KR200218598Y1 - Metal mold for forming lead flame of semi-conductor - Google Patents

Abstract

The present invention allows the upper and lower modules to be mounted on the upper and lower housings in a sliding manner so that accurate positioning of the upper and lower modules can be achieved, and the assembly parts for fixing the upper and lower housings and the upper and lower modules from the mold are not separated. The present invention relates to a mold for forming a semiconductor lead frame that can simplify assembly and disassembly by simple operation of a bolt, thereby improving the speed and maintenance of module replacement.

The subject innovation is the upper and lower holders installed at intervals up and down; A guide set connecting the upper and lower holders to provide lifting force for the upper holder to move up and down on the lower holder; Upper and lower housings which are respectively installed on the lower surface of the upper holder and the upper surface of the lower holder, the guide rails protrude from both inner surfaces thereof, and fastening holes are formed at predetermined positions on both sides of the front and rear surfaces; Upper and lower modules having slide grooves formed at both sides thereof so as to be seated on the guide rails of the upper and lower housings; And it is provided on both sides of the front and rear surfaces of the upper, lower housing provides a mold for molding the semiconductor lead frame comprising a fixing means for fixing between the upper and lower modules.

Description

Metal mold for forming lead flame of semi-conductor

The present invention relates to a mold for forming a lead package of a semiconductor package, and in particular, it is possible to easily disassemble and assemble an upper and a lower module from an upper and a lower holder to form a semiconductor lead frame which improves maintenance, workability, and production cost. It relates to a mold for.

In recent years, in the production of semiconductor packages with integrated circuits, there has been a shift from mass production of small quantities to small quantity production, and a package process capable of producing many kinds in a short time is required.

In order to meet these demands, in the mold apparatus for lead frame molding used in the package process, the disassembly and assembly structure of the modules mounted on the upper and lower holders is improved to improve maintenance and workability.

In the conventional mold assembly structure for lead frame molding, as shown in FIG. 1, module mounting plates 103 and 104 are respectively installed on upper and lower mold holders 101 and 102, and the module mounting plate is shown. The upper and lower modules 105 and 106 are seated on the 103 and 104, respectively, and are tightened with bolts to fix them.

Since the above structure is a structure in which one set of molds composed of the upper module 105 and the lower module 106 can normally produce only one type of lead frame, it is necessary to produce a different type of lead frame. One set of molds was required, which caused excessive mold cost for the production of the product, and also had a problem of poor workability due to mold replacement.

In order to overcome this problem, Utility Model Publication No. 94-5491 slides the upper and lower modules 203 and 204 on the upper and lower mold holders 201 and 202 as shown in FIGS. 2 and 3. The upper and lower housings 205 and 206, which can be disassembled and assembled, respectively, and the upper and lower modules 203 and 204 and the upper and lower housings 205 and 206 are fastened through the clamps 207 and 208. A mold for forming a semiconductor lead frame that improves replacement workability due to component replacement or module replacement, and can reduce mold production cost and product production cost, has been proposed.

However, in the above structure, since both lower ends of the upper module 203 are inserted into the lower part of the upper housing 205 by simply sliding, the positioning of the upper and lower modules and the lower module may be unstable. . In addition, the upper clamp 207 is formed of a square plate, the lower clamp 208 is also formed of a 'c' shaped plate to the structure to be broken by tightening the bolt after the lower module 204 is inserted. In order to secure the upper and lower modules 203 and 204 to the upper and lower housings 205 and 206, the bolts must be tightened or loosened in a state where the clamps 207 and 208 are held with one hand. Therefore, the assembly and disassembly process is very cumbersome and complicated to have a problem that the replacement efficiency is reduced.

Therefore, the present invention has been devised to solve the above problems, and the upper and lower modules are mounted on the upper and lower housings in a sliding manner to achieve accurate positioning of the upper and lower modules, and from the mold to the upper and lower housings. For the formation of semiconductor lead frame that can improve the speed and maintenance of module replacement by simplifying assembly and disassembly by simple operation of bolts without removing assembly parts for fixing upper and lower modules. The purpose is to provide a mold.

1 is an exploded perspective view showing a configuration of one embodiment of a mold for forming a semiconductor lead frame according to the prior art;

Figure 2 is an exploded perspective view showing another embodiment configuration of a mold for forming a semiconductor lead frame according to the prior art.

3 is an assembled cross-sectional view of FIG.

Figure 4 is an exploded perspective view showing an embodiment of a mold apparatus for forming a semiconductor lead frame according to the present invention.

