KR200246609Y1 - Integrated Circuit Solder Ball Implant Machine - Google Patents

Abstract

The present invention relates to an integrated circuit solder ball transplanting machine comprising a machine base, a solder ball implanter, a solder ball pressurizing device, an integrated circuit component positioning device, and an integrated circuit mold ejection device, and utilizes the integrated circuit component positioning device. And the integrated circuit component positioning device reciprocates from the lower side of the solder ball implanter to the left and right directions and vibrates back and forth to directly transport the solder balls through the supply holes of the solder ball implanter. By using the respective solder balls on the integrated circuit component within the integrated circuit component positioning device, the solder balls are stably, accurately, normally and conveniently transported and positioned. In addition, when the solder ball implanter moves upward in use, the module of the integrated circuit component positioning device may move in the horizontal direction, and thus, when the solder ball transplantation is completed on the integrated circuit component in operation, the mold is ejected from the set position. The integrated circuit component can be raised by the device.

Description

Integrated Circuit Solder Ball Implant Machine

Referring to FIG. 1, a conventional configuration and method of operating a device for implanting solder balls onto integrated circuit components is a level platform with a planar module (2) for supporting and positioning the integrated component (A). It consists of a level platform (1), and hinge pins (3) located at one end and on top of the planar module (2) connected to the solder ball transfer plate (4). After the surface of the integrated circuit component is coated with a rosin solution and arranged on the planar module 2, the solder ball transfer plate 4 covers the top of the integrated component A and aligns a suitable gap. It is rotated on the hinge pin (3). The solder balls B are then arranged on the surface of the solder ball graft plate 4, and the balls are implanted into the implant hole 41 until the respective balls fall into place on the surface of the integrated component A. FIG. The worker knocks on the plate with his hand so as to fall inside the cages. Since the surface of the integrated circuit component is coated with an adhesive, the solder balls B are fixed by a degree of adhesion appropriately in place on the integrated circuit component 5 and integrated after the solder ball transfer plate 4 is fully raised. Implantation is carried out on the part (A). Clearly this type of integrated circuit solder ball transplantation method has value and utility in terms of time and is also the most commonly used method in recent years. However, according to manufacturers using the method, there are a number of inconveniences that need improvement in actual use. For example, the hand tapping operation is not only time-consuming and inefficient, but also allows the implantation of hundreds of integrated circuit components at the same time to initiate rolling motion of the solder balls into the graft holes of the solder ball graft plate. With holes (more than 300 holes), workers are easily tired by prolonged eye work, and as a result, solder balls cannot be implanted into all implant holes. As a result, implant defects in integrated circuit solder balls occur quite frequently, resulting in poor stability, consistency and accuracy, resulting in a much larger integrated circuit defect rate. In addition, after completion of the solder ball implantation, since the solder ball graft plate is separated from the solder ball at an angle during the tapping operation, the minimum transplant positions of the solder balls are easily deformed, and are released from the position due to vibration. This directly affects the precision and quality of the integrated components.

Referring to the above description, it is evident that the means for implanting solder balls onto integrated circuit components in accordance with the prior art is invalidated by a number of problems that need improvement.

Therefore, the main object of the present invention is the solder ball output slot (slot) of the solder ball pressurizing device in the upper portion of the solder ball implantation device can be reciprocated left and right, and included in the pressure box by the vibrating movement of the vibration device When the solder balls are moved downwards, when the solder transfer operation is performed, the solder balls are delivered quickly, simply, consistently and accurately into the respective implantation holes, effectively increasing the actual working efficiency as well as the solder balls. It is to provide an integrated circuit solder ball transplant machine that eliminates the transplant error and improves the quality of the integrated circuit components.

Another object of the present invention is to provide a positioning device for the integrated circuit components in the lower portion of the soldering ball implantation machine, the positioning module can be moved to the left and right, and the soldering ball implantation device is to move up and down The integrated circuit components can be arranged above the positioning module, the module moving to the bottom of the solder ball module, and the solder balls transferred through the solder ball module into the respective implantation holes during the solder ball implantation operation. The solder ball implanter can rise vertically until the solder ball module ejects the solder balls, after the solder ball implantation is completed, smoothly and accurately implanted on the circuit components, and the solder ball in the completed implant position Integrated circuit soldering ensures accuracy and positioning effectively due to angles that do not twist, vibrate or move out of position To provide a ball implant machine.

