KR200236074Y1 - thermoelectric use of a cooling unit - Google Patents

thermoelectric use of a cooling unit Download PDF

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Publication number
KR200236074Y1
KR200236074Y1 KR2020010010225U KR20010010225U KR200236074Y1 KR 200236074 Y1 KR200236074 Y1 KR 200236074Y1 KR 2020010010225 U KR2020010010225 U KR 2020010010225U KR 20010010225 U KR20010010225 U KR 20010010225U KR 200236074 Y1 KR200236074 Y1 KR 200236074Y1
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South Korea
Prior art keywords
heat sink
heat
cooling body
thermoelectric semiconductor
thermal conductivity
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KR2020010010225U
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Korean (ko)
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이용락
허점숙
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주식회사 티이솔루션
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D31/00—Other cooling or freezing apparatus
    • F25D31/006—Other cooling or freezing apparatus specially adapted for cooling receptacles, e.g. tanks
    • F25D31/007—Bottles or cans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2331/00—Details or arrangements of other cooling or freezing apparatus not provided for in other groups of this subclass
    • F25D2331/80—Type of cooled receptacles
    • F25D2331/803—Bottles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

본 고안은 다수의 방열핀이 가로 길이로 길게 형성된 방열판)이 장착된 히트씽크(발열부) 선단에 열전반도체소자를 형성하고, 상기 열전반도체소자 전방으로 열전도율이 좋은 알루미늄등의 소재로 된 원형이나 다각형으로 개개의 물품을 수납하도록 형성한 다수의 물품수납실이 구비된 별도의 냉각몸체를 일체로 형성하여 캔이나 음료수,와인,주류 등을 신속하게 냉각하도록 구성하여, 호텔이나 자동차, 비행기등에 설치되어 있는 소형냉장고 내부에 냉각몸체를 설치하여 다양한 종류의 캔이나 음료를 저장하여 더욱 신속하게 냉각시켜 음용할 수 있으며, 특히 냉각몸체를 일정한 온도로 유지하여 고급스러운 주류나 와인등을 최상의 상태에서 음용할 수 있도록 한 것이다.The present invention forms a thermoconductor element at the tip of a heat sink (heat sink) in which a plurality of heat sink fins are formed to have a horizontal length, and is circular or polygonal made of a material such as aluminum having good thermal conductivity in front of the thermoconductor element. It is formed in a hotel, car, airplane, etc. by quickly forming cans, drinks, wine, liquor, etc. by forming a separate cooling body integrally with a plurality of storage compartments formed to store individual articles. By installing a cooling body inside a small refrigerator, you can store various kinds of cans or beverages and cool them more quickly.In particular, you can keep your cooling body at a constant temperature to drink luxurious liquor or wine in the best condition. I would have to.

Description

열전반도체를 사용하는 냉각장치{thermoelectric use of a cooling unit}Thermoelectric use of a cooling unit

본 고안은 열전반도체를 사용하는 냉각장치에 관한 것으로, 더욱 상세하게는 다수의 방열핀이 형성된 방열판 장착된 히트씽크(발열부) 선단에 열전반도체소자를 형성하고, 상기 열전반도체소자 앞쪽으로 소정의 간격을 두고 열전도율이 좋은 알루미늄등으로 된 'ㄷ'형의 냉각씽크(흡열부)를 일체화하여 유니트화하도록 구성한 본인의 선출원 고안 제2000-66981호를 더욱 개량한 고안으로, 상기 열전반도체소자 전방으로 열전도율이 좋은 알루미늄등의 소재로 된 원형이나 다각형으로 개개의 물품을 수납하도록 형성한 다수의 물품수납실이 구비된 별도의 냉각몸체를 일체로 형성하여, 냉동몸체에 형성되어 있는 여러 개의 물품수납실에 다양한 종류의 캔이나 음료,주류,와인등을 신속하게 냉각시켜 음용할 수 있도록 한 것이다.The present invention relates to a cooling apparatus using a thermoelectric semiconductor, and more particularly, a thermoelectric semiconductor element is formed at the tip of a heat sink (heating unit) equipped with a plurality of heat sink fins, and a predetermined distance toward the front of the thermoelectric semiconductor element. It is a further improvement of the original design No. 2000-66981, which is configured to unitize the 'c' type cooling sink (heat absorbing part) made of aluminum with good thermal conductivity, and has a thermal conductivity in front of the thermal semiconductor element. A separate cooling body is provided integrally with a plurality of article storage chambers formed to store individual articles in a circle or polygon made of a material such as aluminum, and is integrated into a plurality of article storage chambers formed in the freezing body. Various kinds of cans, drinks, liquor, wines, etc. can be quickly cooled for drinking.