5 is an assembled front cross-sectional view of FIG.

Figure 6 is an assembled side cross-sectional view of Figure 4;

Figure 7 is a partial perspective view showing another embodiment of the block coupling portion that is the main design of the present invention.

* Explanation of symbols for main parts of the drawings

1, 2: upper, lower holder 3: main bush

4: main post 5, 6: upper, lower housing

7: Positioning pin 8, 9: Upper, lower module

17: fixed block 18: bolt

21: step

In order to achieve the above object, the present invention is provided with upper and lower holders spaced apart from each other; A guide set connecting the upper and lower holders to provide lifting force for the upper holder to move up and down on the lower holder; Upper and lower housings which are respectively installed on the lower surface of the upper holder and the upper surface of the lower holder, the guide rails protrude from both inner surfaces thereof, and fastening holes are formed at predetermined positions on both sides of the front and rear surfaces; Upper and lower modules having slide grooves formed at both sides thereof so as to be seated on the guide rails of the upper and lower housings; And it is provided on both sides of the front and rear surfaces of the upper, lower housing provides a mold for molding the semiconductor lead frame comprising a fixing means for fixing between the upper and lower modules.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The mold for forming the semiconductor lead frame according to the present invention is implemented to disassemble and assemble the upper and lower modules by simple operation of bolts without separating the assembly parts from the mold in order to efficiently produce various kinds of lead frames. In this embodiment, as shown in Fig. 4, the upper and lower holders 1 and 2 provided at predetermined intervals up and down, and are installed upright on the square ends of the upper and lower holders 1 and 2, A guide set having a main bush (3) and a main post (4) to be connected to provide a lifting force to move the upper holder (1) on the lower holder (2), and the upper holder (1) Guide rails 5a and 6a which are respectively installed on the bottom surface and the upper surface of the lower holder 2 and protrude from both inner surfaces thereof are formed, respectively, and the upper and lower housings 5 in which the fastening holes 5b and 6b are formed on both front and rear surfaces thereof. 6) and the phase, Position fixing pins (7) for fixing the upper and lower holders (1, 2) to the mounting position through the upper surfaces of both sides of the secondary housing (5, 6), and guides of the upper and lower housings (5, 6) The upper and lower modules 8 and 9 and the upper and lower modules 8 and 9 that are inserted into the rails 5a and 6a and are seated in a sliding manner are installed on both sides of the upper and lower housings 8 and 9. 9) is composed of a fixing means for fixing the liver.

Here, slide grooves 8a and 9a are formed on both side surfaces of the upper and lower modules 8 and 9 to be fitted to the guide rails 5a and 6a, but the present invention is not limited thereto. It is well known that the modules 8, 9 are also mounted on the guide rails of the upper and lower housings 5, 6.

In addition, the upper module 8 has a punch backing plate 11, a punch holder 12, and a stripper plate having both sides thereof which play a direct role in forming the semiconductor lead frame. plate 13 is sequentially stacked and bonded to each other, and the lower module 9 has a die holder 15 and a die backing plate 16 sequentially formed on both sides thereof. It is a laminated and bonded structure.

The fixing means includes a through hole 17a formed to communicate with the fastening holes 5b and 6b of the upper and lower housings 5 and 6 and through the through hole 17a to the fastening holes 5b and 6b. It is composed of a fixing block 17 having a bolt 18 for fixing between the upper and lower housings 5 and 6 and the upper and lower modules 8 and 9 by being inserted. Accordingly, when assembling the upper and lower modules 8 and 9 to the upper and lower housings 5 and 6, both parts of the fixing block 17 may be upper and lower housings 5 and 6 and the upper and lower modules 8 and 9. 9) and then the bolt 18 fitted in the through hole 17a of the fixing block 17 is inserted into the fastening holes 5b and 6b to be tightened, and the upper and lower housings 5 and 6 can be easily , The lower modules 8 and 9 can be fixed. On the contrary, when disassembling, the fixing block 17 is rotated downward by releasing the fixing force of the bolt 18 so that the upper and lower modules 8 and 9 can be rotated. ) To be an environment in which the upper and lower housings 5 and 6 can be separated.

Meanwhile, another embodiment of the present invention for the structure of assembling the upper and lower housings 5 and 6 and the upper and lower modules 8 and 9 is shown in FIG. 6.