Still another object of the present invention is to provide pneumatic cylinders having a supporting function at the base of the machine, and an integrated circuit mold release device is moved upward and downward by the pneumatic cylinders when the solder ball implantation of the integrated circuit components is completed. After the positioning module of the positioning device of the integrated circuit component is moved to the setting position, the upward movement of the pneumatic cylinders is used to stably raise the integrated circuit component, so that the operator is simple and convenient. It is to provide an integrated circuit solder ball transplant machine that performs a quick removal.

To further understand the above objects, the operation of the present invention, a brief description of the drawings, and a detailed description of the invention are provided below.

1 is a vertical view of a solder ball implantation work according to the prior art.

2 is a perspective view of the present invention.

3 is an exploded perspective view of the present invention.

* Code Description *

10 ... Machine base 20 ... Solder ball implant

30 ... Solder ball pressurization device 40 ... Integrated circuit component positioning device

50 ... Integrated Circuit Component Positioner 201 ... Floor Base

301 ... Guide rail 303 ... Solder ball pressurized box

402 ... Positioning module 403,501 ... Pneumatic cylinder

2 and 3, the present invention is based on the machine base 10, solder ball implantation device 20, solder ball pressing device 30, integrated circuit component positioning device 40 and integrated circuit mold ejection device ( 50) related to an integrated circuit solder ball implanter.

The machine base 10 is a rectangular body provided for installation and mounting of the following device.

The bottom base 201 is provided to the solder ball implanter 20, and a solder ball transplantation module 2010 installed at the center is configured in the solder ball implanter. In addition, the solder ball transplant module 2010 is arranged according to the solder ball arrangement of the integrated circuit component, and a plurality of solder ball implant holes 20101 and guide bars 2011 at the bottom of each of the four corners. In addition, the guide rods (2011) are inserted upward toward the lower portion of the machine base carrier plate 101, the sleeve 2012 is also inserted into the upper portion of the conveying plate 101, the The coil springs 2013 are inserted in the lower part, and the lower end of the coil springs 2013 are supported by the edges of the flange structure at the lower part thereof, so that a constant lifting pressure is applied to the guide bar 2011 and the bottom base 201. This exists. Each of the four pneumatic cylinders 202 is located at the bottom of the guide bars 2011, and the screws 2021 are respectively mounted so as to mount and secure the lower sleeve 2022 directly on the transport plate 101 of the machine base. After being inserted in place, the piston rods 2023 can be raised and lowered inside, and the guide rods 2011 and the bottom base 201 are lowered and raised vertically by the movement. The solder ball press device 30 is located exactly on top of the solder ball implanter 20 and has two rails 301 with tie rods 3011 at each end, It is installed between the two ends of the bottom bottom 201 of the solder ball implant 20. The vibrator 302 is inserted over the two guide rails 301, the solder ball press box 303 is located on one side of the vibrator 302, the solder ball (B) contained therein during the implantation operation Is provided by the solder ball pressurizing box, the solder ball pressurizing box has a rectangular solder ball output slot 3031 at the bottom, and also forms a container space 3033 and is located close to the edges of the output slot. Has a brush portion 3032, the brush portion 3032 is in slight contact with the solder ball transfer module 2010 of the solder ball implantation device (20). A pneumatic cylinder 304 is installed on the tie rod 3011 of one of the two guide rails 301, and a piston rod 3041 is attached to the vibrator 302, so that the solder ball is transplanted during the expansion and contraction movement. The solder ball pressurizing box 303 moves the solder ball pressurizing box 303 and the vibrator 302 in the upper part of the module 2010 to descend into the solder ball transplantation hole 20101 of the solder ball transplantation module 2010. The solder balls (B) included in the inside are driven by the vibration load.

The integrated circuit component positioning device 40 is located under the solder ball implanter 20 and has two guide rails 401 with tie rods 4011 at each end, and also the machine base 10. It is installed between the two ends of the transport plate 101 of the), the positioning module 402 is inserted over the two guide rails 401, and provides the function of fixing the integrated circuit (A) in place and It has vertically directed guide holes 4021 at the center position. A pneumatic cylinder 403 is installed at the end of one tie rod 4011 of the two guide rails 401, and a piston rod 4031 is attached to the integrated circuit component positioning module 402, during expansion and contraction movement. In the lower part of the solder ball transplantation module 2010, the positioning module 402 moves.