열전반도체소자는 반도체와 금속의 접합면에 전류가 흐를 때 줄(Joule)열 이외의 열을 발생하고 흡수하는 열전현상을 이용한 것으로서, 전류의 크기와 방향에 의하여 흡열과 발열의 양과 방향 조절이 가능하고, 기계적으로 작동하는 부분이 없으며 또한 설치위치나 방향이 그 동작에 영향을 미치지 않는다는 장점이 있어 부하를 가열하거나 냉각시키는 데 널리 사용되고 있다.The thermoelectric semiconductor device uses a thermoelectric phenomenon that generates and absorbs heat other than Joule heat when a current flows through a junction surface of a semiconductor and a metal. The amount and direction of heat absorption and heat generation can be controlled by the magnitude and direction of the current. In addition, there is no mechanically operating part, and the installation position or direction does not affect its operation, and thus it is widely used to heat or cool a load.

첨부도면 도 1에 도시된 바와 같이 열전반도체소자(1)는 반도체 열전쌍이 직렬로 다수 연결되어 있는 열전쌍부(2)를 가지고 있으며, 이 열전쌍부(2)의 중앙에는 N형의 반도체와 P형의 반도체로 구성되어 직렬로 다수를 연결 모듈로 만든 것이열전반도체소자(1)인 것이다.As shown in FIG. 1, the thermoelectric semiconductor element 1 has a thermocouple portion 2 in which a plurality of semiconductor thermocouples are connected in series, and in the center of the thermocouple portion 2 is an N-type semiconductor and a P-type. The thermoelectric semiconductor device 1 is composed of a plurality of semiconductor modules.

이 열전반도체소자의 흡열량과 발열량은 전류의 크기 및 반도체와 금속 접합면의 절대온도 각각 비례하여 증가하고, 발열측 온도는 흡열측 온도보다 일정한 차 만큼 높게 유지되며, 이러한 특성을 이용하여 냉장고의 냉동실과 냉장실을 냉각하는데 열전반도체소자을 사용할 수 있다.The endothermic amount and the calorific value of the thermoelectric semiconductor element increase in proportion to the magnitude of the current and the absolute temperature of the semiconductor and the metal junction, respectively, and the temperature of the heat generating side is maintained by a certain difference higher than the temperature of the endothermic side. Thermoelectric semiconductor elements can be used to cool the freezer compartment and the refrigerating compartment.

그런데 종래 열전반도체소자를 이용한 냉장고에서는 압출형 히트씽크(3)의 한계 때문에 히트씽크(3)의 주위의 온도가 올라가면 열방출이 곤란하여 효율이 저하되고, 히트씽크의 방출열 방출효율이 낮아 냉장고의 냉각효율이 낮았으며, 히트씽크(3)의 저효율 때문에 일어나는 과열은 열전반도체소자(1)의 파손을 가져올 수 있다. 아울러 평면 흡열부측의 저효율로 냉각효과가 떨어지며, 이로 인하여 냉동실의 운전이 불가능하였다.However, in the refrigerator using a conventional thermoelectric semiconductor element, due to the limitation of the extruded heat sink 3, when the temperature around the heat sink 3 rises, heat dissipation is difficult and the efficiency is lowered. The cooling efficiency is low, and overheating caused by the low efficiency of the heat sink 3 may cause breakage of the thermoelectric semiconductor device 1. In addition, the cooling effect is reduced due to the low efficiency of the planar endothermic portion, and thus the operation of the freezer compartment is impossible.

또한, 열전반도체소자를 이용한 냉장고에서는 압출형 히트씽크의 한계 때문에 히티씽크의 주위의 온도가 올라가면 열방출이 곤란하여 효율이 저하되고, 히트씽크의 방출열 방출효율이 낮아 냉장고의 냉각효율이 낮아져 문제점이 되고, 히트씽크의 저효율때문에 일어나는 과열은 열전반도체소자의 파손을 가져오는 요인이 되었다.In addition, in the refrigerator using a thermoelectric semiconductor element, due to the limitation of the extruded heat sink, the heat dissipation is difficult due to the limitation of the heat dissipating heat, and the efficiency is lowered. In addition, overheating caused by the low efficiency of the heat sink has become a factor that causes breakage of the thermoelectric semiconductor element.

