KR200212520Y1 - Heat radiating apparatus of notebook computer - Google Patents

Abstract

The present invention relates to a heat dissipation device of a notebook computer, the purpose of which is to install a heat pipe that can transfer heat between the video chip and bios chip and the blower tube to reduce the internal temperature of the notebook computer It is to provide a heat dissipation device, the motherboard 20 is provided on the inner bottom surface of the case 10, the video chip 60 and the BIOS chip 70 and the central processing provided on the upper side of the motherboard 20 Is connected to the central processing unit collecting unit 85, the central processing unit collecting unit 85, which is installed in close contact with the apparatus 50, the central processing unit 50, one side extends to the outside of the case 10 The heat sink 81 is installed on one side of the bottom surface of the heat sink 81, and is blown out through the blow fan 82 and the blow fan 82 for dissipating heat transferred to the heat sink 81 to the outside. Guide the heat to the outside of the case 10 The blower tube 83, the video chip 60, and the bioschip 70 are provided with a video chip collector 86 and a bioschip collector 87, and the video chip collector 86 and a bioschip collector. The heat pipes 186 and 187 having high thermal conductivity are provided between the heat portion 87 and the blower tube 83.

Description

Heat Dissipation Device for Notebook Computers {HEAT RADIATING APPARATUS OF NOTEBOOK COMPUTER}

The present invention relates to a heat dissipation device of a notebook computer, and more particularly, to improve the structure of the heat dissipation device so that more heat is dissipated quickly through a heat dissipation device provided to dissipate heat from the central processing unit. A heat dissipation device for a notebook computer.

In general, notebook computers include INPUT / OUTPUT CONTROL, CPU, RAM, ROM, ADDRESS BUS, CONTROL BUS, and DATA BUS. (DATA BUS), etc., since the central processing unit emits high heat, and a separate heat dissipation device is provided for this.

1 is a view showing the structure of such a conventional notebook computer heat dissipation device. As shown therein, a case 1 is formed to form a lower portion of the notebook computer, and the inner bottom of the case 1 has a motherboard 2, a MOTHER BOARD, a hard drive 3, and a floppy. The drive 4 (FLOPPY DRIVE) is accommodated. On the upper side of the motherboard 2, a central processing unit 5, a video chip 6 (VIDEO CHIP) and a BIOS chip 7 (BIOS CHIP, BX CHIP) are provided.

On the other hand, the heat dissipation device 8 is provided above the central processing unit 5 so as to be adjacent to the central processing unit 5 to discharge heat generated from the central processing unit 5 to the outside. The heat dissipating device 8 is a heat sink 8a provided as a metal plate having good thermal conductivity so as to connect the central processing unit 5 with the outside and an upper side of the central processing unit 5 on one side of the bottom surface of the heat sink 8a. And a blower (8b) and a blower (8d) provided on the other side of the bottom surface of the heat sink (8a) and arranged directly in contact with the central processing unit (5). At this time, one side end of the blower tube 8d extends to the outside of the case 1 to discharge heat generated from the heat sink 8a to the outside.

However, the heat dissipation device of the conventional notebook computer configured as described above emits heat generated from the central processing unit to the outside through a heat sink. At this time, the video chip and the bios chip are not provided with a separate heat dissipation device. The heat generated from the bioschip caused the laptop computer to overheat.

The present invention is to solve such a problem, the purpose of the present invention is to install a heat pipe that can transfer heat between the video chip and the bios chip and the blower tube to lower the internal temperature of the notebook computer It is to provide a heat dissipation device of.

1 is an exploded perspective view showing a heat dissipation device of a conventional notebook computer.

2 is an exploded perspective view showing a heat dissipation device of a notebook computer according to the present invention.

Explanation of symbols on the main parts of the drawings

10: Case 20: Motherboard

30: hard drive 40: floppy drive

50: central processing unit 60: video chip

70: biochip 80: heat dissipation device

81: Heat sink 82: Blower fan

83: blower pipe 85: central processing unit heat collecting unit

86: video chip collector 87: biochip chip collector

186,187: Heat pipe

The present invention for achieving the above object, the motherboard is provided on the inner bottom surface of the case, the video chip and bios chip and central processing unit provided on the upper side of the motherboard is installed in close contact with the upper portion of the central processing unit A heat collecting part, a heat sink connected to the heat collecting part, and one side of which is installed at one side of a bottom surface of the heat sink, a blowing fan for dissipating heat transferred to the heat sink to the outside, through the blowing fan In a heat dissipation device of a notebook computer provided with a blower tube for guiding the discharged heat to the outside of the case, the video chip and the bios chip is provided with a video chip collector and a bios chip collector, the video chip collector And a heat pipe having a high thermal conductivity between the bioschip collector and the blower tube.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment according to the present invention will be described.

