to obtain a final device (package).

That is, after the mold process of the semiconductor package (a process of forming a certain shape to protect the material from external impact and contact by using a thermosetting resin and forming the appearance of the product) is completed, a sawing process is performed to complete the singulation. do.

In order to perform the sawing process, a mounting process is performed in which an adhesive tape is adhered to one surface of the printed circuit board where the mold process is completed. The reason for such a mounting process is that the separation process is separated into individual packages. This is to ensure that the package does not fall off and adheres to the adhesive tape.

In this way, the separated packages are bonded to the adhesive tape, and the individual packages can be picked up and stacked in a tray. This process is performed in a pick-and-place system, and the pick-and-place system is a single package. An ejection device is installed to easily separate the package from the adhesive tape when adsorbing the separated package.

However, the pick-and-place system in which the ejection device is installed was required as the CABGA semiconductor package was developed. In the past, no separate equipment for the pick-and-place has been developed.

Therefore, in the related art, in order to manufacture the CABGA semiconductor package, all the processes are performed by hand, which leads to a complicated work process, an increase in working time, a decrease in productivity, and a cost increase due to an increase in labor costs.

The purpose of the present invention is to solve the above problems, and by simplifying the structure of the ejection device installed in the pick-and-place system of the CABGA semiconductor package to facilitate the coupling, the replacement of the needle pin of the ejection device can be easily replaced. The present invention provides an ejection device for a pick-and-place system for semiconductor equipment.

1 is an exploded perspective view showing the structure of the ejection apparatus according to the present invention

Figure 2 is a cross-sectional view showing the structure of the ejection apparatus according to the present invention

Figure 3 is an enlarged plan view showing a needle pin fixture according to the present invention

4a and 4b is a view showing the operating state of the ejection apparatus according to the present invention

-Explanation of symbols for the main parts of the drawing-

10-Needle Pin Fixture 11-Needle Pin

12-mating hole 13,22-cutout

14-set screw 20-fastener

21-Hole 23,31-Taper

24-external thread 30-diaphragm

32-internal thread 40-main unit

41-Needle Pin Operator 42-Suction Hole

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

In the ejection apparatus according to the present invention, one surface of the printed circuit board 6 in which the mold process is completed is attached to the adhesive tape 7 in the mounting process, and the package 8 cut in the sawing process is picked up and stored in the tray. Of the adhesive tape 7 which is provided at the upper portion of the pick-up section 50 and which is positioned below the package 8 to be picked up by the pick-up section 50 and to which the package 8 to be picked up is bonded. It is configured to push the package 8 to be picked up by operating the needle pin 11 to protrude to the upper side in the state of absorbing the bottom.

The ejection device is formed with a coupling hole 12 to which the needle pin 11 is coupled, and the coupling hole 12 extends to both sides to form a cutout portion 13 cut into a predetermined depth. Fixing screw 14 is fastened to the notch 13 in the horizontal direction, the needle pin fixture 10 for fixing the needle pin 11 coupled to the coupling hole 12 is installed.

The needle pin fixture 10 is coupled to the fastener 20, the fastener 20 is formed with an insertion hole 21 is inserted into the lower portion of the needle pin fixture 10, the insertion hole The cut-out part 22 is cut out in all directions of 21, and the outer peripheral surface is provided with the taper 23 of the upper and lower narrow narrows, and the male screw 24 is formed in the lower part. By tightening the outer circumferential surface of the fastener 20 is formed with a fastener 30 for fixing the needle pin fixture 10, the fastener 30 is the upper and lower light formed on the outer peripheral surface of the fastener 20 The narrow taper 23 and the corresponding taper 31 are formed in the inner surface, and the lower part of the female thread 32 which is fastened to the above-mentioned external thread 24 is formed.

In addition, the outer body of the needle pin fixture 10 is provided with a main body 40, the needle pin operating hole 41 which can be operated so that the needle pin 11 protrudes upward on the upper surface of the main body 40. ) Is formed, and a plurality of adsorption holes 42 are formed which can adsorb the adhesive tape 7 located on the bottom of the package 8 to be picked up by backing.

The present invention configured as described above, the needle pin 11 is coupled to the needle pin fixture 10, in order to be coupled in this way, the needle pin coupling hole (11) formed in the needle pin fixture (10) When the fixing screw 14 is fastened in the inserted state 12, the needle pin 11 is firmly fixed while the gap between the cutout portions 13 formed in the needle pin coupling hole 12 is narrowed.

In addition, the needle pin fixture 10, the needle pin 11 is fixed in this way is fixed to the fastener 20, in order to fasten in this way the lower portion of the needle pin fixture 10 is fastener 20 When the tightening tool 30 is tightened in the state inserted into the insertion hole 21 of the upper and lower surfaces formed on the outer peripheral surface of the needle pin fixing tool 10 by the taper 31 formed on the inner circumferential surface of the tightening tool 30. By tightening the narrowing taper 23, the gap between the cutouts 22 cut in all directions of the insertion hole 21 is tightened while being narrowed.

As shown in FIGS. 4A and 4B, the operation of the combined ejection apparatus attaches one surface of the printed circuit board 6 having completed the mold process to the adhesive tape 7 in the mounting process, and cut the package individually in the sawing process. (8) is picked up by the pickup section 50 and stored in a tray (not shown).

At this time, the ejection apparatus is positioned under the package 8 picked up by the pickup unit 50, and the bottom surface of the adhesive tape 7 to which the package 8 to be picked up is bonded is sucked by the back. In the state, the needle pin 11 is operated to protrude upwards and pushes the package 8 to be picked up. Therefore, the package 8 to be picked up can be easily picked up by the pick-up section 50.

As can be seen from the above description, according to the present invention, by simply simplifying the structure of the ejection device installed in the pick-and-place system of the CABGA semiconductor package, the needle pin of the ejection device can be firmly and simply combined. There is.

Claims (1)

Pick-up unit 50 which attaches one surface of the printed circuit board 6 with the mold process completed by the adhesive tape 7 in the mounting process, picks up the package 8 cut in the sawing process, and stores it in the tray. Is installed on the upper portion, the needle pin (with a state of adsorbing the bottom surface of the adhesive tape 7 to which the package 8 to be picked up and positioned below the package 8 to be picked up by the pick-up unit 50 ( In the ejection apparatus, 11) is operated to protrude upwards and to push up the package 8 to be picked up. The ejection device is formed with a coupling hole 12 to which the needle pin 11 is coupled, and the coupling hole 12 extends to both sides to form a cutout portion 13 cut into a predetermined depth. The needle pin fastener 10 for fastening the needle pin 11 coupled to the coupling hole 12 by fastening the screw in the transverse direction to the coupling part 13, and the lower portion of the needle pin fastener 10 described above. An insertion hole 21 to be inserted is formed, and the insertion hole 21 is cut in four directions by a notch 22, and an outer circumferential surface thereof is formed with a taper 23 of a light beam lower side, and an external thread 24 at a lower portion thereof. ) And a taper 31 corresponding to the taper 23 of the upper and lower narrowings formed on the outer circumferential surface of the fastener 20 are formed on the inner surface, and the male screw 24 at the lower portion thereof. The fastener 30 is formed to fasten the female screw 32 is formed, and is installed to surround the needle pin fixture 10, the needle pin 11 is formed on the upper surface The main body is formed with a needle pin operating hole (41) operable to protrude to a negative portion and a plurality of suction holes (42) capable of sucking the adhesive tape (7) located at the bottom of the package (8) to be picked up by backing. Ejection device of the pick and place system for semiconductor equipment, characterized in that consisting of (40).