상기와 같은 문제점을 해결하기 위해 본인의 선출원 고안 제2000-66981호는 첨부 도면 도 3에 도시된 바와 같이 다수의 방열핀(42)이 형성된 방열판(41) 장착된 히트씽크(발열부)(40) 선단에 열전반도체소자(20)를 형성하고, 상기 열전반도체소자(20) 앞쪽으로 소정의 간격을 두고 열전도율이 좋은 알루미늄등으로 된 'ㄷ'형의 냉각씽크(흡열부)(30)를 일체화하여 유니트화하도록 구성하며, 상기 냉각씽크(30) 아래측에 냉각씽크(30) 닿는 냉각그릴(50)을 형성하고, 상기 히트씽크(40) 내부에 장착되는 다수의 방열핀(42)을 가로 길이로 길게 형성하며, 강제로 내부의 열을 외부로 배출하도록 방열팬(43)을 형성하도록 구성하며, 열전도율이 좋은 알루미늄등으로 된 'ㄷ'형의 냉각씽크(30)의 냉동실(70) 내부에 상기 열전반도체소자(10)에 인가되는 전압이 끊김없이 세기를 조정하여 일정한 온도를 유지하는 온도센서(60)를 장착하도록 구성하였으나, 이는 냉장고의 효율은 높이지만 별도로 체결되는 급속냉장실(80)가 자동차에 한정되고, 급속냉장실(80)에 형성되어 있는 냉장통(80)의 수가 적어 다수의 음료를 냉각하는데 한계가 있었다.In order to solve the problems as described above, the first application designation No. 2000-66981 is a heat sink (heating unit) 40 is equipped with a heat sink 41 formed with a plurality of heat radiation fins 42 as shown in the accompanying drawings The thermoelectric semiconductor element 20 is formed at the tip, and the 'c' type cooling sink 30 is formed of aluminum having good thermal conductivity at a predetermined interval toward the front of the thermoelectric semiconductor element 20 so as to be integrated. It is configured to be unitized, and forming a cooling grill 50 in contact with the cooling sink 30 on the lower side of the cooling sink 30, a plurality of heat sink fins 42 mounted in the heat sink 40 in a horizontal length It is formed long, and is configured to form a heat radiating fan 43 to forcibly discharge the internal heat to the outside, and the inside of the freezing chamber 70 of the 'c' type cooling sink 30 made of aluminum, such as good thermal conductivity The voltage applied to the thermoelectric semiconductor device 10 is adjusted without interruption. Although it is configured to mount a temperature sensor 60 to maintain a constant temperature, which is high efficiency of the refrigerator, but the high temperature freezer compartment 80 is fastened separately, is limited to the car, the refrigeration container is formed in the rapid freezer (80) The low number of 80) limits the cooling of many beverages.

본 고안은 상기와 같은 본인의 선출원 고안인 제2000-66981호의 문제점을 해결하기 위하여 안출한 것으로, 열전반도체소자 전방으로 열전도율이 좋은 알루미늄등의 소재로 된 원형이나 다각형으로 개개의 물품을 수납하도록 형성한 다수의 물품수납실이 구비된 별도의 냉각몸체를 일체로 형성하여, 냉동몸체에 형성되어 있는 여러 개의 물품수납실에 다양한 종류의 캔이나 음료,주류,와인등을 신속하게 냉각시켜 음용할 수 있도록 함에 그 목적이 있다.The present invention was devised to solve the problems of the above-described prior application designation No. 2000-66981, and formed to house individual articles in a circle or polygon made of a material such as aluminum having good thermal conductivity in front of the thermal semiconductor element. By forming a separate cooling body equipped with a plurality of storage compartments, you can quickly cool a variety of cans, drinks, alcohol, wine, etc. in several storage compartments formed in the frozen body for drinking The purpose is to make it.

도 1은 열전반도체소자의 단면도.1 is a cross-sectional view of a thermoelectric semiconductor device.