2 is an exploded perspective view showing a heat dissipation device of a notebook computer according to the present invention. As shown in the drawing, a case 10 is formed to form a lower portion of a notebook computer, and a motherboard 20, a hard drive 30, and a floppy drive 40 are accommodated in an inner bottom of the case 10. . And the upper side of the motherboard 20, the central processing unit 50, the video chip 60, the BIOS chip 70 and the like are installed.

Since the central processing unit 50 emits high heat, a separate heat dissipating device 80 is provided for this purpose. The heat dissipating device 80 is provided to connect the central processing unit 50 to the outside. The heat generated by the central processing unit 50 is transferred to the outside.

The heat dissipation device 80 is composed of a combination of a plurality of components. First, the heat sink 81 is provided as a wide metal plate having good thermal conductivity, and is disposed above the central processing unit 50 on one side of the bottom surface of the heat sink 81. And a blower fan 82 and a blower tube 83 provided on the other side of the bottom surface of the heat sink 81 and the central processor unit heat collecting unit 85 which comes into close contact with the central processor 50. At this time, one side end of the blower tube 83 extends to the outside of the case 10 to discharge heat generated from the heat sink 81 to the outside.

In addition, in the present invention, the heat generated from the video chip 60 and the bios chip 70 is moved to the blower tube 83 to reduce the internal temperature of the notebook computer.

That is, the heat sink 81 is provided with the video chip collecting unit 86 and the bioschip collecting unit 87 so as to be in close contact with the video chip 60 and the BIOS chip 70, and each central processing unit collecting unit 85 is provided. ) Is connected to the blower tube 83 through the heat pipes 186 and 187 having high thermal conductivity to emit heat generated from the video chip 60 and the bios chip 70 to the outside.

The heat pipes 186 and 187 are mechanisms having a heat transfer mechanism using liquid evaporation and latent heat, and are generally used in heat transfer apparatuses and the like. That is, the heat pipes 186 and 187 are composed of three parts, a REFRIGERANT, a CONTAINER, and a WICK, and an evaporation part receiving heat during operation, a condensing part dissipating heat, and no heat insulator. It is divided into parts to quickly move the heat of one side to the other side.

The heat dissipation device 80 of the notebook computer of the present invention configured as described above is installed in close contact with the central processing unit collecting unit 85 on the upper side of the central processing unit 50, and the central processing unit collecting unit 85 is centrally installed. Heat from the processing device 50 is transferred to the heat sink 81. In addition, heat of the video chip 60 and the bioschip 70 is transferred through the heat sink 81 and the heat pipes 186 and 187 through the heat pipes 186 and 187 installed in the video chip 60 and the bios chip 70. The heat transmitted to the blower tube 83 and thus transferred is quickly discharged to the outside of the case 10 by the blower fan 82 to cool the central processing unit 50.

As described in detail above, the heat dissipation device of the notebook computer according to the present invention is capable of dissipating heat from the central processing unit and the video chip and the bios chip to the outside, thereby improving the performance of the notebook computer by lowering the internal temperature of the notebook computer. There is an advantage.

Claims (2)

Motherboard is provided on the inner bottom of the case, the video chip and the BIOS chip and the central processing unit is provided on the upper side of the motherboard, the heat collecting portion is installed in close contact with the upper portion of the central processing unit, the heat collecting portion is connected to one side A heat sink extending outwardly of the case, a blower fan installed at one side of a bottom surface of the heat sink to discharge heat transferred to the heat sink to the outside, and guide the heat discharged through the blower fan to the outside of the case; In the heat dissipation device of a notebook computer is provided with a blow pipe so The video chip collecting unit 86 and the bioschip collecting unit 87 are provided in the video chip 60 and the bios chip 70, and the video chip collecting unit 86 and the bioschip collecting unit 87 and the A heat dissipation device for a notebook computer, characterized in that heat pipes (186, 187) having high thermal conductivity are provided between the blower tubes (83). The method of claim 1, One end of the heat pipe (186,187) is a heat dissipation device of a notebook computer, characterized in that connected to the end of the blower tube (83) extending to the outside of the case (10).