As shown in the drawing, the fixing block 17 is formed by forming a step 21 having a predetermined width at the lower side of the fastening holes 5b and 6b formed at both front and rear sides of the upper and lower housings 5 and 6. ) Is no longer rotated downward, but spanned. That is, when assembling the fixing block 17 to the bolt 18 during assembly, by positioning the fixing block 17 on the step 21 to be tightened with the bolt 18 by the other hand fixed block The work of holding (17) is eliminated.

Referring to the working state of the present invention configured as described above are as follows,

First, when the upper and lower modules 8 and 9 for forming the lead frame are mounted on the upper and lower housings 5 and 6 mounted on the upper and lower holders 1 and 2, the upper and lower modules 8 , The slide grooves 8a and 9a of 9 are fitted to the guide rails 5a and 6a of the upper and lower housings 5 and 6, and the fixing block 17 is mounted on the upper and lower housings 5 and 6, respectively. And, the upper and lower modules (8, 9) are placed on both sides of their front and rear so as to be in close contact with each other, the fastening holes (5b) of the upper and lower housings (5, 6) of the through hole (17a) of the fixing block 17 , 6b) and then simply insert the bolt 18 to tighten the assembly work.

On the contrary, in the case where the upper and lower modules 8 and 9 are to be disassembled from the upper and lower housings 5 and 6, the fastening holes 5b and 6b pass through the through holes 17a of the fixing block 17. The upper and lower housings 5 and 6 and the upper and lower modules 8 and 9 are fixed in close contact with each other by only loosening the bolts 18 fastened to the fastening holes 5b and 6b. The fixing force of the fixed block 17 is loosened and rotated downward. Accordingly, the upper and lower modules 8 and 9 are free from the upper and lower housings 5 and 6 and are detachable.

In the case of assembling the upper and lower modules 8 and 9 from the upper and lower housings 5 and 6 as described above, when the step 21 is formed in the upper and lower housings 5 and 6. In the upper and lower housings 5 and 6 and the upper and lower modules 8 and 9 by holding the fixing block 17 slightly over the step 21, the fixing block 17 is held by hand. There is no need to adjust the position to be in close contact with.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope without departing from the technical spirit of the present invention. It will be apparent to those who have knowledge.

As described above, according to the present invention, when assembling and disassembling the upper and lower modules for forming the lead frame in the upper and lower housings mounted on the upper and lower holders, the slide grooves of the upper and lower modules are respectively upper and lower housings. By simply being fitted to the guide rail of the guide, it is possible to determine the exact position of the upper module and the lower module to obtain a better shape when forming the lead frame, and only one bolt provided in the fixed block and the upper and lower housings It is possible to fix the upper and lower modules, so that the assembly and disassembly work can be performed quickly and simply without separating the assembly parts from the upper and lower housings, thereby shortening the module replacement time for forming various types of lead frames, and the number and processing of parts. By reducing the man-hours, it has the effect of contributing to the cost reduction of the mold manufacturing cost.

Claims (4)

Upper and lower holders disposed at upper and lower intervals; A guide set connecting the upper and lower holders to provide lifting force for the upper holder to move up and down on the lower holder; Upper and lower housings which are respectively installed on the lower surface of the upper holder and the upper surface of the lower holder, the guide rails protrude from both inner surfaces thereof, and fastening holes are formed at predetermined positions on both sides of the front and rear surfaces; Upper and lower modules seated on the guide rails of the upper and lower housings; And Fixing means for fixing each of the upper, lower modules installed on both sides of the front and rear surfaces of the upper, lower housing Mold for molding the semiconductor lead frame comprising a. The method of claim 1, The fixing means A fixing block formed at a lower portion thereof, the through-hole communicating with the fastening holes of the upper and lower housings, the fixing block for being tightly fixed between the upper and lower housings and the upper and lower modules; And It includes a bolt that is inserted into the fastening hole of the upper, lower housing through the through hole of the fixing block and fastened, The upper and lower housings and the upper and lower modules are fixed when the fixing block is placed in the horizontal direction and the upper and lower modules are released when the tightening force of the bolt is released so that the fixing block is rotatable in the lower direction. A mold for forming a semiconductor lead frame detachable from the upper and lower housings. The method according to claim 1 or 2, The mold for forming a semiconductor lead frame further comprises a step formed in each of the upper and lower housings and the lower fastening hole of the upper and lower housings so that the fixing block is positioned across the upper and lower modules. The method according to claim 1 or 2, The upper and lower modules are a mold for forming a semiconductor lead frame so that the slide grooves are formed on both sides of each of the upper and lower modules so as to slide in the guide rails of the upper and lower housings.