KR200262602Y1 - Heat sink - Google Patents

Abstract

The present invention is in close contact with a heat generating component (for example, a semiconductor device such as a transistor (TR), an integrated circuit (IC), etc.) mounted on a printed circuit board (PCB) to optimally dissipate heat emitted from it The present invention relates to a heat sink configured to optimally shape a heat sink to maximize heat dissipation efficiency, and the present invention has a plurality of through-holes through which a heating part is fixed and a coupling means is formed at a lower side thereof. A base portion provided with a plurality of shaped bases to fix the pins; A pin part corresponding to the base in the base part one to one and provided with a plurality of pins having a predetermined thickness to form the through hole in one-to-one correspondence with the through hole of the base; After inserting a plurality of through-holes formed at the bottom of the base and the fin, both sides are pressurized to implement a heat sink as a coupling means for coupling the base and the fins sequentially arranged in a one-to-one correspondence, thereby enabling optimum heat dissipation efficiency.

In addition, by inserting a copper plate between the fin and the base, applying heat-resistant grease to both sides of the base, or applying aluminum bond to both sides of the base, the heat dissipation can be increased by removing the microcavity between the base and the fin.

Description

Heat Sink {HEAT SINK}

The present invention relates to a heat sink, and in particular, closely adheres to a heating component (for example, a semiconductor element such as a transistor (TR) or an integrated circuit (IC)) mounted on a printed circuit board (PCB). The present invention relates to a heat sink that maximizes heat dissipation efficiency by optimally dissipating heat dissipated therefrom and optimally shaping the heat sink.

In general, heat-producing electric and electronic components include a central processing unit (CPU), a thermoelectric module, a power transistor, a VGA chip (CHIP), and a radio frequency chip. As it generates a lot of heat, the cooling is very important.

If the temperature of the electrical and electronic equipment components exceeds the appropriate temperature, an error occurs in the electrical and electronic equipment components or the electrical and electronic equipment components are damaged. In particular, in expensive electronic products such as computers, heat generation of corresponding electronic and electronic component parts is a serious problem.

Therefore, a heat sink is installed in the electronic and electronic component, and the heat sink serves to lower the temperature of the electronic and electronic component by dissipating heat generated in the electronic and electronic component into the air.

Looking briefly at the existing heat sink that plays this role, the base and the fins are joined by brazing, in which case the fins are likely to melt if they are joined at high temperatures due to the nature of the fins (usually aluminum). .

In order to solve this problem, conventional heat sinks have been manufactured by increasing the thickness of fins. However, increasing the thickness of fins causes a problem of deterioration of heat transfer efficiency per unit area. Therefore, it causes a problem that the heat dissipation efficiency is relatively low.

On the other hand, in order to solve the above problems of the existing heat sink, there have been attempts to increase the heat dissipation efficiency by increasing the number of fins by thinning the fins by another method, but in this method, the fins become thin during the brazing process. Melting occurred, causing a problem that the pin shape is not made properly.

In this regard, the present invention is proposed to solve various problems occurring in the existing heat sink as described above.

An object of the present invention is to optimize heat generated by being closely adhered to a heat generating component (for example, a semiconductor device such as a transistor TR or an integrated circuit IC) mounted on a printed circuit board (PCB). The heat sink is to provide a heat sink to maximize the heat dissipation efficiency by heat dissipation.

More specifically, the base and the fins are formed in pieces, and the base and the pins are attached in a one-to-one correspondence, thereby solving all the problems in the existing brazing process and increasing the number of fins to dissipate heat. The purpose is to provide a heat sink to improve the efficiency.

Another object of the present invention is to provide a heat sink to improve the heat transfer rate by attaching a copper plate between the base and the fins, and to increase the heat dissipation efficiency by removing the microcavity between the base and the fins.

It is still another object of the present invention to provide a heat sink in which a heat dissipation grease is applied to a base to remove an air layer between the fin and the base to increase heat dissipation efficiency.

Another object of the present invention is to provide a heat sink to increase the heat dissipation efficiency by removing the micro-space between the fin and the base by applying an aluminum bond on both sides of the base to which the fin is bonded.

"Heat sink" according to the present invention for achieving the above object,

A base portion for fixing a heating part at a lower portion thereof, and having a plurality of through-holes through which coupling means can pass, and having a plurality of mountain-shaped bases to fix fins;

A pin part corresponding to the base in the base part one to one and provided with a plurality of pins having a predetermined thickness to form the through hole in one-to-one correspondence with the through hole of the base;

After inserting the plurality of through-holes formed in the base and the pin is characterized in that it comprises a coupling means for coupling both the base and the pins sequentially arranged in a one-to-one correspondence.