도 2는 종래 고안의 구성을 나타낸 예시도.2 is an exemplary view showing a configuration of a conventional design.

도 3은 본인의 선출원 고안의 구성을 나타낸 예시도.Figure 3 is an illustration showing the configuration of the original application design.

도 4는 본 고안의 구성을 나타낸 사시도.Figure 4 is a perspective view showing the configuration of the present invention.

도 5는 본 고안의 사용상태를 나타낸 예시도.5 is an exemplary view showing a use state of the present invention.

♣도면의 주요부분에 대한 부호의 설명♣♣ Explanation of symbols for main part of drawing ♣

20 : 열전반도체소자20: thermoelectric semiconductor element

40 : 히트씽크 41 : 방열판40: heatsink 41: heat sink

42 : 방열핀 43 : 방열팬42: heat dissipation fin 43: heat dissipation fan

60 : 온도센서60: temperature sensor

80 : 냉각몸체 81 : 물품수납실80: cooling body 81: storage compartment

100 : 냉장고100: refrigerator

상기와 같은 목적을 달성하기 위한 본 고안은 첨부 도면 도 4 내지 도 5에 도시된 바와 같이 다수의 방열핀(42)이 가로 길이로 길게 형성된 방열판(41)이 장착된 히트씽크(40) 선단에 열전반도체소자(20)를 형성하고, 상기열전반도체소자(20) 전방으로 열전도율이 좋은 알루미늄등의 소재로 된 원형이나 다각형으로 개개의 물품을 수납하도록 형성한 다수의 물품수납실(81)이 구비된 별도의 냉각몸체(80)를 일체로 형성하여 캔이나 음료수,와인,주류 등을 신속하게 냉각하도록 구성하였다.The present invention for achieving the above object is a thermoelectric at the tip of the heat sink 40 is equipped with a heat sink 41 formed with a plurality of heat radiation fins 42 is formed in a horizontal length as shown in Figure 4 to 5 A plurality of article storage chambers 81 are formed to form a semiconductor element 20 and to store individual articles in a circular or polygonal shape made of a material such as aluminum having good thermal conductivity in front of the thermal semiconductor element 20. A separate cooling body 80 was formed integrally and configured to quickly cool cans, beverages, wine, liquor, and the like.

상기와 같은 본 고안의 사용상태를 더욱 상세히 설명하면 다음과 같다.Referring to the state of use of the present invention in more detail as follows.

다수의 방열핀(42)이 가로 길이 방향으로 길게 형성된 방열판(41) 장착된 히트씽크(40) 선단에 열전반도체소자(20)를 형성하고, 상기 열전반도체소자(20) 앞쪽으로 소정의 간격을 두고 열전도율이 좋은 알루미늄등으로 원형이나 다각형으로 개개의 물품을 수납하도록 형성한 다수의 물품수납실(81)이 구비된 별도의 냉각몸체(80)를 일체로 형성된 냉장고(100)를 형성한다.A plurality of heat dissipation fins 42 are formed at the tip of the heat sink 40 in which the heat sink 41 is formed to extend in the horizontal length direction, and a thermoelectric semiconductor element 20 is formed at a predetermined interval toward the thermoelectric semiconductor element 20. The refrigerator 100 is formed integrally with a separate cooling body 80 having a plurality of article storage chambers 81 formed to accommodate individual articles in a circular or polygonal shape such as aluminum having good thermal conductivity.

첨부 도면 도4에 도시된 바와 같이 물품수납실(81)에 캔이나 음료수,와인등을 집어 넣은 다음에, 냉장고(100)에 전원을 인가하면, 상기 열전반도체소자(20)의 흡열부측면에 형성되어 있는 열전도율이 좋은 알루미늄등으로 소재로된 냉각몸체(80)가 냉각되면서 상기 물품수납실(81)에 삽입되어 있는 물품을 냉각시키고, 열전반도체소자(20)의 발열측면에 형성된 발열부의 히트씽크(40)는 열을 방출하는데 히트씽크(40)에서 강제로 내부의 열을 외부로 배출하도록 방열팬(43)이 회전하면서 방열한다.As shown in FIG. 4, when a can, a beverage, wine, or the like is put in the article storage room 81, and power is applied to the refrigerator 100, the heat absorbing portion side of the thermoelectric semiconductor element 20 is provided. While the cooling body 80 made of aluminum or the like having good thermal conductivity is cooled, the article inserted in the article storage chamber 81 is cooled, and the heat generated in the heat generating side of the thermoelectric semiconductor element 20 is heated. The sink 40 radiates heat and radiates heat while the heat radiating fan 43 rotates to forcibly discharge heat from the inside of the heat sink 40.