The integrated circuit mold discharging device 50 is installed on one end of the lower portion of the carrier plate 101 of the machine base 10, has a pneumatic cylinder 501, and has an inner portion of the carrier plate 101 of the machine base 10. The piston rod 5011 of the pneumatic cylinder can be moved to the set position by the vertical movement through the guide hole 1011, the solder ball is implanted in the positioning module 402 of the integrated circuit component positioning device 40 The piston rod 5011 is inserted into the guide hole 4021 of the positioning module 402 when the piston rod is moved to the set position so that it can be separated from the bottom of the module 2010.

When the above structure of the present invention is used, the brush portion 3032 located in the lower portion of the solder ball pressurization box 303 of the solder ball pressurizing device 30 is the solder ball transplantation module 2010 of the solder ball implantation device 20. Since the lower part of the container space 3033 is not aligned with the implantation hole 20101 of the solder ball transplantation module 2010 before the solder ball implantation operation, the solder ball press box 303 The included solder balls (B) do not come out.

In addition, since the solder ball implanter 20 can be controlled to move up and down, and the positioning module 402 of the integrated circuit component positioning device 40 can move left and right, the integrated circuit When the solder ball transplantation operation should be performed, the piston rods 2023 of the four pneumatic cylinders 202 of the solder ball implanter 20 are first expanded and contracted, and the guide rods 2011 are the bottom base 201. The piston rod 4031 is extended outward by the pneumatic cylinder 403 of the integrated circuit component positioning device 40, and then the positioning module 402 outside the Pressure, and as a result is separated from the bottom of the bottom bottom 201. After the integrated circuit component A is arranged on the positioning module 402, the piston rod 4031 of the pneumatic cylinder 403 of the positioning device 40 contracts and carries the integrated circuit component A. Until the positioning module 402 moves from the bottom of the ball module 2010 to the setting position, and the ball module 2010 of the bottom base 201 receives the tension load of the coil springs 2013, The pneumatic cylinder 202 of the solder ball transplantation apparatus 20 is retracted until the minimum section (approximately 1/4 of the solder ball diameter) between the ball module 2010 and the integrated circuit component A is aligned with the set position. Descend immediately. The pneumatic cylinder 304 of the solder ball pressurizing device 30 can move in the front-rear direction, and the vibration device 302 on the solder ball pressurizing box 303 operates as a driving load of the front-rear movement, and the vibration device 302 By the continuous vibration of the solder ball (B) contained in the solder ball press box 303 is stirred, due to the downward load acting during the process, the lower portion of the solder ball press box 303 during movement In the container space 3033 is aligned with the solder ball graft hole 20101 of the ball module 2010, the solder ball (B) therein is subjected to downward load, smooth, accurate into the solder ball graft holes When it is quickly discharged and moved back and forth across the brush portion 3032, all the graft holes 20101 are solder ball B without implantation error and mismatch and without damaging the solder ball B. ) And correctly soldered Since the integrated circuit A is arranged in the positioning module 402 of the integrated circuit component positioning device 40 located at the set position at the bottom of the module 2010, the solder balls B into the implant holes 20101. ) Are implanted into the integrated circuit component (A) to smoothly, accurately and quickly discharge the work and to complete the solder ball implantation simply, conveniently, quickly and accurately.

After implanting the solder balls B on the integrated circuit component, the pneumatic cylinders 202 of the solder ball implanter 20 are moved upwards at a suitable time, and also the solder ball module 2010 on the bottom base 201 is removed. The solder ball module 2010 is continuously separated from the solder balls B which are vertically moved upwards and implanted during vertical movement on the integrated circuit component A, and the vertical movement is inclined in the prior art device. Different from the separation angle and different from the prior art apparatus, the solder balls B first implanted on the integrated circuit component A are not contacted or moved by rolling motion due to vibration movement, It effectively improves quality, accuracy and stability.

