CN218039117U

CN218039117U - Chip packaging jig

Info

Publication number: CN218039117U
Application number: CN202222196851.0U
Authority: CN
Inventors: 徐江; 龚祥东
Original assignee: Zhejiang Yaxin Microelectronics Co ltd
Current assignee: Zhejiang Yaxin Microelectronics Co ltd
Priority date: 2022-08-19
Filing date: 2022-08-19
Publication date: 2022-12-13
Anticipated expiration: 2032-08-19

Abstract

The utility model provides a chip packaging jig, including cope match-plate pattern and lower bolster, install a plurality of guide pillars on the lower bolster, install a plurality of pilot pins that are used for the positioning frame anchor clamps on the lower bolster, install a plurality of guide pin bushings with guide pillar matched with on the cope match-plate pattern, a serial communication port, a plurality of lower mounting grooves have been seted up on the lower bolster, demountable installation has the bed die in the mounting groove down, the last membrane chamber that has of bed die, still set up a plurality of holes of placing that are used for placing the plastic envelope resin stick on the bed die, a plurality of upper mounting grooves have been seted up on the cope match-plate pattern, demountable installation has the mould in the upper mounting groove, the last membrane chamber that has of going up on the mould, and go up the membrane chamber and form the die cavity that is used for the shaping chip with the closed back in lower membrane chamber.

Description

Chip packaging jig

Technical Field

The utility model belongs to the technical field of the chip, a chip packaging jig is related to.

Background

The chip plastic package refers to a process of packaging and protecting a semi-finished product after bonding by using plastic package resin under certain pressure and temperature conditions, and specifically, the semi-finished product to be plastic packaged is placed into a frame clamp, the frame clamp is placed on a large-scale plastic package press, and the chip packaging operation is realized under the matching of an upper packaging mold and a lower packaging mold.

In the prior art, an upper packaging mold and a lower packaging mold are integrated, each pair of molds is used for packaging chips of a unified type, and in the production process, different plastic packaging resins and different products need to be packaged sometimes, and then subsequent tests are carried out, so that the whole set of molds need to be frequently disassembled and assembled.

Disclosure of Invention

The utility model aims at solving the problems of the prior art and providing a chip packaging jig.

The purpose of the utility model can be realized by the following technical proposal: a chip packaging jig comprises an upper template and a lower template, wherein a plurality of guide pillars are installed on the lower template, a plurality of positioning pins for positioning a frame fixture are installed on the lower template, a plurality of guide sleeves matched with the guide pillars are installed on the upper template, the chip packaging jig is characterized in that a plurality of lower mounting grooves are formed in the lower template, a lower die is detachably installed in the lower mounting grooves, a lower die cavity is formed in the lower die, a plurality of placing holes for placing plastic package resin rods are further formed in the lower die, a plurality of upper mounting grooves are formed in the upper template, an upper die is detachably installed in the upper mounting grooves, an upper die cavity is formed in the upper die, and a die cavity for forming chips is formed after the upper die cavity and the lower die cavity are closed.

The two sides of the upper die are provided with first connecting lugs, and the first connecting lugs are provided with first connecting holes; and two sides of the lower die are provided with second connecting lugs, and the second connecting lugs are provided with second connecting holes.

The upper template is provided with a first threaded hole matched with the first connecting hole, and the lower template is provided with a second threaded hole matched with the second connecting hole.

The upper die is provided with a first protruding part for preventing reverse, and the lower die is provided with a second protruding part for preventing reverse.

The first protruding part and the second protruding part are semi-cylindrical in shape.

Compared with the prior art, this chip packaging tool has this advantage:

the utility model discloses in through offering the mounting groove in the template, demountable installation has the mould in the mounting groove to can install the mould of many sets of different grade types in the whole template, be applicable to chip production, when encapsulating different plastic envelope resin and different products, only need select required that set can, avoid necessarily dismantling a whole set of mould, convenient to use.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic perspective view of the middle and lower templates of the present invention;

fig. 3 is a schematic perspective view of the middle and lower molds of the present invention;

fig. 4 is a schematic perspective view of the upper die plate of the present invention;

fig. 5 is a schematic perspective view of the upper mold of the present invention;

in the figure, 1, a lower template; 1a, a lower mounting groove; 1b, a threaded hole II; 2. a guide post; 3. a positioning pin; 4. a guide sleeve; 5. mounting a template; 5a, mounting the groove; 5b, a first threaded hole; 6. an upper die; 6a, a first protruding part; 6b, connecting the lug I; 6b1, connecting a hole I; 6c, an upper film cavity; 7. a lower die; 7a and a second bulge; 7b, a second connecting lug; 7b1 and a connecting hole II; 7c, a lower membrane cavity; 7d, placing holes.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