In the above, the coupling means is characterized in that the coupling rod for coupling the base and the pin while being inserted into the through-hole of the base and the pin corresponding one-to-one and both edge portions are expanded by the pressure on both sides.

The coupling rod is characterized in that a groove is formed in the center of both ends.

In the above, the pin, the upper surface is coupled to the fan is characterized in that both sides are symmetrically etched on the basis of the inclined surface.

In the above, the pin is characterized in that the upper surface to which the fan is coupled has a V-shaped groove that is gradually deeper toward the center.

In the above, the pin, characterized in that the upper surface to which the fan is coupled has an inclined surface etched inclined to one side.

In addition, the heat sink according to the present invention,

The copper plate is provided between the pin and the base to increase the heat transfer rate and to increase the heat dissipation by removing the micro space.

In addition, the heat sink according to the present invention,

The heat dissipation grease is applied to both sides of the base to which the fins are coupled to remove heat insulation by the air layer between the aluminum fins and the aluminum base to increase heat dissipation.

In addition, the heat sink according to the present invention,

By applying an aluminum bond on both sides of the base to which the fin is bonded, the pin and the base are bonded to each other, thereby increasing heat dissipation by removing microcavities.

Figure 1a is an exploded perspective view of the heat sink according to the present invention, Figure 1b is a combined perspective view of the heat sink according to the present invention,

2 is a front view of a heat sink according to the present invention,

3 is a side cross-sectional view of a heat sink according to the present invention,

Figure 4 is a perspective view of the components installed on the top and bottom of the heat sink according to the present invention,

5 is a perspective view of another embodiment of a pin according to the present invention,

6 is a perspective view of another embodiment of a pin according to the present invention,

7 is a side cross-sectional view of the heat sink when the copper plate is attached to the fin and the base in the present invention.

<Explanation of symbols for main parts of the drawings>

100 ..... Base part

110 ..... Through Hole

121 to 121 + n ..... Base

200 ..... Pin part

210 ..... Through Hole

241 to 241 + n ..... pin

300 ..... Joining means

310 .....

611 ~ 611 + n ..... Copper Plate

Hereinafter, described in detail with reference to the accompanying drawings, preferred embodiments of the present invention according to the technical spirit as described above.

1A is an exploded perspective view of the heat sink 1000 according to the present invention, and FIG. 1B is a combined perspective view of the heat sink 1000 according to the present invention.

Here, the reference numeral 100 is a heat generating part 400 is fixed to the lower side, a plurality of through-hole 110 through which the coupling means 300 can be formed is formed, the mountain-shaped base (121 ~ 121 + n) is A plurality of base parts are provided to fix the pins 241 to 241 + n, and reference numeral 200 corresponds to the bases 121 to 121 + n in the base part 100 one-to-one, and the bases 121 to 121 + n ) Represents a pin portion provided with a plurality of pins 241 to 241 + n of a predetermined thickness having a through hole 210 in a one-to-one correspondence with the through hole 110, and reference numeral 300 denotes the base 121 to 121 + n. ) And the bases 121 to 121 + n and the pins 241 to sequentially inserted in a one-to-one correspondence after being inserted into the plurality of through holes 110 and 210 formed at the bottom of the pins 241 to 241 + n. 241 + n).

In the above, the coupling means 300 is inserted into the through-holes 110 and 210 of the base 121 to 121 + n and the pins 241 to 241 + n corresponding to one-to-one, and then both edge portions by pressing on both sides. The expansion rod is characterized in that the coupling rod 310 for coupling the base 121 ~ 121 + n and the pins (241 ~ 241 + n).

The coupling rod 310 is characterized in that the groove 311 is formed in the center of both ends.

In the above, the pins 241 to 241 + n are characterized in that the upper surface to which the fan 500 is coupled is symmetrically etched on both sides of the center to have inclined surfaces 251 and 252.

In the above, the pins 241 to 241 + n have a V-shaped groove 260 that is deeper toward the center of the upper surface to which the fan 500 is coupled.

In the above, the pins 241 to 241 + n have an inclined surface 270 in which the upper surface to which the fan 500 is coupled is etched to be inclined to one side.

2 is a combined front view of the heat sink according to the present invention.