After the upward movement of the solder ball implanter 20, the integrated circuit until the pneumatic cylinder 403 of the integrated circuit component positioning device 40 extends outward and the mold ejection device 50 is aligned with the set position. The pneumatic cylinder 501 of the component positioning integrated circuit mold ejection device 50 is operated at a suitable time, and is inserted into the guide hole 4021 previously located in the positioning module 402, and the integrated circuit A After removal, the solder ball implantation is completed conveniently, simply, quickly and smoothly, and the operator removes the integrated circuit.

Claims (6)

In the integrated circuit solder ball implantation machine comprising a machine base, a solder ball implanter, a solder ball pressurizer, an integrated circuit component positioning device and an integrated circuit mold ejection device, And the machine base is a rectangular body provided for installation and mounting of the following devices. In the integrated circuit solder ball implantation machine comprising a machine base, a solder ball implanter, a solder ball presser, an integrated circuit component positioning device and an integrated circuit mold ejection device, A bottom base is mounted on the solder ball implanter, and has a solder ball implant module installed at the center, the solder ball implant module is formed according to the solder ball arrangement of the integrated circuit components, and guide bars are provided at the bottom of each of the four corners. A plurality of solder ball graft holes are formed, the guide bars are inserted upward toward the bottom of the machine base carrier plate, sleeves are inserted at the top of the carrier plate, coil springs are inserted at the bottom, and the coil springs. The lower end of the pole is supported by flanged edges at the bottom, each of four pneumatic cylinders located under the guide rods, for fastening and directly mounting the sleeve in place on the carrying plate of the machine base. After the screws are respectively inserted, the inner piston rods can move up and down, and the guide membrane And solder balls transplantation machine integrated circuit characterized in that to raise and lower the bottom in the vertical base portion. In the integrated circuit solder ball implantation machine comprising a machine base, a solder ball implanter, a solder ball presser, an integrated circuit component positioning device and an integrated circuit mold ejection device, The solder ball presser is positioned exactly on top of the solder ball implanter, has two guide rails with tie rods at each end, and is installed between the two ends of the bottom base of the solder ball implanter. A vibrating device is inserted on the two guide rails, and a soldering ball pressing box is located on one side of the vibrating device, and the soldering ball pressing box supplies the soldering balls contained therein during implantation and is rectangular at the bottom. It has a shaped solder ball output slot, has a brush portion at a position proximate the edges of the output slot, and also forms a container space, the brush portion slightly contacting the solder ball implant module of the solder ball implanter. A pneumatic cylinder is installed on the tie rods of the two guide rails, and a piston rod is mounted on the vibrator. In the expansion and contraction movement, movement is transmitted to the solder ball pressurization box and the vibrator at the upper portion of the solder ball implantation module, and the vibration load transfers the solder balls contained in the solder ball pressurization box to the solder ball implantation. An integrated circuit solder ball implanter characterized by dropping into the solder ball implantation holes of the module. In the integrated circuit solder ball implantation machine comprising a machine base, a solder ball implanter, a solder ball presser, an integrated circuit component positioning device and an integrated circuit mold ejection device, The integrated circuit component positioning device is located below the solder ball implanter, has two guide rails with tie rods at each end, and is installed between the two ends of the carrier plate of the machine base. A positioning module is inserted over the two guide rails, holds the integrated circuit in place, has a guide hole in the vertical direction in the center, and a pneumatic cylinder at the end of the tie rod of the two guide rails. And a piston rod is attached to the integrated circuit positioning module so that movement is transmitted from the lower portion of the solder ball implantation module to the positioning module. In the integrated circuit solder ball implantation machine comprising a machine base, a solder ball implanter, a solder ball presser, an integrated circuit component positioning device and an integrated circuit mold ejection device, The integrated circuit mold discharging device is installed at the lower end of the carrying plate of the machine base, has a pneumatic cylinder, and moves up and down through the guide hole in the carrying plate of the machine base, so that the piston rod of the pneumatic cylinder is Can be set in position, and can be separated from the bottom of the solder ball implant module in the positioning module of the integrated circuit component positioning device, such that when moved to the setting position, the piston is An integrated circuit solder ball implanter, characterized in that it is inserted into the guide hole. In an integrated circuit solder ball implantation machine comprising a machine base, a solder ball implanter, a solder ball pressurizer, an integrated circuit component positioning device, and an integrated circuit mold ejection device, the devices are the structure of the integrated circuit solder ball implanter of the present invention. Integrated circuit solder ball transplant machine, characterized in that to complete the.