As shown in fig. 1-5, the chip packaging jig comprises an upper template 5 and a lower template 1, wherein the lower template 1 is provided with a plurality of guide pillars 2, the lower template 1 is provided with a plurality of positioning pins 3 for positioning a frame fixture, and the upper template 5 is provided with a plurality of guide sleeves 4 matched with the guide pillars 2, and is characterized in that the lower template 1 is provided with a plurality of lower mounting grooves 1a, a lower mold 7 is detachably mounted in the lower mounting grooves 1a, the lower mold 7 is provided with a lower film cavity 7c, the lower mold 7 is also provided with a plurality of placing holes 7d for placing a plastic package resin rod, the upper template 5 is provided with a plurality of upper mounting grooves 5a, the upper mounting grooves 5a are detachably mounted with an upper mold 6, the upper mold 6 is provided with an upper film cavity 6c, and the upper film cavity 6c and the lower film cavity 7c are closed to form a mold cavity for forming a chip; in this embodiment, the chip packaging operation performed by the upper template 5, the lower template 1, the upper mold 6 and the lower mold 7 is performed by the prior art, and the installation between the upper template and the large-scale plastic packaging press is also performed by the prior art.

Two sides of the upper die 6 are provided with connecting lugs 6b, and the connecting lugs 6b are provided with connecting holes 6b1; two sides of the lower die 7 are provided with a second connecting lug 7b, and the second connecting lug 7b is provided with a second connecting hole 7b1.

The upper template 5 is provided with a first threaded hole 5b matched with the first connecting hole 6b1, and the lower template 1 is provided with a second threaded hole 1b matched with the second connecting hole 7b1.

By adopting the structure, when the upper die 6 is arranged in the upper mounting groove 5a of the upper die plate 5, the mounting can be completed only by mounting screws in the connecting hole I6 b1 and the threaded hole I5 b; when the lower die 7 is arranged in the lower mounting groove 1a of the lower template 1, the lower die can be mounted only by mounting screws in the connecting hole II 7b1 and the threaded hole II 1b

The upper die 6 is provided with a first bulge 6a for preventing reverse, and the lower die 7 is provided with a second bulge 7a for preventing reverse; in this embodiment, the first protrusion 6a and the second protrusion 7a can prevent the installation from being mistaken.

The first projection 6a and the second projection 7a are semi-cylindrical in shape.

In practice, the lower template 1 is also provided with an exhaust pipeline, which adopts the prior art.

The utility model discloses in through offering the mounting groove in the template, demountable installation has the mould in the mounting groove to can install the mould of many sets of different grade types in the whole template, be applicable to chip production, when encapsulating different plastic envelope resin and different products, only need select required that set can, avoid necessarily dismantling a whole set of mould.

The above components are all standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experiments.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Claims

1. The utility model provides a chip packaging jig, includes cope match-plate pattern (5) and lower bolster (1), install a plurality of guide pillars (2) on lower bolster (1), install a plurality of pilot pins (3) that are used for the positioning frame anchor clamps on lower bolster (1), install a plurality of guide pin bushings (4) with guide pillar (2) matched with on cope match-plate pattern (5), its characterized in that, set up a plurality of lower mounting grooves (1 a) on lower bolster (1), demountable installation has bed die (7) in lower mounting groove (1 a), bed die chamber (7 c) has on bed die (7), still set up a plurality of holes (7 d) of placing that are used for placing the plastic envelope resin stick on bed die (7), set up a plurality of upper mounting groove (5 a) on cope match-plate pattern (5 a), demountable installation has bed die (6) in upper die (5 a), form the die cavity (6 c) on cope die (6), and form the die cavity that is used for the shaping chip after upper die chamber (6 c) and bed die chamber (7 c) are closed.

2. The die packaging jig according to claim 1, wherein the upper die (6) has first connecting lugs (6 b) on both sides thereof, and the first connecting lugs (6 b) have first connecting holes (6 b 1); two sides of the lower die (7) are provided with a second connecting lug (7 b), and the second connecting lug (7 b) is provided with a second connecting hole (7 b 1).

3. The jig for chip packaging according to claim 2, wherein the upper template (5) has a first threaded hole (5 b) matched with the first connecting hole (6 b 1), and the lower template (1) has a second threaded hole (1 b) matched with the second connecting hole (7 b 1).

4. The jig for chip packaging according to claim 1, wherein the upper mold (6) has a first projection (6 a) for reverse prevention thereon, and the lower mold (7) has a second projection (7 a) for reverse prevention thereon.

5. The jig for chip packaging according to claim 4, wherein the first protrusion (6 a) and the second protrusion (7 a) are semi-cylindrical in shape.