The manufacturing process and operation of the heat sink according to the present invention configured as described above will be described in detail with reference to FIGS. 1A to 7.

First, the base unit 100 is composed of a plurality of bases 121 to 121 + n, and one base (for example, reference numeral 121) has a predetermined thickness for space. In addition, the material is aluminum which is a normal base material.

In addition, a plurality of through holes 110 are formed at the side surfaces such that the plurality of coupling rods 310, which are the coupling means 300, may be inserted, and the air may be projected to the side as a mountain shape.

If the shape is a mountain shape, the air is similar to the side in the wind direction, it is possible to increase the heat radiation efficiency.

The base 121 is seated on a specific jig (not shown in the drawing), and when one base 121 is seated, the pin 241 shown in FIG. 1A is seated on the rear surface thereof.

Here, one pin 241 is formed with a plurality of through holes 210 so as to be coupled to the plurality of through holes 110 formed in the base 121 in one-to-one, and has a predetermined thickness. The material is aluminum which is used for a normal heat sink. And the upper surface is formed with a lower groove than the predetermined portion (281, 282), except for the predetermined portion (281, 282) on which the fan 500 is seated, the groove is shown in the partial enlarged view of FIG. As shown, both sides are symmetrically etched with respect to the center to have inclined surfaces 251 and 252.

When the upper surface is symmetrically etched on both sides with respect to the center to form the inclined surfaces 251 and 252, the flow of air introduced by the fan 500 may be improved to increase heat radiation efficiency.

In addition, the lower edge portion of the pin 241 is formed with grooves 283 and 284 so that a specific mechanism (for example, a ring) can be inserted therein.

Meanwhile, as is well known, when the fin 241 is seated, the base 122 is seated on the rear surface again to serve as a spacer, and the fin 242 is seated on the rear surface of the base 122. ) Is produced.

In other words, the heat sink 1000 is fabricated in such a manner that a pin is inserted between the base and the base.

In this process, when the base 121 to 121 + n and the pins 241 to 241 + n are completely seated on the jig, as shown in FIG. 1A, the coupling rod 310, which is the coupling means 300, is located. It is inserted into the through hole 110 of the base 121 and the through hole 210 of the pin 241.

In practice, the number of coupling rods is equal to the number of through holes formed in the base and the pin.

Then, pressing both sides with a press or the like, while the both ends of the edge portion is expanded to combine the base (121 ~ 121 + n) and the pins (241 ~ 241 + n).

In this case, the coupling rod 310 has grooves 311 formed at the centers of both ends thereof, as shown in a partially enlarged view shown in FIG. 3.

Therefore, when the coupling rod 310 is inserted into the through hole (for example, 110 and 210), and both ends are pressed by a press or the like, both ends of the edge portion are expanded to couple the base and the pin.

In this process, a heat sink is manufactured, and FIG. 4 is a perspective view in which parts are installed at upper and lower portions of the heat sink manufactured as described above. Reference numeral 400 denotes a heat generating component.

On the other hand, the heat sink according to the present invention, the thickness of the fin is 0.5 ~ 3mm, the spacing between the fin and the fin is 1 ~ 4mm.

5 is a perspective view of another embodiment of a pin according to the present invention.

This is formed to have a V-shaped groove 260 that is gradually deeper toward the center of the shape of the symmetric inclined surface (251, 252).

If the upper surface is formed as a V-shaped groove 260 gradually deeper toward the center, the wind flowing by the fan 500 can be concentrated to the center side to increase the heat dissipation efficiency.

That is, as shown in Figure 4, the fan 500 has a rotation axis 510 in the center of the characteristics, it is common that the wing 520 is fixedly coupled around the rotation axis 510.

Therefore, when the rotation is a small amount of wind flows into the pin located on the lower portion of the rotary shaft 510, a lot of wind flows into the pin located on the lower portion of the wing 520. Therefore, in order to introduce a large amount of wind into the fin located below the rotating shaft 510, as the fin is formed as shown in FIG. 5, since the wind is concentrated in the center, the heat dissipation efficiency caused by the characteristics of the fan 500 as described above is reduced. You can prevent it.

Figure 6 is a perspective view of another embodiment of a pin according to the present invention.

The shape of the symmetric inclined surfaces 251 and 252 is formed to have an inclined surface 270 etched inclined to one side.

When the upper surface is inclined to one side in this way, the fan air volume and the wind pressure can be increased due to the reverse wind, thereby improving heat dissipation efficiency.