이때, 상기 히트씽크(40)는 내부의 방열판(41)에 다수의 방열핀(42)을 가로 길이로 길게 형성하여 방출열 방출을 높여 냉장고의 냉각 효율을 극대화시킨다.At this time, the heat sink 40 forms a plurality of heat dissipation fins 42 long in the heat dissipation plate 41 in a horizontal length to maximize the cooling efficiency of the refrigerator by increasing the discharge heat.

그리고, 열전반도체소자(20)의 특성상 전압이 떨어지면 전류도 함께 떨어지는 성질을 이용하여 냉동몸체(80) 일측에 형성된 온도센서(60)를 사용하여 목표온도를 감지하고 이 목표온도에 도달하면 전압이 자동으로 떨어져 항상 목표온도와 평형이 되는 전압을 흐르게 함으로서 냉장고의 효휼을 향상시키고, 물품수납실에 보관되어 있는 음료등이 항상 일정한 온도를 유지하도록 한다.In addition, by using the property that the current falls together when the voltage drops due to the characteristics of the thermoelectric semiconductor device 20, the target temperature is sensed using the temperature sensor 60 formed on one side of the freezing body 80, and when the target temperature is reached, the voltage It automatically falls off and flows a voltage that is always in equilibrium with the target temperature to improve the efficiency of the refrigerator, and keep the beverages stored in the storage compartment at a constant temperature at all times.

상기와 같은 본 고안은 열전반도체소자 전방으로 열전도율이 좋은 알루미늄등의 소재로 된 원형이나 다각형으로 개개의 물품을 수납하도록 형성한 다수의 물품수납실이 구비된 별도의 냉각몸체를 일체로 형성하여, 냉동몸체에 형성되어 있는 여러 개의 물품수납실에 다양한 종류의 캔이나 음료,주류,와인등을 삽입하여 냉각하기가 대단히 편하며, 특히 호텔이나 자동차, 비행기등에 형성되어 있는 냉장고에 본 고안의 냉각장치를 장착하면 각종 음료등을 항상 일정한 온도를 유지하도록 하여 신선하게 음용하도록 하는 등 매우 신규한 고안이다.The present invention as described above is integrally formed with a separate cooling body having a plurality of article storage chambers formed to accommodate individual articles in a circular or polygonal material made of a material such as aluminum with a good thermal conductivity in front of the thermoelectric semiconductor element, It is very easy to cool by inserting various kinds of cans, beverages, liquor, wine, etc. into the various storage compartments formed in the freezing body, especially the refrigerator of the present invention in the refrigerator formed in a hotel, a car, an airplane, etc. Equipped with a variety of beverages such as to maintain a constant temperature all the time is a very novel design such as to drink fresh.

Claims (1)

다수의 방열핀(42)이 가로 길이로 길게 형성된 방열판(41)이 장착된 히트씽크(40) 선단에 열전반도체소자(20)를 형성하고, 상기 열전반도체소자(20) 전방으로 열전도율이 좋은 알루미늄등의 소재로 된 원형이나 다각형으로 개개의 물품을 수납하도록 형성한 다수의 물품수납실(81)이 구비된 별도의 냉각몸체(80)를 일체로 형성하여 캔이나 음료수,와인,주류 등을 신속하게 냉각하도록 구성함을 특징으로 열전반도체를 사용하는 냉각장치.A plurality of heat dissipation fins 42 are formed in the heat sink 40, the heat sink 40 is mounted on the heat sink 41 is formed long in the horizontal length, the thermal conductivity element 20, such as aluminum having a good thermal conductivity in front Cans, beverages, wine, alcohol, etc. by forming a separate cooling body (80) integrally provided with a plurality of article storage chamber 81 formed to accommodate individual articles in a circular or polygonal material of Cooling apparatus using a thermoelectric semiconductor, characterized in that configured to cool.
KR2020010010225U 2001-04-12 2001-04-12 thermoelectric use of a cooling unit KR200236074Y1 (en)

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