On the other hand, the heat sink according to the present invention, as shown in Figure 7, a thin copper plate (611 ~ 611 + n) is attached between the base 121 and the fin 241.

In this case, the copper plate has a heat transfer rate of about 30% higher than that of aluminum, so that the heat dissipation efficiency can be increased, and the strength, hardness, and firing rate are good, so that the microcavity between the fin and the base can be removed, thereby increasing the overall heat dissipation. In addition, a plurality of through holes are formed to be coupled to the connecting means 300 like the pin and the base.

Another method is to apply heat dissipation grease to both sides of the base to be joined with the fins. Also in this case, since the heat insulation generated by the air layer between the aluminum fin and the aluminum base is removed, and the microcavity can be removed, the overall heat dissipation can be increased.

Another method is to apply an aluminum bond on both sides of the base to be joined with the pin. Herein, an aluminum bond refers to a bond obtained by mixing aluminum powder with a normal bond in a predetermined ratio. In this way, the microcavity between the fin and the base can be removed, thereby increasing the overall heat dissipation.

In addition, the heat sink according to the present invention can further increase heat dissipation by appropriately mixing the various heat dissipation methods as described above, for example, copper plate, heat dissipation grease, and aluminum bond.

According to the present invention "heat sink" described above, by separating the pin and the base, and the pin is fitted between the base and the base, and then combine the pin and the base using a coupling rod, when brazing as before It is possible to solve the problem of melting the generated pin.

In addition, by forming the upper surface shape of the fin like a symmetrical inclined surface, V-shaped groove, inclined surface, there is an advantage that the air flow is improved to maximize the heat dissipation efficiency.

In addition, by inserting the copper plate between the fin and the base, it is possible to increase the heat transfer efficiency, there is an advantage that the heat dissipation is increased by removing the micro-space between the fin and the base.

In addition, by applying heat-dissipating grease on both sides of the base, it is possible to remove the air layer insulation between the pin of the aluminum material and the base of the aluminum material, it is possible to remove the micro space, there is an advantage to increase the heat dissipation.

In addition, by applying an aluminum bond on both sides of the base, there is an advantage to increase the heat dissipation by removing the micro-space between the pin and the base.

Claims (9)

The lower part of the heat generating part 400 is fixed, and a plurality of mountain-shaped bases 121 to 121 + n having a plurality of through-holes 110 through which the coupling means 300 penetrates are provided at the lower side thereof. A base portion for fixing 241 + n); Pins 141 to 141 + n having a predetermined thickness corresponding to the base 121 in the base part 100 and having the through hole 210 corresponding to the through hole 110 of the base 121 one to one. A plurality of pin parts 200 provided; The base 121 and 121 + n and the pins 241 to 241 which are sequentially inserted in a one-to-one correspondence after being inserted into the base 121 and the plurality of through holes 110 and 210 formed in the plurality of pins 241. Heat sink characterized in that it comprises a coupling means for coupling + n). The method of claim 1, wherein the coupling means 300, One-to-one corresponding bases 121 to 121 + n and the through holes 110 and 210 of the pins 241 to 241 + n are inserted into the grooves 311 formed at the centers of both ends by pressure on both sides. Heat sink, characterized in that the coupling rod 310 to combine the base (121 ~ 121 + n) and the fin (241 ~ 241 + n). According to claim 1, wherein the pins (241 ~ 241 + n), Heat sink, characterized in that the upper surface is coupled to the fan 500 is symmetrically etched on both sides with respect to the center has an inclined surface (251, 252). According to claim 1, wherein the pins (241 ~ 241 + n), Heat sink, characterized in that the upper surface to which the fan 500 is coupled has a V-shaped groove 260 gradually deeper toward the center. According to claim 1, wherein the pins (241 ~ 241 + n), The heat sink, characterized in that the upper surface to which the fan 500 is coupled to have an inclined surface 270 etched inclined to one side. The copper plate (611 to 611 + n) according to claim 1, wherein the copper plate (611 to 611 + n) is provided between the fins (121 to -121 + n) and the bases (241 to 241 + n) to increase a heat transfer rate and to increase heat dissipation by removing micro spaces. Heat sink further comprising. delete delete The heat sink as claimed in claim 1, wherein the thickness of one fin (241) is 0.5 to 3 mm, and the spacing between the fin (241) and the fin (242) is 1 to 4 mm.